WO2005110915A1 - Reduction of etching charge damage in manufacture of microelectromechanical devices - Google Patents
Reduction of etching charge damage in manufacture of microelectromechanical devices Download PDFInfo
- Publication number
- WO2005110915A1 WO2005110915A1 PCT/US2005/013462 US2005013462W WO2005110915A1 WO 2005110915 A1 WO2005110915 A1 WO 2005110915A1 US 2005013462 W US2005013462 W US 2005013462W WO 2005110915 A1 WO2005110915 A1 WO 2005110915A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive
- conductive layers
- layer
- layers together
- etch
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00563—Avoid or control over-etching
- B81C1/00579—Avoid charge built-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/0008—Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020067023026A KR101162192B1 (en) | 2004-05-04 | 2005-04-20 | Reduction of etching charge damage in manufacture of microelectromechanical devices |
CN2005800139140A CN1950291B (en) | 2004-05-04 | 2005-04-20 | Reduction of etching charge damage in manufacture of microelectromechanical devices |
JP2007511399A JP4603039B2 (en) | 2004-05-04 | 2005-04-20 | Reduction of etching charge damage in the manufacture of microelectromechanical elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/839,329 | 2004-05-04 | ||
US10/839,329 US7476327B2 (en) | 2004-05-04 | 2004-05-04 | Method of manufacture for microelectromechanical devices |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005110915A1 true WO2005110915A1 (en) | 2005-11-24 |
Family
ID=34966567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/013462 WO2005110915A1 (en) | 2004-05-04 | 2005-04-20 | Reduction of etching charge damage in manufacture of microelectromechanical devices |
Country Status (6)
Country | Link |
---|---|
US (2) | US7476327B2 (en) |
JP (1) | JP4603039B2 (en) |
KR (1) | KR101162192B1 (en) |
CN (1) | CN1950291B (en) |
TW (1) | TWI286124B (en) |
WO (1) | WO2005110915A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009527371A (en) * | 2006-02-22 | 2009-07-30 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Electrical adjustment of MEMS device and its insulating layer |
JP2010521318A (en) * | 2007-02-20 | 2010-06-24 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Apparatus and method for performing MEMS etching |
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Also Published As
Publication number | Publication date |
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CN1950291A (en) | 2007-04-18 |
US20050249966A1 (en) | 2005-11-10 |
KR101162192B1 (en) | 2012-07-05 |
US7704772B2 (en) | 2010-04-27 |
JP4603039B2 (en) | 2010-12-22 |
TW200607750A (en) | 2006-03-01 |
TWI286124B (en) | 2007-09-01 |
US20090068781A1 (en) | 2009-03-12 |
JP2007536097A (en) | 2007-12-13 |
CN1950291B (en) | 2011-01-05 |
KR20070004943A (en) | 2007-01-09 |
US7476327B2 (en) | 2009-01-13 |
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