What is claimed is:
[cl] A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising: defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar; and using the desired angle to position the first metal bar, the first bump, and the second bump on the integrated circuit.
[c2] The method of claim 1, wherein using the desired angle to position the first metal bar, the first bump, and the second bump creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across the top metal layer.
[c3] The method of claim 1, wherein using the desired angle to position the first metal bar, the first bump, and the second bump creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across a portion of the top metal layer.
[c4] The method of claim 1, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c5] The method of claim 1, further comprising: determining a value of the desired angle prior to positioning the first metal bar, the first bump, and the second bump on the integrated circuit
[c6] The method of claim 5, wherein determining the value of the desired angle is dependent upon at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, desired signal track availability.
[c7] A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising: defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar; and using the desired angle to position the first metal bar and the second metal bar on the integrated circuit.
[c8] The method of claim 7, wherein using the desired angle to position the first metal bar and the second metal bar on the integrated circuit creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across the top metal layer.
[c9] The method of claim 7, wherein using the desired angle to position the first metal bar and the second metal bar on the integrated circuit creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across a portion of the top metal layer.
[clO] The method of claim 7, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[cll] The method of claim 7, further comprising: determining a value of the desired angle prior to positioning the first metal bar and the second metal bar on the integrated circuit
[cl2] The method of claim 11, wherein determining the value the desired angle is dependent upon at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, desired signal track availability.
[cl3] A computer system, comprising: a processor; a memory; and instructions, residing in the memory and executable on the processor, for determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump.
[cl4] The computer system of claim 13, wherein the reference bumps resides on a first metal bar of a metal layer of an integrated circuit, and wherein the first and second bumps reside on a second metal bar of the metal layer.
[cl5] The computer system of claim 13, wherein determining the value of the angle is dependent on a desired metal layer property comprising at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the metal layer, desired signal track availability.
[cl6] The computer system of claim 15, further comprising: determining a metal layer design based on the desired metal layer property.
[cl7] A computer-readable medium having instructions therein executable by processing, the instructions for: inputting a desired metal layer property; and determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump based on the desired metal layer property, wherein the reference bump resides on a first metal bar, and wherein the first and second bumps reside on a second metal bar.
[cl8] The computer-readable medium of claim 17, wherein the value of the angle is used to create a particular bump placement among the first bump, the second bump, and the reference bump.
[cl9] The computer-readable medium of claim 18, wherein the bump placement is repeated across a metal layer of an integrated circuit.
[c20] The computer-readable medium of claim 18, wherein the bump placement is repeated across a portion of a metal layer of an integrated circuit.
[c21] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first bump and the second bump are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 60 degrees.
[c22] The integrated circuit of claim 21, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c23] The integrated circuit of claim 21, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c24] The integrated circuit of claim 21, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c25] The integrated circuit of claim 21, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c26] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first metal bar and the second metal bar are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 60 degrees.
[c27] The integrated circuit of claim 26, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c28] The integrated circuit of claim 26, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c29] The integrated circuit of claim 26, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c30] The integrated circuit of claim 26, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c31] A patterned bump array for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first bump, the second bump, and the reference bump are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 60 degrees.
[c32] The patterned bump array of claim 31, wherein the first metal bar and second metal bar form a portion of the power grid.
[c33] The patterned bump array of claim 31, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[c34] The patterned bump array of claim 31, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across the power grid.
[c35] The patterned bump array of claim 31, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across a portion of the power grid.
[c36] The patterned bump array of claim 31, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c37] A bump layout for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first metal bar and the second metal bar are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 60 degrees.
[c38] The bump layout of claim 37, wherein the first metal bar and second metal bar form a portion of the power grid.
[c39] The bump layout of claim 37, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[c40] The bump layout of claim 37, wherein the arrangement of the first metal bar and the second metal bar is repeated across the power grid.
[c41] The bump layout of claim 37, wherein the arrangement of the first metal bar and the second metal bar is repeated across a portion of the power grid.
[c42] The bump layout of claim 37, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c43] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first bump and the second bump are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 90 degrees.
[c44] The integrated circuit of claim 43, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c45] The integrated circuit of claim 43, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c46] The integrated circuit of claim 43, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c47] The integrated circuit of claim 43, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c48] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar,
wherein the first metal bar and the second metal bar are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 90 degrees.
[c49] The integrated circuit of claim 48, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c50] The integrated circuit of claim 48, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c51] The integrated circuit of claim 48, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c52] The integrated circuit of claim 48, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c53] A patterned bump array for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first bump, the second bump, and the reference bump are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 90 degrees.
[c54] The patterned bump array of claim 53, wherein the first metal bar and second metal bar form a portion of the power grid.
[c55] The patterned bump array of claim 53, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[c56] The patterned bump array of claim 53, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across the power grid.
[c57] The patterned bump array of claim 53, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across a portion of the power grid.
[c58] The patterned bump array of claim 53, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c59] A bump layout for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first metal bar and the second metal bar are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 90 degrees.
[c60] The bump layout of claim 59, wherein the first metal bar and second metal bar form a portion of the power grid.
[c61] The bump layout of claim 59, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[c62] The bump layout of claim 59, wherein the arrangement of the first metal bar and the second metal bar is repeated across the power grid.
[c63] The bump layout of claim 59, wherein the arrangement of the first metal bar and the second metal bar is repeated across a portion of the power grid.
[c64] The bump layout of claim 59, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c65] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first bump and the second bump are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 120 degrees.
[c66] The integrated circuit of claim 65, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c67] The integrated circuit of claim 65, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c68] The integrated circuit of claim 65, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c69] The integrated circuit of claim 65, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c70] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first metal bar and the second metal bar are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 120 degrees.
[c71] The integrated circuit of claim 70, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c72] The integrated circuit of claim 70, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c73] The integrated circuit of claim 70, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c74] The integrated circuit of claim 70, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c75] A patterned bump array for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first bump, the second bump, and the reference bump are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 120 degrees.
[c76] The patterned bump array of claim 75, wherein the first metal bar and second metal bar form a portion of the power grid.
[c77] The patterned bump array of claim 75, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[c78] The patterned bump array of claim 75, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across the power grid.
[c79] The patterned bump array of claim 75, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across a portion of the power grid.
[c80] The patterned bump array of claim 75, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c81] A bump layout for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and
a second bump disposed on a second metal bar, wherein the first metal bar and the second metal bar are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 120 degrees.
[c82] The bump layout of claim 81, wherein the first metal bar and second metal bar form a portion of the power grid.
[c83] The bump layout of claim 81, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[c84] The bump layout of claim 81, wherein the arrangement of the first metal bar and the second metal bar is repeated across the power grid.
[c85] The bump layout of claim 81, wherein the arrangement of the first metal bar and the second metal bar is repeated across a portion of the power grid.
[c86] The bump layout of claim 81, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c87] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first bump and the second bump are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 150 degrees.
[c88] The integrated circuit of claim 87, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c89] The integrated circuit of claim 87, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c90] The integrated circuit of claim 87, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c91] The integrated circuit of claim 87, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c92] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first metal bar and the second metal bar are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 150 degrees.
[c93] The integrated circuit of claim 92, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[c94] The integrated circuit of claim 92, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[c95] The integrated circuit of claim 92, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[c96] The integrated circuit of claim 92, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[c97] A patterned bump array for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first bump, the second bump, and the reference bump are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 150 degrees.
[c98] The patterned bump array of claim 97, wherein the first metal bar and second metal bar form a portion of the power grid.
[c99] The patterned bump array of claim 97, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[clOO] The patterned bump array of claim 97, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across the power grid.
[clOl] The patterned bump array of claim 97, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across a portion of the power grid.
[cl02] The patterned bump array of claim 97, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[cl03] A bump layout for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first metal bar and the second metal bar are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 150 degrees.
[cl04] The bump layout of claim 103, wherein the first metal bar and second metal bar form a portion of the power grid.
[cl05] The bump layout of claim 103, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[cl06] The bump layout of claim 103, wherein the arrangement of the first metal bar and the second metal bar is repeated across the power grid.
[cl07] The bump layout of claim 103, wherein the arrangement of the first metal bar and the second metal bar is repeated across a portion of the power grid.
[cl08] The bump layout of claim 103, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[cl09] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first bump and the second bump are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 180 degrees.
[cllO] The integrated circuit of claim 109, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[clll] The integrated circuit of claim 109, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[cll2] The integrated circuit of claim 109, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[cll3] The integrated circuit of claim 109, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[el 14] An integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the integrated circuit comprising: a first bump disposed on the first metal bar; a second bump disposed on the first metal bar; and a reference bump disposed on the second metal bar, wherein the first metal bar and the second metal bar are positioned such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 180 degrees.
[cll5] The integrated circuit of claim 114, wherein the first bump, the second bump, and the reference bump form a bump structure that is repeated across the top metal layer to form a patterned bump array.
[el 16] The integrated circuit of claim 114, wherein the first bump, the second bump, and the reference bump for a bump structure that is repeated across a portion of the top metal layer.
[el 17] The integrated circuit of claim 114, wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
[el 18] The integrated circuit of claim 114, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[el 19] A patterned bump array for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first bump, the second bump, and the reference bump are arranged such that an angle between a line from the reference
bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 180 degrees.
[cl20] The patterned bump array of claim 119, wherein the first metal bar and second metal bar form a portion of the power grid.
[cl21] The patterned bump array of claim 119, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[cl22] The patterned bump array of claim 119, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across the power grid.
[cl23] The patterned bump array of claim 119, wherein the arrangement of the first bump, the second bump, and the reference bump is repeated across a portion of the power grid.
[cl24] The patterned bump array of claim 119, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.
[cl25] A bump layout for a power grid of an integrated circuit, comprising: a reference bump disposed on a first metal bar; a first bump disposed on a second metal bar; and a second bump disposed on a second metal bar, wherein the first metal bar and the second metal bar are arranged such that an angle between a line from the reference bump to the first bump and a line from the reference bump to the second bump has a value substantially equal to 180 degrees.
[cl26] The bump layout of claim 125, wherein the first metal bar and second metal bar form a portion of the power grid.
[cl27] The bump layout of claim 125, wherein the first metal bar is operatively connected to power, and wherein the second metal bar is operatively connected to ground.
[cl28] The bump layout of claim 125, wherein the arrangement of the first metal bar and the second metal bar is repeated across the power grid.
[cl29] The bump layout of claim 125, wherein the arrangement of the first metal bar and the second metal bar is repeated across a portion of the power grid.
[cl30] The bump layout of claim 125, wherein the value of the angle is dependent on at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, and desired signal track availability.