WO2004080134A3 - High frequency chip packages with connecting elements - Google Patents
High frequency chip packages with connecting elements Download PDFInfo
- Publication number
- WO2004080134A3 WO2004080134A3 PCT/US2003/041132 US0341132W WO2004080134A3 WO 2004080134 A3 WO2004080134 A3 WO 2004080134A3 US 0341132 W US0341132 W US 0341132W WO 2004080134 A3 WO2004080134 A3 WO 2004080134A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- leads
- connecting element
- circuit board
- frequency chip
- assembly
- Prior art date
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Classifications
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003299866A AU2003299866A1 (en) | 2003-02-25 | 2003-12-24 | High frequency chip packages with connecting elements |
JP2004569225A JP4504204B2 (en) | 2003-02-25 | 2003-12-24 | High frequency chip package with connecting elements |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44967303P | 2003-02-25 | 2003-02-25 | |
US60/449,673 | 2003-02-25 | ||
US46217003P | 2003-04-11 | 2003-04-11 | |
US60/462,170 | 2003-04-11 |
Publications (2)
Publication Number | Publication Date |
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WO2004080134A2 WO2004080134A2 (en) | 2004-09-16 |
WO2004080134A3 true WO2004080134A3 (en) | 2005-01-27 |
Family
ID=32965513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/041132 WO2004080134A2 (en) | 2003-02-25 | 2003-12-24 | High frequency chip packages with connecting elements |
Country Status (3)
Country | Link |
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JP (1) | JP4504204B2 (en) |
AU (1) | AU2003299866A1 (en) |
WO (1) | WO2004080134A2 (en) |
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US9018774B2 (en) | 2001-03-30 | 2015-04-28 | Qualcomm Incorporated | Chip package |
US9142527B2 (en) | 2002-10-15 | 2015-09-22 | Qualcomm Incorporated | Method of wire bonding over active area of a semiconductor circuit |
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KR100770684B1 (en) * | 2006-05-18 | 2007-10-29 | 삼성전기주식회사 | Camera module package |
JP5154262B2 (en) | 2008-02-26 | 2013-02-27 | 太陽誘電株式会社 | Electronic components |
US8854277B2 (en) | 2008-11-19 | 2014-10-07 | Nxp, B.V. | Millimetre-wave radio antenna module |
US8304887B2 (en) * | 2009-12-10 | 2012-11-06 | Texas Instruments Incorporated | Module package with embedded substrate and leadframe |
JP5749468B2 (en) * | 2010-09-24 | 2015-07-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Circuit device and manufacturing method thereof |
US8928153B2 (en) * | 2011-04-21 | 2015-01-06 | Tessera, Inc. | Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
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KR101388857B1 (en) * | 2012-06-29 | 2014-04-23 | 삼성전기주식회사 | Semiconductor package and method of manufacturing the semiconductor package |
JP6318084B2 (en) * | 2014-12-17 | 2018-04-25 | 新光電気工業株式会社 | Semiconductor device and manufacturing method thereof |
US10317512B2 (en) | 2014-12-23 | 2019-06-11 | Infineon Technologies Ag | RF system with an RFIC and antenna system |
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JP2018107394A (en) * | 2016-12-28 | 2018-07-05 | 新光電気工業株式会社 | Wiring board, electronic component device and manufacturing method thereof |
WO2018148444A1 (en) * | 2017-02-10 | 2018-08-16 | Behrooz Mehr | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods |
WO2024034278A1 (en) * | 2022-08-10 | 2024-02-15 | 株式会社村田製作所 | Circuit module |
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JP4142170B2 (en) * | 1998-09-25 | 2008-08-27 | 新電元工業株式会社 | Electrical equipment |
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- 2003-12-24 AU AU2003299866A patent/AU2003299866A1/en not_active Abandoned
- 2003-12-24 JP JP2004569225A patent/JP4504204B2/en not_active Expired - Fee Related
- 2003-12-24 WO PCT/US2003/041132 patent/WO2004080134A2/en active Application Filing
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US5382829A (en) * | 1992-07-21 | 1995-01-17 | Mitsubishi Denki Kabushiki Kaisha | Packaged microwave semiconductor device |
US5473190A (en) * | 1993-12-14 | 1995-12-05 | Intel Corporation | Tab tape |
US5895972A (en) * | 1996-12-31 | 1999-04-20 | Intel Corporation | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
US6353263B1 (en) * | 1999-04-14 | 2002-03-05 | Sharp Kabushiki Kaisha | Semiconductor device and manufacturing method thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9018774B2 (en) | 2001-03-30 | 2015-04-28 | Qualcomm Incorporated | Chip package |
US9142527B2 (en) | 2002-10-15 | 2015-09-22 | Qualcomm Incorporated | Method of wire bonding over active area of a semiconductor circuit |
Also Published As
Publication number | Publication date |
---|---|
JP2006514438A (en) | 2006-04-27 |
WO2004080134A2 (en) | 2004-09-16 |
JP4504204B2 (en) | 2010-07-14 |
AU2003299866A8 (en) | 2004-09-28 |
AU2003299866A1 (en) | 2004-09-28 |
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