WO2007038191A3 - Microbolometer ir focal plane array (fpa) with in-situ micro vacuum sensor and method of fabrication - Google Patents

Microbolometer ir focal plane array (fpa) with in-situ micro vacuum sensor and method of fabrication Download PDF

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Publication number
WO2007038191A3
WO2007038191A3 PCT/US2006/036788 US2006036788W WO2007038191A3 WO 2007038191 A3 WO2007038191 A3 WO 2007038191A3 US 2006036788 W US2006036788 W US 2006036788W WO 2007038191 A3 WO2007038191 A3 WO 2007038191A3
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum
microbolometer
fpa
variability
fabrication
Prior art date
Application number
PCT/US2006/036788
Other languages
French (fr)
Other versions
WO2007038191A2 (en
Inventor
Wames Roger E De
James R Waldrop
Original Assignee
Rockwell Scient Licensing Llc
Wames Roger E De
James R Waldrop
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rockwell Scient Licensing Llc, Wames Roger E De, James R Waldrop filed Critical Rockwell Scient Licensing Llc
Publication of WO2007038191A2 publication Critical patent/WO2007038191A2/en
Publication of WO2007038191A3 publication Critical patent/WO2007038191A3/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L21/00—Vacuum gauges
    • G01L21/10—Vacuum gauges by measuring variations in the heat conductivity of the medium, the pressure of which is to be measured
    • G01L21/12—Vacuum gauges by measuring variations in the heat conductivity of the medium, the pressure of which is to be measured measuring changes in electric resistance of measuring members, e.g. of filaments; Vacuum gauges of the Pirani type

Abstract

A microbolometer IR FPA is provided with in-situ vacuum sensing capability by realizing that the IR sensor microbolometer pixel element itself may be used as a vacuum sensor. The application of an electrical signal to the resistive element heats the bolometer material thereby producing a variable resistance related to vacuum level. The degree of variability for a given material depends on the efficiency of heat transfer from the material to the surrounding environment. In a good vacuum, heat transfer is poor, and thus heat will be retained in the material to produce a relatively large temperature increase and the resistance variability will be large. In a poor vacuum, heat is readily transferred to the environment and the temperature rise will be relatively small and thus resistance variability will be small. Consequently, the variable resistance magnitude can be readout to determine the vacuum level.
PCT/US2006/036788 2005-09-26 2006-09-19 Microbolometer ir focal plane array (fpa) with in-situ micro vacuum sensor and method of fabrication WO2007038191A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/162,849 2005-09-26
US11/162,849 US7385199B2 (en) 2005-09-26 2005-09-26 Microbolometer IR focal plane array (FPA) with in-situ mirco vacuum sensor and method of fabrication

Publications (2)

Publication Number Publication Date
WO2007038191A2 WO2007038191A2 (en) 2007-04-05
WO2007038191A3 true WO2007038191A3 (en) 2008-01-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/036788 WO2007038191A2 (en) 2005-09-26 2006-09-19 Microbolometer ir focal plane array (fpa) with in-situ micro vacuum sensor and method of fabrication

Country Status (2)

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US (1) US7385199B2 (en)
WO (1) WO2007038191A2 (en)

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US6889568B2 (en) * 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US7757574B2 (en) * 2002-01-24 2010-07-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
US8604361B2 (en) * 2005-12-13 2013-12-10 Kla-Tencor Corporation Component package for maintaining safe operating temperature of components
US7470904B1 (en) 2006-03-20 2008-12-30 Flir Systems, Inc. Infrared camera packaging
EP2015046A1 (en) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Vacuum Sensor
US7786440B2 (en) * 2007-09-13 2010-08-31 Honeywell International Inc. Nanowire multispectral imaging array
DE102008005167A1 (en) * 2008-01-19 2009-07-23 Testo Ag Thermal camera
JP5255873B2 (en) * 2008-03-17 2013-08-07 浜松ホトニクス株式会社 Photodetector
WO2010023654A1 (en) * 2008-08-28 2010-03-04 Opgal Optronic Industries Ltd. Method for detecting changes in a vacuum state in a detector of a thermal camera
JP2010071816A (en) * 2008-09-18 2010-04-02 Toshiba Corp Electronic device
US8117898B2 (en) * 2008-12-19 2012-02-21 Institut National D'optique Method for sensing gas composition and pressure
EP2359116B1 (en) 2008-12-19 2019-02-27 Institut National d'Optique Micro-thermistor gas pressure sensor
CA2746335C (en) * 2008-12-19 2014-05-13 Institut National D'optique Method for sensing gas composition and pressure
US8171801B2 (en) * 2008-12-19 2012-05-08 Institut National D'optique Micro-thermistor gas pressure sensor
US8471206B1 (en) 2009-07-14 2013-06-25 Flir Systems, Inc. Infrared detector vacuum test systems and methods
US8546757B2 (en) * 2010-04-28 2013-10-01 L-3 Communications Corporation Pixel structure for microbolometer detector
US8681493B2 (en) 2011-05-10 2014-03-25 Kla-Tencor Corporation Heat shield module for substrate-like metrology device
US8748808B2 (en) 2012-05-16 2014-06-10 Institut National D'optique Detection and correction of a loss of calibration of microbolometer thermal imaging radiometers
EP3035015B1 (en) 2014-12-15 2017-04-12 Melexis Technologies NV Ir sensor for ir sensing based on power control
CN106482892A (en) * 2016-10-21 2017-03-08 云南北方昆物光电科技发展有限公司 Non-refrigerated infrared focal plane probe inner vacuum method of testing
CN107144356B (en) * 2017-06-26 2019-06-04 电子科技大学 Non-refrigerated infrared focal plane probe array thermal Response Time Test System and method
KR101842955B1 (en) 2017-09-28 2018-03-29 ㈜시리우스 Micro bolometer manufacturing method using selective etching and micro bolometer manufactrued thereby
US20220399394A1 (en) * 2021-06-11 2022-12-15 Raytheon Company Thin film obscurant for microelectronics

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US5729019A (en) * 1995-12-29 1998-03-17 Honeywell Inc. Split field-of-view uncooled infrared sensor
US5801383A (en) * 1995-11-22 1998-09-01 Masahiro Ota, Director General, Technical Research And Development Institute, Japan Defense Agency VOX film, wherein X is greater than 1.875 and less than 2.0, and a bolometer-type infrared sensor comprising the VOX film
US20050176179A1 (en) * 2002-12-27 2005-08-11 Kimiya Ikushima Electronic device and method of manufacturing the same

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US6453748B1 (en) * 1999-12-15 2002-09-24 Wayne State University Boron nitride piezoresistive device
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801383A (en) * 1995-11-22 1998-09-01 Masahiro Ota, Director General, Technical Research And Development Institute, Japan Defense Agency VOX film, wherein X is greater than 1.875 and less than 2.0, and a bolometer-type infrared sensor comprising the VOX film
US5729019A (en) * 1995-12-29 1998-03-17 Honeywell Inc. Split field-of-view uncooled infrared sensor
US20050176179A1 (en) * 2002-12-27 2005-08-11 Kimiya Ikushima Electronic device and method of manufacturing the same

Also Published As

Publication number Publication date
US7385199B2 (en) 2008-06-10
US20070069133A1 (en) 2007-03-29
WO2007038191A2 (en) 2007-04-05

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