WO2005039261A3 - Solder structures for out of plane connections and related methods - Google Patents
Solder structures for out of plane connections and related methods Download PDFInfo
- Publication number
- WO2005039261A3 WO2005039261A3 PCT/US2004/033946 US2004033946W WO2005039261A3 WO 2005039261 A3 WO2005039261 A3 WO 2005039261A3 US 2004033946 W US2004033946 W US 2004033946W WO 2005039261 A3 WO2005039261 A3 WO 2005039261A3
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- WO
- WIPO (PCT)
- Prior art keywords
- die
- solder
- edge
- wettable pad
- related methods
- Prior art date
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
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US51081903P | 2003-10-14 | 2003-10-14 | |
US60/510,819 | 2003-10-14 |
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PCT/US2004/033946 WO2005039261A2 (en) | 2003-10-14 | 2004-10-14 | Solder structures for out of plane connections and related methods |
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US (2) | US7049216B2 (en) |
WO (1) | WO2005039261A2 (en) |
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CN102479765B (en) * | 2010-11-24 | 2016-08-24 | 日月光半导体制造股份有限公司 | There is the encapsulating structure of semiconductor subassembly |
US9355978B2 (en) | 2013-03-11 | 2016-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaging devices and methods of manufacture thereof |
US9461008B2 (en) | 2012-08-16 | 2016-10-04 | Qualcomm Incorporated | Solder on trace technology for interconnect attachment |
US8802556B2 (en) * | 2012-11-14 | 2014-08-12 | Qualcomm Incorporated | Barrier layer on bump and non-wettable coating on trace |
US9196529B2 (en) * | 2013-09-27 | 2015-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact pad for semiconductor devices |
US9466590B1 (en) * | 2015-11-13 | 2016-10-11 | International Business Machines Corporation | Optimized solder pads for microelectronic components |
US10103116B2 (en) * | 2016-02-01 | 2018-10-16 | Qualcomm Incorporated | Open-passivation ball grid array pads |
US10192841B2 (en) | 2017-01-03 | 2019-01-29 | Nanya Technology Corporation | Semiconductor package and method for preparing the same |
CN107734226A (en) * | 2017-10-24 | 2018-02-23 | 捷开通讯(深圳)有限公司 | Filming apparatus and electronic equipment for electronic equipment |
US10847478B2 (en) | 2018-02-27 | 2020-11-24 | Amkor Technology Singapore Holding Pte. Ltd. | Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structures |
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Also Published As
Publication number | Publication date |
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US7659621B2 (en) | 2010-02-09 |
US7049216B2 (en) | 2006-05-23 |
US20050136641A1 (en) | 2005-06-23 |
US20060138675A1 (en) | 2006-06-29 |
WO2005039261A2 (en) | 2005-04-28 |
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