WO2003019677A3 - Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement - Google Patents

Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement Download PDF

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Publication number
WO2003019677A3
WO2003019677A3 PCT/DE2002/002866 DE0202866W WO03019677A3 WO 2003019677 A3 WO2003019677 A3 WO 2003019677A3 DE 0202866 W DE0202866 W DE 0202866W WO 03019677 A3 WO03019677 A3 WO 03019677A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductor frame
housing
radiation
emitting component
component
Prior art date
Application number
PCT/DE2002/002866
Other languages
English (en)
French (fr)
Other versions
WO2003019677A2 (de
Inventor
Karlheinz Arndt
Georg Bogner
Guenter Waitl
Original Assignee
Osram Opto Semiconductors Gmbh
Karlheinz Arndt
Georg Bogner
Guenter Waitl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2001140831 external-priority patent/DE10140831A1/de
Application filed by Osram Opto Semiconductors Gmbh, Karlheinz Arndt, Georg Bogner, Guenter Waitl filed Critical Osram Opto Semiconductors Gmbh
Priority to US10/487,576 priority Critical patent/US7193299B2/en
Priority to EP02767077A priority patent/EP1435118B1/de
Priority to JP2003523022A priority patent/JP4388806B2/ja
Publication of WO2003019677A2 publication Critical patent/WO2003019677A2/de
Publication of WO2003019677A3 publication Critical patent/WO2003019677A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Die Erfindung beschreibt einen Leiterrahmen für ein oberflächenmontierbares strahlungsemittierendes Bauelement, vorzugsweise ein Lichtemissionsdiodenbauelement mit mindestens einem Chipanschlussbereich und mindestens einem externen Anschlussstreifen, wobei der Leiterrahmen eben gebildet ist und zwischen dem Chipanschlussbereich und dem externen Anschlussstreifen ein Verformungselement, vorzugsweise ein Federelement, angeordnet ist, das eine elastische oder plastische Verformung des Leiterrahmens in der Ebene des Leiterrahmens ermöglicht. Weiterhin wird ein Gehäuse, ein oberflächenmontierbares Bauelement und eine Anordnung mit einer Mehrzahl solcher Bauelemente angegeben.
PCT/DE2002/002866 2001-08-21 2002-08-02 Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement WO2003019677A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/487,576 US7193299B2 (en) 2001-08-21 2002-08-02 Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
EP02767077A EP1435118B1 (de) 2001-08-21 2002-08-02 Gehäuse für ein oberflächenmontierbares strahlungsemittierendes bauelement, oberflächenmontierbares strahlungsemittierendes bauelement und anordnung mit einer mehrzahl von oberflächenmontierbaren strahlungsemittierenden bauelementen
JP2003523022A JP4388806B2 (ja) 2001-08-21 2002-08-02 放射線放出構成部材のためのケーシング及び導体フレーム、放射線放出構成部材、放射線放出構成部材を備えたディスプレイ装置及び／又は照明装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10140831.5 2001-08-21
DE2001140831 DE10140831A1 (de) 2001-08-21 2001-08-21 Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen
DE10157909 2001-11-26
DE10157909.8 2001-11-26

Publications (2)

Publication Number Publication Date
WO2003019677A2 WO2003019677A2 (de) 2003-03-06
WO2003019677A3 true WO2003019677A3 (de) 2004-04-29

Family

ID=26009971

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002866 WO2003019677A2 (de) 2001-08-21 2002-08-02 Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement

Country Status (6)

Country Link
US (1) US7193299B2 (de)
EP (1) EP1435118B1 (de)
JP (1) JP4388806B2 (de)
CN (1) CN100359703C (de)
TW (1) TW571447B (de)
WO (1) WO2003019677A2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10243247A1 (de) * 2002-09-17 2004-04-01 Osram Opto Semiconductors Gmbh Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung
DE10324909B4 (de) * 2003-05-30 2017-09-07 Osram Opto Semiconductors Gmbh Gehäuse für ein strahlungsemittierendes Bauelement, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
DE102005041064B4 (de) * 2005-08-30 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102006010729A1 (de) * 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optisches Element, Herstellungsverfahren hierfür und Verbund-Bauteil mit einem optischen Element
KR20080106402A (ko) 2006-01-05 2008-12-05 일루미텍스, 인크. Ｌｅｄ로부터 광을 유도하기 위한 개별 광학 디바이스
EP2070123A2 (de) 2006-10-02 2009-06-17 Illumitex, Inc. Led-system und -verfahren
TWI356486B (en) * 2007-09-07 2012-01-11 Young Lighting Technology Led light source module and manufacturing method t
EP2240968A1 (de) 2008-02-08 2010-10-20 Illumitex, Inc. System und verfahren zur bildung einer emitterschicht
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
DE102009013219A1 (de) * 2009-03-17 2010-12-09 3A Technology & Management Ag Leuchtvorrichtung sowie deren Verwendung
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8350500B2 (en) * 2009-10-06 2013-01-08 Cree, Inc. Solid state lighting devices including thermal management and related methods
US8264155B2 (en) * 2009-10-06 2012-09-11 Cree, Inc. Solid state lighting devices providing visible alert signals in general illumination applications and related methods of operation
US9081226B2 (en) * 2012-03-29 2015-07-14 Samsung Display Co., Ltd. Light-emitting module
JP5732619B2 (ja) * 2012-06-27 2015-06-10 パナソニックＩｐマネジメント株式会社 発光装置及びそれを用いた照明装置
JP6205894B2 (ja) * 2012-07-04 2017-10-04 日亜化学工業株式会社 発光装置用パッケージ成形体およびそれを用いた発光装置
KR102033928B1 (ko) 2012-09-13 2019-10-18 엘지이노텍 주식회사 발광 소자 및 조명 시스템
DE102014112540A1 (de) * 2014-09-01 2016-03-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
EP3223322B1 (de) * 2016-03-25 2019-05-01 LG Innotek Co., Ltd. Gehäuse für lichtemittierende vorrichtung
CN109983591B (zh) * 2016-11-11 2022-10-04 亮锐控股有限公司 制造引线框的方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766656A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Lead frame for semiconductor device
JPS6066454A (ja) * 1983-09-21 1985-04-16 Toshiba Corp 半導体装置
EP0274313A1 (de) * 1986-12-15 1988-07-13 Thomson Components-Mostek Corporation Kompensationsbiegung von gekrümmten, in einer Ebene radial verlaufenden Leitungen in einem Leiterrahmen, verwendet beim Verpacken von Halbleiterchips
DE3835942A1 (de) * 1988-10-21 1990-04-26 Telefunken Electronic Gmbh Flaechenhafter strahler
EP0590336A1 (de) * 1992-10-02 1994-04-06 TEMIC TELEFUNKEN microelectronic GmbH Optoelektronisches Bauelement mit engem Öffnungswinkel
US5874748A (en) * 1996-03-29 1999-02-23 Rohm Co., Ltd. Light-emitting diode device and illuminator with light-emitting surface using same
JP2001024237A (ja) * 1999-07-05 2001-01-26 Rohm Co Ltd Ｌｅｄ及びそれを用いた表示装置
EP1111738A1 (de) * 1998-08-31 2001-06-27 Rohm Co., Ltd. Halbleitervorrichtung und substrat für eine halbleitervorrichtung
US20020089064A1 (en) * 2001-01-08 2002-07-11 Jiahn-Chang Wu Flexible lead surface-mount semiconductor package

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022787B2 (de) 1989-05-31 2012-07-11 OSRAM Opto Semiconductors GmbH Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
JP2913577B2 (ja) 1995-04-13 1999-06-28 サンケン電気株式会社 樹脂封止形半導体発光装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766656A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Lead frame for semiconductor device
JPS6066454A (ja) * 1983-09-21 1985-04-16 Toshiba Corp 半導体装置
EP0274313A1 (de) * 1986-12-15 1988-07-13 Thomson Components-Mostek Corporation Kompensationsbiegung von gekrümmten, in einer Ebene radial verlaufenden Leitungen in einem Leiterrahmen, verwendet beim Verpacken von Halbleiterchips
DE3835942A1 (de) * 1988-10-21 1990-04-26 Telefunken Electronic Gmbh Flaechenhafter strahler
EP0590336A1 (de) * 1992-10-02 1994-04-06 TEMIC TELEFUNKEN microelectronic GmbH Optoelektronisches Bauelement mit engem Öffnungswinkel
US5874748A (en) * 1996-03-29 1999-02-23 Rohm Co., Ltd. Light-emitting diode device and illuminator with light-emitting surface using same
EP1111738A1 (de) * 1998-08-31 2001-06-27 Rohm Co., Ltd. Halbleitervorrichtung und substrat für eine halbleitervorrichtung
JP2001024237A (ja) * 1999-07-05 2001-01-26 Rohm Co Ltd Ｌｅｄ及びそれを用いた表示装置
US20020089064A1 (en) * 2001-01-08 2002-07-11 Jiahn-Chang Wu Flexible lead surface-mount semiconductor package

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 006, no. 144 (E - 122) 3 August 1982 (1982-08-03) *
PATENT ABSTRACTS OF JAPAN vol. 009, no. 201 (E - 336) 17 August 1985 (1985-08-17) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 16 8 May 2001 (2001-05-08) *

Also Published As

Publication number Publication date
US20040262717A1 (en) 2004-12-30
TW571447B (en) 2004-01-11
JP2005500703A (ja) 2005-01-06
CN100359703C (zh) 2008-01-02
EP1435118A2 (de) 2004-07-07
CN1545737A (zh) 2004-11-10
JP4388806B2 (ja) 2009-12-24
EP1435118B1 (de) 2011-11-02
US7193299B2 (en) 2007-03-20
WO2003019677A2 (de) 2003-03-06

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