WO2006041889A3 - Conductive pad design modification for better wafer-pad contact - Google Patents

Conductive pad design modification for better wafer-pad contact Download PDF

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Publication number
WO2006041889A3
WO2006041889A3 PCT/US2005/035768 US2005035768W WO2006041889A3 WO 2006041889 A3 WO2006041889 A3 WO 2006041889A3 US 2005035768 W US2005035768 W US 2005035768W WO 2006041889 A3 WO2006041889 A3 WO 2006041889A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact surface
conductive
pad
design modification
metallic coating
Prior art date
Application number
PCT/US2005/035768
Other languages
French (fr)
Other versions
WO2006041889A2 (en
Inventor
Rashid A Mavliev
Lakshmanan Karuppiah
Original Assignee
Applied Materials Inc
Rashid A Mavliev
Lakshmanan Karuppiah
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Rashid A Mavliev, Lakshmanan Karuppiah filed Critical Applied Materials Inc
Publication of WO2006041889A2 publication Critical patent/WO2006041889A2/en
Publication of WO2006041889A3 publication Critical patent/WO2006041889A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H01L21/32125—Planarisation by chemical mechanical polishing [CMP] by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing, e.g. ECMP

Abstract

An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
PCT/US2005/035768 2004-10-05 2005-10-05 Conductive pad design modification for better wafer-pad contact WO2006041889A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61602804P 2004-10-05 2004-10-05
US60/616,028 2004-10-05

Publications (2)

Publication Number Publication Date
WO2006041889A2 WO2006041889A2 (en) 2006-04-20
WO2006041889A3 true WO2006041889A3 (en) 2006-08-03

Family

ID=35539633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/035768 WO2006041889A2 (en) 2004-10-05 2005-10-05 Conductive pad design modification for better wafer-pad contact

Country Status (2)

Country Link
US (1) US7520968B2 (en)
WO (1) WO2006041889A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070153453A1 (en) * 2006-01-05 2007-07-05 Applied Materials, Inc. Fully conductive pad for electrochemical mechanical processing
US20070227901A1 (en) * 2006-03-30 2007-10-04 Applied Materials, Inc. Temperature control for ECMP process
US20070235344A1 (en) * 2006-04-06 2007-10-11 Applied Materials, Inc. Process for high copper removal rate with good planarization and surface finish
US20070251832A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc. Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance
US20070295610A1 (en) * 2006-06-27 2007-12-27 Applied Materials, Inc. Electrolyte retaining on a rotating platen by directional air flow
US7452264B2 (en) * 2006-06-27 2008-11-18 Applied Materials, Inc. Pad cleaning method
US8012000B2 (en) * 2007-04-02 2011-09-06 Applied Materials, Inc. Extended pad life for ECMP and barrier removal
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
DE102009047583A1 (en) * 2009-12-07 2011-06-09 Robert Bosch Gmbh Electrically conductive grinding tool
JP5732354B2 (en) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 Polishing pad
CN104956467B (en) * 2013-01-31 2018-02-16 应用材料公司 Method and apparatus for the base-plate cleaning after chemical-mechanical planarization
TWI662610B (en) 2013-10-25 2019-06-11 美商應用材料股份有限公司 Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
US9676075B2 (en) 2015-06-12 2017-06-13 Globalfoundries Inc. Methods and structures for achieving target resistance post CMP using in-situ resistance measurements
JP6438868B2 (en) * 2015-09-16 2018-12-19 東芝メモリ株式会社 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
US11951590B2 (en) * 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040082289A1 (en) * 2000-02-17 2004-04-29 Butterfield Paul D. Conductive polishing article for electrochemical mechanical polishing
US20040163946A1 (en) * 2000-02-17 2004-08-26 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing

Family Cites Families (154)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE333311A (en) 1925-05-23
US1927162A (en) 1931-02-27 1933-09-19 Research Corp Electroplating
US2112691A (en) * 1936-01-30 1938-03-29 Pyrene Mfg Co Electroplating anode unit
US2240265A (en) * 1937-03-30 1941-04-29 John S Nachtman Method of continuously tin plating ferrous metal stock
US2431065A (en) 1938-12-12 1947-11-18 Meaker Company Continuous wire and strip electro-processing machine
US2392687A (en) * 1943-02-15 1946-01-08 John S Nachtman Apparatus for electroplating wire
US2461556A (en) * 1943-04-01 1949-02-15 Carnegie Illinois Steel Corp Method and apparatus for the electrolytic coating of metal strip
US2544510A (en) * 1943-10-23 1951-03-06 Nat Steel Corp Apparatus and method for plating strips
US2503863A (en) * 1943-11-18 1950-04-11 Siegfried G Bart Apparatus for electroplating the inside of pipes
US2509304A (en) * 1944-02-24 1950-05-30 Nat Steel Corp Method and apparatus for electrolytic coating of strip material
US2453481A (en) 1944-03-14 1948-11-09 Nat Steel Corp Anode for electrolytic coating
US2490055A (en) 1944-03-30 1949-12-06 Nat Steel Corp Metal strip electroplating apparatus
US2495695A (en) * 1944-05-08 1950-01-31 Kenmore Metals Corp Electroplating apparatus
US2536912A (en) * 1944-07-12 1951-01-02 Ibm Electrolysis etching device
US2569578A (en) 1944-08-07 1951-10-02 Nat Steel Corp Apparatus for electrocoating striplike material
US2480022A (en) 1944-10-07 1949-08-23 George B Hogaboom Rotary barrel
US2473290A (en) * 1944-10-21 1949-06-14 George E Millard Apparatus for plating journals of crankshafts
US2456185A (en) 1944-11-23 1948-12-14 Gen Motors Corp Electroplating apparatus
US2517907A (en) 1945-01-05 1950-08-08 Conmar Prod Corp Apparatus for electrotreating metal slide fasteners
US2500205A (en) * 1945-04-12 1950-03-14 Cleveland Graphite Bronze Co Method of plating
US2454935A (en) 1945-06-27 1948-11-30 Meaker Company Continuous wire and strip electroprocessing machine
NL69965C (en) 1945-08-10
US2619454A (en) 1945-08-30 1952-11-25 Brush Dev Co Method of manufacturing a magnetic recording medium by electrodeposition
US2554943A (en) * 1945-10-25 1951-05-29 Bethlehem Steel Corp Electroplating apparatus
US2506794A (en) * 1945-11-23 1950-05-09 Revere Copper & Brass Inc Apparatus for electroplating
US2530677A (en) 1946-01-17 1950-11-21 Edward L Berkenkotter Apparatus for plating crankshafts
US2457510A (en) 1946-01-23 1948-12-28 Delbert G Van Ornum Electroplating apparatus
US2519945A (en) 1946-01-25 1950-08-22 Gen Electric Electroplating apparatus
US2477808A (en) 1946-05-08 1949-08-02 Carl G Jones Electrolytic apparatus for treatment of moving strip
US2576074A (en) 1946-06-11 1951-11-20 John S Nachtman Method and apparatus for continuous strip metal treatment
US2479323A (en) 1946-06-13 1949-08-16 Udylite Corp Plating machine
US2512328A (en) * 1946-06-28 1950-06-20 Armco Steel Corp Continuous electroplating device
US2500206A (en) * 1946-06-29 1950-03-14 Cleveland Graphite Bronze Co Apparatus for plating
US2560534A (en) 1946-07-12 1951-07-17 Nat Standard Co Method of operating a continuous electroplating system
US2539898A (en) * 1946-08-16 1951-01-30 Udylite Corp Electrical contact mechanism for plating machines
US2549678A (en) * 1946-08-23 1951-04-17 Conn Ltd C G Method of and apparatus for electroforming metal articles
US2556017A (en) * 1947-01-29 1951-06-05 Edwin E Vonada Electrolytic method and apparatus for cleaning strip
US2535966A (en) 1947-02-07 1950-12-26 Teplitz Alfred Electrolytic apparatus for cleaning strip
US2540175A (en) * 1947-02-11 1951-02-06 Rosenqvist Gunnar Manufacture by electrodeposition
US2569577A (en) 1947-05-09 1951-10-02 Nat Steel Corp Method of and apparatus for electroplating
US2458676A (en) * 1947-07-22 1949-01-11 Brenner Abner Apparatus for electroplating
US2560966A (en) 1947-07-31 1951-07-17 Revere Copper & Brass Inc Method of electroplating copper clad stainless steel cooking vessels
US2571709A (en) 1947-08-26 1951-10-16 Western Electric Co Apparatus for electroplating articles
US2646398A (en) 1948-10-08 1953-07-21 Gen Motors Corp Electroprocessing apparatus
BE494578A (en) * 1949-03-18
US2689215A (en) 1949-07-13 1954-09-14 Siegfried G Bart Method and apparatus for plating pipe
US2587630A (en) * 1949-07-28 1952-03-04 Sulphide Ore Process Company I Method for electrodeposition of iron in the form of continuous strips
US2656283A (en) 1949-08-31 1953-10-20 Ohio Commw Eng Co Method of plating wire
US2656284A (en) 1949-09-07 1953-10-20 Ohio Commw Eng Co Method of plating rolled sheet metal
US2657457A (en) 1949-09-10 1953-11-03 Ohio Commw Eng Co Continuous metal production and continuous gas plating
US2684939A (en) 1949-12-17 1954-07-27 Time Inc Apparatus for plating chromium
US2633452A (en) * 1950-05-03 1953-03-31 Jr George B Hogaboom Strainer bags for enclosing electroplating anodes
US2657177A (en) 1950-07-10 1953-10-27 United States Steel Corp Plating thickness regulator
US2674550A (en) * 1950-09-05 1954-04-06 Kolene Corp Apparatus and method for processing of steel strip continuously
US2680710A (en) * 1950-09-14 1954-06-08 Kenmore Metal Corp Method and apparatus for continuously electroplating heavy wire and similar strip material
US2675348A (en) * 1950-09-16 1954-04-13 Greenspan Lawrence Apparatus for metal plating
US2706173A (en) * 1950-10-12 1955-04-12 Harold R Wells Apparatus for electro-plating crankshaft journals
US2673836A (en) * 1950-11-22 1954-03-30 United States Steel Corp Continuous electrolytic pickling and tin plating of steel strip
US2696859A (en) 1950-12-16 1954-12-14 Gildo J Somma Screw driver attachment
US2695269A (en) 1951-03-02 1954-11-23 United States Steel Corp Apparatus for electroplating wire
US2698832A (en) * 1951-03-20 1955-01-04 Standard Process Corp Plating apparatus
US2711993A (en) * 1951-05-01 1955-06-28 Lyon George Albert Apparatus for conveying cylindrical articles through a bath
US2710834A (en) * 1951-10-27 1955-06-14 Vrilakas Marcus Apparatus for selective plating
US2708445A (en) * 1952-07-11 1955-05-17 Nat Standard Co Wire processing apparatus
US3162588A (en) 1961-04-17 1964-12-22 Hammond Machinery Builders Inc Belt type electrolytic grinding machine
US3334041A (en) 1964-08-28 1967-08-01 Norton Co Coated abrasives
US3476677A (en) 1965-02-15 1969-11-04 Carbond Corp Electrolytic grinding tools
US3433730A (en) * 1965-04-28 1969-03-18 Gen Electric Electrically conductive tool and method for making
US3448023A (en) 1966-01-20 1969-06-03 Hammond Machinery Builders Inc Belt type electro-chemical (or electrolytic) grinding machine
US3942959A (en) * 1967-12-22 1976-03-09 Fabriksaktiebolaget Eka Multilayered flexible abrasive containing a layer of electroconductive material
AU3308268A (en) 1968-02-05 1970-03-12 Raynors Pty. Limited Plating and anodising bath racks
US3992178A (en) 1973-04-17 1976-11-16 Fabrika Ab Eka Flexible coated abrasive with graphite outer layer
US3873512A (en) * 1973-04-30 1975-03-25 Martin Marietta Corp Machining method
US4001094A (en) * 1974-09-19 1977-01-04 Jumer John F Method for incremental electro-processing of large areas
US4047902A (en) 1975-04-01 1977-09-13 Wiand Richard K Metal-plated abrasive product and method of manufacturing the product
GB1539309A (en) 1976-12-14 1979-01-31 Inoue Japax Res Electrochemical polishing
US4119515A (en) 1977-03-28 1978-10-10 National Steel Corporation Apparatus for electroplating sheet metals
US4312716A (en) * 1980-11-21 1982-01-26 Western Electric Co., Inc. Supporting an array of elongate articles
US4523411A (en) 1982-12-20 1985-06-18 Minnesota Mining And Manufacturing Company Wet surface treating device and element therefor
US4704511A (en) 1985-10-17 1987-11-03 Inoue-Japax Research Incorporated Traveling-wire electroerosion machine with swiveling nozzle assembly
JPS62127492A (en) 1985-11-26 1987-06-09 Shigeo Hoshino Electroplating method using carbon fiber
US4839993A (en) 1986-01-28 1989-06-20 Fujisu Limited Polishing machine for ferrule of optical fiber connector
ES2024439B3 (en) 1986-02-28 1992-03-01 Schering Ag Berlin Und Bergkamen EXTENDED FRAMES AND CORRESPONDING PARTS FOR THE RELEASABLE FIXATION OF PRINTED CIRCUIT PLATES TO BE GALVANIZED, AND CORRESPONDING PRINTED CIRCUIT PLATES.
US4772361A (en) 1987-12-04 1988-09-20 Dorsett Terry E Application of electroplate to moving metal by belt plating
US4793895A (en) 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
JPH01193166A (en) 1988-01-28 1989-08-03 Showa Denko Kk Pad for specularly grinding semiconductor wafer
US4934102A (en) 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
JP2601333B2 (en) * 1988-10-05 1997-04-16 三井金属鉱業株式会社 Composite whetstone and method of manufacturing the same
CH678156A5 (en) 1989-03-20 1991-08-15 Exnii Metallorezh Stankov
US5061294A (en) 1989-05-15 1991-10-29 Minnesota Mining And Manufacturing Company Abrasive article with conductive, doped, conjugated, polymer coat and method of making same
US5108463B1 (en) * 1989-08-21 1996-08-13 Minnesota Mining & Mfg Conductive coated abrasives
US5136817A (en) 1990-02-28 1992-08-11 Nihon Dempa Kogyo Co., Ltd. Automatic lapping apparatus for piezoelectric materials
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5137542A (en) 1990-08-08 1992-08-11 Minnesota Mining And Manufacturing Company Abrasive printed with an electrically conductive ink
US5066370A (en) 1990-09-07 1991-11-19 International Business Machines Corporation Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
US5096550A (en) * 1990-10-15 1992-03-17 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for spatially uniform electropolishing and electrolytic etching
US5217586A (en) 1992-01-09 1993-06-08 International Business Machines Corporation Electrochemical tool for uniform metal removal during electropolishing
US5203884A (en) * 1992-06-04 1993-04-20 Minnesota Mining And Manufacturing Company Abrasive article having vanadium oxide incorporated therein
US5225034A (en) 1992-06-04 1993-07-06 Micron Technology, Inc. Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
US5562529A (en) * 1992-10-08 1996-10-08 Fujitsu Limited Apparatus and method for uniformly polishing a wafer
JPH08112769A (en) * 1994-10-14 1996-05-07 Fuji Photo Film Co Ltd Abrasive tape
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5882491A (en) * 1996-01-02 1999-03-16 Skf Industrial Trading & Development Company B.V. Electrode for electrochemical machining, method of electrochemical machining with said electrode, a bearing and a method of determining a profile using said electrode
NL1003233C2 (en) * 1996-05-30 1997-12-03 Skf Ind Trading & Dev A method for manufacturing a bearing ring and a bearing comprising such a bearing ring.
US5871392A (en) * 1996-06-13 1999-02-16 Micron Technology, Inc. Under-pad for chemical-mechanical planarization of semiconductor wafers
US6056851A (en) * 1996-06-24 2000-05-02 Taiwan Semiconductor Manufacturing Company Slurry supply system for chemical mechanical polishing
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6020264A (en) * 1997-01-31 2000-02-01 International Business Machines Corporation Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing
US6537140B1 (en) * 1997-05-14 2003-03-25 Saint-Gobain Abrasives Technology Company Patterned abrasive tools
US6692338B1 (en) * 1997-07-23 2004-02-17 Lsi Logic Corporation Through-pad drainage of slurry during chemical mechanical polishing
US6033293A (en) * 1997-10-08 2000-03-07 Lucent Technologies Inc. Apparatus for performing chemical-mechanical polishing
US6372001B1 (en) * 1997-10-09 2002-04-16 3M Innovative Properties Company Abrasive articles and their preparations
WO1999026758A1 (en) * 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
US6391166B1 (en) * 1998-02-12 2002-05-21 Acm Research, Inc. Plating apparatus and method
US6210257B1 (en) * 1998-05-29 2001-04-03 Micron Technology, Inc. Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6190494B1 (en) * 1998-07-29 2001-02-20 Micron Technology, Inc. Method and apparatus for electrically endpointing a chemical-mechanical planarization process
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
JP2000141215A (en) * 1998-11-05 2000-05-23 Sony Corp Flattening grinding device and its method
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
US6238592B1 (en) * 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
EP1052062A1 (en) * 1999-05-03 2000-11-15 Applied Materials, Inc. Pré-conditioning fixed abrasive articles
US6381169B1 (en) * 1999-07-01 2002-04-30 The Regents Of The University Of California High density non-volatile memory device
US6234870B1 (en) * 1999-08-24 2001-05-22 International Business Machines Corporation Serial intelligent electro-chemical-mechanical wafer processor
US6520843B1 (en) * 1999-10-27 2003-02-18 Strasbaugh High planarity chemical mechanical planarization
US6551179B1 (en) * 1999-11-05 2003-04-22 Strasbaugh Hard polishing pad for chemical mechanical planarization
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
US6368184B1 (en) * 2000-01-06 2002-04-09 Advanced Micro Devices, Inc. Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes
US6630059B1 (en) * 2000-01-14 2003-10-07 Nutool, Inc. Workpeice proximity plating apparatus
US6368190B1 (en) * 2000-01-26 2002-04-09 Agere Systems Guardian Corp. Electrochemical mechanical planarization apparatus and method
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US6537144B1 (en) * 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6383066B1 (en) * 2000-06-23 2002-05-07 International Business Machines Corporation Multilayered polishing pad, method for fabricating, and use thereof
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7160176B2 (en) * 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US6561889B1 (en) * 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US6517426B2 (en) * 2001-04-05 2003-02-11 Lam Research Corporation Composite polishing pad for chemical-mechanical polishing
US20030013397A1 (en) * 2001-06-27 2003-01-16 Rhoades Robert L. Polishing pad of polymer coating
KR20030015567A (en) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 Chemical mechanical polishing pad having wave grooves
US6884724B2 (en) * 2001-08-24 2005-04-26 Applied Materials, Inc. Method for dishing reduction and feature passivation in polishing processes
US6856761B2 (en) * 2003-06-06 2005-02-15 Kevin Doran Wallpaper removing steamers
US6848977B1 (en) * 2003-08-29 2005-02-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad for electrochemical mechanical polishing
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040082289A1 (en) * 2000-02-17 2004-04-29 Butterfield Paul D. Conductive polishing article for electrochemical mechanical polishing
US20040163946A1 (en) * 2000-02-17 2004-08-26 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing

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