WO2006110864A3 - Method for improving surface roughness during electro-polishing - Google Patents
Method for improving surface roughness during electro-polishing Download PDFInfo
- Publication number
- WO2006110864A3 WO2006110864A3 PCT/US2006/013804 US2006013804W WO2006110864A3 WO 2006110864 A3 WO2006110864 A3 WO 2006110864A3 US 2006013804 W US2006013804 W US 2006013804W WO 2006110864 A3 WO2006110864 A3 WO 2006110864A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stream
- partial electrode
- electrolyte
- insulator wall
- polishing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Abstract
A surface is electropolished using a stream of electrolyte. A nozzle is used to apply the stream of electrolyte to the surface. The nozzle has an insulator wall and a partial electrode. The insulator wall and the partial electrode form a flow channel for the stream of electrolyte. The stream of electrolyte contacts the insulator wall and the partial electrode when the stream of electrolyte flows through the flow channel formed by the insulator wall and the partial electrode. The insulator wall is less electrically conductive than the partial electrode. A power supply is connected to the partial electrode. The power supply is configured to apply a charge to the stream of electrolyte through the partial electrode when the stream of electrolyte flows through the flow channel formed by the insulator wall and the partial electrode.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67211105P | 2005-04-12 | 2005-04-12 | |
US60/672,111 | 2005-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006110864A2 WO2006110864A2 (en) | 2006-10-19 |
WO2006110864A3 true WO2006110864A3 (en) | 2008-09-25 |
Family
ID=37087692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/013804 WO2006110864A2 (en) | 2005-04-12 | 2006-04-12 | Method for improving surface roughness during electro-polishing |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2006110864A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101891730B1 (en) | 2012-03-30 | 2018-08-24 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Nozzle for stress-free polishing metal layers on semiconductor wafers |
TWI639488B (en) * | 2013-07-31 | 2018-11-01 | 盛美半導體設備(上海)有限公司 | No-stress electrochemical polishing nozzle |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3485744A (en) * | 1966-11-21 | 1969-12-23 | Westinghouse Electric Corp | Zirconium electrode for electro-chemical machining |
US6395152B1 (en) * | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
-
2006
- 2006-04-12 WO PCT/US2006/013804 patent/WO2006110864A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3485744A (en) * | 1966-11-21 | 1969-12-23 | Westinghouse Electric Corp | Zirconium electrode for electro-chemical machining |
US6395152B1 (en) * | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
WO2006110864A2 (en) | 2006-10-19 |
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