WO2005043059A3 - Manufacture of a heat transfer system - Google Patents

Manufacture of a heat transfer system Download PDF

Info

Publication number
WO2005043059A3
WO2005043059A3 PCT/US2004/035548 US2004035548W WO2005043059A3 WO 2005043059 A3 WO2005043059 A3 WO 2005043059A3 US 2004035548 W US2004035548 W US 2004035548W WO 2005043059 A3 WO2005043059 A3 WO 2005043059A3
Authority
WO
WIPO (PCT)
Prior art keywords
barrier wall
liquid
vapor
vapor barrier
wick
Prior art date
Application number
PCT/US2004/035548
Other languages
French (fr)
Other versions
WO2005043059A2 (en
Inventor
Edward J Kroliczek
James Yun
Michael Nikitkin
David A Wolf
Original Assignee
Swales & Associates Inc
Edward J Kroliczek
James Yun
Michael Nikitkin
David A Wolf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swales & Associates Inc, Edward J Kroliczek, James Yun, Michael Nikitkin, David A Wolf filed Critical Swales & Associates Inc
Priority to AU2004286255A priority Critical patent/AU2004286255B2/en
Priority to MXPA06004692A priority patent/MXPA06004692A/en
Priority to BRPI0416000-2A priority patent/BRPI0416000B1/en
Priority to JP2006538194A priority patent/JP5060785B2/en
Priority to EP04810031.7A priority patent/EP1682309B1/en
Publication of WO2005043059A2 publication Critical patent/WO2005043059A2/en
Publication of WO2005043059A3 publication Critical patent/WO2005043059A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F28F2275/127—Fastening; Joining by methods involving deformation of the elements by shrinking

Abstract

A method of making an evaporator (115) includes orienting a vapor barrier wall (117) , orienting a liquid barrier wall (135) , and positioning a wick (145) between the vapor barrier wall and the liquid barrier wall. The vapor barrier wall is oriented such that a heat-absorbing surface (116) of the vapor barrier wall defines at least a portion of an exterior surface of the evaporator. The exterior surface is configured to receive heat (Qin) . The liquid barrier wall is oriented adjacent the vapor barrier wall. The liquid barrier wall has a surface configured to confine liquid. A vapor removal channel is defined at an interface between the wick and the vapor barrier wall. A liquid flow channel is defined between the liquid barrier wall and the primary wick (140) .
PCT/US2004/035548 2003-10-28 2004-10-28 Manufacture of a heat transfer system WO2005043059A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2004286255A AU2004286255B2 (en) 2003-10-28 2004-10-28 Manufacture of a heat transfer system
MXPA06004692A MXPA06004692A (en) 2003-10-28 2004-10-28 Manufacture of a heat transfer system.
BRPI0416000-2A BRPI0416000B1 (en) 2003-10-28 2004-10-28 METHOD FOR PRODUCING AN EVAPORATOR
JP2006538194A JP5060785B2 (en) 2003-10-28 2004-10-28 Heat transfer system manufacturing
EP04810031.7A EP1682309B1 (en) 2003-10-28 2004-10-28 Manufacture of an evaporator for a heat transfer system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51467003P 2003-10-28 2003-10-28
US60/514,670 2003-10-28

Publications (2)

Publication Number Publication Date
WO2005043059A2 WO2005043059A2 (en) 2005-05-12
WO2005043059A3 true WO2005043059A3 (en) 2005-12-29

Family

ID=34549344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/035548 WO2005043059A2 (en) 2003-10-28 2004-10-28 Manufacture of a heat transfer system

Country Status (7)

Country Link
EP (1) EP1682309B1 (en)
JP (1) JP5060785B2 (en)
CN (1) CN100457379C (en)
AU (1) AU2004286255B2 (en)
BR (1) BRPI0416000B1 (en)
MX (1) MXPA06004692A (en)
WO (1) WO2005043059A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9273887B2 (en) 2000-06-30 2016-03-01 Orbital Atk, Inc. Evaporators for heat transfer systems

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8109325B2 (en) 2000-06-30 2012-02-07 Alliant Techsystems Inc. Heat transfer system
US8047268B1 (en) 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
US7931072B1 (en) 2002-10-02 2011-04-26 Alliant Techsystems Inc. High heat flux evaporator, heat transfer systems
US8944155B2 (en) * 2010-07-15 2015-02-03 Dana Canada Corporation Annular axial flow ribbed heat exchanger
CN107677155A (en) * 2017-11-03 2018-02-09 中国科学院理化技术研究所 A kind of flat heat pipe radiator
KR102219183B1 (en) * 2019-10-25 2021-02-23 충북대학교 산학협력단 Heat sink having 3d-radial shape
CN111757656B (en) * 2020-08-10 2021-07-06 西安电子科技大学 Conformal countercurrent liquid cooling radiator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3734173A (en) * 1969-01-28 1973-05-22 Messerschmitt Boelkow Blohm Arrangement for transmitting heat
US3792318A (en) * 1972-02-01 1974-02-12 Siemens Ag Cooling apparatus for flat semiconductors using one or more heat pipes
US3803688A (en) * 1971-07-13 1974-04-16 Electronic Communications Method of making a heat pipe
US4005297A (en) * 1972-10-18 1977-01-25 Westinghouse Electric Corporation Vacuum-type circuit interrupters having heat-dissipating devices associated with the contact structures thereof
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US6330907B1 (en) * 1997-03-07 2001-12-18 Mitsubishi Denki Kabushiki Kaisha Evaporator and loop-type heat pipe using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175586A (en) * 1986-01-29 1987-08-01 Toshiba Corp Closed loop type heat pipe
RU2098733C1 (en) 1995-03-07 1997-12-10 Институт теплофизики Уральского отделения РАН Evaporation chamber of loop heat pipe
FR2752291B1 (en) * 1996-08-12 1998-09-25 Centre Nat Etd Spatiales HAIR EVAPORATOR FOR DIPHASIC LOOP OF TRANSFER OF ENERGY BETWEEN A HOT SOURCE AND A COLD SOURCE
JP2000222070A (en) * 1999-01-29 2000-08-11 Mitsubishi Electric Corp Information device
JP2001033179A (en) * 1999-07-22 2001-02-09 Showa Alum Corp Tubular heat exchanger and its manufacture
US6293333B1 (en) * 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
AU1199301A (en) * 1999-11-04 2001-05-14 Swales Aerospace Starter for loop heat pipe
EP1305562B1 (en) * 2000-06-30 2006-03-08 Swales Aerospace Phase control in the capillary evaporators
WO2002010661A1 (en) * 2000-07-27 2002-02-07 Advanced Technologies Limited High-efficiency computer thermal management apparatus and method
FR2813662B1 (en) * 2000-09-05 2003-01-24 Astrium Sas HAIR EVAPORATOR FOR TRANSFER LOOP
US6474074B2 (en) * 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
JP2002195769A (en) * 2000-12-22 2002-07-10 Mitsubishi Electric Corp System and method for producing evaporator
JP2003172589A (en) * 2001-12-06 2003-06-20 Mitsubishi Electric Corp Loop-type heat pipe and evaporator
BR0202997A (en) * 2002-07-16 2004-05-25 Brasil Compressores Sa Refrigeration system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3734173A (en) * 1969-01-28 1973-05-22 Messerschmitt Boelkow Blohm Arrangement for transmitting heat
US3803688A (en) * 1971-07-13 1974-04-16 Electronic Communications Method of making a heat pipe
US3792318A (en) * 1972-02-01 1974-02-12 Siemens Ag Cooling apparatus for flat semiconductors using one or more heat pipes
US4005297A (en) * 1972-10-18 1977-01-25 Westinghouse Electric Corporation Vacuum-type circuit interrupters having heat-dissipating devices associated with the contact structures thereof
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US6330907B1 (en) * 1997-03-07 2001-12-18 Mitsubishi Denki Kabushiki Kaisha Evaporator and loop-type heat pipe using the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1682309A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9273887B2 (en) 2000-06-30 2016-03-01 Orbital Atk, Inc. Evaporators for heat transfer systems

Also Published As

Publication number Publication date
AU2004286255B2 (en) 2010-04-08
EP1682309A2 (en) 2006-07-26
MXPA06004692A (en) 2008-10-08
JP2007510125A (en) 2007-04-19
AU2004286255A1 (en) 2005-05-12
EP1682309B1 (en) 2018-12-19
EP1682309A4 (en) 2009-11-04
CN1910008A (en) 2007-02-07
BRPI0416000A (en) 2007-01-02
WO2005043059A2 (en) 2005-05-12
BRPI0416000B1 (en) 2019-10-15
JP5060785B2 (en) 2012-10-31
CN100457379C (en) 2009-02-04

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