WO2006031975A3 - Improved systems and methods for wafer translation - Google Patents

Improved systems and methods for wafer translation Download PDF

Info

Publication number
WO2006031975A3
WO2006031975A3 PCT/US2005/032945 US2005032945W WO2006031975A3 WO 2006031975 A3 WO2006031975 A3 WO 2006031975A3 US 2005032945 W US2005032945 W US 2005032945W WO 2006031975 A3 WO2006031975 A3 WO 2006031975A3
Authority
WO
WIPO (PCT)
Prior art keywords
transfer
methods
improved systems
automation system
wafer translation
Prior art date
Application number
PCT/US2005/032945
Other languages
French (fr)
Other versions
WO2006031975A2 (en
Inventor
Victor Mimken
Original Assignee
Applied Materials Inc
Victor Mimken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Victor Mimken filed Critical Applied Materials Inc
Publication of WO2006031975A2 publication Critical patent/WO2006031975A2/en
Publication of WO2006031975A3 publication Critical patent/WO2006031975A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Abstract

A two-axis automation system (100) can be used to transfer and rotate wafers between horizontal and vertical orientations necessary for differing steps in a semiconductor fabrication process. The two rotational axes (104, 106) allow for the transfer and rotation to be done in a minimal space and with a minimum amount of swept volume. A transfer arm (102) of the automation system (100) can include a pair of load pads (300, 302) capable of loading and unloading a wafer processing chamber in a single sweep.
PCT/US2005/032945 2004-09-15 2005-09-15 Improved systems and methods for wafer translation WO2006031975A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/941,600 2004-09-15
US10/941,600 US7993093B2 (en) 2004-09-15 2004-09-15 Systems and methods for wafer translation

Publications (2)

Publication Number Publication Date
WO2006031975A2 WO2006031975A2 (en) 2006-03-23
WO2006031975A3 true WO2006031975A3 (en) 2006-07-27

Family

ID=35508280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/032945 WO2006031975A2 (en) 2004-09-15 2005-09-15 Improved systems and methods for wafer translation

Country Status (3)

Country Link
US (1) US7993093B2 (en)
TW (1) TW200614332A (en)
WO (1) WO2006031975A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090029560A1 (en) * 2001-12-07 2009-01-29 Applied Materials, Inc. Apparatus and method for single substrate processing
US20070079932A1 (en) * 2001-12-07 2007-04-12 Applied Materials, Inc. Directed purge for contact free drying of wafers
US20080000495A1 (en) * 2001-12-07 2008-01-03 Eric Hansen Apparatus and method for single substrate processing
US7896602B2 (en) * 2006-06-09 2011-03-01 Lutz Rebstock Workpiece stocker with circular configuration
US20080112787A1 (en) 2006-11-15 2008-05-15 Dynamic Micro Systems Removable compartments for workpiece stocker
US20080155852A1 (en) * 2006-12-29 2008-07-03 Olgado Donald J K Multiple substrate vapor drying systems and methods
US7980000B2 (en) 2006-12-29 2011-07-19 Applied Materials, Inc. Vapor dryer having hydrophilic end effector
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US20080236615A1 (en) * 2007-03-28 2008-10-02 Mimken Victor B Method of processing wafers in a sequential fashion
US20110116900A1 (en) * 2009-11-18 2011-05-19 Applied Materials, Inc. Substrate alignment apparatus
US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
US9287151B2 (en) * 2014-01-10 2016-03-15 Taiwan Semiconductor Manufacturing Co., Ltd Systems and method for transferring a semiconductor substrate
JP6456768B2 (en) * 2015-05-18 2019-01-23 株式会社ディスコ Processing equipment
KR102378623B1 (en) * 2019-11-08 2022-03-24 사이언테크 코포레이션 Wet processing device for substrates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
US5096364A (en) * 1986-04-28 1992-03-17 Varian Associates, Inc. Wafer arm handler mechanism
WO2000002808A1 (en) * 1998-07-11 2000-01-20 Semitool, Inc. Robots for microelectronic workpiece handling
JP2000260858A (en) * 1999-03-12 2000-09-22 Sumitomo Heavy Ind Ltd Wafer transfer hand and wafer transfer method using the same
JP2004055697A (en) * 2002-07-17 2004-02-19 Ace:Kk Apparatus and method for transferring and conveying substrate

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1158760A1 (en) * 1983-11-03 1985-05-30 Davydov Vladimir S Device for bracing the members of mine roof support
EP0198501B1 (en) * 1985-04-17 1992-07-01 Hitachi, Ltd. Gripping device
US4778332A (en) * 1987-02-09 1988-10-18 The Perkin-Elmer Corporation Wafer flip apparatus
US5615988A (en) 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability
JP2676334B2 (en) * 1995-07-31 1997-11-12 住友重機械工業株式会社 Robot arm
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
US6132165A (en) * 1998-02-23 2000-10-17 Applied Materials, Inc. Single drive, dual plane robot
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
JP2002531942A (en) * 1998-12-02 2002-09-24 ニューポート・コーポレーション Robot arm end effector holding sample
JP3437812B2 (en) * 2000-02-07 2003-08-18 タツモ株式会社 Substrate transfer device
AU2001286946A1 (en) * 2000-09-01 2002-03-13 Asyst Technologies, Inc. Edge grip aligner with buffering capabilities
US6592324B2 (en) * 2001-02-26 2003-07-15 Irm, Llc Gripper mechanism
JP2003007664A (en) * 2001-06-22 2003-01-10 Ses Co Ltd Method and apparatus for cleaning single wafer
US6726848B2 (en) 2001-12-07 2004-04-27 Scp Global Technologies, Inc. Apparatus and method for single substrate processing
JP2003273187A (en) * 2002-03-12 2003-09-26 Matsushita Electric Ind Co Ltd Method and equipment for transferring thin plate material
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
JP3592702B1 (en) * 2003-08-12 2004-11-24 エス・イー・エス株式会社 Substrate processing method and substrate processing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5096364A (en) * 1986-04-28 1992-03-17 Varian Associates, Inc. Wafer arm handler mechanism
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
WO2000002808A1 (en) * 1998-07-11 2000-01-20 Semitool, Inc. Robots for microelectronic workpiece handling
JP2000260858A (en) * 1999-03-12 2000-09-22 Sumitomo Heavy Ind Ltd Wafer transfer hand and wafer transfer method using the same
JP2004055697A (en) * 2002-07-17 2004-02-19 Ace:Kk Apparatus and method for transferring and conveying substrate

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 12 3 January 2001 (2001-01-03) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) *

Also Published As

Publication number Publication date
US20060104795A1 (en) 2006-05-18
WO2006031975A2 (en) 2006-03-23
US7993093B2 (en) 2011-08-09
TW200614332A (en) 2006-05-01

Similar Documents

Publication Publication Date Title
WO2006031975A3 (en) Improved systems and methods for wafer translation
US10553469B2 (en) Sealed substrate carriers and systems and methods for transporting substrates
JP5268126B2 (en) Dual robot transfer system
ATE311619T1 (en) SEMICONDUCTOR WAFER DEVELOPMENT DEVICE WITH VERTICALLY STACKED DEVELOPMENT ROOMS AND SINGLE-AXIS DUAL WAFER TRANSFER SYSTEM
WO2003100837A3 (en) Large substrate test system
TWI749207B (en) Substrate cleaning apparatus and substrate processing apparatus
EP1405336A2 (en) Substrate processing method
CN108630585A (en) Substrate carrier
EP1047114A3 (en) A method of detecting the position of a wafer
CN111656506A (en) Apparatus for processing substrates of various sizes
CN102047407A (en) Processing chamber
US8322963B2 (en) End effector for a cluster tool
TW202314271A (en) Smart vibration wafer with optional integration with semiconductor processing tool
CN109564888A (en) Substrate transports hand, baseplate transportation robot and substrate shifting apparatus
EP1052681A3 (en) A method and apparatus for processing wafers
US9352471B1 (en) Substrate gripper apparatus and methods
EP1422742A3 (en) System for processing semiconductor wafers
CN115519526A (en) Substrate transfer robot for transferring substrate in vacuum chamber
US7585142B2 (en) Substrate handling chamber with movable substrate carrier loading platform
WO2004109748A3 (en) Supporting shelf for front opening unified pod
TW202224849A (en) Substrate handling systems and methods for cmp processing
CN209981183U (en) Wafer boat cleaning device
US20080156359A1 (en) Systems and methods for modular and configurable substrate cleaning
TW200616090A (en) Versatile semi-toroidal processing furnace with automatic and reconfigurable wafer exchange
WO2002095795A3 (en) Device for receiving plate-shaped objects

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase