WO2003022509A9 - Method and apparatus for monitoring and adjusting a laser welding process - Google Patents
Method and apparatus for monitoring and adjusting a laser welding processInfo
- Publication number
- WO2003022509A9 WO2003022509A9 PCT/US2002/028854 US0228854W WO03022509A9 WO 2003022509 A9 WO2003022509 A9 WO 2003022509A9 US 0228854 W US0228854 W US 0228854W WO 03022509 A9 WO03022509 A9 WO 03022509A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- laser
- laser beam
- material processing
- processing head
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Definitions
- the present invention relates to a method and apparatus for monitoring and adjusting
- a laser welding process and more particularly, a method and apparatus having a closed looped system within a laser material processing head for monitoring and adjusting a laser welding process.
- workpiece may be welded, cut or otherwise processed.
- welding may be programmable, thereby allowing the contour of a weld seam to be pre ⁇
- Deviations from the theoretical positioning and dimensioning of the workpiece are introduced through the limits and accuracy of handling systems, tolerances in the dimensions of the workpiece, and tolerances in the fixturing of the workpiece.
- the present invention is a method and apparatus for monitoring and adjusting a laser welding process.
- a laser material processing head provides a laser source that provides a
- a position sensor coupled to the laser material
- processing head measures the difference between the actual position of the workpiece and a
- An adjusting means disposed within the head, positions the laser beam in response to a signal from the position sensor.
- a closed loop controller coupled to the laser material processing head, interfaces the position sensor with the adjusting means to allow the adjusting means to properly position the laser beam with respect to the workpiece.
- a process sensor coupled to the laser material processing head, may also be provided for indicating the quality of the weld created by the laser welding process. The closed loop controller may interface the process sensor with the adjusting means to properly adjust the laser beam by adjusting the power level of the laser source.
- process sensor may also communicate with the handling system, separate from the laser
- the adjusting means may provide a means for reflecting the laser beam toward the workpiece.
- the reflecting means may provide at least one mirror mounted on at least one pivotal axis.
- the mirror may also provide a concave surface for reflecting the
- the adjusting means may also provide a transparent means for redirecting the laser
- the transparent means may provide at least one prism mounted
- the transparent means may also provide substantially flat parallel glass plates for deflecting the laser beam toward the
- the adjusting means may provide an optic lens for focusing the laser beam onto
- Fig. 1 is a schematic diagram of the method and apparatus of the present invention utilizing mirrors to reflect the laser beam to the workpiece.
- Fig. 2 is a schematic diagram of the method and apparatus of the present invention utilizing transparent elements to redirect the laser beam to the workpiece.
- Fig. 3 is a schematic diagram of the method and apparatus of the present invention wherein a concave mirror is utilized to reflect the laser beam to the workpiece. Description of the Preferred Embodiment
- the present invention provides a method and apparatus 10
- the present invention provides a laser
- the laser material processing head 12 also provides position sensors 18 for measuring the laser material
- Process sensors 20 may also be coupled to the laser material processing head
- the laser material processing head 12 also provides a means for adjusting 31
- controller 22 provides an interface between the position sensor 18 and the process sensor 20
- the position sensor 18 and the process sensor 20 may also be in
- the laser material processing head 12 provides a laser source 26 for
- the laser source 26 may
- the present invention provides the adjusting
- the means includes positioning the laser beam 14 relative to the workpiece 16. The adjusting
- the means may provide a reflecting means for reflecting the laser beam 14 toward the workpiece 16.
- the reflecting means may provide at least one movable mirror 28 for reflecting the laser
- the laser beam 14 can be directed along the X and
- Y axes along the workpiece 16.
- a pair of mirrors 28 may be utilized.
- each mirror 28 is mounted on a pivoting axis wherein one of the
- mirrors 28 moves in the X axes and the other mirror 28 moves in the Y axes.
- the laser beam reflects off a first mirror 28, a second mirror 28, and then the second mirror
- the pivoting of the mirrors 28 may be driven by a small
- the laser beam 14 is transmitted through a
- the wavelength filter 30 after reflecting off the mirrors 28.
- the wavelength filter 30 allows laser
- a focusing optic 32 which is disposed in or coupled to the laser
- the focusing optic 32 focuses the laser beam 14 on the
- the focusing optic 32 may be moved toward or away from
- the adjusting means may use conventional means,
- the filter 30 works as a mirror for certain
- This beam of varying wavelengths is reflected to mirror 34 wherein the beam is
- the process sensor 20 receives the beam from
- the closed loop controller 22 may direct the adjusting means to adjust
- the process sensor 20 may utilize a plasma detector to determine the
- position sensors 18 may be mounted within to the laser material processing head 12.
- position sensor 18 may provide a CCD camera, a low power laser beam separate from laser
- the position sensor 18 senses the actual position of the beam 14 or a spring-loaded mechanical probe.
- controller 22 interfaces the position sensor 18 with the adjusting means.
- controller 22 may provide a central processing unit or a high speed computer which receives
- the adjusting means moves mirrors 28 in order to properly position the
- the adjusting means provides a transparent means for
- the transparent means 29 may include at least one prism or a pair of substantially parallel glass plates. In either case, the transparent means is mounted on a pivoting axis for pivoting the transparent means about an X and Y axis. By moving the transparent means and deflecting the laser beam 14, the laser beam 14 can be properly positioned with respect to workpiece 16.
- the present invention may utilize infrared or CO 2 lasers as
- the infrared or CO 2 laser 40 emits a beam on two
- the first surface 44 is a substantially flat angular surface which
- the laser beam 14 reflects off the second surface 46 of the mirror 42
- An aperture 48 is provided in a central portion of the
- the aperture 48 allows various combinations
- closed loop controller 22 or the material handling device 24 are closed loop controller 22 or the material handling device 24.
- the present invention is utilized by having the laser source 26 emit a laser
- the adjusting means reflects or deflects and focuses
- the position sensors 18 sense the position of the laser beam 14 onto the workpiece 16.
- the position sensors 18 sense the position of the laser beam 14 onto the workpiece 16.
- the position sensor provides a signal to the closed loop
- controller 22 which interprets the signal and responds to the adjusting means.
- the adjusting means The adjusting
- the process sensor 20 also serves to adjust the laser beam 14 with respect to the workpiece 16.
- the process sensor 20 also serves to adjust the laser beam 14 with respect to the workpiece 16.
- the closed loop controller 22 interprets the signal and may provide a signal to the closed loop controller 22 or the material handling system 24. If the closed loop controller 22 receives a signal from the process sensor
- the adjusting means may adjust the power level of the laser source 26. If the process
- the material handling system 24 may
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002335734A AU2002335734A1 (en) | 2001-09-12 | 2002-09-12 | Method and apparatus for monitoring and adjusting a laser welding process |
DE10297255T DE10297255B4 (en) | 2001-09-12 | 2002-09-12 | Method and device for monitoring and adjusting a laser welding process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/951,960 | 2001-09-12 | ||
US09/951,960 US6596961B2 (en) | 2001-09-12 | 2001-09-12 | Method and apparatus for monitoring and adjusting a laser welding process |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003022509A1 WO2003022509A1 (en) | 2003-03-20 |
WO2003022509A9 true WO2003022509A9 (en) | 2003-05-08 |
Family
ID=25492394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/028854 WO2003022509A1 (en) | 2001-09-12 | 2002-09-12 | Method and apparatus for monitoring and adjusting a laser welding process |
Country Status (4)
Country | Link |
---|---|
US (1) | US6596961B2 (en) |
AU (1) | AU2002335734A1 (en) |
DE (1) | DE10297255B4 (en) |
WO (1) | WO2003022509A1 (en) |
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DE10234242B4 (en) * | 2002-07-09 | 2005-10-27 | Airbus Deutschland Gmbh | Arrangement and method for controlling the seam position of a laser-beam-applied profile |
US7106300B2 (en) * | 2002-07-12 | 2006-09-12 | Mitutoyo Corporation | Method for converting joystick deflection into motion in a computer vision system |
CA2463409A1 (en) * | 2004-04-02 | 2005-10-02 | Servo-Robot Inc. | Intelligent laser joining head |
DE202004021725U1 (en) * | 2004-06-05 | 2010-07-15 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laser processing machine with beam diagnosis device for determining at least one beam characteristic of a laser beam on a laser processing machine |
DE102004045408B4 (en) * | 2004-09-14 | 2008-01-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus and method for processing workpieces by means of laser radiation |
WO2006111896A2 (en) * | 2005-04-19 | 2006-10-26 | Koninklijke Philips Electronics N.V. | Device for directing radiation to a layer, apparatus with such device and method using such apparatus |
JP2007098464A (en) * | 2005-10-07 | 2007-04-19 | Nissan Motor Co Ltd | Laser beam machining robot controller, method for controlling laser beam machining robot and laser beam machining robot controlling program |
DE102006004919A1 (en) * | 2006-02-01 | 2007-08-16 | Thyssenkrupp Steel Ag | Laser beam welding head |
DE102006017629A1 (en) * | 2006-02-22 | 2007-08-30 | Lpkf Laser & Electronics Ag | Industrial laser cutting or welding process and assembly has sensor for correction of dynamically induced errors |
DE102008015133B4 (en) | 2008-03-20 | 2010-04-08 | Peter Dr. Arnold | Device for detecting the process radiation during laser material processing |
DE102008059763A1 (en) | 2008-12-01 | 2010-06-02 | Lpkf Laser & Electronics Ag | Laser processing a substrate by a laser processing head along a first processing path, comprises deflecting laser beams on the substrate at a focal point, and determining position of the respective focal points for further processing paths |
DE102010015682B4 (en) * | 2010-04-21 | 2014-01-02 | Peter Arnold | Device for detecting the process radiation during laser material processing |
TWI562854B (en) * | 2012-10-30 | 2016-12-21 | Hon Hai Prec Ind Co Ltd | Device for manufacturing mold core |
US9821415B2 (en) | 2014-03-28 | 2017-11-21 | Crc-Evans Pipeline International, Inc. | Internal pipeline cooler |
US10589371B2 (en) | 2013-05-23 | 2020-03-17 | Crc-Evans Pipeline International, Inc. | Rotating welding system and methods |
US10040141B2 (en) | 2013-05-23 | 2018-08-07 | Crc-Evans Pipeline International, Inc. | Laser controlled internal welding machine for a pipeline |
US10480862B2 (en) | 2013-05-23 | 2019-11-19 | Crc-Evans Pipeline International, Inc. | Systems and methods for use in welding pipe segments of a pipeline |
US11767934B2 (en) | 2013-05-23 | 2023-09-26 | Crc-Evans Pipeline International, Inc. | Internally welded pipes |
US10695876B2 (en) | 2013-05-23 | 2020-06-30 | Crc-Evans Pipeline International, Inc. | Self-powered welding systems and methods |
BR112017003933A2 (en) | 2014-08-29 | 2018-03-06 | Crc evans pipeline int inc | welding method and system |
DE112015004532B4 (en) * | 2014-10-02 | 2024-02-01 | Ngk Spark Plug Co., Ltd. | Evaluation method, laser device and method for producing a sensor |
DE102014017307B4 (en) * | 2014-11-21 | 2019-08-01 | Kuka Roboter Gmbh | Method and system for processing a component with a robot-guided tool |
US11458571B2 (en) | 2016-07-01 | 2022-10-04 | Crc-Evans Pipeline International, Inc. | Systems and methods for use in welding pipe segments of a pipeline |
JP6670786B2 (en) * | 2017-03-23 | 2020-03-25 | キオクシア株式会社 | Dicing method and laser processing device |
KR20190052516A (en) * | 2017-11-08 | 2019-05-16 | 삼성전자주식회사 | Surface inspection apparatus |
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US6040550A (en) | 1996-10-28 | 2000-03-21 | Chang; Dale U. | Apparatus and method for laser welding the outer joints of metal bellows |
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DE19839482C2 (en) * | 1998-08-29 | 2002-09-19 | Sam Saechsische Anlagen Und Ma | Freely manageable one-hand processing head for material processing using high-power diode lasers with a power of more than 500 W. |
DE19852302A1 (en) * | 1998-11-12 | 2000-05-25 | Fraunhofer Ges Forschung | Method and device for processing workpieces with high-energy radiation |
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-
2001
- 2001-09-12 US US09/951,960 patent/US6596961B2/en not_active Expired - Fee Related
-
2002
- 2002-09-12 AU AU2002335734A patent/AU2002335734A1/en not_active Abandoned
- 2002-09-12 WO PCT/US2002/028854 patent/WO2003022509A1/en not_active Application Discontinuation
- 2002-09-12 DE DE10297255T patent/DE10297255B4/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10297255T5 (en) | 2004-11-25 |
AU2002335734A1 (en) | 2003-03-24 |
US20030047542A1 (en) | 2003-03-13 |
DE10297255B4 (en) | 2007-08-16 |
US6596961B2 (en) | 2003-07-22 |
WO2003022509A1 (en) | 2003-03-20 |
AU2002335734A8 (en) | 2003-03-24 |
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