WO2003060414A1 - Small scale chip cooler assembly - Google Patents

Small scale chip cooler assembly Download PDF

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Publication number
WO2003060414A1
WO2003060414A1 PCT/US2003/000457 US0300457W WO03060414A1 WO 2003060414 A1 WO2003060414 A1 WO 2003060414A1 US 0300457 W US0300457 W US 0300457W WO 03060414 A1 WO03060414 A1 WO 03060414A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
housing
evaporator chamber
conductive element
base
Prior art date
Application number
PCT/US2003/000457
Other languages
French (fr)
Inventor
Michael R. Cosley
Richard L. Fischer
Jack H. Thiesen
Gary S. Willen
Original Assignee
Marconi Intellectual Property (Ringfence) Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Intellectual Property (Ringfence) Inc. filed Critical Marconi Intellectual Property (Ringfence) Inc.
Priority to AU2003209176A priority Critical patent/AU2003209176A1/en
Priority to EP03707320A priority patent/EP1472499A4/en
Priority to CA002474042A priority patent/CA2474042A1/en
Priority to MXPA04006760A priority patent/MXPA04006760A/en
Publication of WO2003060414A1 publication Critical patent/WO2003060414A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/37—Capillary tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0068—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
    • F28D2021/0071—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a chip cooling assembly and more particularly to a very small-scale chip cooling assembly for efficiently and effectively cooling small but powerful electronic microprocessors or other small, heat generating devices.
  • microprocessors such as Intel's Pentium brand series
  • Intel's Pentium brand series become more powerful, they also generate more heat.
  • a number of different devices trying to accomplish this have been patented. These include the use of cold plates, microchannels, impingement jets and variations and combinations of these as well as other cooling devices. See for example, U.S. Patents 4,392,362; 4,941,530; 5,183,104; 5,169,372; 5,394,936; 5,544,696; 5,696,405; and 5,870,823.
  • the search goes on for more effective, efficient and reliable cooling mechanisms.
  • the below described embodiment improves upon the prior efforts and is a small scale cooler system comprising a housing, an inlet port formed in the housing for receiving a refrigerant or similar fluid, an outlet port formed in the housing, a thermally conductive element connected to the housing, an evaporator chamber operatively communicating with the housing where heat exchange takes place, a capillary passage formed in the housing extending downstream from the inlet port, and an expansion zone formed downstream of the capillary passage and in fluid communication with the evaporator chamber.
  • a small scale cooler system comprising a housing, an inlet port formed in the housing for receiving a refrigerant or similar fluid, an outlet port formed in the housing, a thermally conductive element connected to the housing, an evaporator chamber operatively communicating with the housing where heat exchange takes place, a capillary passage formed in the housing extending downstream from the inlet port, and an expansion zone formed downstream of the capillary passage and in fluid communication with the evaporator chamber.
  • Another object of the present invention is to provide a small cooling system which is simple, reliable and economical. Yet another feature of the present invention is to provide a cooling system which is very small scale and easily attached to a small heat generating device. Yet a further feature of the present invention is to provide a cooling system flexible enough to transfer heat by forced convection, flow boiling, and pool boiling and any combination thereof.
  • FIGURE 1 is a top plan view of the cooling assembly described hereinbelow.
  • FIGURE 2 is a side elevation view of the cooling assembly.
  • FIGURE 3 is a bottom plan view of the cooling assembly.
  • FIGURE 4 is a front elevation view of the cooling assembly.
  • FIGURE 5 is a top view of a cover of the cooling assembly rotated 180 degrees from that shown in FIGURE 1.
  • FIGURE 6 is a side elevation view of the cover.
  • FIGURE 7 is a rear elevation view of the cover.
  • FIGURE 8 is a top plan view of a base member of the cooling assembly shown in FIGURE 1.
  • FIGURE 9 is a side elevation view of the base.
  • FIGURE 10 is a bottom plan view of the base.
  • FIGURE 11 is a rear elevation view of the base.
  • FIGURE 12 is a top plan view of a thermally conductive element of the cooling assembly shown in FIGURE 1.
  • FIGURE 13 is a side elevation view of the thermally conductive element.
  • FIGURE 14 is a bottom plan view of the thermally conductive element.
  • FIGURE 15 is a front elevation view of the thermally conductive element.
  • FIGURE 16 is a sectional isometric view of the cooling assembly.
  • FIGURE 17 is an exploded isometric view of the cooling assembly.
  • FIGURE 18 is an exploded isometric view of a cooling assembly having a construction different from that of the FIGURE 1 embodiment.
  • microscale refers to a very small scale consistent with the size of microchips, such as Intel's Pentium brand processor.
  • a synonym of microscale is "mesoscale.”
  • microsystem refers directly to a microchip such as the Pentium brand processor. The reference to the Pentium brand processor is not to be considered limiting in any way and other microprocessors may be substituted.
  • pool boiling involves the technology of boiling heat transfer and is a term well known by those skilled in the art.
  • the term also appears in research articles such as the article, "Pool Boiling Heat Transfer From Plain And Microporous, Square Pin-Finned Surfaces In Saturated FC-72.” This article appeared in the August, 2000 edition of the Journal of Heat Transfer, pages 509-516.
  • the system includes a housing 22, which is itself comprised of a cover 24 and a base 26.
  • the system also includes an evaporator 28.
  • Mounted to the cover are an inlet fitting 30 and an outlet fitting 32.
  • the cover and base are made of any suitable thermally insulating synthetic resin, such as Nylon 6 or PBT.
  • thermally insulating it is meant a material having low thermal conductivity.
  • the cover and base act as an insulator for refrigerant or other heat transferring fluid, liquid and gas flowing within the assembly. Formed between the base and the evaporator is an evaporator chamber to be described below.
  • the cover 24 is a generally flat plate having two holes 34, 36, FIGURES 5-7, for forming inlet and outlet ports, respectively.
  • the cover includes an outside surface 38 and an inside surface 40. Mounted to the cover on the outside surface are the inlet fitting 30 and the outlet fitting 32, FIGURES 1, 2 and 4. Also mounted to or formed on the outside surface of the cover are a series of paired grooming clips 44, 46, 48, 50, 52, 54 for aligning and constraining conduits (not shown) supplying a refrigerant or fluid for absorbing heat and conduits for carrying away gas phase refrigerant or other gas phase product back to a compressor as will be explained below.
  • the cover is generally square with each side measuring about forty millimeters. The cover may be 0.5 to 1.0 millimeter thick.
  • the base 26 is also a generally flat plate having first surface 56 and second surface 58.
  • the first surface 56 abuts and is sealed to the inside surface 40 of the cover.
  • Formed in the first surface of the base is a capillary passage 60 having as a top wall the inside surface 40 of the cover 24.
  • the capillary passage has an upstream end 62 and a downstream end 64.
  • the upstream end 62 aligns with the inlet port 34 of the cover 24 so that liquid pumped to the inlet port enters the capillary passage 60.
  • the capillary passage may be serpentine to allow its length to be adjusted as desired by forming more or less loops. The length of the capillary passage depends upon the fluid used and the heat lift capacity desired as well as other factors.
  • the cross-sectional dimensions of the capillary passage are also related to the length of the capillary passage. They balance flow, ability to pump and provide the required pressure drop.
  • the downstream end 64 of the capillary passage adjoins an opening 66 in the base 26.
  • the capillary passage may be formed in the base by molding or by hot embossing or by any other convenient manufacturing technique known or developed in the future.
  • the capillary passage is square shaped in cross section having a side dimension of about two hundred fifty microns.
  • the passage may be semicircular or trapezoidal in shape and corners may have a radius.
  • the base 26 may have a thickness of about one millimeter.
  • the base 26 also includes a second opening 68 which aligns with an elongated recess 70. A far end portion 72 of the recess aligns with the outlet port 36, FIGURE 5, in the cover 24.
  • the base may also includes a sealing ridge 74 around the periphery of the first surface 56. The sealing ridge facilitates assembly of the cover to the base by ultrasonic welding, laser welding or RF welding, processes which are well known to those skilled in the art.
  • Extending from the second surface 58 is a mounting flange 76.
  • the flange 76 will engage a lip of the evaporator 28, FIGURE 3, as will be explained below.
  • the mounting flange has an oblong hexagonal shape as is readily seen in FIGURE 10.
  • the fluid referred to above may be any heat transferring fluid including a refrigerant, such as those known as R236fa, R123, R134a, R124, or C0 2 .
  • a refrigerant such as those known as R236fa, R123, R134a, R124, or C0 2 .
  • any suitable dielectric fluid or other suitable refrigerant may be used as is well known to those skilled in the refrigerant art.
  • other heat transferring fluids may be used, such as DYNALENE, FLUORINET, NOVEC, FLUTEC and a liquid slurry with encapsulated phos change materials (PCM).
  • PCM liquid slurry with encapsulated phos change materials
  • the liquid is formed by compressing a gas to its liquid phase and then cooling the liquid before being exposed to heat.
  • the evaporator 28 is a thermally conductive element in the form of a metal plate 80 with a number of projections or fins 82, as they are usually called, mounted to an inside surface 84.
  • An outside surface 86 of the evaporator is generally flat and is adapted to be connected to a heat source such as a microprocessor.
  • the evaporator may also be connected to other small heat generating mechanisms, such as transistors, power semiconductors, laser optical IGBTs or other electronic or opto-electronic devices.
  • the term "microsystem” is used here to refer to all such items and others, whether now in existence or developed in the future.
  • the evaporator is formed of a material having high thermal conductivity, such as copper or aluminum.
  • the evaporator is attached to the base by any convenient means, such as molding the base to the evaporator or using other techniques known by those in the art.
  • the evaporator 28 includes a lip 88 around its periphery which may form an interference fit with the mounting flange 76 of the base 26. See also FIGURE 16.
  • the evaporator may be connected to a microsystem by a thermal adhesive, thermal pad, or an evaporator may be molded or formed as a part of the microsystem should that prove more effective or efficient. All of these are commercially available and add considerable flexibility to the design.
  • An evaporator chamber 90 is formed between the evaporator 28 and the base 26, downstream of the capillary passage 60 and upstream of the outlet port 36 and among the fins 82.
  • An expansion zone 92 is also formed between the evaporator and the base, and more particularly immediately downstream of the opening 66. The expansion zone is also immediately upstream of the evaporator chamber 90. This allows liquid in the capillary passage to cool in the expansion zone 92 and then pass into the evaporator chamber where pool boiling occurs among the fins.
  • a housing 101 includes a base 102 and a cover 104.
  • Inlet and outlet fittings 106, 108 are located in inlet and outlet ports 110, 112, respectively.
  • a capillary tube 113 is connected to the inlet fitting 106.
  • An expansion port 114 is formed in the base 102 and an evaporator chamber 116 is also formed in the base.
  • An upper wall of the evaporator chamber is formed by the cover 104.
  • a lower wall of the evaporator chamber is formed by an evaporator 118 and includes a plate 120 with a multitude of fins 122.
  • Downstream of the evaporator chamber is a region 124 which includes upstanding blocks, such as the block 126 which alternate with passageways between the blocks, such as the passageway 128.
  • the blocks form multiple exhaust ports to help separate flow to make more efficient use of the evaporator, to minimize orientation effects, to reduce pressure drop and to minimize blockage due to contamination.
  • Downstream of the blocks is a passage 130 which is upstream of the outlet port 112.
  • the construction of FIGURE 18 includes a high thermally conductive evaporator and low thermally conductive cover and base.
  • the refrigerant is at a high pressure state when delivered to the inlet fitting 30, FIGURE 17.
  • the inlet pressure is about 55 psi
  • the flow rate is about 0.00055 kilograms per second
  • the capillary passage 60 is about two inches long and may have a square cross section of about 0.250 millimeters per side.
  • the length of the cooling system is about 40 millimeters, the width about 40 millimeters and the height about 7 millimeters.
  • the pins in the evaporator chamber may be about 1 millimeter square in cross section and about 5 millimeters in height.
  • a Pentium brand microsystem may have a surface temperature maintained within the range of -20 to 50°C, depending on application and fluid selected.
  • the refrigerant is compressed in a compressor and cooled by a condenser before entering the capillary passage 60.
  • a heat transfer fluid may be pumped. Thereafter, the refrigerant expands, absorbs heat by pool boiling, forced convection or flow boiling (or a combination of these) in the evaporator chamber 90, leaves through the opening 68 in the base and the outlet port 36 before returning to the compressor for the start of a new cycle.
  • the capillary passage may be enlarged, the inlet pressure increased, and/or the evaporator charged to a material having a higher heat conductivity.
  • the circulating liquid may also be changed. If less heat lift is needed, the capillary passage size may be reduced, the flow rate lessened, the refrigerant altered and/or the like. Other variables may also change. There is no intention to limit the invention here due to changes in the amount of heat lift required or desired.
  • the pressure drop provided by the capillary passage is proportional to L divided by d where L is length and d is hydraulic diameter.
  • L is length and d is hydraulic diameter.
  • the advantage of a design that accommodates a long capillary passage is that the width and depth may be proportionately larger. This is beneficial so that the passage will be resistant to clogging. Also, a larger dimensioned passage may be easier to consistently manufacture.
  • the specification describes in detail embodiments of two variations of the present invention. Other modifications and variations will under the doctrine of equivalents or otherwise come within the scope of the appended claims. For example, as mentioned, enlarging the capillary passage or making it longer or changing the refrigerant or other liquid used to transfer heat or using aluminum rather than cooper for the evaporator all are considered equivalent structures. Still other alternatives will also be equivalent as will many new technologies. There is no desire or intention here to limit in any way the application of the doctrine of equivalents or the scope of the claims.

Abstract

A microscale chip cooling system (20) for a heat dissipating item, such as Intel's Pentium brand microprocessor, includes a 40 millimeter by 40 millimeter thermally insulated housing (22) including a base and a cover (24) and the system also includes a thermally conductive evaporator (28). The evaporator (28) is adapted to be attached to a heat source such as the microprocessor. The cover (24) includes inlet and outlet ports (30, 32) and the base (26) includes a capillary passage (60). A refrigerant or heat transferring fluid is pumped or past through the passage (60) before making a sudden expansion in an expansion zone (92) just before passing into an evaporator chamber (90). Pool and flow boiling and forced convection may occur in the evaporator chamber (90) as heat is transferred from the microprocessor through the thermally conductive evaporator (28) to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient.

Description

SMALL SCALE CHIP COOLER ASSEMBLY
BACKGROUND OF THE INVENTION
Technical Field
The present invention relates to a chip cooling assembly and more particularly to a very small-scale chip cooling assembly for efficiently and effectively cooling small but powerful electronic microprocessors or other small, heat generating devices.
B ac ground Art
As microprocessors, such as Intel's Pentium brand series, become more powerful, they also generate more heat. To prevent failure and to ensure optimum capability, it is necessary to remove heat and to maintain the temperature of these microprocessors within a predetermined range. A number of different devices trying to accomplish this have been patented. These include the use of cold plates, microchannels, impingement jets and variations and combinations of these as well as other cooling devices. See for example, U.S. Patents 4,392,362; 4,941,530; 5,183,104; 5,169,372; 5,394,936; 5,544,696; 5,696,405; and 5,870,823. The search, however, goes on for more effective, efficient and reliable cooling mechanisms.
DISCLOSURE OF THE INVENTION
The below described embodiment improves upon the prior efforts and is a small scale cooler system comprising a housing, an inlet port formed in the housing for receiving a refrigerant or similar fluid, an outlet port formed in the housing, a thermally conductive element connected to the housing, an evaporator chamber operatively communicating with the housing where heat exchange takes place, a capillary passage formed in the housing extending downstream from the inlet port, and an expansion zone formed downstream of the capillary passage and in fluid communication with the evaporator chamber. There are a number of advantages, features and objects achieved with the present invention which are believed not to be available in earlier related devices. For example, one advantage is that the present invention provides a very effective cooling system for very small heat dissipating items, such as electronic microprocessors. Another object of the present invention is to provide a small cooling system which is simple, reliable and economical. Yet another feature of the present invention is to provide a cooling system which is very small scale and easily attached to a small heat generating device. Yet a further feature of the present invention is to provide a cooling system flexible enough to transfer heat by forced convection, flow boiling, and pool boiling and any combination thereof.
A more complete understanding of the present invention and other objects, advantages and features thereof will be gained from a consideration of the following description of the preferred embodiment read in conjunction with the accompanying drawing provided herein. BRIEF DESCRIPTION OF DRAWINGS
FIGURE 1 is a top plan view of the cooling assembly described hereinbelow.
FIGURE 2 is a side elevation view of the cooling assembly. FIGURE 3 is a bottom plan view of the cooling assembly. FIGURE 4 is a front elevation view of the cooling assembly.
FIGURE 5 is a top view of a cover of the cooling assembly rotated 180 degrees from that shown in FIGURE 1.
FIGURE 6 is a side elevation view of the cover. FIGURE 7 is a rear elevation view of the cover. FIGURE 8 is a top plan view of a base member of the cooling assembly shown in FIGURE 1.
FIGURE 9 is a side elevation view of the base. FIGURE 10 is a bottom plan view of the base. FIGURE 11 is a rear elevation view of the base. FIGURE 12 is a top plan view of a thermally conductive element of the cooling assembly shown in FIGURE 1. FIGURE 13 is a side elevation view of the thermally conductive element.
FIGURE 14 is a bottom plan view of the thermally conductive element. FIGURE 15 is a front elevation view of the thermally conductive element.
FIGURE 16 is a sectional isometric view of the cooling assembly. FIGURE 17 is an exploded isometric view of the cooling assembly. FIGURE 18 is an exploded isometric view of a cooling assembly having a construction different from that of the FIGURE 1 embodiment. BEST MODE FOR CARRYING OUT THE INVENTION
While the present invention is open to various modifications and alternative constructions, the preferred embodiment shown in the drawing will be described herein in detail. It is understood, however, that there is no intention to limit the invention to the particular form disclosed. On the contrary, the intention is to cover all modifications, equivalent structures and methods, and alternative constructions falling within the spirit and scope of the invention as expressed in the appended claims. As used here, the term "microscale" refers to a very small scale consistent with the size of microchips, such as Intel's Pentium brand processor. A synonym of microscale is "mesoscale." The term "microsystem" refers directly to a microchip such as the Pentium brand processor. The reference to the Pentium brand processor is not to be considered limiting in any way and other microprocessors may be substituted. Also, future microprocessors of the same, similar, smaller or even larger size are considered within the scope, range and extent of the present invention. The term "pool boiling" involves the technology of boiling heat transfer and is a term well known by those skilled in the art. The term also appears in research articles such as the article, "Pool Boiling Heat Transfer From Plain And Microporous, Square Pin-Finned Surfaces In Saturated FC-72." This article appeared in the August, 2000 edition of the Journal of Heat Transfer, pages 509-516.
Referring now to FIGURES 1-4, an example of the claimed invention, in the form of a microscale cooling system 20, is illustrated. The system includes a housing 22, which is itself comprised of a cover 24 and a base 26. The system also includes an evaporator 28. Mounted to the cover are an inlet fitting 30 and an outlet fitting 32. The cover and base are made of any suitable thermally insulating synthetic resin, such as Nylon 6 or PBT. By the term "thermally insulating", it is meant a material having low thermal conductivity. The cover and base act as an insulator for refrigerant or other heat transferring fluid, liquid and gas flowing within the assembly. Formed between the base and the evaporator is an evaporator chamber to be described below.
' The cover 24 is a generally flat plate having two holes 34, 36, FIGURES 5-7, for forming inlet and outlet ports, respectively. The cover includes an outside surface 38 and an inside surface 40. Mounted to the cover on the outside surface are the inlet fitting 30 and the outlet fitting 32, FIGURES 1, 2 and 4. Also mounted to or formed on the outside surface of the cover are a series of paired grooming clips 44, 46, 48, 50, 52, 54 for aligning and constraining conduits (not shown) supplying a refrigerant or fluid for absorbing heat and conduits for carrying away gas phase refrigerant or other gas phase product back to a compressor as will be explained below. The cover is generally square with each side measuring about forty millimeters. The cover may be 0.5 to 1.0 millimeter thick.
Referring now to FIGURES 8-11, the base 26 is also a generally flat plate having first surface 56 and second surface 58. The first surface 56 abuts and is sealed to the inside surface 40 of the cover. Formed in the first surface of the base is a capillary passage 60 having as a top wall the inside surface 40 of the cover 24. The capillary passage has an upstream end 62 and a downstream end 64. The upstream end 62 aligns with the inlet port 34 of the cover 24 so that liquid pumped to the inlet port enters the capillary passage 60. The capillary passage may be serpentine to allow its length to be adjusted as desired by forming more or less loops. The length of the capillary passage depends upon the fluid used and the heat lift capacity desired as well as other factors. The cross-sectional dimensions of the capillary passage are also related to the length of the capillary passage. They balance flow, ability to pump and provide the required pressure drop. The downstream end 64 of the capillary passage adjoins an opening 66 in the base 26. The capillary passage may be formed in the base by molding or by hot embossing or by any other convenient manufacturing technique known or developed in the future. Generally, the capillary passage is square shaped in cross section having a side dimension of about two hundred fifty microns. The passage may be semicircular or trapezoidal in shape and corners may have a radius. The base 26 may have a thickness of about one millimeter.
The base 26 also includes a second opening 68 which aligns with an elongated recess 70. A far end portion 72 of the recess aligns with the outlet port 36, FIGURE 5, in the cover 24. The base may also includes a sealing ridge 74 around the periphery of the first surface 56. The sealing ridge facilitates assembly of the cover to the base by ultrasonic welding, laser welding or RF welding, processes which are well known to those skilled in the art. Extending from the second surface 58 is a mounting flange 76. The flange 76 will engage a lip of the evaporator 28, FIGURE 3, as will be explained below. The mounting flange has an oblong hexagonal shape as is readily seen in FIGURE 10. The fluid referred to above may be any heat transferring fluid including a refrigerant, such as those known as R236fa, R123, R134a, R124, or C02. Also, any suitable dielectric fluid or other suitable refrigerant may be used as is well known to those skilled in the refrigerant art. Further, other heat transferring fluids may be used, such as DYNALENE, FLUORINET, NOVEC, FLUTEC and a liquid slurry with encapsulated phos change materials (PCM). As is also well understood to those skilled in the art, the liquid is formed by compressing a gas to its liquid phase and then cooling the liquid before being exposed to heat. Upon the transfer of heat, the liquid again returns to a gas phase, or the liquid is pumped in and picks up heat via forced convection (remains liquid) or by flow or pool boiling where it becomes a gas or gas mixture which is later condensed back to a liquid. Other fluids can also be used as is well known to those skilled in the art.. The evaporator 28 is a thermally conductive element in the form of a metal plate 80 with a number of projections or fins 82, as they are usually called, mounted to an inside surface 84. An outside surface 86 of the evaporator is generally flat and is adapted to be connected to a heat source such as a microprocessor. The evaporator may also be connected to other small heat generating mechanisms, such as transistors, power semiconductors, laser optical IGBTs or other electronic or opto-electronic devices. The term "microsystem" is used here to refer to all such items and others, whether now in existence or developed in the future. The evaporator is formed of a material having high thermal conductivity, such as copper or aluminum. The evaporator is attached to the base by any convenient means, such as molding the base to the evaporator or using other techniques known by those in the art. The evaporator 28 includes a lip 88 around its periphery which may form an interference fit with the mounting flange 76 of the base 26. See also FIGURE 16. The evaporator may be connected to a microsystem by a thermal adhesive, thermal pad, or an evaporator may be molded or formed as a part of the microsystem should that prove more effective or efficient. All of these are commercially available and add considerable flexibility to the design.
An evaporator chamber 90, FIGURES 16 and 17, is formed between the evaporator 28 and the base 26, downstream of the capillary passage 60 and upstream of the outlet port 36 and among the fins 82. An expansion zone 92 is also formed between the evaporator and the base, and more particularly immediately downstream of the opening 66. The expansion zone is also immediately upstream of the evaporator chamber 90. This allows liquid in the capillary passage to cool in the expansion zone 92 and then pass into the evaporator chamber where pool boiling occurs among the fins.
When passing through the evaporator chamber, the heat transferring fluid will change phase to a gas or remain liquid when absorbing heat from the evaporator. The gas or liquid proceeds to a collection region 94 downstream of the evaporator chamber before exiting through the outlet port 36 and back to a compressor, not shown. Referring now to FIGURE 18, a cooling system 100 with a slightly different construction is disclosed. A housing 101 includes a base 102 and a cover 104. Inlet and outlet fittings 106, 108 are located in inlet and outlet ports 110, 112, respectively. A capillary tube 113 is connected to the inlet fitting 106. An expansion port 114 is formed in the base 102 and an evaporator chamber 116 is also formed in the base. An upper wall of the evaporator chamber is formed by the cover 104. A lower wall of the evaporator chamber is formed by an evaporator 118 and includes a plate 120 with a multitude of fins 122. Downstream of the evaporator chamber is a region 124 which includes upstanding blocks, such as the block 126 which alternate with passageways between the blocks, such as the passageway 128. The blocks form multiple exhaust ports to help separate flow to make more efficient use of the evaporator, to minimize orientation effects, to reduce pressure drop and to minimize blockage due to contamination. Downstream of the blocks is a passage 130 which is upstream of the outlet port 112. Like the assembly in FIGURE 1, the construction of FIGURE 18 includes a high thermally conductive evaporator and low thermally conductive cover and base.
In operation, the refrigerant is at a high pressure state when delivered to the inlet fitting 30, FIGURE 17. In a construction where R236 is the refrigerant and a heat lift of 50 watts is sought, the inlet pressure is about 55 psi, the flow rate is about 0.00055 kilograms per second and the capillary passage 60 is about two inches long and may have a square cross section of about 0.250 millimeters per side. The length of the cooling system is about 40 millimeters, the width about 40 millimeters and the height about 7 millimeters. The pins in the evaporator chamber may be about 1 millimeter square in cross section and about 5 millimeters in height. With such an arrangement, a Pentium brand microsystem may have a surface temperature maintained within the range of -20 to 50°C, depending on application and fluid selected.
The refrigerant is compressed in a compressor and cooled by a condenser before entering the capillary passage 60. A heat transfer fluid may be pumped. Thereafter, the refrigerant expands, absorbs heat by pool boiling, forced convection or flow boiling (or a combination of these) in the evaporator chamber 90, leaves through the opening 68 in the base and the outlet port 36 before returning to the compressor for the start of a new cycle. Should more heat lift be desired, the capillary passage may be enlarged, the inlet pressure increased, and/or the evaporator charged to a material having a higher heat conductivity. The circulating liquid may also be changed. If less heat lift is needed, the capillary passage size may be reduced, the flow rate lessened, the refrigerant altered and/or the like. Other variables may also change. There is no intention to limit the invention here due to changes in the amount of heat lift required or desired.
The pressure drop provided by the capillary passage is proportional to L divided by d where L is length and d is hydraulic diameter. The advantage of a design that accommodates a long capillary passage is that the width and depth may be proportionately larger. This is beneficial so that the passage will be resistant to clogging. Also, a larger dimensioned passage may be easier to consistently manufacture. The specification describes in detail embodiments of two variations of the present invention. Other modifications and variations will under the doctrine of equivalents or otherwise come within the scope of the appended claims. For example, as mentioned, enlarging the capillary passage or making it longer or changing the refrigerant or other liquid used to transfer heat or using aluminum rather than cooper for the evaporator all are considered equivalent structures. Still other alternatives will also be equivalent as will many new technologies. There is no desire or intention here to limit in any way the application of the doctrine of equivalents or the scope of the claims.

Claims

1. A microscale cooling system adapted to be operatively connected to a microsystem comprising: a housing; an inlet port formed in said housing for receiving a heat transferring fluid; an outlet port formed in said housing for passing said heat transferring fluid; a thermally conductive element operatively connected to said housing; an evaporator chamber formed by said housing and said thermally conductive element upstream of said outlet port; a capillary passage formed by said housing extending downstream from said inlet port; and an expansion zone formed downstream of said capillary passage between said housing and said thermally conductive element and in communication with said evaporator chamber.
2. An apparatus as claimed in claim 1 wherein: said thermally conductive element forms a wall of said evaporator chamber.
3. An apparatus as claimed in claim 1 including: a region upstream of said outlet port and downstream of said evaporator chamber.
4. An apparatus as claimed in claim 3 wherein: said region includes a filter for the heat transferring fluid.
5. An apparatus as claimed in claim 3 including: a plurality of blocks formed in said region for forming a plurality of passages for the flow of said heat transferring fluid.
6. An apparatus as claimed in claim 1 wherein: said thermally conductive element is a plate having a plurality of projections formed thereon.
7. An apparatus as claimed in claim 1 including: means for attaching said thermally conductive element to said microsystem.
8. An apparatus as claimed in claim 7 wherein: said attaching means is a thermally conductive adhesive.
9. An apparatus as claimed in claim 1 wherein: said thermally conductive element forms a wall of said evaporator chamber; and said thermally conductive element is a plate having a plurality of projections formed thereon.
10. An apparatus as claimed in claim 1 wherein: said thermally conductive element is a plate in fluid tight engagement with said housing wherein the evaporator chamber is formed between the plate and the housing.
11. An apparatus as claimed in claim 10 wherein: said plate is sized to attach to a heat generating microsystem.
12. An apparatus as claimed in claim 1 wherein: said housing includes a cover and a base, said base having said capillary passage formed therein.
13. An apparatus as claimed in claim 1 wherein: said housing includes a portion having said capillary passage and another portion having an evaporator chamber.
14. An apparatus as claimed in claim 1 wherein: said capillary passage has a generally square section of about 0.250 millimeters per side.
15. An apparatus as claimed in claim 1 wherein: said heat transferring fluid is a refrigerant flowing through said capillary passage and having a flow rate of about 0.00055 kilograms/second.
16. An apparatus as claimed in claim 1 wherein: pressure on said heat transferring fluid is about 55 psi at said inlet port.
17. An apparatus as claimed in claim 16 wherein: said heat transferring fluid becomes a gas in said evaporator chamber; and said gas in said evaporator chamber is at a pressure of about 15 psi.
18. An apparatus as claimed in claim 1 wherein: said heat transferring fluid is pressurized at said inlet port.
19. An apparatus as claimed in claim 18 wherein: said housing includes a cover; said housing includes a base, said base having said capillary passage; said thermally conductive element is a plate having a plurality of projections formed thereon; said plate being in a fluid tight connection with said base and forming said evaporator chamber, said expansion zone and a filter region; and including a plurality of spaced apart blocks.
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CA002474042A CA2474042A1 (en) 2002-01-14 2003-01-08 Small scale chip cooler assembly
MXPA04006760A MXPA04006760A (en) 2002-01-14 2003-01-08 Small scale chip cooler assembly.

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005125296A1 (en) * 2004-06-15 2005-12-29 Tm4 Inc. Cooling device for electric circuit
WO2008036529A2 (en) * 2006-09-23 2008-03-27 Varian Semiconductor Equipment Associates, Inc. Techniques for temperature-controlled ion implantation
CN102799244A (en) * 2012-08-27 2012-11-28 无锡市福曼科技有限公司 Multi-channel water-cooling device structure of computer CPU (Central Processing Unit)
JP2014075385A (en) * 2012-10-02 2014-04-24 Toyota Industries Corp Cooling device and semiconductor device

Families Citing this family (150)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335965B2 (en) * 1999-08-25 2008-02-26 Micron Technology, Inc. Packaging of electronic chips with air-bridge structures
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
JP2006522463A (en) * 2002-11-01 2006-09-28 クーリギー インコーポレイテッド Optimal spreader system, apparatus and method for micro heat exchange cooled by fluid
US20050211418A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US20040112571A1 (en) * 2002-11-01 2004-06-17 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US20050211417A1 (en) * 2002-11-01 2005-09-29 Cooligy,Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US20050211427A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7410484B2 (en) * 2003-01-15 2008-08-12 Cryodynamics, Llc Cryotherapy probe
US7083612B2 (en) * 2003-01-15 2006-08-01 Cryodynamics, Llc Cryotherapy system
US7273479B2 (en) 2003-01-15 2007-09-25 Cryodynamics, Llc Methods and systems for cryogenic cooling
US7201012B2 (en) * 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
US20040182551A1 (en) * 2003-03-17 2004-09-23 Cooligy, Inc. Boiling temperature design in pumped microchannel cooling loops
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
FR2861894B1 (en) * 2003-10-31 2008-01-18 Valeo Equip Electr Moteur DEVICE FOR COOLING A POWER ELECTRONIC
US7365980B2 (en) * 2003-11-13 2008-04-29 Intel Corporation Micropin heat exchanger
US6989991B2 (en) * 2004-05-18 2006-01-24 Raytheon Company Thermal management system and method for electronic equipment mounted on coldplates
US7212405B2 (en) * 2004-05-27 2007-05-01 Intel Corporation Method and apparatus for providing distributed fluid flows in a thermal management arrangement
US7300821B2 (en) * 2004-08-31 2007-11-27 Micron Technology, Inc. Integrated circuit cooling and insulating device and method
US7212403B2 (en) * 2004-10-25 2007-05-01 Rocky Research Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
AU2011203084B2 (en) * 2004-11-03 2013-09-05 Velocys, Inc. Partial boiling in mini and micro-channels
EP1819436A1 (en) 2004-11-03 2007-08-22 Velocys, Inc. Partial boiling in mini and micro-channels
DE102004054337B4 (en) * 2004-11-09 2007-01-11 Rittal Res Electronic Systems Gmbh & Co. Kg cooling arrangement
US7202562B2 (en) * 2004-12-02 2007-04-10 Micron Technology, Inc. Integrated circuit cooling system and method
US7301770B2 (en) * 2004-12-10 2007-11-27 International Business Machines Corporation Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
US7193316B2 (en) * 2004-12-16 2007-03-20 Intel Corporation Integrated circuit coolant microchannel with movable portion
CA2606687C (en) * 2005-01-05 2015-08-11 Tir Technology Lp Thermally and electrically conductive apparatus
US20080296589A1 (en) * 2005-03-24 2008-12-04 Ingo Speier Solid-State Lighting Device Package
CA2614803C (en) * 2005-04-05 2015-08-25 Tir Technology Lp Electronic device package with an integrated evaporator
US8109324B2 (en) * 2005-04-14 2012-02-07 Illinois Institute Of Technology Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
US7927948B2 (en) 2005-07-20 2011-04-19 Micron Technology, Inc. Devices with nanocrystals and methods of formation
TWM288699U (en) * 2005-08-17 2006-03-11 Man Zai Ind Co Ltd Circulation type water-cooling base
CA2558840A1 (en) * 2005-09-07 2007-03-07 Coolit Systems Inc. Cooling device for electronic components
US7515418B2 (en) 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7272006B2 (en) * 2005-09-30 2007-09-18 Intel Corporation IC coolant microchannel assembly with integrated attachment hardware
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) * 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
DE102006008033A1 (en) * 2006-02-21 2007-09-06 Siemens Ag Österreich Heat sink with coolant flowing through the pipe
US7412844B2 (en) * 2006-03-07 2008-08-19 Blue Zone 40 Inc. Method and apparatus for cooling semiconductor chips
US20070215324A1 (en) * 2006-03-14 2007-09-20 Wen-Han Chen Liquid-cooled heat dissipater
US20080006396A1 (en) * 2006-06-30 2008-01-10 Girish Upadhya Multi-stage staggered radiator for high performance liquid cooling applications
US7906794B2 (en) 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
US20080093054A1 (en) * 2006-08-29 2008-04-24 Tilton Charles L Manifold for a Two-Phase Cooling System
KR101484488B1 (en) * 2006-10-31 2015-01-20 코닌클리케 필립스 엔.브이. Lighting device package
FR2910227A1 (en) * 2006-12-18 2008-06-20 Sagem Defense Securite INTEGRATED ELECTRONIC COMPONENT DEVICE PROVIDED WITH A VENTILATED ZONE SEPARATION PAN
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
CA2587998A1 (en) 2007-03-30 2008-09-30 Coolit Systems Inc. Pump expansion vessel
US7499279B2 (en) * 2007-04-30 2009-03-03 International Business Machines Corporation Cold plate stability
US20080310116A1 (en) * 2007-06-15 2008-12-18 O'connor Kurt F Heatsink having an internal plenum
US7495916B2 (en) * 2007-06-19 2009-02-24 Honeywell International Inc. Low cost cold plate with film adhesive
US20090008662A1 (en) * 2007-07-05 2009-01-08 Ian Ashdown Lighting device package
TW200912621A (en) * 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US20090071630A1 (en) * 2007-09-17 2009-03-19 Raytheon Company Cooling System for High Power Vacuum Tubes
US8345424B2 (en) * 2008-02-19 2013-01-01 Nec Corporation Optical interconnection device
US8250877B2 (en) * 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
EP2277365B1 (en) 2008-05-16 2011-11-02 Parker-Hannifin Corporation Modular high-power drive stack cooled with vaporizable dielectric fluid
US7639499B1 (en) * 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US8299604B2 (en) * 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7885070B2 (en) 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
US7929306B2 (en) * 2009-03-31 2011-04-19 Alcatel-Lucent Usa Inc. Circuit pack cooling solution
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
US8631858B2 (en) * 2009-06-16 2014-01-21 Uop Llc Self cooling heat exchanger with channels having an expansion device
US20110079376A1 (en) * 2009-10-03 2011-04-07 Wolverine Tube, Inc. Cold plate with pins
US8931546B2 (en) * 2010-03-29 2015-01-13 Hamilton Sundstrand Space Sytems International, Inc. Compact two sided cold plate with threaded inserts
US20110232887A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Cold plate with integral structural fluid port
US8991478B2 (en) * 2010-03-29 2015-03-31 Hamilton Sundstrand Space Systems International, Inc. Compact two sided cold plate with transfer tubes
US20110232866A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Integral cold plate and honeycomb facesheet assembly
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8353332B2 (en) 2010-10-13 2013-01-15 Reid Aarne H Integrated electronics cooling device
US8797741B2 (en) * 2010-10-21 2014-08-05 Raytheon Company Maintaining thermal uniformity in micro-channel cold plates with two-phase flows
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
ITTO20111182A1 (en) * 2011-12-21 2013-06-22 Thesan S P A CONNECTION FOR ROLL-BOND PANELS
RU2510732C2 (en) * 2012-08-02 2014-04-10 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Light-emitting diode module cooling system
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
FR3002624B1 (en) * 2013-02-28 2015-02-27 Bull Sas HYDRAULIC DISTRIBUTOR
TWI531795B (en) 2013-03-15 2016-05-01 水冷系統公司 Sensors, multiplexed communication techniques, and related systems
AU2014327045B2 (en) 2013-09-24 2019-08-08 Adagio Medical, Inc. Endovascular near critical fluid based cryoablation catheter and related methods
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
US10617459B2 (en) 2014-04-17 2020-04-14 Adagio Medical, Inc. Endovascular near critical fluid based cryoablation catheter having plurality of preformed treatment shapes
US9258926B2 (en) 2014-06-24 2016-02-09 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9560789B2 (en) 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US9408332B2 (en) 2014-06-24 2016-08-02 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9699939B2 (en) 2014-06-24 2017-07-04 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11744041B2 (en) 2014-06-24 2023-08-29 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US10543032B2 (en) 2014-11-13 2020-01-28 Adagio Medical, Inc. Pressure modulated cryoablation system and related methods
US9655281B2 (en) * 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
WO2017048965A1 (en) 2015-09-18 2017-03-23 Adagio Medical Inc. Tissue contact verification system
US10065256B2 (en) 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
WO2017095756A1 (en) 2015-11-30 2017-06-08 Adagio Medical, Inc. Ablation method for creating elongate continuous lesions enclosing multiple vessel entries
US10941924B2 (en) 2015-12-15 2021-03-09 Wangs Alliance Corporation LED lighting methods and apparatus
US11686459B2 (en) 2015-12-15 2023-06-27 Wangs Alliance Corporation LED lighting methods and apparatus
US10208935B2 (en) 2015-12-15 2019-02-19 Wangs Alliance Corporation LED lighting apparatus with adjustable beam angle lens
CN109154641B (en) 2016-03-04 2021-09-17 概念集团有限责任公司 Vacuum insulation article with reflective material enhancement
CA3043868A1 (en) 2016-11-15 2018-05-24 Concept Group Llc Multiply-insulated assemblies
CA3043915A1 (en) 2016-11-15 2018-05-24 Concept Group Llc Enhanced vacuum-insulated articles with microporous insulation
US10390455B2 (en) 2017-03-27 2019-08-20 Raytheon Company Thermal isolation of cryo-cooled components from circuit boards or other structures
US11812525B2 (en) 2017-06-27 2023-11-07 Wangs Alliance Corporation Methods and apparatus for controlling the current supplied to light emitting diodes
CN107327995A (en) * 2017-07-17 2017-11-07 青岛海尔空调电子有限公司 The gas collecting apparatus and air-conditioning system of central air-conditioning
WO2019040885A1 (en) 2017-08-25 2019-02-28 Reid Aarne H Multiple geometry and multiple material insulated components
IL273075B1 (en) 2017-09-05 2024-03-01 Adagio Medical Inc Ablation catheter having a shape memory stylet
EP3474321A1 (en) * 2017-10-17 2019-04-24 Siemens Aktiengesellschaft Cooling system
WO2019103729A1 (en) 2017-11-22 2019-05-31 Hewlett-Packard Development Company, L.P. Microfluidic devices with lid for loading fluid
CA3087772A1 (en) 2018-01-10 2019-07-18 Adagio Medical, Inc. Cryoablation element with conductive liner
US11516949B2 (en) * 2018-03-13 2022-11-29 Nissan Motor Co., Ltd. Power convertor
JP7061770B2 (en) * 2018-03-30 2022-05-02 日立Astemo株式会社 Cooling system
JP7185420B2 (en) * 2018-05-24 2022-12-07 現代自動車株式会社 boiling cooler
CN111406314B (en) * 2018-06-27 2023-09-22 富士电机株式会社 Cooling device, semiconductor module, and vehicle
US10749288B2 (en) * 2018-06-28 2020-08-18 Mellanox Technologies, Ltd. Flexible liquid-cooling assembly for high-power pluggable connectors
CN109011743B (en) * 2018-07-09 2020-09-08 佛山市金凯地过滤设备有限公司 Filter plate cooling equipment of filter press
CN210008008U (en) * 2018-11-30 2020-01-31 富顶精密组件（深圳）有限公司 locking structure for fixing chip module and backboard structure thereof
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
USD917587S1 (en) * 2019-02-08 2021-04-27 Panasonic Intellectual Property Management Co., Ltd. Laser impingement cooler
USD916149S1 (en) * 2019-02-08 2021-04-13 Panasonic Intellectual Property Management Co., Ltd. Laser impingement cooler
USD916150S1 (en) * 2019-02-08 2021-04-13 Panasonic Intellectual Property Management Co., Ltd. Laser impingement cooler
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11896136B2 (en) * 2019-09-19 2024-02-13 Apple Inc. Pneumatic haptic device having actuation cells for producing a haptic output over a bed mattress
US20220408600A1 (en) * 2019-10-24 2022-12-22 Sanhua (Hangzhou) Micro Channel Heat Exchanger Co., Ltd. Heat exchange system used for heat dissipation of electronic control assembly and computer host
JP7419050B2 (en) * 2019-12-16 2024-01-22 日立Astemo株式会社 Power module, power converter, and power module manufacturing method
CN110985903B (en) 2019-12-31 2020-08-14 江苏舒适照明有限公司 Lamp module
US11598517B2 (en) 2019-12-31 2023-03-07 Lumien Enterprise, Inc. Electronic module group
EP3893274A1 (en) * 2020-04-07 2021-10-13 ABB Schweiz AG Cooling element and method of manufacturing a cooling element
CN111503556B (en) 2020-04-23 2020-11-27 江苏舒适照明有限公司 Spotlight structure
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
DE102020119288A1 (en) * 2020-07-22 2022-01-27 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Heat exchange module for an energy storage module, and a manufacturing method for such a heat exchange module
CN112033196B (en) * 2020-08-19 2022-02-18 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) Low-pressure gas-liquid two-phase flow cold plate
CN215935363U (en) * 2020-09-02 2022-03-01 春鸿电子科技(重庆)有限公司 Liquid cooling head
EP4053895A1 (en) * 2021-03-03 2022-09-07 Ovh Water block assembly having an insulating housing
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US20230200009A1 (en) * 2021-12-22 2023-06-22 Baidu Usa Llc Two phase immersion system with local fluid accelerations
US20230284414A1 (en) * 2022-03-04 2023-09-07 Aavid Thermalloy, Llc Liquid cooled heat exchanger
US11943904B2 (en) 2022-05-31 2024-03-26 GE Grid GmbH Hybrid thermosyphon with immersion cooled evaporator
US11802682B1 (en) 2022-08-29 2023-10-31 Wangs Alliance Corporation Modular articulating lighting

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4685512A (en) * 1982-03-22 1987-08-11 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
US5220809A (en) * 1991-10-11 1993-06-22 Nartron Corporation Apparatus for cooling an air conditioning system electrical controller
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10050A (en) * 1853-09-27 Making chains
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US3917370A (en) * 1974-08-29 1975-11-04 Amp Inc Interconnect device for use in closed fluid circulating systems
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
US4315300A (en) * 1979-01-29 1982-02-09 The United States Of America As Represented By The Secretary Of The Navy Cooling arrangement for plug-in module assembly
US4392362A (en) 1979-03-23 1983-07-12 The Board Of Trustees Of The Leland Stanford Junior University Micro miniature refrigerators
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
WO1984002177A1 (en) * 1982-12-01 1984-06-07 William A Little Fast cooldown miniature refrigerators
US4498118A (en) 1983-04-05 1985-02-05 Bicc-Vero Electronics Limited Circuit board installation
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
US4866570A (en) * 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
US4941530A (en) 1989-01-13 1990-07-17 Sundstrand Corporation Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
US4958257A (en) * 1989-03-29 1990-09-18 Hughes Aircraft Company Heat conducting interface for electronic module
US5183104A (en) 1989-06-16 1993-02-02 Digital Equipment Corporation Closed-cycle expansion-valve impingement cooling system
US5057968A (en) * 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
US5169372A (en) 1990-03-23 1992-12-08 Armand Tecco Exercise device
US5088005A (en) 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5067047A (en) 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
US5285347A (en) 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
JP2795289B2 (en) * 1990-09-04 1998-09-10 富士通株式会社 Printed board unit holding structure in electronic equipment
US5099910A (en) 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
US5218515A (en) 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5316075A (en) * 1992-12-22 1994-05-31 Hughes Aircraft Company Liquid jet cold plate for impingement cooling
US5394936A (en) 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US5509468A (en) 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor
US5365749A (en) 1993-12-23 1994-11-22 Ncr Corporation Computer component cooling system with local evaporation of refrigerant
US5544696A (en) 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US5696405A (en) 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US5870823A (en) 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5823005A (en) 1997-01-03 1998-10-20 Ncr Corporation Focused air cooling employing a dedicated chiller
US5923533A (en) * 1998-02-17 1999-07-13 Lockheed Martin Corporation Multiple tile scaleable cooling system for semiconductor components
CA2352997A1 (en) 2001-07-13 2003-01-13 Coolit Systems Inc. Computer cooling apparatus
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4685512A (en) * 1982-03-22 1987-08-11 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
US5220809A (en) * 1991-10-11 1993-06-22 Nartron Corporation Apparatus for cooling an air conditioning system electrical controller
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1472499A4 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005125296A1 (en) * 2004-06-15 2005-12-29 Tm4 Inc. Cooling device for electric circuit
WO2008036529A2 (en) * 2006-09-23 2008-03-27 Varian Semiconductor Equipment Associates, Inc. Techniques for temperature-controlled ion implantation
WO2008036529A3 (en) * 2006-09-23 2008-08-28 Varian Semiconductor Equipment Techniques for temperature-controlled ion implantation
US7993698B2 (en) 2006-09-23 2011-08-09 Varian Semiconductor Equipment Associates, Inc. Techniques for temperature controlled ion implantation
CN102799244A (en) * 2012-08-27 2012-11-28 无锡市福曼科技有限公司 Multi-channel water-cooling device structure of computer CPU (Central Processing Unit)
CN102799244B (en) * 2012-08-27 2016-06-22 无锡市福曼科技有限公司 The multiple flow passages water cooling plant structure of computer CPU
JP2014075385A (en) * 2012-10-02 2014-04-24 Toyota Industries Corp Cooling device and semiconductor device

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EP1472499A1 (en) 2004-11-03
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US7258161B2 (en) 2007-08-21
AU2003209176A1 (en) 2003-07-30
US20030131972A1 (en) 2003-07-17
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US20040163797A1 (en) 2004-08-26
CA2474042A1 (en) 2003-07-24

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