WO2005100497A1 - Cmp porous pad with component-filled pores - Google Patents
Cmp porous pad with component-filled pores Download PDFInfo
- Publication number
- WO2005100497A1 WO2005100497A1 PCT/US2005/008527 US2005008527W WO2005100497A1 WO 2005100497 A1 WO2005100497 A1 WO 2005100497A1 US 2005008527 W US2005008527 W US 2005008527W WO 2005100497 A1 WO2005100497 A1 WO 2005100497A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing pad
- pores
- component
- polishing
- polymeric material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127016015A KR20120087991A (en) | 2004-03-23 | 2005-03-14 | Cmp porous pad with component-filled pores |
KR1020067019556A KR101178335B1 (en) | 2004-03-23 | 2005-03-14 | Cmp porous pad with component-filled pores |
CN2005800085827A CN1934208B (en) | 2004-03-23 | 2005-03-14 | Cmp porous pad with component-filled pores |
JP2007505008A JP2007531276A (en) | 2004-03-23 | 2005-03-14 | CMP porous pad having a plurality of pores filled with components |
EP05725594.5A EP1751243B1 (en) | 2004-03-23 | 2005-03-14 | Cmp porous pad with component-filled pores |
IL176955A IL176955A (en) | 2004-03-23 | 2006-07-19 | Cmp porous pad with component-filled pores |
IL215969A IL215969A0 (en) | 2004-03-23 | 2011-10-26 | Cmp porous pad with component-filled pores |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/807,064 US7195544B2 (en) | 2004-03-23 | 2004-03-23 | CMP porous pad with component-filled pores |
US10/807,064 | 2004-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005100497A1 true WO2005100497A1 (en) | 2005-10-27 |
Family
ID=34962652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/008527 WO2005100497A1 (en) | 2004-03-23 | 2005-03-14 | Cmp porous pad with component-filled pores |
Country Status (9)
Country | Link |
---|---|
US (2) | US7195544B2 (en) |
EP (1) | EP1751243B1 (en) |
JP (1) | JP2007531276A (en) |
KR (2) | KR101178335B1 (en) |
CN (1) | CN1934208B (en) |
IL (2) | IL176955A (en) |
MY (2) | MY139413A (en) |
TW (1) | TWI280266B (en) |
WO (1) | WO2005100497A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8546457B2 (en) | 2007-08-14 | 2013-10-01 | Basf Se | Method for the production of abrasive foams |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10456886B2 (en) | 2016-01-19 | 2019-10-29 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
US10537974B2 (en) | 2014-10-17 | 2020-01-21 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US11446788B2 (en) | 2014-10-17 | 2022-09-20 | Applied Materials, Inc. | Precursor formulations for polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US20070010175A1 (en) * | 2005-07-07 | 2007-01-11 | San Fang Chemical Industry Co., Ltd. | Polishing pad and method of producing same |
EP1910453B1 (en) * | 2005-07-19 | 2017-01-25 | Dow Global Technologies LLC | Frothed thermoplastic foam and its uses in sanitary applications |
TW200709892A (en) * | 2005-08-18 | 2007-03-16 | Rohm & Haas Elect Mat | Transparent polishing pad |
TWI378844B (en) * | 2005-08-18 | 2012-12-11 | Rohm & Haas Elect Mat | Polishing pad and method of manufacture |
US7438636B2 (en) * | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
JP5514806B2 (en) * | 2008-04-29 | 2014-06-04 | セミクエスト・インコーポレーテッド | Polishing pad composition, method for producing the same and use thereof |
TWI409137B (en) * | 2008-06-19 | 2013-09-21 | Bestac Advanced Material Co Ltd | Polishing pad and the method of forming micro-structure thereof |
TWM352127U (en) * | 2008-08-29 | 2009-03-01 | Bestac Advanced Material Co Ltd | Polishing pad |
JP5377909B2 (en) * | 2008-09-03 | 2013-12-25 | 東洋ゴム工業株式会社 | Polishing pad and manufacturing method thereof |
TWM352126U (en) * | 2008-10-23 | 2009-03-01 | Bestac Advanced Material Co Ltd | Polishing pad |
TWI465315B (en) * | 2008-11-12 | 2014-12-21 | Bestac Advanced Material Co Ltd | Conductive polishing pad and method for making the same |
DE102008059044B4 (en) * | 2008-11-26 | 2013-08-22 | Siltronic Ag | A method of polishing a semiconductor wafer with a strained-relaxed Si1-xGex layer |
IL196146A (en) | 2008-12-23 | 2014-01-30 | Elta Systems Ltd | System and method of transmitting a signal back towards a transmitting source |
JP5393434B2 (en) * | 2008-12-26 | 2014-01-22 | 東洋ゴム工業株式会社 | Polishing pad and manufacturing method thereof |
WO2010123744A2 (en) * | 2009-04-23 | 2010-10-28 | Cabot Microelectronics Corporation | Cmp porous pad with particles in a polymeric matrix |
US8702479B2 (en) | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
US8257152B2 (en) * | 2010-11-12 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Silicate composite polishing pad |
JP2012245582A (en) * | 2011-05-27 | 2012-12-13 | Nippon Electric Glass Co Ltd | Method for manufacturing cerium oxide-based abrasive |
US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
JP2015185815A (en) * | 2014-03-26 | 2015-10-22 | 株式会社東芝 | Polishing pad, polishing method and manufacturing method of semiconductor device |
US9238294B2 (en) * | 2014-06-18 | 2016-01-19 | Nexplanar Corporation | Polishing pad having porogens with liquid filler |
JP2016087770A (en) * | 2014-11-11 | 2016-05-23 | 株式会社東芝 | Polishing cloth and polishing method |
US10946495B2 (en) | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
CN107866753A (en) * | 2017-12-08 | 2018-04-03 | 清华大学 | With random cellular structure metals binding agent sand wheel, device and preparation technology |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
CN113977453B (en) * | 2021-11-08 | 2023-01-13 | 万华化学集团电子材料有限公司 | Chemical mechanical polishing pad for improving polishing flatness and application thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010053658A1 (en) * | 2000-03-15 | 2001-12-20 | Budinger William D. | Window portion with an adjusted rate of wear |
US20020173225A1 (en) * | 1998-12-01 | 2002-11-21 | Yuchun Wang | Chemical mechanical polishing endpoint detection |
US20030060137A1 (en) * | 2001-08-30 | 2003-03-27 | Steve Kramer | CMP pad having isolated pockets of continuous porosity and a method for using such pad |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3769093A (en) * | 1970-08-21 | 1973-10-30 | Gen Electric | Vacuum loading process for the manufacture of a narrow pore fluid electrode |
US4127515A (en) * | 1974-10-21 | 1978-11-28 | Colgate-Palmolive Company | Waxing sponge |
DE2632545C2 (en) * | 1976-07-20 | 1984-04-26 | Collo Gmbh, 5303 Bornheim | Cleaning body for personal care, household purposes and the like. |
US4138228A (en) * | 1977-02-02 | 1979-02-06 | Ralf Hoehn | Abrasive of a microporous polymer matrix with inorganic particles thereon |
US4470859A (en) * | 1981-06-26 | 1984-09-11 | Diamond Shamrock Chemicals Company | Coated porous substrate formation by solution coating |
US4581287A (en) * | 1984-06-18 | 1986-04-08 | Creative Products Resource Associates, Ltd. | Composite reticulated foam-textile cleaning pad |
AU604899B2 (en) * | 1987-05-27 | 1991-01-03 | Minnesota Mining And Manufacturing Company | Abrasive grits formed of ceramic, impregnation method of making the same and products made therewith |
US5104421B1 (en) * | 1990-03-23 | 1993-11-16 | Fujimi Abrasives Co.,Ltd. | Polishing method of goods and abrasive pad therefor |
US5222092A (en) * | 1990-07-11 | 1993-06-22 | University Of Florida | Laser dye impregnated silica sol-gel monoliths |
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
JPH074769B2 (en) * | 1991-10-11 | 1995-01-25 | ロデール・ニッタ株式会社 | Polishing cloth |
US6099394A (en) * | 1998-02-10 | 2000-08-08 | Rodel Holdings, Inc. | Polishing system having a multi-phase polishing substrate and methods relating thereto |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US6022264A (en) * | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
US5893935A (en) * | 1997-01-09 | 1999-04-13 | Minnesota Mining And Manufacturing Company | Method for making abrasive grain using impregnation, and abrasive articles |
US5972792A (en) * | 1996-10-18 | 1999-10-26 | Micron Technology, Inc. | Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad |
JPH10277923A (en) * | 1997-02-03 | 1998-10-20 | Tokyo Electron Ltd | Polishing device and polishing method |
US5944583A (en) * | 1997-03-17 | 1999-08-31 | International Business Machines Corporation | Composite polish pad for CMP |
US6165560A (en) * | 1997-05-30 | 2000-12-26 | Micell Technologies | Surface treatment |
US5899745A (en) * | 1997-07-03 | 1999-05-04 | Motorola, Inc. | Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor |
US5876266A (en) * | 1997-07-15 | 1999-03-02 | International Business Machines Corporation | Polishing pad with controlled release of desired micro-encapsulated polishing agents |
JP3618541B2 (en) * | 1998-03-23 | 2005-02-09 | 信越半導体株式会社 | Polishing cloth, polishing cloth processing method and polishing method |
JPH11285961A (en) * | 1998-04-03 | 1999-10-19 | Nikon Corp | Polishing pad and polishing method |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6103628A (en) * | 1998-12-01 | 2000-08-15 | Nutool, Inc. | Reverse linear polisher with loadable housing |
US6521284B1 (en) * | 1999-11-03 | 2003-02-18 | Scimed Life Systems, Inc. | Process for impregnating a porous material with a cross-linkable composition |
US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
AU2001291143A1 (en) * | 2000-10-06 | 2002-04-22 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
US6645624B2 (en) * | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
US6561889B1 (en) * | 2000-12-27 | 2003-05-13 | Lam Research Corporation | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
JP2002283221A (en) * | 2001-03-21 | 2002-10-03 | Rodel Nitta Co | Abrasive cloth |
US20020192268A1 (en) * | 2001-06-19 | 2002-12-19 | Alwattari Ali Abdelaziz | Substrates utilizing shear responsive micropockets for storage and delivery of substances |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
JP4266579B2 (en) * | 2002-06-28 | 2009-05-20 | 株式会社ノリタケカンパニーリミテド | Polishing body and method for producing the same |
JP2004281685A (en) * | 2003-03-14 | 2004-10-07 | Mitsubishi Electric Corp | Polishing pad for semiconductor substrate and method for polishing semiconductor substrate |
US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US7966969B2 (en) * | 2004-09-22 | 2011-06-28 | Asm International N.V. | Deposition of TiN films in a batch reactor |
-
2004
- 2004-03-23 US US10/807,064 patent/US7195544B2/en not_active Expired - Fee Related
-
2005
- 2005-03-01 TW TW094105984A patent/TWI280266B/en not_active IP Right Cessation
- 2005-03-14 EP EP05725594.5A patent/EP1751243B1/en not_active Not-in-force
- 2005-03-14 WO PCT/US2005/008527 patent/WO2005100497A1/en active Application Filing
- 2005-03-14 KR KR1020067019556A patent/KR101178335B1/en not_active IP Right Cessation
- 2005-03-14 JP JP2007505008A patent/JP2007531276A/en active Pending
- 2005-03-14 CN CN2005800085827A patent/CN1934208B/en not_active Expired - Fee Related
- 2005-03-14 KR KR1020127016015A patent/KR20120087991A/en not_active Application Discontinuation
- 2005-03-21 MY MYPI20051221A patent/MY139413A/en unknown
- 2005-03-21 MY MYPI20085335A patent/MY146815A/en unknown
-
2006
- 2006-07-19 IL IL176955A patent/IL176955A/en not_active IP Right Cessation
-
2007
- 2007-03-26 US US11/690,944 patent/US7699684B2/en not_active Expired - Fee Related
-
2011
- 2011-10-26 IL IL215969A patent/IL215969A0/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020173225A1 (en) * | 1998-12-01 | 2002-11-21 | Yuchun Wang | Chemical mechanical polishing endpoint detection |
US20010053658A1 (en) * | 2000-03-15 | 2001-12-20 | Budinger William D. | Window portion with an adjusted rate of wear |
US20030060137A1 (en) * | 2001-08-30 | 2003-03-27 | Steve Kramer | CMP pad having isolated pockets of continuous porosity and a method for using such pad |
Non-Patent Citations (2)
Title |
---|
CABOT MICROELECTRONICS CORPORATION: "Cabot MMD enters CMP pad market with revolutionary polishing technology", 1999, XP002333234, Retrieved from the Internet <URL:HTTP://WWW.CABOTCMP.COM/PRESS_ROOM/1999/071299_EPIC.HTM> [retrieved on 20050622] * |
THIMOTHY DYER, JIM SCHLUETER: "Characterising CMP pad conditioning using diamond abrasives", January 2002 (2002-01-01), XP002333235, Retrieved from the Internet <URL:HTTP://WWW.MICROMAGAZINE.COM/ARCHIVE/02/01/DYER.HTML> [retrieved on 20050622] * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8546457B2 (en) | 2007-08-14 | 2013-10-01 | Basf Se | Method for the production of abrasive foams |
US11446788B2 (en) | 2014-10-17 | 2022-09-20 | Applied Materials, Inc. | Precursor formulations for polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10537974B2 (en) | 2014-10-17 | 2020-01-21 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10953515B2 (en) | 2014-10-17 | 2021-03-23 | Applied Materials, Inc. | Apparatus and method of forming a polishing pads by use of an additive manufacturing process |
US11724362B2 (en) | 2014-10-17 | 2023-08-15 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US11958162B2 (en) | 2014-10-17 | 2024-04-16 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10456886B2 (en) | 2016-01-19 | 2019-10-29 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US11772229B2 (en) | 2016-01-19 | 2023-10-03 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
Also Published As
Publication number | Publication date |
---|---|
TWI280266B (en) | 2007-05-01 |
KR101178335B1 (en) | 2012-08-29 |
KR20120087991A (en) | 2012-08-07 |
US7699684B2 (en) | 2010-04-20 |
IL176955A0 (en) | 2006-12-10 |
US20070180778A1 (en) | 2007-08-09 |
MY139413A (en) | 2009-09-30 |
US7195544B2 (en) | 2007-03-27 |
CN1934208B (en) | 2011-08-10 |
EP1751243B1 (en) | 2014-04-16 |
TW200609315A (en) | 2006-03-16 |
JP2007531276A (en) | 2007-11-01 |
EP1751243A1 (en) | 2007-02-14 |
CN1934208A (en) | 2007-03-21 |
MY146815A (en) | 2012-09-28 |
IL215969A0 (en) | 2011-12-29 |
KR20060127221A (en) | 2006-12-11 |
US20050215177A1 (en) | 2005-09-29 |
IL176955A (en) | 2012-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7195544B2 (en) | CMP porous pad with component-filled pores | |
WO2005099963A1 (en) | Low surface energy cmp pad | |
US20050153634A1 (en) | Negative poisson's ratio material-containing CMP polishing pad | |
EP1667816B1 (en) | Polishing pad with recessed window | |
EP2193010B1 (en) | Polishing pad | |
EP1915233B1 (en) | Transparent microporous materials for cmp | |
US7435165B2 (en) | Transparent microporous materials for CMP | |
US7204742B2 (en) | Polishing pad comprising hydrophobic region and endpoint detection port | |
WO2005000526A1 (en) | Polishing pad with oriented pore structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 176955 Country of ref document: IL |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580008582.7 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007505008 Country of ref document: JP Ref document number: 1020067019556 Country of ref document: KR |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2005725594 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067019556 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2005725594 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 215969 Country of ref document: IL |