WO2003066282A3 - Systems and methods for characterizing a polishing process - Google Patents

Systems and methods for characterizing a polishing process Download PDF

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Publication number
WO2003066282A3
WO2003066282A3 PCT/US2003/003306 US0303306W WO03066282A3 WO 2003066282 A3 WO2003066282 A3 WO 2003066282A3 US 0303306 W US0303306 W US 0303306W WO 03066282 A3 WO03066282 A3 WO 03066282A3
Authority
WO
WIPO (PCT)
Prior art keywords
specimen
measurement spots
systems
methods
polishing
Prior art date
Application number
PCT/US2003/003306
Other languages
French (fr)
Other versions
WO2003066282A2 (en
Inventor
Kurt Lehman
Charles Chen
Ronald L Allen
Robert Shinagawa
Anantha R Sethuraman
Christopher F Bevis
Tom Trikas
Haiguang Chen
Ching Ling Meng
Original Assignee
Kla Tencor Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp filed Critical Kla Tencor Tech Corp
Priority to AU2003207834A priority Critical patent/AU2003207834A1/en
Publication of WO2003066282A2 publication Critical patent/WO2003066282A2/en
Publication of WO2003066282A3 publication Critical patent/WO2003066282A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Abstract

Systems and methods for detecting a presence of blobs on a specimen (12), are provided. A method may include scanning measurement spots across the specimen, (12), during polishing of a specimen. The method may also include determining if the blobs are present on the specimen, (12), at the measurement spots. In addition, systems and methods for characterizing polishing of a specimen, (12), are provided. The method may include combining a portion of output signals generated at measurement spots located within a zone on the specimen. The method may further include determining a characteristic of the polishing within the zone from the combined portion of the output signals. A method may also include determining a characteristic of polishing at measurement spots and determining relative locations of the measurement spots on the specimen. Such a method may also include generating a two-dimensional map of the characteristic at the relative locations of the measurement spots.
PCT/US2003/003306 2002-02-04 2003-02-04 Systems and methods for characterizing a polishing process WO2003066282A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003207834A AU2003207834A1 (en) 2002-02-04 2003-02-04 Systems and methods for characterizing a polishing process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35417902P 2002-02-04 2002-02-04
US60/354,179 2002-02-04

Publications (2)

Publication Number Publication Date
WO2003066282A2 WO2003066282A2 (en) 2003-08-14
WO2003066282A3 true WO2003066282A3 (en) 2003-12-31

Family

ID=27734329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/003306 WO2003066282A2 (en) 2002-02-04 2003-02-04 Systems and methods for characterizing a polishing process

Country Status (3)

Country Link
US (10) US7175503B2 (en)
AU (1) AU2003207834A1 (en)
WO (1) WO2003066282A2 (en)

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US7052369B2 (en) 2006-05-30
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US8831767B2 (en) 2014-09-09
WO2003066282A2 (en) 2003-08-14
US7030018B2 (en) 2006-04-18
US20030181139A1 (en) 2003-09-25
US20030181131A1 (en) 2003-09-25
US20030181132A1 (en) 2003-09-25
US7332438B2 (en) 2008-02-19
US20030190864A1 (en) 2003-10-09
US7175503B2 (en) 2007-02-13
US20030180973A1 (en) 2003-09-25
US20080207089A1 (en) 2008-08-28
US20060131273A1 (en) 2006-06-22
US6884146B2 (en) 2005-04-26
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US20030181138A1 (en) 2003-09-25
US20060148383A1 (en) 2006-07-06

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