WO2006019446A3 - Double inspection of reticle or wafer - Google Patents

Double inspection of reticle or wafer Download PDF

Info

Publication number
WO2006019446A3
WO2006019446A3 PCT/US2005/015932 US2005015932W WO2006019446A3 WO 2006019446 A3 WO2006019446 A3 WO 2006019446A3 US 2005015932 W US2005015932 W US 2005015932W WO 2006019446 A3 WO2006019446 A3 WO 2006019446A3
Authority
WO
WIPO (PCT)
Prior art keywords
reticle
coordinates
wafer
consecutive frames
defects
Prior art date
Application number
PCT/US2005/015932
Other languages
French (fr)
Other versions
WO2006019446A2 (en
Inventor
Ron Naftali
Yochanan Madmon
Gavriel Speyer
Oren Boiman
Original Assignee
Applied Materials Israel Ltd
Applied Materials Inc
Ron Naftali
Yochanan Madmon
Gavriel Speyer
Oren Boiman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2004/023395 external-priority patent/WO2005010510A1/en
Application filed by Applied Materials Israel Ltd, Applied Materials Inc, Ron Naftali, Yochanan Madmon, Gavriel Speyer, Oren Boiman filed Critical Applied Materials Israel Ltd
Publication of WO2006019446A2 publication Critical patent/WO2006019446A2/en
Publication of WO2006019446A3 publication Critical patent/WO2006019446A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

Abstract

During mask or reticle inspection, each region is scanned at least twice, using an overlap between each pair of consecutive frames. System contamination and camera blemishes have approximately constant frame coordinates, while mask defects have constant reticle coordinates, but inconstant scan frame coordinates. True defects are detected at different coordinates in consecutive frames with a known displacement therebetween.
PCT/US2005/015932 2004-07-19 2005-05-04 Double inspection of reticle or wafer WO2006019446A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
PCT/US2004/023395 WO2005010510A1 (en) 2003-07-21 2004-07-19 Double inspection on reticle/wafer
USPCT/US2004/023395 2004-07-19
US92332204A 2004-08-20 2004-08-20
US10/923,322 2004-08-20

Publications (2)

Publication Number Publication Date
WO2006019446A2 WO2006019446A2 (en) 2006-02-23
WO2006019446A3 true WO2006019446A3 (en) 2006-05-04

Family

ID=34969055

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/015932 WO2006019446A2 (en) 2004-07-19 2005-05-04 Double inspection of reticle or wafer

Country Status (1)

Country Link
WO (1) WO2006019446A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7433033B2 (en) 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
US8049878B2 (en) * 2008-08-22 2011-11-01 Corning Incorporated Systems and methods for detecting defects in ceramic filter bodies
US9128064B2 (en) 2012-05-29 2015-09-08 Kla-Tencor Corporation Super resolution inspection system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081325A (en) * 1996-06-04 2000-06-27 Kla-Tencor Corporation Optical scanning system for surface inspection
US6122397A (en) * 1997-07-03 2000-09-19 Tri Path Imaging, Inc. Method and apparatus for maskless semiconductor and liquid crystal display inspection
WO2005010510A1 (en) * 2003-07-21 2005-02-03 Applied Materials Israel, Ltd. Double inspection on reticle/wafer
WO2005026706A1 (en) * 2003-09-04 2005-03-24 Applied Materials Israel, Ltd. Method for high efficiency multipass article inspection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081325A (en) * 1996-06-04 2000-06-27 Kla-Tencor Corporation Optical scanning system for surface inspection
US6122397A (en) * 1997-07-03 2000-09-19 Tri Path Imaging, Inc. Method and apparatus for maskless semiconductor and liquid crystal display inspection
WO2005010510A1 (en) * 2003-07-21 2005-02-03 Applied Materials Israel, Ltd. Double inspection on reticle/wafer
WO2005026706A1 (en) * 2003-09-04 2005-03-24 Applied Materials Israel, Ltd. Method for high efficiency multipass article inspection

Also Published As

Publication number Publication date
WO2006019446A2 (en) 2006-02-23

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