WO2006071790A3 - Communication systems incorporating control meshes - Google Patents
Communication systems incorporating control meshes Download PDFInfo
- Publication number
- WO2006071790A3 WO2006071790A3 PCT/US2005/046841 US2005046841W WO2006071790A3 WO 2006071790 A3 WO2006071790 A3 WO 2006071790A3 US 2005046841 W US2005046841 W US 2005046841W WO 2006071790 A3 WO2006071790 A3 WO 2006071790A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- communication systems
- circuitry
- systems incorporating
- mesh
- incorporating control
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
- F28F1/405—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element and being formed of wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/122—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Optical Couplings Of Light Guides (AREA)
- Selective Calling Equipment (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
The method of communicating with circuitry that includes providing a woven mesh having elongated conductive elements (201, 202) extending in array forming directions relative to the circuitry, establishing communication sites (203) associated with the mesh elements, located in spaced apart relation, and operating the sites via the mesh to communicate optically with the circuitry, having detection capability.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63880904P | 2004-12-23 | 2004-12-23 | |
US60/638,809 | 2004-12-23 | ||
US64139905P | 2005-01-05 | 2005-01-05 | |
US64142305P | 2005-01-05 | 2005-01-05 | |
US60/641,423 | 2005-01-05 | ||
US60/641,399 | 2005-01-05 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2006071790A2 WO2006071790A2 (en) | 2006-07-06 |
WO2006071790A3 true WO2006071790A3 (en) | 2007-03-29 |
WO2006071790B1 WO2006071790B1 (en) | 2007-05-10 |
Family
ID=36615406
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/046841 WO2006071790A2 (en) | 2004-12-23 | 2005-12-21 | Communication systems incorporating control meshes |
PCT/US2005/046099 WO2006071631A2 (en) | 2004-12-23 | 2005-12-21 | Cooling systems incorporating heat transfer meshes |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/046099 WO2006071631A2 (en) | 2004-12-23 | 2005-12-21 | Cooling systems incorporating heat transfer meshes |
Country Status (9)
Country | Link |
---|---|
US (3) | US7599626B2 (en) |
EP (1) | EP1828701A2 (en) |
JP (1) | JP4989487B2 (en) |
KR (1) | KR20070108124A (en) |
CN (1) | CN101072978B (en) |
AU (1) | AU2005322254A1 (en) |
CA (1) | CA2574862A1 (en) |
MX (1) | MX2007002798A (en) |
WO (2) | WO2006071790A2 (en) |
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US10006720B2 (en) | 2011-08-01 | 2018-06-26 | Teledyne Scientific & Imaging, Llc | System for using active and passive cooling for high power thermal management |
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US9302452B2 (en) | 2012-03-02 | 2016-04-05 | Ppg Industries Ohio, Inc. | Transparent laminates comprising inkjet printed conductive lines and methods of forming the same |
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US5049855A (en) * | 1989-10-24 | 1991-09-17 | Slemon Charles S | Security screen system |
US6215464B1 (en) * | 1997-06-10 | 2001-04-10 | Jorgen Korsgaard Jensen | Stereoscopic intersecting beam phosphorous display system |
US20040125515A1 (en) * | 2002-08-26 | 2004-07-01 | Popovich John M. | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
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-
2005
- 2005-12-20 US US11/314,400 patent/US7599626B2/en active Active
- 2005-12-20 US US11/314,433 patent/US7219715B2/en active Active
- 2005-12-21 MX MX2007002798A patent/MX2007002798A/en active IP Right Grant
- 2005-12-21 JP JP2007548386A patent/JP4989487B2/en active Active
- 2005-12-21 KR KR1020077005594A patent/KR20070108124A/en not_active Application Discontinuation
- 2005-12-21 CN CN2005800301489A patent/CN101072978B/en active Active
- 2005-12-21 WO PCT/US2005/046841 patent/WO2006071790A2/en active Application Filing
- 2005-12-21 AU AU2005322254A patent/AU2005322254A1/en not_active Abandoned
- 2005-12-21 CA CA002574862A patent/CA2574862A1/en not_active Abandoned
- 2005-12-21 EP EP05854760A patent/EP1828701A2/en not_active Withdrawn
- 2005-12-21 WO PCT/US2005/046099 patent/WO2006071631A2/en active Application Filing
-
2006
- 2006-12-01 US US11/606,819 patent/US7694722B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5049855A (en) * | 1989-10-24 | 1991-09-17 | Slemon Charles S | Security screen system |
US6215464B1 (en) * | 1997-06-10 | 2001-04-10 | Jorgen Korsgaard Jensen | Stereoscopic intersecting beam phosphorous display system |
US20040125515A1 (en) * | 2002-08-26 | 2004-07-01 | Popovich John M. | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
Also Published As
Publication number | Publication date |
---|---|
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EP1828701A2 (en) | 2007-09-05 |
WO2006071790A2 (en) | 2006-07-06 |
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JP4989487B2 (en) | 2012-08-01 |
US7694722B2 (en) | 2010-04-13 |
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JP2008526028A (en) | 2008-07-17 |
AU2005322254A1 (en) | 2006-07-06 |
US20060137856A1 (en) | 2006-06-29 |
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