WO2003046974A3 - Kondensator und verfahren zum herstellen eines kondensators - Google Patents
Kondensator und verfahren zum herstellen eines kondensators Download PDFInfo
- Publication number
- WO2003046974A3 WO2003046974A3 PCT/EP2002/012786 EP0212786W WO03046974A3 WO 2003046974 A3 WO2003046974 A3 WO 2003046974A3 EP 0212786 W EP0212786 W EP 0212786W WO 03046974 A3 WO03046974 A3 WO 03046974A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- trench
- conductive material
- semiconductor substrate
- contact structure
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66181—Conductor-insulator-semiconductor capacitors, e.g. trench capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors with potential-jump barrier or surface barrier
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
- H01L29/945—Trench capacitors
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002356602A AU2002356602A1 (en) | 2001-11-30 | 2002-11-14 | Capacitor and a method for producing a capacitor |
EP02803774A EP1449245A2 (de) | 2001-11-30 | 2002-11-14 | Kondensator und verfahren zum herstellen eines kondensators |
US10/853,740 US7030457B2 (en) | 2001-11-30 | 2004-05-25 | Capacitor and method for producing a capacitor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10158798A DE10158798A1 (de) | 2001-11-30 | 2001-11-30 | Kondensator und Verfahren zum Herstellen eines Kondensators |
DE10158798.8 | 2001-11-30 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/853,740 Continuation US7030457B2 (en) | 2001-11-30 | 2004-05-25 | Capacitor and method for producing a capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003046974A2 WO2003046974A2 (de) | 2003-06-05 |
WO2003046974A3 true WO2003046974A3 (de) | 2003-12-31 |
Family
ID=7707533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2002/012786 WO2003046974A2 (de) | 2001-11-30 | 2002-11-14 | Kondensator und verfahren zum herstellen eines kondensators |
Country Status (6)
Country | Link |
---|---|
US (1) | US7030457B2 (de) |
EP (1) | EP1449245A2 (de) |
CN (1) | CN100423211C (de) |
AU (1) | AU2002356602A1 (de) |
DE (1) | DE10158798A1 (de) |
WO (1) | WO2003046974A2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7280590B1 (en) * | 2003-09-11 | 2007-10-09 | Xilinx, Inc. | Receiver termination network and application thereof |
JP4830360B2 (ja) * | 2005-06-17 | 2011-12-07 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP5076570B2 (ja) * | 2007-03-16 | 2012-11-21 | 富士通セミコンダクター株式会社 | 半導体装置とその製造方法 |
US8429085B2 (en) * | 2007-06-22 | 2013-04-23 | Visa U.S.A. Inc. | Financial transaction token with onboard power source |
US9324071B2 (en) | 2008-03-20 | 2016-04-26 | Visa U.S.A. Inc. | Powering financial transaction token with onboard power source |
US8143659B2 (en) | 2008-04-14 | 2012-03-27 | Infineon Technologies Ag | Vertical trench capacitor, chip comprising the capacitor, and method for producing the capacitor |
US8552829B2 (en) | 2010-11-19 | 2013-10-08 | Infineon Technologies Austria Ag | Transformer device and method for manufacturing a transformer device |
US9111781B2 (en) | 2012-02-24 | 2015-08-18 | Infineon Technologies Ag | Trench capacitors and methods of forming the same |
US9318485B2 (en) | 2012-08-10 | 2016-04-19 | Infineon Technologies Ag | Capacitor arrangements and method for manufacturing a capacitor arrangement |
EP2999002A1 (de) * | 2014-09-18 | 2016-03-23 | Services Petroliers Schlumberger | Kondensatorzelle und Verfahren zu ihrer Herstellung |
CN105390480B (zh) * | 2015-10-23 | 2017-11-28 | 西安理工大学 | 基于硅通孔阵列的三维高值集成电容器及其制作方法 |
US10084035B2 (en) * | 2015-12-30 | 2018-09-25 | Teledyne Scientific & Imaging, Llc | Vertical capacitor contact arrangement |
EP3297024A1 (de) * | 2016-09-20 | 2018-03-21 | Ipdia | 3d-kondensator-struktur |
EP3680934A1 (de) * | 2019-01-08 | 2020-07-15 | Murata Manufacturing Co., Ltd. | Rc-architekturen und verfahren zur herstellung davon |
CN113497006A (zh) * | 2020-03-20 | 2021-10-12 | 中芯国际集成电路制造(北京)有限公司 | 电容结构及其形成方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0283964A2 (de) * | 1987-03-20 | 1988-09-28 | Nec Corporation | Aus einer Vielzahl von Eintransistorzellen bestehende dynamische Speichervorrichtung mit wahlfreiem Zugriff |
DE19713052A1 (de) * | 1997-03-27 | 1998-10-01 | Siemens Ag | Kondensatorstruktur |
US6140199A (en) * | 1997-06-06 | 2000-10-31 | Telefonaktiebolaget Im Ericsson | Method and arrangement of a buried capacitor, and a buried capacitor arranged according to said method |
US6144055A (en) * | 1995-03-15 | 2000-11-07 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4017885A (en) * | 1973-10-25 | 1977-04-12 | Texas Instruments Incorporated | Large value capacitor |
DE8603689U1 (de) * | 1986-02-12 | 1987-08-13 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
EP0479143A1 (de) | 1990-10-02 | 1992-04-08 | Ramtron International Corporation | Grabenkondensator-DRAM mit Spannungsfeldisolation |
US5256588A (en) * | 1992-03-23 | 1993-10-26 | Motorola, Inc. | Method for forming a transistor and a capacitor for use in a vertically stacked dynamic random access memory cell |
DE4428195C1 (de) * | 1994-08-09 | 1995-04-20 | Siemens Ag | Verfahren zur Herstellung eines Siliziumkondensators |
US5770484A (en) * | 1996-12-13 | 1998-06-23 | International Business Machines Corporation | Method of making silicon on insulator buried plate trench capacitor |
US7701059B1 (en) * | 1997-08-21 | 2010-04-20 | Micron Technology, Inc. | Low resistance metal silicide local interconnects and a method of making |
JP2001068647A (ja) * | 1999-08-30 | 2001-03-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6472702B1 (en) * | 2000-02-01 | 2002-10-29 | Winbond Electronics Corporation | Deep trench DRAM with SOI and STI |
-
2001
- 2001-11-30 DE DE10158798A patent/DE10158798A1/de not_active Withdrawn
-
2002
- 2002-11-14 WO PCT/EP2002/012786 patent/WO2003046974A2/de not_active Application Discontinuation
- 2002-11-14 AU AU2002356602A patent/AU2002356602A1/en not_active Abandoned
- 2002-11-14 CN CNB028237919A patent/CN100423211C/zh not_active Expired - Fee Related
- 2002-11-14 EP EP02803774A patent/EP1449245A2/de not_active Ceased
-
2004
- 2004-05-25 US US10/853,740 patent/US7030457B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0283964A2 (de) * | 1987-03-20 | 1988-09-28 | Nec Corporation | Aus einer Vielzahl von Eintransistorzellen bestehende dynamische Speichervorrichtung mit wahlfreiem Zugriff |
US6144055A (en) * | 1995-03-15 | 2000-11-07 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
DE19713052A1 (de) * | 1997-03-27 | 1998-10-01 | Siemens Ag | Kondensatorstruktur |
US6140199A (en) * | 1997-06-06 | 2000-10-31 | Telefonaktiebolaget Im Ericsson | Method and arrangement of a buried capacitor, and a buried capacitor arranged according to said method |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 20 10 July 2001 (2001-07-10) * |
ROOZEBOOM F ET AL: "High-value MOS capacitor arrays in ultradeep trenches in silicon", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 53, no. 1-4, June 2000 (2000-06-01), pages 581 - 584, XP004237840, ISSN: 0167-9317 * |
Also Published As
Publication number | Publication date |
---|---|
US7030457B2 (en) | 2006-04-18 |
DE10158798A1 (de) | 2003-06-18 |
CN100423211C (zh) | 2008-10-01 |
WO2003046974A2 (de) | 2003-06-05 |
EP1449245A2 (de) | 2004-08-25 |
CN1596463A (zh) | 2005-03-16 |
US20050013090A1 (en) | 2005-01-20 |
AU2002356602A1 (en) | 2003-06-10 |
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