WO2004108358A3 - Conductive polishing article for electrochemical mechanical polishing - Google Patents

Conductive polishing article for electrochemical mechanical polishing Download PDF

Info

Publication number
WO2004108358A3
WO2004108358A3 PCT/US2004/017827 US2004017827W WO2004108358A3 WO 2004108358 A3 WO2004108358 A3 WO 2004108358A3 US 2004017827 W US2004017827 W US 2004017827W WO 2004108358 A3 WO2004108358 A3 WO 2004108358A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
conductive
article
electrochemical mechanical
polishing article
Prior art date
Application number
PCT/US2004/017827
Other languages
French (fr)
Other versions
WO2004108358A2 (en
Inventor
Yongqi Hu
Alain Duboust
Antoine P Manens
Stan D Tsai
Paul D Butterfield
Yan Wang
Feng Q Liu
Siew S Neo
Liang-Yuh Chen
Yuan A Tian
Sen-Hou Ko
Robert A Ewald
Original Assignee
Applied Materials Inc
Yongqi Hu
Alain Duboust
Antoine P Manens
Stan D Tsai
Paul D Butterfield
Yan Wang
Feng Q Liu
Siew S Neo
Liang-Yuh Chen
Yuan A Tian
Sen-Hou Ko
Robert A Ewald
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/455,895 external-priority patent/US20040020789A1/en
Priority claimed from US10/455,941 external-priority patent/US6991528B2/en
Application filed by Applied Materials Inc, Yongqi Hu, Alain Duboust, Antoine P Manens, Stan D Tsai, Paul D Butterfield, Yan Wang, Feng Q Liu, Siew S Neo, Liang-Yuh Chen, Yuan A Tian, Sen-Hou Ko, Robert A Ewald filed Critical Applied Materials Inc
Priority to JP2006515213A priority Critical patent/JP2006527483A/en
Publication of WO2004108358A2 publication Critical patent/WO2004108358A2/en
Publication of WO2004108358A3 publication Critical patent/WO2004108358A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

Embodiments of a polishing article for processing a substracte are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
PCT/US2004/017827 2003-06-06 2004-06-07 Conductive polishing article for electrochemical mechanical polishing WO2004108358A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006515213A JP2006527483A (en) 2003-06-06 2004-06-07 Conductive polishing equipment for electrochemical mechanical polishing

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/455,895 US20040020789A1 (en) 2000-02-17 2003-06-06 Conductive polishing article for electrochemical mechanical polishing
US10/455,895 2003-06-06
US10/455,941 2003-06-06
US10/455,941 US6991528B2 (en) 2000-02-17 2003-06-06 Conductive polishing article for electrochemical mechanical polishing

Publications (2)

Publication Number Publication Date
WO2004108358A2 WO2004108358A2 (en) 2004-12-16
WO2004108358A3 true WO2004108358A3 (en) 2005-06-09

Family

ID=33513860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/017827 WO2004108358A2 (en) 2003-06-06 2004-06-07 Conductive polishing article for electrochemical mechanical polishing

Country Status (4)

Country Link
JP (1) JP2006527483A (en)
KR (2) KR20070104686A (en)
TW (1) TWI285576B (en)
WO (1) WO2004108358A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100721196B1 (en) * 2005-05-24 2007-05-23 주식회사 하이닉스반도체 Polishing pad and using chemical mechanical polishing apparatus
US20070158201A1 (en) * 2006-01-06 2007-07-12 Applied Materials, Inc. Electrochemical processing with dynamic process control
CN107206570B (en) * 2015-01-30 2021-04-02 应用材料公司 Multi-layer nanofiber chemical mechanical polishing pad
TWI757410B (en) * 2017-01-20 2022-03-11 美商應用材料股份有限公司 A thin plastic polishing article for cmp applications
JP7113626B2 (en) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 polishing pad
WO2022187025A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
CN116065225B (en) * 2023-03-31 2023-06-16 太原理工大学 Electrolytic polishing device for inner wall of special-shaped micro-fine tube

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
EP1361023A2 (en) * 2002-05-07 2003-11-12 Applied Materials, Inc. Polishing articles for electrochemical mechanical polishing of substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3448023A (en) * 1966-01-20 1969-06-03 Hammond Machinery Builders Inc Belt type electro-chemical (or electrolytic) grinding machine
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
GB9721494D0 (en) * 1997-10-09 1997-12-10 Minnesota Mining & Mfg Abrasive articles and their preparations
KR20030090788A (en) * 2001-04-24 2003-11-28 어플라이드 머티어리얼스, 인코포레이티드 Conductive polishing article for electrochemical mechanical polishing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
EP1361023A2 (en) * 2002-05-07 2003-11-12 Applied Materials, Inc. Polishing articles for electrochemical mechanical polishing of substrates

Also Published As

Publication number Publication date
JP2006527483A (en) 2006-11-30
KR20070104686A (en) 2007-10-26
TW200520893A (en) 2005-07-01
WO2004108358A2 (en) 2004-12-16
KR20060055463A (en) 2006-05-23
TWI285576B (en) 2007-08-21

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