WO2007008811A3 - High speed substrate aligner apparatus - Google Patents
High speed substrate aligner apparatus Download PDFInfo
- Publication number
- WO2007008811A3 WO2007008811A3 PCT/US2006/026747 US2006026747W WO2007008811A3 WO 2007008811 A3 WO2007008811 A3 WO 2007008811A3 US 2006026747 W US2006026747 W US 2006026747W WO 2007008811 A3 WO2007008811 A3 WO 2007008811A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- aligner
- transporter
- frame
- during alignment
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads . In other embodiments the substrate support employs a buffer system for buffering substrate inside the apparatus allowing for fast swapping of substrates.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800333075A CN101479829B (en) | 2005-07-11 | 2006-07-07 | High speed substrate aligner apparatus |
JP2008521500A JP2009515318A (en) | 2005-07-11 | 2006-07-07 | High-speed substrate array device |
KR1020087003015A KR101383746B1 (en) | 2005-07-11 | 2006-07-07 | High speed substrate aligner apparatus |
EP06786787A EP1902460A4 (en) | 2005-07-11 | 2006-07-07 | High speed substrate aligner apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/179,745 | 2005-07-11 | ||
US11/179,745 US8545165B2 (en) | 2005-03-30 | 2005-07-11 | High speed substrate aligner apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007008811A2 WO2007008811A2 (en) | 2007-01-18 |
WO2007008811A3 true WO2007008811A3 (en) | 2007-11-22 |
Family
ID=37637835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/026747 WO2007008811A2 (en) | 2005-07-11 | 2006-07-07 | High speed substrate aligner apparatus |
Country Status (7)
Country | Link |
---|---|
US (3) | US8545165B2 (en) |
EP (1) | EP1902460A4 (en) |
JP (1) | JP2009515318A (en) |
KR (1) | KR101383746B1 (en) |
CN (1) | CN101479829B (en) |
TW (1) | TWI462217B (en) |
WO (1) | WO2007008811A2 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US8545165B2 (en) | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US7891936B2 (en) | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
JP5597536B2 (en) * | 2008-08-01 | 2014-10-01 | 株式会社アルバック | Teaching method for transfer robot |
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
JP5243569B2 (en) * | 2011-03-07 | 2013-07-24 | 東京エレクトロン株式会社 | Substrate transport apparatus, substrate transport method, and recording medium on which program for executing the substrate transport method is recorded |
CN103199033B (en) * | 2012-01-05 | 2016-03-23 | 沈阳新松机器人自动化股份有限公司 | For the whirligig of prealignment machine |
JP5614417B2 (en) * | 2012-01-05 | 2014-10-29 | 株式会社安川電機 | Transport system |
CN103192463A (en) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | Transparent clamping type pre-alignment machine |
TWI624862B (en) * | 2012-06-11 | 2018-05-21 | 應用材料股份有限公司 | Melt depth determination using infrared interferometric technique in pulsed laser annealing |
US9199216B2 (en) * | 2012-08-07 | 2015-12-01 | Molecular Devices, Llc | Apparatuses and methods for conditioning and reorienting components of an electrophysiology measurement system |
CN103811388A (en) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | Two-station wafer pre-alignment device |
US9842757B2 (en) * | 2013-06-05 | 2017-12-12 | Persimmon Technologies Corporation | Robot and adaptive placement system and method |
CN106463438B (en) * | 2014-01-28 | 2019-09-10 | 布鲁克斯自动化公司 | Substrate transport equipment |
JP6742849B2 (en) * | 2016-07-29 | 2020-08-19 | 株式会社アルバック | Substrate transfer robot, vacuum processing device |
US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
US10522381B2 (en) * | 2017-04-07 | 2019-12-31 | Applied Materials, Inc. | Aligner apparatus and methods |
US10790237B2 (en) * | 2018-09-14 | 2020-09-29 | Lam Research Corporation | Fiducial-filtering automatic wafer centering process and associated system |
US11164769B2 (en) * | 2019-07-30 | 2021-11-02 | Brooks Automation, Inc. | Robot embedded vision apparatus |
KR20210024319A (en) * | 2019-08-21 | 2021-03-05 | 삼성전자주식회사 | Nspection apparatus |
CN110640324B (en) * | 2019-09-02 | 2022-06-10 | 中芯集成电路(宁波)有限公司 | Wafer double-side manufacturing system |
KR20230150865A (en) * | 2021-03-03 | 2023-10-31 | 어플라이드 머티어리얼스, 인코포레이티드 | Drying system with integrated substrate alignment stage |
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US6729462B2 (en) * | 2000-09-01 | 2004-05-04 | Asyst Technologies, Inc. | Edge grip aligner with buffering capabilities |
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US7891936B2 (en) | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US8545165B2 (en) | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
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-
2005
- 2005-07-11 US US11/179,745 patent/US8545165B2/en active Active
-
2006
- 2006-07-07 KR KR1020087003015A patent/KR101383746B1/en active IP Right Grant
- 2006-07-07 EP EP06786787A patent/EP1902460A4/en not_active Ceased
- 2006-07-07 CN CN2006800333075A patent/CN101479829B/en active Active
- 2006-07-07 JP JP2008521500A patent/JP2009515318A/en active Pending
- 2006-07-07 WO PCT/US2006/026747 patent/WO2007008811A2/en active Search and Examination
- 2006-07-11 TW TW095125183A patent/TWI462217B/en active
-
2013
- 2013-09-30 US US14/042,248 patent/US9601362B2/en active Active
-
2017
- 2017-03-21 US US15/465,326 patent/US11508597B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6275742B1 (en) * | 1999-04-16 | 2001-08-14 | Berkeley Process Control, Inc. | Wafer aligner system |
US6729462B2 (en) * | 2000-09-01 | 2004-05-04 | Asyst Technologies, Inc. | Edge grip aligner with buffering capabilities |
Also Published As
Publication number | Publication date |
---|---|
KR101383746B1 (en) | 2014-04-10 |
US20060222477A1 (en) | 2006-10-05 |
US8545165B2 (en) | 2013-10-01 |
JP2009515318A (en) | 2009-04-09 |
US9601362B2 (en) | 2017-03-21 |
TWI462217B (en) | 2014-11-21 |
EP1902460A2 (en) | 2008-03-26 |
TW200717692A (en) | 2007-05-01 |
CN101479829A (en) | 2009-07-08 |
US20170236739A1 (en) | 2017-08-17 |
EP1902460A4 (en) | 2010-12-29 |
CN101479829B (en) | 2012-12-12 |
US20140147234A1 (en) | 2014-05-29 |
WO2007008811A2 (en) | 2007-01-18 |
US11508597B2 (en) | 2022-11-22 |
KR20080036073A (en) | 2008-04-24 |
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