WO2003008134A3 - Surface protection film - Google Patents

Surface protection film Download PDF

Info

Publication number
WO2003008134A3
WO2003008134A3 PCT/JP2002/007177 JP0207177W WO03008134A3 WO 2003008134 A3 WO2003008134 A3 WO 2003008134A3 JP 0207177 W JP0207177 W JP 0207177W WO 03008134 A3 WO03008134 A3 WO 03008134A3
Authority
WO
WIPO (PCT)
Prior art keywords
protection film
surface protection
adherend
peeling
electrostatic charge
Prior art date
Application number
PCT/JP2002/007177
Other languages
French (fr)
Other versions
WO2003008134A2 (en
Inventor
Atsushi Takei
Hisatsugu Tokunaga
Mikio Shimizu
Original Assignee
Denki Kagaku Kogyo Kk
Atsushi Takei
Hisatsugu Tokunaga
Mikio Shimizu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk, Atsushi Takei, Hisatsugu Tokunaga, Mikio Shimizu filed Critical Denki Kagaku Kogyo Kk
Priority to US10/483,270 priority Critical patent/US7084516B2/en
Priority to JP2003513728A priority patent/JP2004534904A/en
Priority to AU2002317508A priority patent/AU2002317508A1/en
Priority to EP02746065A priority patent/EP1409601A2/en
Priority to KR10-2004-7000744A priority patent/KR20040030811A/en
Publication of WO2003008134A2 publication Critical patent/WO2003008134A2/en
Publication of WO2003008134A3 publication Critical patent/WO2003008134A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09H—PREPARATION OF GLUE OR GELATINE
    • C09H9/00—Drying of glue or gelatine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C08L2666/36—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133502—Antiglare, refractive index matching layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/22—Antistatic materials or arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

A surface protection film which comprises a substrate layer and an adhesive layer, and of which the electrostatic charge by peeling from an adherend is from +0.01 to -0.01 nC/mm2.
PCT/JP2002/007177 2001-07-16 2002-07-15 Surface protection film WO2003008134A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/483,270 US7084516B2 (en) 2001-07-16 2002-07-15 Surface protection film
JP2003513728A JP2004534904A (en) 2001-07-16 2002-07-15 Surface protection film
AU2002317508A AU2002317508A1 (en) 2001-07-16 2002-07-15 Surface protection film
EP02746065A EP1409601A2 (en) 2001-07-16 2002-07-15 Surface protection film
KR10-2004-7000744A KR20040030811A (en) 2001-07-16 2002-07-15 Surface protection film

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001214969 2001-07-16
JP2001-214969 2001-07-16
JP2001214968 2001-07-16
JP2001-214968 2001-07-16
JP2002005867 2002-01-15
JP2002-5867 2002-01-15
JP2002-195465 2002-07-04
JP2002195465 2002-07-04

Publications (2)

Publication Number Publication Date
WO2003008134A2 WO2003008134A2 (en) 2003-01-30
WO2003008134A3 true WO2003008134A3 (en) 2003-10-30

Family

ID=27482435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007177 WO2003008134A2 (en) 2001-07-16 2002-07-15 Surface protection film

Country Status (8)

Country Link
US (1) US7084516B2 (en)
EP (1) EP1409601A2 (en)
JP (1) JP2004534904A (en)
KR (1) KR20040030811A (en)
CN (1) CN1527868A (en)
AU (1) AU2002317508A1 (en)
TW (1) TW574109B (en)
WO (1) WO2003008134A2 (en)

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JP4137551B2 (en) * 2002-08-09 2008-08-20 日東電工株式会社 Surface protective film for transparent conductive substrate and transparent conductive substrate with surface protective film
AU2003286937A1 (en) * 2002-12-12 2004-06-30 Denki Kagaku Kogyo Kabushiki Kaisha Surface protective film
TWI239893B (en) * 2004-02-20 2005-09-21 Optimax Tech Corp Method to improve film property
CN100392488C (en) * 2004-08-02 2008-06-04 日东电工株式会社 Method for manufacturing liquid crystal alignment film, liquid crystal alignment film, optical film and image viewing display
US8236400B2 (en) * 2004-09-17 2012-08-07 Hewlett-Packard Development Company, L.P. Adhesive cover systems for articles
CN101142274B (en) * 2005-03-14 2010-05-19 株式会社Adeka Antistatic composition
EP1703668A1 (en) 2005-03-18 2006-09-20 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO System for processing quality-of-service parameters in a communication network
US20070141289A1 (en) * 2005-12-19 2007-06-21 Physical Systems, Inc. Peel ply masking device for an adhesive bonded attachment
KR100838345B1 (en) * 2006-02-17 2008-06-13 에스케이씨하스디스플레이필름(유) Composition of Coating for Surface Protection and Protective Film Using Same
TW200829345A (en) * 2006-07-25 2008-07-16 Sustainable Titania Technology Inc Method for protecting substrate
JP5443992B2 (en) * 2006-11-07 2014-03-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Antistatic hot melt adhesive
JP5101111B2 (en) * 2007-01-05 2012-12-19 日東電工株式会社 Adhesive sheet for semiconductor substrate processing
KR100838461B1 (en) * 2007-01-24 2008-06-16 율촌화학 주식회사 Surface protective film
CN101657522B (en) * 2007-04-13 2014-05-07 3M创新有限公司 Antistatic optically clear pressure sensitive adhesive
US9296924B2 (en) * 2008-07-01 2016-03-29 Firestone Building Products Company, Llc Static dissipative release liner
JP5143671B2 (en) * 2008-08-27 2013-02-13 電気化学工業株式会社 Protective sheet
CN102152572A (en) * 2010-12-13 2011-08-17 苏州金海薄膜科技发展有限公司 Scratch-resistant color screen protective film and manufacturing method thereof
CN102152574A (en) * 2010-12-13 2011-08-17 苏州金海薄膜科技发展有限公司 Flavor screen protective film and manufacturing method thereof
CN102152569A (en) * 2010-12-13 2011-08-17 苏州金海薄膜科技发展有限公司 Common anti-scratch protective membrane and manufacturing method thereof
JP5749076B2 (en) * 2011-05-19 2015-07-15 藤森工業株式会社 Surface protective film and optical component to which it is attached
CN102320174A (en) * 2011-08-16 2012-01-18 苏州金海薄膜科技发展有限公司 Superbright high-definition protective film with self luminescence under sunlight or ultraviolet light and manufacturing method thereof
CN102423951A (en) * 2011-10-20 2012-04-25 番禺南沙殷田化工有限公司 Method for attaching protective film to fine-pitch film circuit
KR101355020B1 (en) * 2012-02-10 2014-01-27 에스케이씨하스디스플레이필름(유) Glass scattering preventing film for thin-film display protection
JP6049474B2 (en) * 2013-01-25 2016-12-21 株式会社ニトムズ Sebum-absorbing diffusion film
JP5853001B2 (en) * 2013-08-13 2016-02-09 藤森工業株式会社 Surface protective film and optical component on which it is bonded
JP6327703B2 (en) * 2014-05-20 2018-05-23 日東電工株式会社 Surface protection film
JP6327704B2 (en) * 2014-05-20 2018-05-23 日東電工株式会社 Method for producing surface protective film
TWI735411B (en) * 2014-06-18 2021-08-11 日商味之素股份有限公司 Adhesive sheet with protective film
KR101675051B1 (en) * 2014-12-19 2016-11-10 율촌화학 주식회사 Adhesive tape for protecting surface of cover glass for direct bonding and method for direct bonding of cover glass using the same
JP6313720B2 (en) * 2015-03-25 2018-04-18 藤森工業株式会社 Antistatic surface protection film
JP6226904B2 (en) * 2015-03-26 2017-11-08 藤森工業株式会社 Surface protective film and optical component to which it is attached
JP6428432B2 (en) * 2015-03-27 2018-11-28 味の素株式会社 Sealing sheet, production method and evaluation method thereof
WO2017061066A1 (en) * 2015-10-05 2017-04-13 ソニー株式会社 Residual quantity measuring device, battery pack, electric power tool, electric-type aircraft, electric vehicle and power supply
US10353283B2 (en) * 2016-07-11 2019-07-16 Shin-Etsu Chemical Co., Ltd. Adhesive for pellicle, pellicle, and method of selecting adhesive for pellicle
JP6483764B2 (en) * 2017-07-21 2019-03-13 藤森工業株式会社 Surface protection film
CN111016313A (en) * 2019-11-07 2020-04-17 广东中晨电子科技有限公司 Film protection film

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Also Published As

Publication number Publication date
TW574109B (en) 2004-02-01
US7084516B2 (en) 2006-08-01
CN1527868A (en) 2004-09-08
KR20040030811A (en) 2004-04-09
EP1409601A2 (en) 2004-04-21
US20040169290A1 (en) 2004-09-02
WO2003008134A2 (en) 2003-01-30
AU2002317508A1 (en) 2003-03-03
JP2004534904A (en) 2004-11-18

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