WO2006081519A3 - Methods and apparatus for operation of substrate carrier handlers - Google Patents

Methods and apparatus for operation of substrate carrier handlers Download PDF

Info

Publication number
WO2006081519A3
WO2006081519A3 PCT/US2006/003130 US2006003130W WO2006081519A3 WO 2006081519 A3 WO2006081519 A3 WO 2006081519A3 US 2006003130 W US2006003130 W US 2006003130W WO 2006081519 A3 WO2006081519 A3 WO 2006081519A3
Authority
WO
WIPO (PCT)
Prior art keywords
tool
methods
substrate carrier
carrier handlers
specific carrier
Prior art date
Application number
PCT/US2006/003130
Other languages
French (fr)
Other versions
WO2006081519A2 (en
Inventor
Michael Teferra
Amitabh Puri
Eric Englhardt
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/067,302 external-priority patent/US20050209721A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020067022889A priority Critical patent/KR101079487B1/en
Priority to CN2006800002053A priority patent/CN101273312B/en
Publication of WO2006081519A2 publication Critical patent/WO2006081519A2/en
Publication of WO2006081519A3 publication Critical patent/WO2006081519A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.
PCT/US2006/003130 2005-01-28 2006-01-27 Methods and apparatus for operation of substrate carrier handlers WO2006081519A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020067022889A KR101079487B1 (en) 2005-01-28 2006-01-27 Method and apparatus for enhanced operation of substrate carrier handlers
CN2006800002053A CN101273312B (en) 2005-01-28 2006-01-27 Methods and apparatus for enhanced operation of substrate carrier handlers

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US64883805P 2005-01-28 2005-01-28
US60/648,838 2005-01-28
US11/067,302 2005-02-25
US11/067,302 US20050209721A1 (en) 2003-11-06 2005-02-25 Methods and apparatus for enhanced operation of substrate carrier handlers

Publications (2)

Publication Number Publication Date
WO2006081519A2 WO2006081519A2 (en) 2006-08-03
WO2006081519A3 true WO2006081519A3 (en) 2007-02-01

Family

ID=36657280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/003130 WO2006081519A2 (en) 2005-01-28 2006-01-27 Methods and apparatus for operation of substrate carrier handlers

Country Status (4)

Country Link
KR (1) KR101079487B1 (en)
CN (1) CN101273312B (en)
TW (1) TWI350812B (en)
WO (1) WO2006081519A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
JP2010115723A (en) * 2008-11-11 2010-05-27 Seiko Epson Corp Robot and robot system
JP5440518B2 (en) * 2011-01-20 2014-03-12 パナソニック株式会社 Component mounting apparatus and model switching method in component mounting apparatus
US9576834B2 (en) * 2015-03-16 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker and method for dispatching wafer carrier in stocker
CN106909129B (en) * 2017-02-23 2019-10-18 惠科股份有限公司 A kind of method and system of management of shifting products
TWI695805B (en) * 2019-08-14 2020-06-11 力晶積成電子製造股份有限公司 Lot carrying system and lot carrying method
CN115332128A (en) * 2022-10-14 2022-11-11 西安奕斯伟材料科技有限公司 Wafer carrier management system and method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63234511A (en) * 1987-03-24 1988-09-29 Nec Kyushu Ltd Semiconductor substrate treatment device
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JPH06132696A (en) * 1992-10-20 1994-05-13 Tokico Ltd Substrate carrier
EP0850720A1 (en) * 1996-12-24 1998-07-01 Datalogic S.P.A. Manufacturing process for an article
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
US20020114684A1 (en) * 2001-02-22 2002-08-22 Gyu-Chan Jeong Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
US20030202866A1 (en) * 2002-04-25 2003-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for identifying a wafer cassette
US20040187342A1 (en) * 2003-03-25 2004-09-30 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
WO2005006408A1 (en) * 2003-07-11 2005-01-20 Tec-Sem Ag Feeding facility for use in wafer processing methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100278600B1 (en) * 1998-01-14 2001-01-15 윤종용 state management method of equipment unit for management system of a semiconductor process equipment
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
JP3911624B2 (en) * 2001-11-30 2007-05-09 東京エレクトロン株式会社 Processing system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63234511A (en) * 1987-03-24 1988-09-29 Nec Kyushu Ltd Semiconductor substrate treatment device
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JPH06132696A (en) * 1992-10-20 1994-05-13 Tokico Ltd Substrate carrier
EP0850720A1 (en) * 1996-12-24 1998-07-01 Datalogic S.P.A. Manufacturing process for an article
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
US20020114684A1 (en) * 2001-02-22 2002-08-22 Gyu-Chan Jeong Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
US20030202866A1 (en) * 2002-04-25 2003-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for identifying a wafer cassette
US20040187342A1 (en) * 2003-03-25 2004-09-30 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
WO2005006408A1 (en) * 2003-07-11 2005-01-20 Tec-Sem Ag Feeding facility for use in wafer processing methods

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 034 (E - 708) 25 January 1989 (1989-01-25) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 425 (E - 1590) 9 August 1994 (1994-08-09) *

Also Published As

Publication number Publication date
CN101273312B (en) 2012-07-04
CN101273312A (en) 2008-09-24
KR101079487B1 (en) 2011-11-03
TW200635840A (en) 2006-10-16
TWI350812B (en) 2011-10-21
WO2006081519A2 (en) 2006-08-03
KR20070097299A (en) 2007-10-04

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