WO2003056509A1 - A smart label web and a method for its manufacture - Google Patents
A smart label web and a method for its manufacture Download PDFInfo
- Publication number
- WO2003056509A1 WO2003056509A1 PCT/FI2002/001044 FI0201044W WO03056509A1 WO 2003056509 A1 WO2003056509 A1 WO 2003056509A1 FI 0201044 W FI0201044 W FI 0201044W WO 03056509 A1 WO03056509 A1 WO 03056509A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- smart label
- structural part
- chip
- web
- smart
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
Definitions
- the present invention relates to a method for the manufacture of a smart label web, the smart label web comprising smart labels one after another and/or side by side, which comprise a circuitry pattern and an integrated circuit on a chip attached to it, and in which method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web in such a way that a structural part separated from a separate carrier web and containing the integrated circuit on the chip is electrically connected to the smart label by pressing mechanically.
- the present invention also relates to a smart label web comprising smart labels one after another and/or side by side, which comprise a circuitry pattern and a structural part comprising an integrated circuit on a chip, which is electrically connected to the circuitry pattern by a joint made by mechanical pressing.
- the placement of the chip on the smart label requires that the tool used has a long path and also that the chip is positioned very precisely in the correct location.
- the smart label can also be provided with a separate structural part comprising an integrated circuit on a chip, attached on a film material.
- the electrical contact between the integrated circuit on the chip and the circuitry pattern of the smart label is formed so that the film material of the separate structural part comprises a conductive layer which is connected to the chip and which layer is brought into contact with the circuitry pattern in connection with the manufacture of the smart label by connecting both ends of the strip-like structural part to the circuitry pattern, that is, the structural part is off the smart label in the area between its ends.
- the structural part is attached to that side of the smart label on whose opposite side the circuitry pattern is located so that the chip comes against the smart label.
- the distance between the structural part and the circuitry pattern and simultaneously the distance between the integrated circuit on the chip and the circuitry pattern are changed by bending, because the structural part is not wholly attached to the smart label, wherein the stray capacitance affecting the frequency of the electrical oscillating circuit is changed, and
- the smart label has a relatively thick construction, which is disadvantageous in further processing steps.
- the method of the invention for the manufacture of a smart label web is characterized in that the structural part or the smart label comprises a thermoplastic film whereby the structural part is attached to the smart label substantially entirely.
- the smart label web according to the invention is characterized in that the structural part or the smart label comprises a thermoplastic film whereby the structural part is attached to the smart label substantially entirely.
- thermoplastic films provide e.g. the following advantages:
- thermoplastic films can be repeatedly formed by applying heat, the distance between the structural part and the circuitry pattern as well as the distance between the integrated circuit on the chip and the circuitry pattern is fixed, because the structural part is wholly attached to the smart label by the thermoplastic film, wherein the stray capacitance affecting the frequency of the electrical oscillating circuit cannot be changed, and
- thermoplastic film isolates the circuitry pattern from the chip, so they can contact each other only at predetermined contact points.
- the process of attachment of the chip is independent of the size and geometry of the circuitry pattern
- the structural part is small in size, it can contain materials which are more expensive but have better properties, such as more thermoresistant materials or materials with better dimension stability, and
- the attachment of the structural part to the smart label can be made with greater tolerances than the direct attachment of the chip to the circuitry pattern of the smart label.
- the method according to the invention provides e.g. the following advantages:
- smart labels refer to labels comprising an RF-ID circuit (identification) or an RF-EAS circuit (electronic article sur- veillance).
- a smart label web consists of a sequence of successive and/or adjacent smart labels.
- the circuitry pattern can be manufactured by pressing the circuitry pattern with an electroconductive printing ink on a film, by etching the circuitry pattern on a metal film, by punching the circuitry pattern from a metal film; or by winding the circuitry pattern of for example copper wire.
- the circuitry pattern is formed by etching it on the metal film.
- the electrically operating RFID (radio frequency identification) circuit of the smart label is a simple electric oscillating circuit (RCL circuit) operating at a determined frequency.
- the circuit consists of a coil, a capacitor and an integrated circuit on a chip.
- the integrated circuit comprises an escort memory and an RF part which is arranged to communicate with a reader device.
- the capacitor of the RCL circuit can be integrated in the chip or it can be located outside the chip. When the capacitor is located outside the chip, it is formed by plates on the smart label web and the structural part. The plates are located one upon the other thereby forming the capacitor in a ready smart label.
- the smart label web is of a material that is flexible but still has a suitable rigidity, such as polycarbonate, polyolefine, polyester, poly- ethylene terephtalate (PET), polyvinyl chloride (PVC), or acrylonitrile / butadiene / styrene copolymer (ABS).
- a suitable rigidity such as polycarbonate, polyolefine, polyester, poly- ethylene terephtalate (PET), polyvinyl chloride (PVC), or acrylonitrile / butadiene / styrene copolymer (ABS).
- a carrier web comprising a base web is first manufactured.
- the base web can be of the same material as the smart label web but the choice of the material depends for example on the embodiment of the invention to be applied.
- the surface of the base web is provided with a conductive metal coating for electrical contacts of structural parts.
- the wafer is normally supplied for use in attaching processes so that the chips are separated from each other, on a carrying film supported by a frame.
- the single chips are detached in the process by pushing the chip mechanically from underneath the carrying film and by gripping the chip from the opposite side with a die bonder or die sorter utilizing an underpressure suction.
- Integrated circuits on chips are attached one after another and/or next to each other on the surface of the base web by using flip-chip technology.
- the chips are picked up from the silicon wafer by means of a die sorter and placed in a continuous manner onto the surface of the base web.
- Possible techniques to attach the chip to the base web include technologies known as such, such as placing a chip by a die sorter on a piece of a blister tape attached to the smart label.
- the chip can also be placed in a recess formed in the base web. Then contact pads of the chip are in the level of the upper surface of the base web or they are formed at the ends of the chip. The other way to put a chip into a recess is to put it so that the active side of the chip is on the upper level of the chip.
- the chip is in two previous cases relatively thin, at the most 70 ⁇ m, typically 50 - 70 ⁇ m. Because the dimensions of the structural part to be formed of the carrier web are small, it is possible to place chips relatively close to each other on the carrier web, and thereby long paths will not be needed for attaching the chip. With short paths, it is possible to implement sufficiently accurate positioning more easily than on attachment of the chip directly to the circuitry pattern. Furthermore, the position of the chip on the structural part may vary within a larger range.
- thermoplastic film is attached to that side of the base web which has the conductive metal coatings for electrical contacts of the structural parts and the chip.
- the thermoplastic film is formed on the base web by lamination or extrusion.
- the thermoplastic film may include a two layer structure in which the outer layer of the thermoplastic film melts or softens at a lower temperature than the inner layer of the thermoplastic film. The inner layer remains unchanged and keeps its thickness while the outer layer adheres to the smart label when the thermoplastic film is heated to a suitable temperature. Thus the capacitance of the capacitor formed by plates on the smart label and the structural part remains constant.
- the two layer structure is achieved by co-extrusion or lamination.
- Films that can be heat-sealed, for example polyolefines or polyurethane, or hot melt adhesives can be laminated on the base web. Extruded films are formed on the base web in a molten state. Suitable materials to be extruded are for example polyethyleneterephtalate (PET), polyolefines (PE, PP), polyvinylchlo de (PVC), polycarbonate (PC) or acrylonitrile / butadiene / styrene copolymer (ABS).
- PET polyethyleneterephtalate
- PE polyolefines
- PVC polyvinylchlo de
- PC polycarbonate
- ABS acrylonitrile / butadiene / styrene copolymer
- structural parts comprising an integrated circuit on a chip are separated from a carrier web, and the structural parts are attached to the circuitry pattern of a smart label in a web containing smart labels.
- the structural part is preferably attached to that side of the smart label, on which the circuitry pattern is provided, although attachment to the reverse side is also possible.
- the attachment is made so that the structural part is attached by applying heat and pressure to each smart label on the smart label web in such a way that the thermoplastic film is in contact with the smart label and the side of the base web is left as the outer surface of the structural part.
- the structural part is substantially fully attached to the smart label, wherein a reliable bond is achieved.
- the structural part can be attached first slightly to the smart label by using heat to melt or soften the thermoplastic film.
- the final bond can be made in a nip, in a series of nips or in some other arrangement capable of producing pressure and/or heat.
- the electrical contact between the circuitry pattern and the integrated circuit on the chip is achieved by a joint made by mechanical pressing.
- mechanical pressing means that the joint is made by applying pressure to get a physical contact between the counterparts or the counterparts are so close to each other that an electrical contact between them is possible.
- At least one end of the structural part is attached to the smart label by applying pressure, the other end can make an electrical contact through a capacitor formed by plates on the smart label and the structural part which are aligned one upon the other in the ready smart label.
- the manufacture of the carrier web and the manufacture of the smart label web can take place in the same process or in separate processes.
- Fig. 1a shows a circuitry pattern of a smart label in a top view
- Fig. 1 b shows a structural part in a top view
- Fig. 1c shows a ready smart label according to the invention in a top view
- Fig. 2 illustrates the structure of the structural part in a cross- section.
- Figure 1a shows a circuitry pattern 2 of a smart label 1.
- smart labels are in a web form, the web comprising successive and/or adjacent smart labels.
- the ends of the circuitry pattern are indicated with reference numbers 2a and 2b.
- Figure 1b shows a structural part 4.
- the structural part 4 comprises a base web 4b, an integrated circuit 3 on a chip and a thermoplastic film 4a, attached to the surface of the base web (shown in Fig. 2).
- the contact points made of conductive material are indicated with reference numbers 2c and 2d.
- Figure 1c shows a smart label 1 comprising a circuitry pattern 2 and an integrated circuit 3 on a chip, attached to the surface of a separate structural part 4.
- An electrical contact is formed between the circuitry pattern 2 and the integrated circuit 3 on the chip by aligning points 2b and 2c in one end of the structural part and points 2a and 2d in the other end of the structural part.
- the joint is made by mechanical pressing from at least one end of the structural part.
- the structural part 4 is attached to the smart label 1 in such a way that substantially the whole area of its one side is attached to the smart label 1 by means of a thermoplastic film.
- the integrated circuit on the chip 3 is left between the base web 4b and the thermoplastic film 4a.
- the structural part 4 and/or the circuitry pattern 2 of the smart label can be provided with bumps for providing an electrical contact.
- the bumps can be provided before the lamination or the extrusion of the thermoplastic film on the same production line on which the chip is attached to the base web in such a way that suitable bumps, whose material can be a suitable metal, are formed at the ends of the structural part 4.
- So-called stud bumps can be formed at this process step by means of a gold wire bonder but they are not essential.
- Fig. 2 shows the cross-section of the structural part 4.
- the structural part comprises an integrated circuit on a chip 3, a thermoplastic film 4a, and a layer 4b consisting of the base web. On the surface where the thermoplastic film 4a is attached, the layer 4b is provided with the conductive metal coating of the structural part.
- the manufacture of the carrier web and the manufacture of the smart label web can take place in the same process or they can be separate processes.
- the process of manufacture of the smart label web can be continued so that the other layers to be joined to the surface of the smart label web are attached in the same process, even so that the attachment is made simultaneously with the final bond of the structural part.
- the thermoplastic film can also be on the smart label and its size is at least as large as that of the structural part but the thermoplastic film can also cover the whole smart label thus at the same time protecting the smart label.
- the main idea of the present invention is that a separate structural part comprising an integrated circuit on a chip can be attached to a smart label substantially entirely by using a thermoplastic film. Thus problems occurred due to the changing stray capacitance can be avoided.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002352296A AU2002352296A1 (en) | 2001-12-21 | 2002-12-19 | A smart label web and a method for its manufacture |
GB0413695A GB2399561B (en) | 2001-12-21 | 2002-12-19 | A smart label web and a method for its manufacture |
DE10297573.6T DE10297573B4 (en) | 2001-12-21 | 2002-12-19 | Intelligent label and method for its production |
JP2003556951A JP4271038B2 (en) | 2001-12-21 | 2002-12-19 | Smart label web and manufacturing method thereof |
US10/869,586 US7152803B2 (en) | 2001-12-21 | 2004-06-16 | Smart label web and a method for its manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20012549A FI119401B (en) | 2001-12-21 | 2001-12-21 | Smart label web and process for its manufacture |
FI20012549 | 2001-12-21 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/869,586 Continuation US7152803B2 (en) | 2001-12-21 | 2004-06-16 | Smart label web and a method for its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003056509A1 true WO2003056509A1 (en) | 2003-07-10 |
Family
ID=8562556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FI2002/001044 WO2003056509A1 (en) | 2001-12-21 | 2002-12-19 | A smart label web and a method for its manufacture |
Country Status (7)
Country | Link |
---|---|
US (1) | US7152803B2 (en) |
JP (1) | JP4271038B2 (en) |
AU (1) | AU2002352296A1 (en) |
DE (1) | DE10297573B4 (en) |
FI (1) | FI119401B (en) |
GB (1) | GB2399561B (en) |
WO (1) | WO2003056509A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6867983B2 (en) | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
US6940408B2 (en) | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
US7120987B2 (en) | 2003-08-05 | 2006-10-17 | Avery Dennison Corporation | Method of making RFID device |
US7224280B2 (en) | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
US7307527B2 (en) | 2004-07-01 | 2007-12-11 | Avery Dennison Corporation | RFID device preparation system and method |
US7477194B2 (en) | 2003-04-11 | 2009-01-13 | Avery Dennison Corporation | Conductive pattern and method of making |
US7682871B2 (en) | 2003-06-04 | 2010-03-23 | Upm Raflatac Oy | Method for forming a joint |
US7842152B2 (en) | 2005-08-22 | 2010-11-30 | Avery Dennison Corporation | Method of making RFID devices |
US7930815B2 (en) | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI112288B (en) | 2000-01-17 | 2003-11-14 | Rafsec Oy | Procedure for producing an input path for smart labels |
FI112121B (en) * | 2000-12-11 | 2003-10-31 | Rafsec Oy | Smart sticker web, process for making it, process for making a carrier web, and component of a smart sticker on a smart sticker web |
US20060232589A1 (en) * | 2005-04-19 | 2006-10-19 | Microsoft Corporation | Uninterrupted execution of active animation sequences in orphaned rendering objects |
US8235825B2 (en) * | 2007-08-14 | 2012-08-07 | John B. French | Smart card holder for automated gaming system and gaming cards |
US8221244B2 (en) | 2007-08-14 | 2012-07-17 | John B. French | Table with sensors and smart card holder for automated gaming system and gaming cards |
DE102008046338B4 (en) * | 2008-07-10 | 2012-10-31 | Gera-Ident Gmbh | Identification means for a contactless data transmission and manufacturing method thereof |
DE102010019121B4 (en) * | 2010-04-30 | 2014-09-11 | Bundesdruckerei Gmbh | Shielding an integrated circuit in a value or security document |
CN103703616B (en) * | 2011-07-22 | 2018-12-07 | 日立金属株式会社 | Antenna |
US11564435B2 (en) * | 2020-11-24 | 2023-01-31 | CreateMe Technologies LLC | Automated garment manufacturing using continuous webs of fabric |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0706152A2 (en) * | 1994-11-03 | 1996-04-10 | Fela Holding AG | Chip card and method for fabricating it |
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
US5935497A (en) * | 1995-06-21 | 1999-08-10 | Schlumberger Industries | Method of printing a graphic on a memory card |
US5962840A (en) * | 1994-12-23 | 1999-10-05 | Giesecke & Devrient Gmbh | Data carrier with electronic module and embedded coil feature |
FR2780534A1 (en) * | 1998-06-25 | 1999-12-31 | Solaic Sa | Fabrication method for portable objects incorporating electronic components, particularly non-contact smart cards |
DE19915765A1 (en) * | 1999-04-08 | 2000-10-19 | Cubit Electronics Gmbh | Manufacture of contactless transponders by inserting semiconductor chip into cavity in thermoplastic film and pressing antenna and connecting wires into film |
Family Cites Families (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3628977A (en) | 1969-10-02 | 1971-12-21 | Addressograph Multigraph | Multilayer tape for coating intaglio depressions and process for using same |
BE792488A (en) | 1971-12-08 | 1973-03-30 | Dainippon Printing Co Ltd | IDENTIFICATION CARDS AND METHOD FOR MANUFACTURING SUCH CARDS |
US4021705A (en) | 1975-03-24 | 1977-05-03 | Lichtblau G J | Resonant tag circuits having one or more fusible links |
FR2435778A1 (en) | 1978-08-01 | 1980-04-04 | Pyral Soc | SECURITY MAGNETIC RECORDING MEDIUM |
US4253899A (en) | 1979-03-08 | 1981-03-03 | Avery International Corporation | Method of making matrix free thin labels |
US4288499A (en) | 1979-05-08 | 1981-09-08 | Rohm And Haas Company | Polymers adherent to polyolefins |
DE3029939A1 (en) | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION |
JPS57142798A (en) | 1981-02-26 | 1982-09-03 | Nippon Piston Ring Co Ltd | Powder molding method and molded article |
DE3130032A1 (en) | 1981-07-30 | 1983-02-17 | Agfa-Gevaert Ag, 5090 Leverkusen | COUNTERFEIT-PROOF DOCUMENT |
US5294290A (en) | 1982-06-07 | 1994-03-15 | Reeb Max E | Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits |
AU589144B2 (en) | 1984-11-16 | 1989-10-05 | Toyo Seikan Kaisha Ltd. | Packaging material comprising iron foil, and container and container lid composed thereof |
EP0227293A3 (en) | 1985-12-05 | 1988-02-03 | General Binding Corporation | Method for laminating |
US4866505A (en) | 1986-03-19 | 1989-09-12 | Analog Devices, Inc. | Aluminum-backed wafer and chip |
NL8601404A (en) | 1986-05-30 | 1987-12-16 | Papier Plastic Coating Groning | DATA-CARRYING CARD, METHOD FOR MAKING SUCH CARD AND DEVICE FOR CARRYING OUT THIS METHOD |
US4846922A (en) | 1986-09-29 | 1989-07-11 | Monarch Marking Systems, Inc. | Method of making deactivatable tags |
US4954814A (en) | 1986-09-29 | 1990-09-04 | Monarch Marking Systems, Inc. | Tag and method of making same |
JPH0696357B2 (en) | 1986-12-11 | 1994-11-30 | 三菱電機株式会社 | IC card manufacturing method |
US4841712A (en) | 1987-12-17 | 1989-06-27 | Package Service Company, Inc. | Method of producing sealed protective pouchs with premium object enclosed therein |
EP0545910A3 (en) | 1987-12-23 | 1993-10-20 | Alusuisse Lonza Services Ag | Laminated foil for making high-frequency field interfering elements |
JP2833111B2 (en) | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | Circuit connection method and adhesive film used therefor |
KR0147813B1 (en) | 1989-05-16 | 1998-08-01 | 월터 클리웨인, 한스-피터 위트린 | Laminated structure and process for the production thereof |
JPH03239595A (en) | 1990-02-16 | 1991-10-25 | Dainippon Printing Co Ltd | Manufacture of card |
JP2687661B2 (en) | 1990-03-26 | 1997-12-08 | 三菱電機株式会社 | IC card manufacturing method |
DE69304042T2 (en) | 1990-07-12 | 1996-12-19 | C A Lawton Co | Method and device for the production of structurally reinforced preforms, with energetic temporary gluing or stitching |
CH680823A5 (en) | 1990-08-17 | 1992-11-13 | Kobe Properties Ltd | |
DE4034430C1 (en) | 1990-10-29 | 1992-06-17 | Rota-Druck W. Kieser Kg, 8902 Neusaess, De | |
JPH04321190A (en) | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | Antenna circuit and its production for non-contact type portable storage |
US5201976A (en) | 1991-05-06 | 1993-04-13 | Morgan Adhesives Company | Method of producing a continuous label web |
GB9114793D0 (en) | 1991-07-09 | 1991-08-28 | Scient Generics Ltd | Novel rf tag |
JPH05160290A (en) | 1991-12-06 | 1993-06-25 | Rohm Co Ltd | Circuit module |
US5244836A (en) | 1991-12-30 | 1993-09-14 | North American Philips Corporation | Method of manufacturing fusible links in semiconductor devices |
US5302431A (en) | 1992-01-06 | 1994-04-12 | National Poly Products, Inc. | Deformable label |
US5776278A (en) | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
US5266355A (en) | 1992-06-18 | 1993-11-30 | Eastman Kodak Company | Chemical vapor deposition of metal oxide films |
US5386627A (en) | 1992-09-29 | 1995-02-07 | International Business Machines Corporation | Method of fabricating a multi-layer integrated circuit chip interposer |
US5677063A (en) | 1992-12-22 | 1997-10-14 | Dai Nippon Printing Co., Ltd. | Information recording medium and information recording and reproducing method |
DE4327642C2 (en) | 1993-05-17 | 1998-09-24 | Anatoli Stobbe | Reader for a detection plate |
CA2134156A1 (en) | 1993-11-22 | 1995-05-23 | Thomas P. Klun | Coatable compositions, abrasive articles made therefrom, and methods of making and using same |
FR2716555B1 (en) | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Method of manufacturing a contactless card. |
US5751256A (en) | 1994-03-04 | 1998-05-12 | Flexcon Company Inc. | Resonant tag labels and method of making same |
DE69530922T2 (en) | 1994-03-31 | 2003-12-24 | Ibiden Co Ltd | DEVICE WITH ELECTRONIC COMPONENT |
US5464690A (en) | 1994-04-04 | 1995-11-07 | Novavision, Inc. | Holographic document and method for forming |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
KR100355209B1 (en) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | Contactless IC card and its manufacturing method |
US5952713A (en) | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
WO1996023277A1 (en) | 1995-01-27 | 1996-08-01 | Interprint Formularios Ltda. | Memory card and method of producing same |
DE19511300A1 (en) | 1995-03-28 | 1996-10-02 | Telefunken Microelectron | Method of forming antenna structure for inserting into chip-card |
US5976690A (en) | 1995-05-18 | 1999-11-02 | 3M Innovative Properties Company | Opaque adhesives and method therefor |
US5714305A (en) | 1995-05-24 | 1998-02-03 | Polaroid Corporation | Overcoat-releasing laminate and method for the manufacture thereof |
FR2736740A1 (en) | 1995-07-11 | 1997-01-17 | Trt Telecom Radio Electr | PROCESS FOR PRODUCING AND ASSEMBLING INTEGRATED CIRCUIT BOARD AND CARD THUS OBTAINED |
DE19530823A1 (en) | 1995-08-23 | 1997-02-27 | Angewandte Digital Elektronik | Combined chip card |
US5937512A (en) | 1996-01-11 | 1999-08-17 | Micron Communications, Inc. | Method of forming a circuit board |
JP3842362B2 (en) | 1996-02-28 | 2006-11-08 | 株式会社東芝 | Thermocompression bonding method and thermocompression bonding apparatus |
US5781110A (en) | 1996-05-01 | 1998-07-14 | James River Paper Company, Inc. | Electronic article surveillance tag product and method of manufacturing same |
US5936847A (en) | 1996-05-02 | 1999-08-10 | Hei, Inc. | Low profile electronic circuit modules |
US5918363A (en) | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
DE19634473C2 (en) | 1996-07-11 | 2003-06-26 | David Finn | Process for the production of a chip card |
JPH1084014A (en) | 1996-07-19 | 1998-03-31 | Shinko Electric Ind Co Ltd | Manufacture of semiconductor device |
EP2254003A3 (en) | 1996-09-19 | 2011-11-16 | Dai Nippon Printing Co., Ltd. | Multilayered volume hologram structure, and label for making multilayered volume hologram structure |
ATE299797T1 (en) | 1996-09-27 | 2005-08-15 | Avery Dennison Corp | ADHESIVE COMPOSITES AND LAMINATES |
US5867102C1 (en) | 1997-02-27 | 2002-09-10 | Wallace Comp Srvices Inc | Electronic article surveillance label assembly and method of manufacture |
DE19710144C2 (en) | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Method for producing a chip card and chip card produced according to the method |
SE9701612D0 (en) | 1997-04-29 | 1997-04-29 | Johan Asplund | Smartcard and method for its manufacture |
US6077382A (en) | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
US5963134A (en) * | 1997-07-24 | 1999-10-05 | Checkpoint Systems, Inc. | Inventory system using articles with RFID tags |
US6025780A (en) | 1997-07-25 | 2000-02-15 | Checkpoint Systems, Inc. | RFID tags which are virtually activated and/or deactivated and apparatus and methods of using same in an electronic security system |
DE19733800A1 (en) | 1997-08-05 | 1999-02-11 | Sachsenring Automobiltechnik | Method for producing a storage part with an anti-slip covering |
DE19737565A1 (en) | 1997-08-28 | 1999-03-04 | Etr Elektronik Und Technologie | Electronically read chip card |
AU761995B2 (en) | 1997-09-11 | 2003-06-12 | Precision Dynamics Corporation | Laminated radio frequency identification device |
US5982284A (en) | 1997-09-19 | 1999-11-09 | Avery Dennison Corporation | Tag or label with laminated thin, flat, flexible device |
FR2769440B1 (en) | 1997-10-03 | 1999-12-03 | Gemplus Card Int | METHOD FOR MANUFACTURING AN ELECTRONIC CHIP AND / OR ANTENNA DEVICE AND DEVICE OBTAINED BY THE METHOD |
US6177859B1 (en) * | 1997-10-21 | 2001-01-23 | Micron Technology, Inc. | Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus |
FR2772494B1 (en) | 1997-12-15 | 2001-02-23 | Gemplus Card Int | CHIP CARD WITH GUARANTEE LABEL |
DE19758057C1 (en) | 1997-12-29 | 1999-05-12 | Meinen Ziegel & Co Gmbh | Antenna fabrication method for IC card |
TW424312B (en) | 1998-03-17 | 2001-03-01 | Sanyo Electric Co | Module for IC cards, method for making a module for IC cards, hybrid integrated circuit module and method for making same |
US6315856B1 (en) | 1998-03-19 | 2001-11-13 | Kabushiki Kaisha Toshiba | Method of mounting electronic component |
US6040630A (en) | 1998-04-13 | 2000-03-21 | Harris Corporation | Integrated circuit package for flip chip with alignment preform feature and method of forming same |
US6161761A (en) | 1998-07-09 | 2000-12-19 | Motorola, Inc. | Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
AU762475B2 (en) * | 1998-08-14 | 2003-06-26 | 3M Innovative Properties Company | Applications for radio frequency identification systems |
US6066377A (en) | 1998-08-17 | 2000-05-23 | Furon | Laminated air brake tubing |
CA2343404C (en) * | 1998-09-11 | 2002-11-12 | Key-Trak, Inc. | Object tracking system with non-contact object detection and identification |
US6404643B1 (en) | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
US6569280B1 (en) | 1998-11-06 | 2003-05-27 | The Standard Register Company | Lamination by radiation through a ply |
DE59900131D1 (en) * | 1999-01-23 | 2001-07-26 | Ident Gmbh X | RFID transponder with printable surface |
US6412702B1 (en) * | 1999-01-25 | 2002-07-02 | Mitsumi Electric Co., Ltd. | Non-contact IC card having an antenna coil formed by a plating method |
DE60023868T3 (en) * | 1999-02-25 | 2010-06-10 | Pittsfield Weaving Co., Inc. | METHOD AND DEVICE FOR PRODUCING SIGNS |
US6288905B1 (en) | 1999-04-15 | 2001-09-11 | Amerasia International Technology Inc. | Contact module, as for a smart card, and method for making same |
US6248199B1 (en) | 1999-04-26 | 2001-06-19 | Soundcraft, Inc. | Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements |
US6353420B1 (en) | 1999-04-28 | 2002-03-05 | Amerasia International Technology, Inc. | Wireless article including a plural-turn loop antenna |
US6376769B1 (en) | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
IT1317426B1 (en) | 1999-05-19 | 2003-07-09 | Bosch Gmbh Robert | PROCEDURE AND DEVICE TO COMMAND THE UNVEICLE DRIVE UNIT. |
US6780668B1 (en) | 1999-07-16 | 2004-08-24 | Matsushita Electric Industrial Co., Ltd. | Package of semiconductor device and method of manufacture thereof |
JP4588139B2 (en) | 1999-08-31 | 2010-11-24 | リンテック株式会社 | IC card manufacturing method |
US6147662A (en) * | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
US6557766B1 (en) | 1999-10-01 | 2003-05-06 | Keith R. Leighton | Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process |
US6421013B1 (en) | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US6259408B1 (en) | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
US6478229B1 (en) * | 2000-03-14 | 2002-11-12 | Harvey Epstein | Packaging tape with radio frequency identification technology |
US6249199B1 (en) | 2000-04-10 | 2001-06-19 | George Liu | Quick magnetizing and demagnetizing device for screwdrivers |
US6555213B1 (en) | 2000-06-09 | 2003-04-29 | 3M Innovative Properties Company | Polypropylene card construction |
JP2002109491A (en) | 2000-09-29 | 2002-04-12 | Sony Corp | Ic card and method for preparing the same |
US6480110B2 (en) | 2000-12-01 | 2002-11-12 | Microchip Technology Incorporated | Inductively tunable antenna for a radio frequency identification tag |
US6600418B2 (en) * | 2000-12-12 | 2003-07-29 | 3M Innovative Properties Company | Object tracking and management system and method using radio-frequency identification tags |
JP4789348B2 (en) | 2001-05-31 | 2011-10-12 | リンテック株式会社 | Planar coil component, method for adjusting characteristic of planar coil component, ID tag, and method for adjusting resonance frequency of ID tag |
US6843422B2 (en) | 2001-12-24 | 2005-01-18 | Digimarc Corporation | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
-
2001
- 2001-12-21 FI FI20012549A patent/FI119401B/en not_active IP Right Cessation
-
2002
- 2002-12-19 AU AU2002352296A patent/AU2002352296A1/en not_active Abandoned
- 2002-12-19 JP JP2003556951A patent/JP4271038B2/en not_active Expired - Lifetime
- 2002-12-19 DE DE10297573.6T patent/DE10297573B4/en not_active Expired - Fee Related
- 2002-12-19 WO PCT/FI2002/001044 patent/WO2003056509A1/en active Application Filing
- 2002-12-19 GB GB0413695A patent/GB2399561B/en not_active Expired - Lifetime
-
2004
- 2004-06-16 US US10/869,586 patent/US7152803B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
EP0706152A2 (en) * | 1994-11-03 | 1996-04-10 | Fela Holding AG | Chip card and method for fabricating it |
US5962840A (en) * | 1994-12-23 | 1999-10-05 | Giesecke & Devrient Gmbh | Data carrier with electronic module and embedded coil feature |
US5935497A (en) * | 1995-06-21 | 1999-08-10 | Schlumberger Industries | Method of printing a graphic on a memory card |
FR2780534A1 (en) * | 1998-06-25 | 1999-12-31 | Solaic Sa | Fabrication method for portable objects incorporating electronic components, particularly non-contact smart cards |
DE19915765A1 (en) * | 1999-04-08 | 2000-10-19 | Cubit Electronics Gmbh | Manufacture of contactless transponders by inserting semiconductor chip into cavity in thermoplastic film and pressing antenna and connecting wires into film |
Cited By (15)
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US6867983B2 (en) | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
US8072333B2 (en) | 2002-12-31 | 2011-12-06 | Avery Dennison Corporation | RFID device and method of forming |
US6940408B2 (en) | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
US7102520B2 (en) | 2002-12-31 | 2006-09-05 | Avery Dennison Corporation | RFID device and method of forming |
US7224280B2 (en) | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
US9159018B2 (en) | 2003-04-11 | 2015-10-13 | Avery Dennison Corporation | Method of making conductive patterns |
US7477194B2 (en) | 2003-04-11 | 2009-01-13 | Avery Dennison Corporation | Conductive pattern and method of making |
US8769805B2 (en) | 2003-04-11 | 2014-07-08 | Avery Dennison Corporation | Method of making conductive pattern |
US7930815B2 (en) | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
DE112004000956B4 (en) | 2003-06-04 | 2019-02-07 | Smartrac Investment B.V. | Method for forming a connection |
US7682871B2 (en) | 2003-06-04 | 2010-03-23 | Upm Raflatac Oy | Method for forming a joint |
US7333061B2 (en) | 2003-08-05 | 2008-02-19 | Avery Dennison Corporation | RFID device and method of making |
US7120987B2 (en) | 2003-08-05 | 2006-10-17 | Avery Dennison Corporation | Method of making RFID device |
US7307527B2 (en) | 2004-07-01 | 2007-12-11 | Avery Dennison Corporation | RFID device preparation system and method |
US7842152B2 (en) | 2005-08-22 | 2010-11-30 | Avery Dennison Corporation | Method of making RFID devices |
Also Published As
Publication number | Publication date |
---|---|
JP2005512867A (en) | 2005-05-12 |
GB0413695D0 (en) | 2004-07-21 |
FI20012549A0 (en) | 2001-12-21 |
DE10297573T5 (en) | 2005-01-27 |
GB2399561A (en) | 2004-09-22 |
DE10297573B4 (en) | 2016-04-07 |
US7152803B2 (en) | 2006-12-26 |
FI20012549A (en) | 2003-06-22 |
AU2002352296A1 (en) | 2003-07-15 |
US20050087607A1 (en) | 2005-04-28 |
JP4271038B2 (en) | 2009-06-03 |
GB2399561B (en) | 2005-07-13 |
FI119401B (en) | 2008-10-31 |
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