WO2003010713A1 - Multichip support package - Google Patents

Multichip support package Download PDF

Info

Publication number
WO2003010713A1
WO2003010713A1 PCT/FR2002/002034 FR0202034W WO03010713A1 WO 2003010713 A1 WO2003010713 A1 WO 2003010713A1 FR 0202034 W FR0202034 W FR 0202034W WO 03010713 A1 WO03010713 A1 WO 03010713A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
electronic
support
contact
slides
Prior art date
Application number
PCT/FR2002/002034
Other languages
French (fr)
Inventor
Fabrice Clerc
Jacques Dudouit
Aymeric De Solages
Original Assignee
France Telecom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Telecom filed Critical France Telecom
Publication of WO2003010713A1 publication Critical patent/WO2003010713A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0719Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for application selection, e.g. an acceleration sensor or a set of radio buttons
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07741Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card

Definitions

  • the present invention relates to a device for supporting electronic chips.
  • the invention falls within the field of the use of electronic chips, in particular for carrying out an exchange of information requiring secure communication using various types of cards such as bank cards, health cards, pre or postpaid cards. , subscription cards, loyalty cards, electronic wallet.
  • the user has different electronic cards if he wants to use different services, such as a bank transaction, such as a telephone call from a payphone, such as a purchase order associated with a loyalty program, etc.
  • a bank transaction such as a telephone call from a payphone, such as a purchase order associated with a loyalty program, etc.
  • the user respectively has a first smart card which supports the banking transaction service, a second smart card to which is attached a telephone number and a third smart card which supports the service loyalty program.
  • the user wants to use one of the preceding services, he inserts the appropriate smart card into a chip reader associated with the service.
  • the user must have the correct smart card to use a given service.
  • the technical problem to be solved by the object of the present invention is to propose an electronic chip support device, intended to put in chip reading position, in a chip reader, an electronic module comprising an electronic chip, which allows multiple applications highlighting process electronic chips while ensuring a good seal between applications and a limitation of the number of cards required.
  • a solution to the technical problem posed consists, according to the present invention, in that said electronic chip support device, intended to be used by a user during transactions implementing an electronic chip, comprises:
  • an interface smart card comprising an electronic module in the reading position, this module comprising contact zones, and an electrical extension of these contact zones up to one end of the extension,
  • a multi-chip support comprising a determined number of electronic modules accessible independently of one another and distributed according to a determined number of lines
  • - a device for selecting a specific electronic module of the support which provides electrical continuity between the end of the extender and at least one group of contact points, each contact point of a given group being in contact with a zone of electronic module contact determined.
  • the electronic chip support device fictitiously moves the reading position on the multi-chip support.
  • the electrical extension allows a smart card reader to communicate with the determined electronic module, physically located on the multi-chip support.
  • the user selects the determined electronic module by means of the selection device. It then inserts the interface chip card into the chip reader of the telephone or of the bank payment terminal for example.
  • the electronic chip support device allows a user to select an electronic module from among several electronic modules present on the multi-chip support.
  • Each electronic module supporting a specific application such as the establishment of communications from a given number or such as an electronic transaction
  • the choice of an electronic module corresponds to the choice of an application.
  • the electronic chip support device solves the problem posed. Indeed, each application being installed on a different electronic module, that is to say on a different chip, there is no memory sharing.
  • the chip support device provides total sealing.
  • the multi-chip support is equipped with slides and the selection device comprises a bridge equipped with slides and a trolley equipped with contact points electrically connected to the end of the extension.
  • the carriage can be positioned in front of each of the electronic modules of the multi-chip support by means of the different slides.
  • the electronic chip support device can advantageously be used with any chip reader which does not swallow the chip card when it is read and thus leaves part of the chip card free outside the reader.
  • FIG. 1 is a diagram of a top view of a first particular embodiment of a device for supporting electronic chips according to the invention.
  • FIG. 2 is a diagram of a view by transparency of a particular embodiment of an interface chip card of an electronic chip support device shown in FIG. 1.
  • FIG. 3 is a diagram of a top view of a second embodiment of a device for supporting electronic chips according to the invention.
  • FIG. 4 is a diagram of a view by transparency of a particular embodiment of an interface chip card of an electronic chip support device shown in FIG. 3.
  • FIG. 5 is a diagram of a top view of a third particular embodiment of a device for supporting electronic chips according to the invention.
  • FIG. 1 A first particular embodiment of a device for supporting electronic chips according to the invention is illustrated by FIG. 1.
  • the electronic chip support device 1 comprises an interface chip card 2, a multi-chip support 3 and a selection device 4 visible in FIG. 2 which is a view by transparency of an interface chip card 2.
  • the interface chip card 2 typically has the dimensions of an electronic card normahsed according to ISO 7816, that is to say that it has the dimensions (in mm):
  • the interface chip card 2 comprises projections 5 which participate in maintaining the interface chip card 2 in the multi-chip support 3 in a given position.
  • the interface chip card 2 includes an electronic module 6 which occupies the so-called reading position.
  • the ISO 7816 standard determines the location of the contacts between the reader and the card during a read or write operation.
  • the contacts which are eight in number are positioned in two columns of four equidistant contacts. Each contact must be inside an area limited by a small rectangle of 2x1.7 mm, called the contact area. These eight contacts fit into a rectangle of not more than 9.3 x 9.7 mm 2 . This rectangle, positioned at the top right of the map, is closest to 10.25 mm from the short side of the map and 19.23 mm from the long side of the map.
  • the multi-chip support 3 comprises a table of electronic modules 7 arranged on a bottom 8 which may be of the same nature as the plastic support of electronic chip cards.
  • the table presents a certain number of rows and columns determined by the size of the modules and the size of the support.
  • the multi-chip support 3 also comprises a structure 9 superimposed on the bottom but which does not cover the array of electronic modules.
  • This structure comprises slides 10 in which the interface smart card slides.
  • the slides 10 are equipped with notches 11 which cooperate with the projections 5 of the interface chip card 2 to maintain the latter in a given position.
  • FIG. 2 is a diagram of a view by transparency of the interface chip card 2 of the electronic chip support device of FIG. 1.
  • the interface chip card 2 comprises an electronic module 6 in the reading position , with contact zones 12, an electrical extension 13 of these contact zones 12, projections 5, a selection device 4 and three groups 14 of contact points.
  • the electrical extension 13 can be in the form of an electric bus which electrically connects each contact zone 12 to an input of the selection device 4.
  • the selection device 4 has as many inputs and outputs as there are contacts, ie eight according to ISO 7816.
  • the outputs of the device 4 are linked to the group 14 of selected contact points.
  • the number of groups 14 of contact points is identical to the number of rows of electronic modules 7 contained in the table of the multi-chip support 3.
  • the distances between the groups 14 of contact points are the same as the distances between the lines.
  • the table of electronic modules 7 of the device of FIG. 3 is not composed of columns in which the modules are aligned, but oblique Ugnes of electronic modules 7.
  • FIG. 4 is a diagram of a view by transparency of the interface chip card 2 of the electronic chip support device of FIG. 3.
  • This interface chip card 2 is distinguished from the chip card 2 d 'interface described with reference to Figure 2 in that the three groups 14 of contact points are arranged along an oblique line parallel to the oblique lines along which are arranged the electronic modules 7 of the table.
  • each contact point of a group 14 comes into contact with a contact zone of an electronic module of the switchboard. And when reading the interface chip card 2, the reader comes to read the electronic module of the switchboard positioned under the group 14 of contact points selected by the selection device 4.
  • FIG. 5 illustrates a third particular embodiment of a multi-chip support housing according to the invention.
  • the electronic chip support device 1 comprises an interface chip card 2, a multi-chip support 3 and a selection device 4.
  • the interface chip card 2 preferably complies with the ISO 7816 standard and includes an electronic module 6 in the reading position, the contact zones of which are are extended by an electric extension 13 to one end 15 of the extension.
  • the multi-chip support 3 is similar to the support described with reference to FIG. 1.
  • the selection device 4 consists of a carriage 16, a bridge 17 and an electrical cord 18.
  • the carriage 16 is equipped with a group 14 of contact points electrically connected to the end 15 of the electrical extension 13 by the cord 18.
  • the cord 18 preferably has a flexible structure which allows it to bend on itself.
  • the bridge 17 is fitted with slides 19 on which the carriage 16 slides. The bridge 17 can itself slide in the slides 10 of the multi-chip support 3.
  • the slides 19 of the bridge can, in the same way as the slides 10 of the multi-chip support 3, include notches 20 which cooperate with projections 21 of the carriage 16 to maintain the carriage in a given position.
  • the bridge 17 can be equipped with projections 22 which cooperate with the notches 11 of the slides 10 of the support 3 to maintain the bridge 17 in a given position.
  • the user selects a determined electromechanical module 7 by positioning the bridge on the column to which the module 7 belongs and by positioning the carriage 16 above the module 7.
  • the zones 12 of contact of the module 6 in reading position being electrically connected to the contact zones of the determined module 7, by means of the electrical extension 13 and of the selection device 4, the smart card reader in which the smart card 2 is inserted interface comes to read the determined module 7.
  • a display screen disposed either on the interface chip card or on the multi-chip support, for displaying references of the selected electronic module selected.

Abstract

The invention concerns a device for supporting silicon chips for use by a user during transactions involving a silicon chip. Said silicon chip supporting device (1) comprises: an interface chip card including an electronic module (6) in reading position, said electronic module comprising contact zones, and an electrical extender of said contact zones up to one end of the extender, a multichip support (3), a device for selecting a specific electronic module (7) of the multichip support (3) which ensures electrical continuity between the end of the electrical extender and at least a specific group of contact points, each contact point of the specific group being in contact with a contact zone of the specific electronic module (7).

Description

Titre de l'invention Title of invention
BOITIER SUPPORT MULTIPUCESMULTI-CHIP SUPPORT HOUSING
Domaine de l'invention La présente invention se rapporte à un dispositif de support de puces électroniques.Field of the Invention The present invention relates to a device for supporting electronic chips.
L'invention s'inscrit dans le domaine de l'utilisation des puces électroniques, notamment pour réaliser un échange d'informations nécessitant une communication sécurisée mettant en œuvre divers types de cartes telles que cartes bancaires, cartes santé, cartes pré ou post-payées, cartes d'abonnement, cartes de fidélité, porte-monnaie électronique.The invention falls within the field of the use of electronic chips, in particular for carrying out an exchange of information requiring secure communication using various types of cards such as bank cards, health cards, pre or postpaid cards. , subscription cards, loyalty cards, electronic wallet.
Description de l'art antérieurDescription of the Prior Art
Actuellement, l'utilisateur possède différentes cartes électroniques s'il veut faire appel à des services différents, telle qu'une transaction bancaire, telle qu'une communication téléphonique à partir d'un publiphone, telle qu'un ordre d'achat associé à un programme de fidélité, etc.. Ainsi, l'utilisateur possède respectivement une première carte à puce qui supporte le service de transaction bancaire, une deuxième carte à puce à laquelle est attaché un numéro téléphonique et une troisième carte à puce qui supporte le service du programme de fidélité. Lorsque l'utilisateur veut utiliser un des services précédents, il insère la carte à puce adéquate dans un lecteur de puce associé au service. Finalement l'utilisateur doit posséder la bonne carte à puce pour utiliser un service donné.Currently, the user has different electronic cards if he wants to use different services, such as a bank transaction, such as a telephone call from a payphone, such as a purchase order associated with a loyalty program, etc. Thus, the user respectively has a first smart card which supports the banking transaction service, a second smart card to which is attached a telephone number and a third smart card which supports the service loyalty program. When the user wants to use one of the preceding services, he inserts the appropriate smart card into a chip reader associated with the service. Finally, the user must have the correct smart card to use a given service.
Pour résoudre le problème de la multiplication des cartes, il existe des puces qui hébergent plusieurs applications différentes. Toutefois, ces puces soulèvent d'une part le problème de la capacité des puces électroniques et d'autre part, le problème de sécurité lié au manque d'étanchéité entre les différentes applications présentes sur une même puce. Les fournisseurs d'applications soulèvent en outre comme problèmes la disparité des périodes de validité des applications partageant un même support physique, et le partage de la responsabilité juridique en cas d'utilisation abusive d'une carte.To solve the problem of multiplying cards, there are chips that host several different applications. However, these chips raise on the one hand the problem of the capacity of electronic chips and on the other hand, the security problem linked to the lack of sealing between the different applications present on the same chip. Application providers also raise problems as the disparity of validity periods of applications sharing the same physical medium, and the sharing of legal responsibility in the event of improper use of a card.
Résumé de l'inventionSummary of the invention
Aussi, le problème technique à résoudre par l'objet de la présente invention est de proposer un dispositif de support de puces électroniques, destiné à mettre en position de lecture de puce, dans un lecteur de puce, un module électronique comprenant une puce électronique, qui permette des applications multiples mettant en œuvre des puces électroniques tout en garantissant une bonne étanchéité entre les applications et une limitation du nombre de cartes nécessaires.Also, the technical problem to be solved by the object of the present invention is to propose an electronic chip support device, intended to put in chip reading position, in a chip reader, an electronic module comprising an electronic chip, which allows multiple applications highlighting process electronic chips while ensuring a good seal between applications and a limitation of the number of cards required.
Une solution au problème technique posé consiste, selon la présente invention, en ce que ledit dispositif de support de puces électroniques, destiné à être utilisé par un utilisateur lors de transactions mettant en œuvre une puce électronique, comprend :A solution to the technical problem posed consists, according to the present invention, in that said electronic chip support device, intended to be used by a user during transactions implementing an electronic chip, comprises:
- une carte à puce d'interface comprenant un module électronique en position de lecture, ce module comportant des zones de contact, et un prolongateur électrique de ces zones de contact jusqu'à une extrémité du prolongateur,an interface smart card comprising an electronic module in the reading position, this module comprising contact zones, and an electrical extension of these contact zones up to one end of the extension,
- un support multipuces comprenant un nombre déterminé de modules électroniques accessibles indépendamment les uns des autres et répartis selon un nombre déteπniné de lignes,a multi-chip support comprising a determined number of electronic modules accessible independently of one another and distributed according to a determined number of lines,
- un dispositif de sélection d'un module électronique déterminé du support qui assure une continuité électrique entre l'extrémité du prolongateur et au moins un groupe de points de contact, chaque point de contact d'un groupe déterminé étant en contact avec une zone de contact du module électronique déterminé.- a device for selecting a specific electronic module of the support which provides electrical continuity between the end of the extender and at least one group of contact points, each contact point of a given group being in contact with a zone of electronic module contact determined.
Ainsi, le dispositif de support de puces électroniques selon l'invention déplace fictivement la position de lecture sur le support multipuces. En effet, le prolongateur électrique permet à un lecteur de carte à puce de communiquer avec le module électronique déterminé, situé physiquement sur le support multipuces. Lors d'une utilisation du boîtier, l'utilisateur sélectionne le module électronique déterminé au moyen du dispositif de sélection. Il insère ensuite la carte à puce d'interface dans le lecteur de puce du téléphone ou du terminal de paiement bancaire par exemple.Thus, the electronic chip support device according to the invention fictitiously moves the reading position on the multi-chip support. In fact, the electrical extension allows a smart card reader to communicate with the determined electronic module, physically located on the multi-chip support. When using the box, the user selects the determined electronic module by means of the selection device. It then inserts the interface chip card into the chip reader of the telephone or of the bank payment terminal for example.
Ainsi, le dispositif de support de puces électroniques selon l'invention permet à un utilisateur de sélectionner un module électronique parmi plusieurs modules électroniques présents sur le support multipuces. Chaque module électronique supportant une application déterminée, tel l'établissement de communications à partir d'un numéro donné ou telle une transaction électronique, le choix d'un module électronique correspond au choix d'une application. Le dispositif de support de puces électroniques conforme à l'invention résout le problème posé. En effet, chaque application étant implantée sur un module électronique différent, c'est-à-dire sur une puce différente, il n'y a pas de partage de mémoire. Ainsi, le dispositif de support de puces assure une étanchéité totale.Thus, the electronic chip support device according to the invention allows a user to select an electronic module from among several electronic modules present on the multi-chip support. Each electronic module supporting a specific application, such as the establishment of communications from a given number or such as an electronic transaction, the choice of an electronic module corresponds to the choice of an application. The electronic chip support device according to the invention solves the problem posed. Indeed, each application being installed on a different electronic module, that is to say on a different chip, there is no memory sharing. Thus, the chip support device provides total sealing.
Selon un mode de réalisation particulier du dispositif selon l'invention, le support multipuces est équipé de glissières et le dispositif de sélection comporte un pont équipé de glissières et un chariot équipé de points de contact reliés électriquement à l'extrémité du prolongateur. Selon cette réalisation, le chariot peut être positionné devant chacun des modules électroniques du support multipuces par l'intermédiaire des différentes glissières. Ainsi, le dispositif de support de puces électroniques peut avantageusement être utilisé avec tout lecteur de puce qui n'avale pas la carte à puce lors de sa lecture et laisse ainsi une partie de la carte à puce libre à l'extérieur du lecteur.According to a particular embodiment of the device according to the invention, the multi-chip support is equipped with slides and the selection device comprises a bridge equipped with slides and a trolley equipped with contact points electrically connected to the end of the extension. According to this embodiment, the carriage can be positioned in front of each of the electronic modules of the multi-chip support by means of the different slides. Thus, the electronic chip support device can advantageously be used with any chip reader which does not swallow the chip card when it is read and thus leaves part of the chip card free outside the reader.
Brève description des dessinsBrief description of the drawings
D'autres caractéristiques et avantages de l'invention apparaîtront lors de la description qui suit et qui est faite en regard de figures annexées données à titre d'exemples non limitatifs.Other characteristics and advantages of the invention will become apparent from the description which follows and which is given with reference to the appended figures given by way of nonlimiting examples.
La figure 1 est un schéma d'une vue de dessus d'une première réalisation particulière d'un dispositif de support de puces électroniques selon l'invention.FIG. 1 is a diagram of a top view of a first particular embodiment of a device for supporting electronic chips according to the invention.
La figure 2 est un schéma d'une vue par transparence d'une réalisation particulière d'une carte à puce d'interface d'un dispositif de support de puces électroniques représenté à la figure 1.FIG. 2 is a diagram of a view by transparency of a particular embodiment of an interface chip card of an electronic chip support device shown in FIG. 1.
La figure 3 est un schéma d'une vue de dessus d'une deuxième réalisation d'un dispositif de support de puces électroniques selon l'invention.FIG. 3 is a diagram of a top view of a second embodiment of a device for supporting electronic chips according to the invention.
La figure 4 est un schéma d'une vue par transparence d'une réalisation particulière d'une carte à puce d'interface d'un dispositif de support de puces électroniques représenté à la figure 3.FIG. 4 is a diagram of a view by transparency of a particular embodiment of an interface chip card of an electronic chip support device shown in FIG. 3.
La figure 5 est un schéma d'une vue de dessus d'une troisième réalisation particulière d'un dispositif de support de puces électroniques selon l'invention.FIG. 5 is a diagram of a top view of a third particular embodiment of a device for supporting electronic chips according to the invention.
Description d'un mode de réalisation Un premier mode de réalisation particulier d'un dispositif de support de puces électroniques selon l'invention est illustré par la figure 1.Description of an embodiment A first particular embodiment of a device for supporting electronic chips according to the invention is illustrated by FIG. 1.
Le dispositif de support de puces électroniques 1 comprend une carte 2 à puce d'interface, un support 3 multipuces et un dispositif 4 de sélection visible sur la figure 2 qui est une vue par transparence d'une carte 2 à puce d'interface. La carte 2 à puce d'interface a typiquement les dimensions d'une carte électronique normahsée selon la norme ISO 7816, c'est-à-dire qu'elle a pour dimensions (en mm) :The electronic chip support device 1 comprises an interface chip card 2, a multi-chip support 3 and a selection device 4 visible in FIG. 2 which is a view by transparency of an interface chip card 2. The interface chip card 2 typically has the dimensions of an electronic card normahsed according to ISO 7816, that is to say that it has the dimensions (in mm):
- longueur : [85,47-85,72]- length: [85,47-85,72]
- largeur : [53,92-54,03] - épaisseur : 0,76 +/- 0,08 Toutefois, selon le mode décrit, la carte 2 à puce d'interface comprend des saillies 5 qui participent au maintien de la carte 2 à puce d'interface dans le support 3 multipuces dans une position donnée.- width: [53.92-54.03] - thickness: 0.76 +/- 0.08 However, according to the mode described, the interface chip card 2 comprises projections 5 which participate in maintaining the interface chip card 2 in the multi-chip support 3 in a given position.
La carte 2 à puce d'interface comprend un module 6 électronique qui occupe la place dite en position de lecture. Lors de l'insertion d'une carte à puce électronique dans un lecteur de carte à puce, ce dernier est en mesure de lire la puce intégrée dans le module électronique situé sur la carte à puce, si et seulement si ce module occupe la position de lecture. La norme ISO 7816 détermine l'emplacement des contacts entre le lecteur et la carte lors d'une opération de lecture ou d'écriture. Les contacts qui sont au nombre de huit se positionnent en deux colonnes de quatre contacts équidistants. Chaque contact doit se trouver à l'intérieur d'une surface limitée par un petit rectangle de 2x1,7 mm, dite zone de contact. Ces huit contacts s'inscrivent dans un rectangle d'au plus 9,3x9,7 mm2. Ce rectangle, positionné en haut à droite de la carte, se trouve au plus près à 10,25 mm du petit côté de la carte et à 19,23 mm du grand côté de la carte.The interface chip card 2 includes an electronic module 6 which occupies the so-called reading position. When inserting an electronic smart card in a smart card reader, the latter is able to read the integrated chip in the electronic module located on the smart card, if and only if this module occupies the position of reading. The ISO 7816 standard determines the location of the contacts between the reader and the card during a read or write operation. The contacts which are eight in number are positioned in two columns of four equidistant contacts. Each contact must be inside an area limited by a small rectangle of 2x1.7 mm, called the contact area. These eight contacts fit into a rectangle of not more than 9.3 x 9.7 mm 2 . This rectangle, positioned at the top right of the map, is closest to 10.25 mm from the short side of the map and 19.23 mm from the long side of the map.
Le support 3 multipuces comprend un tableau de modules 7 électroniques disposé sur un fond 8 qui peut être de même nature que le support plastique des cartes à puce électronique. Le tableau présente un certain nombre de lignes et de colonnes déterminé par la taille des modules et la taille du support. Le support 3 multipuces comprend en outre une structure 9 superposée sur le fond mais qui ne recouvre pas le tableau de modules électroniques. Cette structure comporte des glissières 10 dans lesquelles coulisse la carte à puce d'interface. Les glissières 10 sont équipées d'encoches 11 qui coopèrent avec les saillies 5 de la carte 2 à puce d'interface pour maintenir cette dernière dans une position donnée. La figure 2 est un schéma d'une vue par transparence de la carte 2 à puce d'interface du dispositif de support de puces électroniques de la figure 1. La carte 2 à puce d'interface comprend un module 6 électronique en position de lecture, avec des zones 12 de contact, un prolongateur 13 électrique de ces zones 12 de contact, des saillies 5, un dispositif 4 de sélection et trois groupes 14 de points de contact. Le prolongateur 13 électrique peut se présenter sous la forme d'un bus électrique qui relie électriquement chaque zone 12 de contact à une entrée du dispositif 4 de sélection.The multi-chip support 3 comprises a table of electronic modules 7 arranged on a bottom 8 which may be of the same nature as the plastic support of electronic chip cards. The table presents a certain number of rows and columns determined by the size of the modules and the size of the support. The multi-chip support 3 also comprises a structure 9 superimposed on the bottom but which does not cover the array of electronic modules. This structure comprises slides 10 in which the interface smart card slides. The slides 10 are equipped with notches 11 which cooperate with the projections 5 of the interface chip card 2 to maintain the latter in a given position. FIG. 2 is a diagram of a view by transparency of the interface chip card 2 of the electronic chip support device of FIG. 1. The interface chip card 2 comprises an electronic module 6 in the reading position , with contact zones 12, an electrical extension 13 of these contact zones 12, projections 5, a selection device 4 and three groups 14 of contact points. The electrical extension 13 can be in the form of an electric bus which electrically connects each contact zone 12 to an input of the selection device 4.
Le dispositif 4 de sélection comporte autant d'entrées et de sorties que de contacts, soit huit selon la norme ISO 7816. Les sorties du dispositif 4 sont en liaison avec le groupe 14 de points de contact sélectionné. Le nombre de groupes 14 de points de contact est identique au nombre de lignes de modules 7 électroniques contenues dans le tableau du support 3 multipuces. Les distances entre les groupes 14 de points de contact sont les mêmes que les distances entre les lignes. Ainsi, lors du glissement de la carte 2 à puce d'interface dans les glissières du support multipuces, chaque point de contact d'un groupe 14 vient en contact avec une zone de contact d'un module électronique du tableau. Ainsi, lors de la lecture de la carte 2 à puce d'interface, le lecteur vient lire le module électronique du tableau positionné sous le groupe 14 de points de contact sélectionné par le dispositif 4 de sélection. Un deuxième mode de réalisation particulier d'un dispositif de support de puces électroniques selon l'invention est illustré par la figure 3.The selection device 4 has as many inputs and outputs as there are contacts, ie eight according to ISO 7816. The outputs of the device 4 are linked to the group 14 of selected contact points. The number of groups 14 of contact points is identical to the number of rows of electronic modules 7 contained in the table of the multi-chip support 3. The distances between the groups 14 of contact points are the same as the distances between the lines. Thus, during the sliding of the interface chip card 2 in the slides of the multi-chip support, each contact point of a group 14 comes into contact with a contact zone of an electronic module of the switchboard. Thus, when reading the interface chip card 2, the reader comes to read the electronic module of the switchboard positioned under the group 14 of contact points selected by the selection device 4. A second particular embodiment of a device for supporting electronic chips according to the invention is illustrated in FIG. 3.
Les éléments de ce dispositif qui sont identiques aux éléments du premier mode de réalisation d'un dispositif ne sont pas décrits de nouveau.The elements of this device which are identical to the elements of the first embodiment of a device are not described again.
Contrairement au tableau de modules 7 électroniques du dispositif de la figure 1, le tableau de modules 7 électroniques du dispositif de la figure 3 n'est pas composé de colonnes dans lesquelles sont alignés les modules, mais de Ugnes obliques de modules 7 électroniques.Unlike the table of electronic modules 7 of the device of FIG. 1, the table of electronic modules 7 of the device of FIG. 3 is not composed of columns in which the modules are aligned, but oblique Ugnes of electronic modules 7.
La figure 4 est un schéma d'une vue par transparence de la carte 2 à puce d'interface du dispositif de support de puces électroniques de la figure 3. Cette carte 2 à puce d'interface se distingue de la carte 2 à puce d'interface décrite en regard de la figure 2 en ce que les trois groupes 14 de points de contact sont disposés suivant une ligne oblique parallèle aux lignes obliques selon lesquelles sont disposés les modules 7 électroniques du tableau.FIG. 4 is a diagram of a view by transparency of the interface chip card 2 of the electronic chip support device of FIG. 3. This interface chip card 2 is distinguished from the chip card 2 d 'interface described with reference to Figure 2 in that the three groups 14 of contact points are arranged along an oblique line parallel to the oblique lines along which are arranged the electronic modules 7 of the table.
Ainsi, lors du glissement de la carte 2 à puce d'interface dans les glissières du support multipuces, chaque point de contact d'un groupe 14 vient en contact avec une zone de contact d'un module électronique du tableau. Et lors de la lecture de la carte 2 à puce d'interface, le lecteur vient lire le module électronique du tableau positionné sous le groupe 14 de points de contact sélectionné par le dispositif 4 de sélection.Thus, during the sliding of the interface chip card 2 in the slides of the multi-chip support, each contact point of a group 14 comes into contact with a contact zone of an electronic module of the switchboard. And when reading the interface chip card 2, the reader comes to read the electronic module of the switchboard positioned under the group 14 of contact points selected by the selection device 4.
La figure 5 illustre un troisième mode de réalisation particulier d'un boîtier support multipuces selon l'invention.FIG. 5 illustrates a third particular embodiment of a multi-chip support housing according to the invention.
Le dispositif 1 de support de puces électroniques comprend une carte 2 à puce d'interface, un support 3 multipuces et un dispositif 4 de sélection.The electronic chip support device 1 comprises an interface chip card 2, a multi-chip support 3 and a selection device 4.
La carte 2 à puce d'interface respecte de préférence la norme ISO 7816 et comprend un module 6 électronique en position de lecture dont les zones de contact sont prolongées par un prolongateur 13 électrique jusqu'à une extrémité 15 du prolongateur.The interface chip card 2 preferably complies with the ISO 7816 standard and includes an electronic module 6 in the reading position, the contact zones of which are are extended by an electric extension 13 to one end 15 of the extension.
Le support 3 multipuces est similaire au support décrit en regard de la figure 1. Le dispositif 4 de sélection se compose d'un chariot 16, d'un pont 17 et d'un cordon 18 électrique.The multi-chip support 3 is similar to the support described with reference to FIG. 1. The selection device 4 consists of a carriage 16, a bridge 17 and an electrical cord 18.
Le chariot 16 est équipé d'un groupe 14 de points de contact reliés électriquement à l'extrémité 15 du prolongateur 13 électrique par le cordon 18. Le cordon 18 a de préférence une structure souple qui lui permet de se plier sur lui-même. Le pont 17 est équipé de glissières 19 sur lesquelles glisse le chariot 16. Le pont 17 peut lui-même glisser dans les glissières 10 du support 3 multipuces.The carriage 16 is equipped with a group 14 of contact points electrically connected to the end 15 of the electrical extension 13 by the cord 18. The cord 18 preferably has a flexible structure which allows it to bend on itself. The bridge 17 is fitted with slides 19 on which the carriage 16 slides. The bridge 17 can itself slide in the slides 10 of the multi-chip support 3.
Les glissières 19 du pont peuvent, de la même manière que les glissières 10 du support 3 multipuces, comporter des encoches 20 qui coopèrent avec des saillies 21 du chariot 16 pour maintenir le chariot dans une position donnée.The slides 19 of the bridge can, in the same way as the slides 10 of the multi-chip support 3, include notches 20 which cooperate with projections 21 of the carriage 16 to maintain the carriage in a given position.
Le pont 17 peut être équipé de saillies 22 qui coopèrent avec les encoches 11 des glissières 10 du support 3 pour maintenir le pont 17 dans une position donnée.The bridge 17 can be equipped with projections 22 which cooperate with the notches 11 of the slides 10 of the support 3 to maintain the bridge 17 in a given position.
Lors d'une utilisation du dispositif 1 de support de puces électroniques, l'utilisateur sélectionne un module 7 electromque déterminé en positionnant le pont sur la colonne à laquelle appartient le module 7 et en positionnant le chariot 16 au dessus du module 7. Les zones 12 de contact du module 6 en position de lecture étant reliées électriquement aux zones de contact du module 7 déterminé, au moyen du prolongateur 13 électrique et du dispositif 4 de sélection, le lecteur de carte à puce dans lequel est inséré la carte 2 à puce d'interface vient lire le module 7 déterminé.When using the device 1 for supporting electronic chips, the user selects a determined electromechanical module 7 by positioning the bridge on the column to which the module 7 belongs and by positioning the carriage 16 above the module 7. The zones 12 of contact of the module 6 in reading position being electrically connected to the contact zones of the determined module 7, by means of the electrical extension 13 and of the selection device 4, the smart card reader in which the smart card 2 is inserted interface comes to read the determined module 7.
Les modes de réalisation préalablement décrits peuvent être complétés par un écran d'affichage disposé soit sur la carte à puce d'interface, soit sur le support multipuces, pour afficher des références du module électronique déterminé sélectionné.The previously described embodiments can be supplemented by a display screen disposed either on the interface chip card or on the multi-chip support, for displaying references of the selected electronic module selected.
Ces références peuvent être le nom d'une application liée au module, par exempleThese references can be the name of an application linked to the module, for example
Carte Bancaire ou Crédit Téléphonique, ou le fournisseur du module. Bank Card or Telephone Credit, or the supplier of the module.

Claims

REVENDICATIONS
1. Dispositif (1) de support de puces électroniques destiné à être utilisé par un utilisateur lors de transactions mettant en œuvre une puce électronique caractérisé en ce qu'il comprend : - une carte (2) à puce d'interface comprenant un module (6) électronique en position de lecture, ce module (6) comportant des zones (12) de contact, et un prolongateur (13) électrique de ces zones (12) de contact jusqu'à une extrémité du prolongateur (13),1. Device (1) for supporting electronic chips intended for use by a user during transactions using an electronic chip, characterized in that it comprises: - a card (2) with an interface chip comprising a module ( 6) electronic in reading position, this module (6) comprising contact zones (12), and an electric extension (13) of these contact zones (12) up to one end of the extension (13),
- un support (3) multipuces comprenant un nombre déterminé de modules (7) électroniques accessibles indépendamment les uns des autres et répartis selon un nombre déterminé de lignes,a multi-chip support (3) comprising a determined number of electronic modules (7) accessible independently of one another and distributed along a determined number of lines,
- un dispositif (4) de sélection d'un module (7) électronique déterminé du support (3) multipuces qui assure une continuité électrique entre l'extrémité (15) du prolongateur (13) électrique et au moins un groupe (14) déterminé de points de contact, chaque point de contact du groupe (14) déterminé étant en contact avec une zone de contact du module (7) electromque déterminé.- a device (4) for selecting a specific electronic module (7) of the multi-chip support (3) which ensures electrical continuity between the end (15) of the electric extension (13) and at least one group (14) determined of contact points, each contact point of the group (14) determined being in contact with a contact zone of the module (7) determined electric.
2. Dispositif (1) de support de puces électroniques selon la revendication 1 dans lequel le dispositif (4) de sélection se compose : - d'autant de groupes (14) de points de contact que de lignes de modules2. Device (1) for supporting electronic chips according to claim 1 in which the selection device (4) is composed: - as many groups (14) of contact points as lines of modules
(7) électroniques sur le support (3) multipuces, d'un commutateur pouvant être actionné par l'utilisateur, qui relie électriquement l'extrémité du prolongateur (13) électrique avec un des groupes (14) de points de contact.(7) electronic on the support (3) multi-chip, of a switch which can be actuated by the user, which electrically connects the end of the electric extender (13) with one of the groups (14) of contact points.
3. Dispositif (1) de support de puces électroniques selon l'une des revendications 1 et 2 dans lequel le support (3) multipuces est équipé de glissières (10), découpées par des encoches (11), pour y glisser la carte (2) à puce d'interface, et dans lequel la carte (2) à puce d'interface comporte des saillies (5) qui coopèrent avec les encoches (11) pour maintenir la carte (2) à puce d'interface dans une position donnée par rapport au support (3) multipuces.3. Device (1) for supporting electronic chips according to one of claims 1 and 2 wherein the support (3) multi-chip is equipped with slides (10), cut by notches (11), to slide the card ( 2) with an interface chip, and in which the interface chip card (2) has projections (5) which cooperate with the notches (11) to hold the interface chip card (2) in a position given with respect to the multi-chip support (3).
4. Dispositif (1) de support de puces électroniques selon la revendication 1 dans lequel : - le support (3) multipuces est équipé de glissières (10) et4. Device (1) for supporting electronic chips according to claim 1, in which: - the multi-chip support (3) is equipped with slides (10) and
- le dispositif (4) de sélection comporte un pont (17) équipé de glissières (19) et un chariot (16) équipé d'un groupe (14) de points de contact reliés électriquement à l'extrémité (15) du prolongateur (13) électrique, le chariot (16) pouvant être positionné devant chacun des modules (7) électromques du support (3) multipuces par l'intermédiaire des différentes glissières (10, 19).- the selection device (4) comprises a bridge (17) equipped with slides (19) and a carriage (16) equipped with a group (14) of contact points electrically connected to the end (15) of the extension ( 13) electric, the carriage (16) being able to be positioned in front of each of the electromechanical modules (7) of the multi-chip support (3) by means of the different slides (10, 19).
5. Dispositif (1) de support de puces électroniques selon la revendication 4 dans lequel les glissières (10) du support (3) multipuces comportent des premiers moyens (11) de blocage et dans lequel le pont (17) comporte des deuxièmes moyens (22) de blocage qui coopèrent avec les premiers moyens (11) de blocage pour maintenir le pont (17) dans une position donnée et dans lequel les glissières (19) du pont (17) comportent des troisièmes moyens (20) de blocage et dans lequel le chariot (16) comporte des quatrièmes moyens (21) de blocage qui coopèrent avec les troisièmes moyens (20) de blocage pour maintenir le chariot (16) dans une position donnée.5. Device (1) for supporting electronic chips according to claim 4 in which the slides (10) of the support (3) multi-chip comprise first means (11) of blocking and in which the bridge (17) comprises second means ( 22) of blocking which cooperate with the first blocking means (11) to maintain the bridge (17) in a given position and in which the slides (19) of the bridge (17) comprise third blocking means (20) and in which the carriage (16) comprises fourth blocking means (21) which cooperate with the third blocking means (20) to maintain the carriage (16) in a given position.
6. Dispositif (1) de support de puces électroniques selon l'une des revendications précédentes dans lequel le support (3) multipuces comporte un écran d'affichage pour afficher le module (7) électronique sélectionné. 6. Device (1) for supporting electronic chips according to one of the preceding claims, in which the multi-chip support (3) comprises a display screen for displaying the selected electronic module (7).
PCT/FR2002/002034 2001-07-25 2002-06-13 Multichip support package WO2003010713A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0109968A FR2827985B1 (en) 2001-07-25 2001-07-25 MULTI-CHIP SUPPORT HOUSING
FR01/09968 2001-07-25

Publications (1)

Publication Number Publication Date
WO2003010713A1 true WO2003010713A1 (en) 2003-02-06

Family

ID=8865913

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2002/002034 WO2003010713A1 (en) 2001-07-25 2002-06-13 Multichip support package

Country Status (2)

Country Link
FR (1) FR2827985B1 (en)
WO (1) WO2003010713A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1486911A1 (en) * 2003-06-12 2004-12-15 Axalto S.A. Dielectric separation between inputs/outputs of a smart card
WO2004111926A1 (en) * 2003-06-12 2004-12-23 Axalto Sa Dielectric separation between inputs/outputs of a smart card
GB2498628A (en) * 2011-12-21 2013-07-24 Ibm Multi-chip card
US8827158B2 (en) 2011-12-21 2014-09-09 International Business Machines Corporation Multi-chip card
US8866847B2 (en) 2010-09-14 2014-10-21 International Business Machines Corporation Providing augmented reality information

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2628867A1 (en) * 1988-03-15 1989-09-22 Sgs Thomson Microelectronics Integrated circuit card carrying integrated circuits - uses multiple small circuits set in rectangular track round which they can slide to be positioned under reader contacts
US5049728A (en) * 1990-04-04 1991-09-17 Rovin George H IC card system with removable IC modules
DE19737565A1 (en) * 1997-08-28 1999-03-04 Etr Elektronik Und Technologie Electronically read chip card

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2628867A1 (en) * 1988-03-15 1989-09-22 Sgs Thomson Microelectronics Integrated circuit card carrying integrated circuits - uses multiple small circuits set in rectangular track round which they can slide to be positioned under reader contacts
US5049728A (en) * 1990-04-04 1991-09-17 Rovin George H IC card system with removable IC modules
DE19737565A1 (en) * 1997-08-28 1999-03-04 Etr Elektronik Und Technologie Electronically read chip card

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1486911A1 (en) * 2003-06-12 2004-12-15 Axalto S.A. Dielectric separation between inputs/outputs of a smart card
WO2004111926A1 (en) * 2003-06-12 2004-12-23 Axalto Sa Dielectric separation between inputs/outputs of a smart card
US8866847B2 (en) 2010-09-14 2014-10-21 International Business Machines Corporation Providing augmented reality information
GB2498628A (en) * 2011-12-21 2013-07-24 Ibm Multi-chip card
US8827158B2 (en) 2011-12-21 2014-09-09 International Business Machines Corporation Multi-chip card
US8925816B2 (en) 2011-12-21 2015-01-06 International Business Machines Corporation Multi-chip card
GB2498628B (en) * 2011-12-21 2015-01-07 Ibm Multi-chip card

Also Published As

Publication number Publication date
FR2827985B1 (en) 2003-12-12
FR2827985A1 (en) 2003-01-31

Similar Documents

Publication Publication Date Title
EP0696010B2 (en) Portable interface for electronic chip card
US20070259567A1 (en) Multiple mode micro memory card connector
FR2687815A1 (en) APPARATUS FOR RECEIVING AND RETAINING A SMART CHIP CARD AND RADIO TELEPHONE INCORPORATING THIS APPARATUS.
WO1998012674A2 (en) Pocket value terminal
WO1999027505A1 (en) Method, card and terminals for carrying out transactions in a telecommunication network
FR2732136A1 (en) DUAL ELECTRONIC CARD AND MANUFACTURING METHOD THEREOF
EP2175565A1 (en) Protective enclosure for a portable electronic device
EP0262036B2 (en) Data processing system with memory cards having a plurality of electronic modules
EP0840247B1 (en) Radio modem equipped with a memory card reader
FR2627880A1 (en) Multi-function card which can be inserted in opposite senses - uses multiple integrated circuits in single card to implement different functions, selected by direction of card insertion
WO2003010713A1 (en) Multichip support package
FR2793575A1 (en) Card reader for miniature SIM cards comprises USB plug for computer with slot and contacts to receive miniature SIM card
JPH10291392A (en) Ic card
EP3326108B1 (en) Compact card reader
EP0329557B1 (en) Portable device for recording, interrogating and reading an ic and/or a magnetic recording card
FR2771199A1 (en) Portable smart card and its operating system
KR100771425B1 (en) Sim card mounting structure
EP2649777B1 (en) Electronic payment device
FR2948794A1 (en) Microcircuit card i.e. identification card, for use in mobile network, has two external contact interfaces defining two surfaces formed on body, so that surfaces coincide partially along vertical direction
BE1012424A4 (en) Safety data control device for memory card.
FR2826148A1 (en) Reader for smart card, uses two different insertion slots for SIM and payment cards, with one slot physically above the other, and a single set of contact fingers making contact with whichever card is accessible
WO1997031343A1 (en) Multiple account management system and method using same
EP2649698B1 (en) Power supply base for an electronic payment terminal
KR20050037902A (en) Smart card having flesh memory
KR100682728B1 (en) Mobile communication terminal having card containng device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG US UZ VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE CH CY DE DK FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ ML MR NE SN TD TG US

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP