WO2007053308A3 - Diffusion barrier layer for mems devices - Google Patents

Diffusion barrier layer for mems devices Download PDF

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Publication number
WO2007053308A3
WO2007053308A3 PCT/US2006/040775 US2006040775W WO2007053308A3 WO 2007053308 A3 WO2007053308 A3 WO 2007053308A3 US 2006040775 W US2006040775 W US 2006040775W WO 2007053308 A3 WO2007053308 A3 WO 2007053308A3
Authority
WO
WIPO (PCT)
Prior art keywords
barrier layer
diffusion barrier
mems devices
metals
physical characteristics
Prior art date
Application number
PCT/US2006/040775
Other languages
French (fr)
Other versions
WO2007053308A2 (en
Inventor
Hsin-Fu Wang
Ming-Hau Tung
Stephen Zee
Original Assignee
Idc Llc
Hsin-Fu Wang
Ming-Hau Tung
Stephen Zee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc, Hsin-Fu Wang, Ming-Hau Tung, Stephen Zee filed Critical Idc Llc
Priority to CN2006800401208A priority Critical patent/CN101305308B/en
Priority to JP2008537782A priority patent/JP2009513372A/en
Priority to EP06836379A priority patent/EP1941316A2/en
Publication of WO2007053308A2 publication Critical patent/WO2007053308A2/en
Publication of WO2007053308A3 publication Critical patent/WO2007053308A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
    • B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
    • B81C1/00793—Avoid contamination, e.g. absorption of impurities or oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain

Abstract

Described herein is the use of a diffusion barrier layer between metallic layers in MEMS devices. The diffusion barrier layer prevents mixing of the two metals, which can alter desired physical characteristics and complicate processing. In one example, the diffusion barrier layer may be used as part of a movable reflective structure in interferometric modulators.
PCT/US2006/040775 2005-10-28 2006-10-19 Diffusion barrier layer for mems devices WO2007053308A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2006800401208A CN101305308B (en) 2005-10-28 2006-10-19 Diffusion barrier layer for mems devices
JP2008537782A JP2009513372A (en) 2005-10-28 2006-10-19 Diffusion barrier layer for MEMS devices
EP06836379A EP1941316A2 (en) 2005-10-28 2006-10-19 Diffusion barrier layer for mems devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/261,236 US7630114B2 (en) 2005-10-28 2005-10-28 Diffusion barrier layer for MEMS devices
US11/261,236 2005-10-28

Publications (2)

Publication Number Publication Date
WO2007053308A2 WO2007053308A2 (en) 2007-05-10
WO2007053308A3 true WO2007053308A3 (en) 2007-07-26

Family

ID=37749399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/040775 WO2007053308A2 (en) 2005-10-28 2006-10-19 Diffusion barrier layer for mems devices

Country Status (7)

Country Link
US (3) US7630114B2 (en)
EP (1) EP1941316A2 (en)
JP (2) JP2009513372A (en)
KR (1) KR20080072872A (en)
CN (2) CN102608754A (en)
TW (1) TW200720183A (en)
WO (1) WO2007053308A2 (en)

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