WO2007002449A1 - Integrated circuit device having optically coupled layers - Google Patents
Integrated circuit device having optically coupled layers Download PDFInfo
- Publication number
- WO2007002449A1 WO2007002449A1 PCT/US2006/024553 US2006024553W WO2007002449A1 WO 2007002449 A1 WO2007002449 A1 WO 2007002449A1 US 2006024553 W US2006024553 W US 2006024553W WO 2007002449 A1 WO2007002449 A1 WO 2007002449A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- photonic crystal
- crystal defect
- optical
- circuit layer
- Prior art date
Links
- 230000007547 defect Effects 0.000 claims abstract description 97
- 230000003287 optical effect Effects 0.000 claims abstract description 85
- 239000004038 photonic crystal Substances 0.000 claims abstract description 61
- 230000008878 coupling Effects 0.000 claims abstract description 30
- 238000010168 coupling process Methods 0.000 claims abstract description 30
- 238000005859 coupling reaction Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 13
- 230000001902 propagating effect Effects 0.000 claims description 4
- 239000011149 active material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 14
- 239000011799 hole material Substances 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 238000000224 chemical solution deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- -1 Siθ2 (n = 1.44) Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 238000001127 nanoimprint lithography Methods 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12002—Three-dimensional structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1225—Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12164—Multiplexing; Demultiplexing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112006001457T DE112006001457T5 (en) | 2005-06-21 | 2006-06-21 | Integrated circuit device with optically coupled layers |
JP2008518456A JP5026416B2 (en) | 2005-06-21 | 2006-06-21 | Integrated circuit device having optically coupled layers |
CN2006800223554A CN101203783B (en) | 2005-06-21 | 2006-06-21 | Integrated circuit device having optically coupled layers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/158,666 US7570849B2 (en) | 2005-06-21 | 2005-06-21 | Integrated circuit device having optically coupled layers |
US11/158,666 | 2005-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007002449A1 true WO2007002449A1 (en) | 2007-01-04 |
Family
ID=37056954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/024553 WO2007002449A1 (en) | 2005-06-21 | 2006-06-21 | Integrated circuit device having optically coupled layers |
Country Status (6)
Country | Link |
---|---|
US (1) | US7570849B2 (en) |
JP (1) | JP5026416B2 (en) |
KR (1) | KR100959426B1 (en) |
CN (1) | CN101203783B (en) |
DE (1) | DE112006001457T5 (en) |
WO (1) | WO2007002449A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008048633A1 (en) * | 2006-10-16 | 2008-04-24 | Hewlett-Packard Development Company, L.P. | Photonic-based interconnects for interconnecting multiple integrated circuits |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101240558B1 (en) * | 2007-11-05 | 2013-03-06 | 삼성전자주식회사 | Multi-chip with optical interconnection |
KR101329453B1 (en) | 2009-03-20 | 2013-11-15 | 알까뗄 루슨트 | Coherent optical detector having a multifunctional waveguide grating |
US8494315B2 (en) * | 2009-12-17 | 2013-07-23 | Alcatel Lucent | Photonic integrated circuit having a waveguide-grating coupler |
CN102565935B (en) * | 2012-01-31 | 2014-04-16 | 中国科学院长春光学精密机械与物理研究所 | Resonant-coupling two-way transmission photon crystal waveguide and manufacturing method thereof |
CN102645695B (en) * | 2012-05-21 | 2014-11-05 | 河南科技大学 | Doped-layer-free photonic crystal optical fiber with filtering range of 430-630 nm and manufacturing method thereof |
US9685762B1 (en) * | 2014-09-30 | 2017-06-20 | Aurrion, Inc. | Semiconductor optical amplifier with gain flattening filter |
KR20180090107A (en) | 2017-02-02 | 2018-08-10 | 삼성전자주식회사 | Spectrometer and apparatus for measuring substance in body |
DE102018108283A1 (en) * | 2018-04-09 | 2019-10-10 | Carl Zeiss Smt Gmbh | Electro-optical circuit board for contacting photonic integrated circuits |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1136853A1 (en) * | 2000-03-24 | 2001-09-26 | TDK Corporation | Two-dimensional photonic crystal waveguides and wavelength demultiplexers |
US20050078902A1 (en) * | 2003-10-11 | 2005-04-14 | Beausoleil Raymond G. | Photonic interconnect system |
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US5009476A (en) * | 1984-01-16 | 1991-04-23 | Texas Instruments Incorporated | Semiconductor layer with optical communication between chips disposed therein |
CA1255382A (en) * | 1984-08-10 | 1989-06-06 | Masao Kawachi | Hybrid optical integrated circuit with alignment guides |
US5148504A (en) * | 1991-10-16 | 1992-09-15 | At&T Bell Laboratories | Optical integrated circuit designed to operate by use of photons |
EP0617314A4 (en) * | 1992-09-10 | 1995-10-18 | Fujitsu Ltd | Optical circuit system and its constituents. |
KR0126247B1 (en) * | 1992-11-09 | 1997-12-26 | Fujitsu Ltd | Method of coupling optical parts and refractive index imaging material |
US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
US5568574A (en) * | 1995-06-12 | 1996-10-22 | University Of Southern California | Modulator-based photonic chip-to-chip interconnections for dense three-dimensional multichip module integration |
US5761350A (en) * | 1997-01-22 | 1998-06-02 | Koh; Seungug | Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly |
US5999308A (en) * | 1998-04-01 | 1999-12-07 | Massachusetts Institute Of Technology | Methods and systems for introducing electromagnetic radiation into photonic crystals |
US6091879A (en) * | 1998-09-15 | 2000-07-18 | Molecular Optoelectronics Corporation | Organic photochromic compositions and method for fabrication of polymer waveguides |
US6690845B1 (en) * | 1998-10-09 | 2004-02-10 | Fujitsu Limited | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making |
US6684007B2 (en) * | 1998-10-09 | 2004-01-27 | Fujitsu Limited | Optical coupling structures and the fabrication processes |
US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
US6343171B1 (en) * | 1998-10-09 | 2002-01-29 | Fujitsu Limited | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making |
US6785447B2 (en) * | 1998-10-09 | 2004-08-31 | Fujitsu Limited | Single and multilayer waveguides and fabrication process |
CN1156063C (en) * | 2000-06-06 | 2004-06-30 | 中国科学院物理研究所 | Photon crystal micro cavity structure |
JP2002022981A (en) * | 2000-07-05 | 2002-01-23 | Nec Corp | Photonic crystal multiplayered substrate and method for manufacturing the same |
US20040028336A1 (en) * | 2001-09-04 | 2004-02-12 | Feuer Mark D. | Method for fabricating optical devices by assembling multiple wafers containing planar optical waveguides |
JP2002182073A (en) * | 2000-12-11 | 2002-06-26 | Nippon Sheet Glass Co Ltd | Light source-optical fiber coupler |
US6618535B1 (en) * | 2001-04-05 | 2003-09-09 | Nortel Networks Limited | Photonic bandgap device using coupled defects |
US6912330B2 (en) * | 2001-05-17 | 2005-06-28 | Sioptical Inc. | Integrated optical/electronic circuits and associated methods of simultaneous generation thereof |
US6832033B2 (en) * | 2001-06-11 | 2004-12-14 | The University Of Delaware | Hetero-structure photonic bandgap materials |
US6853479B1 (en) * | 2001-08-30 | 2005-02-08 | Oewaves, Inc. | Apparatus and method for coupling light between an optical resonator and a semiconductor chip with a minimum number of components and alignment steps |
EP1436652A2 (en) * | 2001-10-19 | 2004-07-14 | NKT Research & Innovation A/S | Integrated photonic crystal structure and method of producing same |
CN1170175C (en) * | 2002-05-24 | 2004-10-06 | 中国科学院上海微系统与信息技术研究所 | 2D photon Si-base crystal waveguide don insulator with dual insulating burried layers and its preparing process |
JP2004012780A (en) * | 2002-06-06 | 2004-01-15 | Seiko Epson Corp | Optical multiplexer/demultiplexer, apparatus for optical communication, and optical communication system |
JP2004157438A (en) * | 2002-11-08 | 2004-06-03 | Tokai Univ | Optical connecting device, optical circuit, and optical circuit-electronic element consolidation circuit |
JP4171326B2 (en) * | 2003-03-17 | 2008-10-22 | 国立大学法人京都大学 | Resonator and wavelength multiplexer / demultiplexer in two-dimensional photonic crystal |
JP4097568B2 (en) * | 2003-06-18 | 2008-06-11 | 日本航空電子工業株式会社 | Optical recording device |
JP4653393B2 (en) * | 2003-09-18 | 2011-03-16 | 株式会社リコー | Light control element |
US6826339B1 (en) * | 2003-11-14 | 2004-11-30 | Corning Incorporated | Electromagnetically induced transparent (EIT) photonic band-gap fibers |
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JP2005266005A (en) * | 2004-03-16 | 2005-09-29 | Fuji Xerox Co Ltd | Optical circuit with photonic crystal and manufacturing method therefor |
-
2005
- 2005-06-21 US US11/158,666 patent/US7570849B2/en active Active
-
2006
- 2006-06-21 KR KR1020077029725A patent/KR100959426B1/en active IP Right Grant
- 2006-06-21 DE DE112006001457T patent/DE112006001457T5/en not_active Ceased
- 2006-06-21 JP JP2008518456A patent/JP5026416B2/en not_active Expired - Fee Related
- 2006-06-21 WO PCT/US2006/024553 patent/WO2007002449A1/en active Application Filing
- 2006-06-21 CN CN2006800223554A patent/CN101203783B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1136853A1 (en) * | 2000-03-24 | 2001-09-26 | TDK Corporation | Two-dimensional photonic crystal waveguides and wavelength demultiplexers |
US20050078902A1 (en) * | 2003-10-11 | 2005-04-14 | Beausoleil Raymond G. | Photonic interconnect system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008048633A1 (en) * | 2006-10-16 | 2008-04-24 | Hewlett-Packard Development Company, L.P. | Photonic-based interconnects for interconnecting multiple integrated circuits |
US7894699B2 (en) | 2006-10-16 | 2011-02-22 | Hewlett-Packard Development Company, L.P. | Photonic based interconnects for interconnecting multiple integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
JP5026416B2 (en) | 2012-09-12 |
CN101203783B (en) | 2010-10-27 |
US7570849B2 (en) | 2009-08-04 |
US20060285792A1 (en) | 2006-12-21 |
KR100959426B1 (en) | 2010-05-25 |
JP2008544331A (en) | 2008-12-04 |
KR20080012367A (en) | 2008-02-11 |
CN101203783A (en) | 2008-06-18 |
DE112006001457T5 (en) | 2008-04-30 |
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