WO2004015441A3 - Radio frequency identificaton device and method - Google Patents

Radio frequency identificaton device and method Download PDF

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Publication number
WO2004015441A3
WO2004015441A3 PCT/US2003/024181 US0324181W WO2004015441A3 WO 2004015441 A3 WO2004015441 A3 WO 2004015441A3 US 0324181 W US0324181 W US 0324181W WO 2004015441 A3 WO2004015441 A3 WO 2004015441A3
Authority
WO
WIPO (PCT)
Prior art keywords
radio frequency
identificaton
leads
microstructure element
rfid
Prior art date
Application number
PCT/US2003/024181
Other languages
French (fr)
Other versions
WO2004015441A2 (en
Inventor
Peikang Liu
David N Edwards
Scott Wayne Ferguson
Yukihiko Sasaki
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Priority to AU2003254301A priority Critical patent/AU2003254301A1/en
Priority to EP03784881A priority patent/EP1543558A4/en
Publication of WO2004015441A2 publication Critical patent/WO2004015441A2/en
Publication of WO2004015441A3 publication Critical patent/WO2004015441A3/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
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    • H01L23/5389Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
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    • H05K2203/1469Circuit made after mounting or encapsulation of the components
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit

Abstract

A device (400), such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element (402), with leads (416) coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.
PCT/US2003/024181 2002-08-07 2003-08-01 Radio frequency identificaton device and method WO2004015441A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003254301A AU2003254301A1 (en) 2002-08-07 2003-08-01 Radio frequency identificaton device and method
EP03784881A EP1543558A4 (en) 2002-08-07 2003-08-01 Radio frequency identificaton device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/214,066 US6867983B2 (en) 2002-08-07 2002-08-07 Radio frequency identification device and method
US10/214,066 2002-08-07

Publications (2)

Publication Number Publication Date
WO2004015441A2 WO2004015441A2 (en) 2004-02-19
WO2004015441A3 true WO2004015441A3 (en) 2004-04-15

Family

ID=31494604

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/024181 WO2004015441A2 (en) 2002-08-07 2003-08-01 Radio frequency identificaton device and method

Country Status (4)

Country Link
US (1) US6867983B2 (en)
EP (1) EP1543558A4 (en)
AU (1) AU2003254301A1 (en)
WO (1) WO2004015441A2 (en)

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US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
JP2007503635A (en) * 2003-08-26 2007-02-22 ミュールバウアー アーゲー Module bridge manufacturing method
ITMO20040080A1 (en) * 2004-04-08 2004-07-08 Windinglab S R L METHOD OF CREATION OF A THIN THICK PRINTED CIRCUIT AND RELATED CIRCUIT
US7948381B2 (en) 2004-04-30 2011-05-24 Binforma Group Limited Liability Company Reversibly deactivating a radio frequency identification data tag
US7292148B2 (en) * 2004-06-18 2007-11-06 Avery Dennison Corporation Method of variable position strap mounting for RFID transponder
US7498940B2 (en) * 2004-06-22 2009-03-03 Vubiq, Inc. RFID system utilizing parametric reradiated technology
US7546946B2 (en) * 2004-06-29 2009-06-16 Kanzaki Specialty Papers, Inc. Multifunction, direct thermal recording material
US7274297B2 (en) * 2004-07-01 2007-09-25 Intermec Ip Corp. RFID tag and method of manufacture
JP4445343B2 (en) * 2004-08-10 2010-04-07 株式会社日立製作所 IC tag mounted liquid crystal display and method of manufacturing the same
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WO2004015441A2 (en) 2004-02-19
EP1543558A2 (en) 2005-06-22

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