WO2002101674A2

WO2002101674A2 - Portable data support with a number of different heights at functional elements

Info

Publication number: WO2002101674A2
Application number: PCT/DE2002/002049
Authority: WO
Inventors: Boris Mayerhofer; Jochen Mueller
Original assignee: Infineon Technologies Ag
Priority date: 2001-06-13
Filing date: 2002-06-05
Publication date: 2002-12-19
Also published as: DE10128579A1; DE10128579B4; WO2002101674A3

Abstract

The invention relates to a portable data support, with at least two electrical functional elements (20a, 20b, 20c) arranged in a support body (10), each comprising at least one contact element (21, 21a, 21b), whereby said functional elements (20a, 20b, 20c) are electrically connected to each other by means of said contact elements (21, 21a, 21b)and a conducting structure (31, 32). According to the invention, an intermediate layer (30, 40) is provided within the support body, the upper (34) and lower surfaces (35) of which comprise conducting structures (31, 32) and define various card body planes. At least two of the electrical functional elements (20a, 20b, 20c) are placed, with the underside thereof which faces the interior of the support body, in various card body planes. The compensation of the level for functional elements (20a, 20b, 20c) of various thicknesses thus occurs as a result of the construction of the portable data support, such that a level surface (12) of the data support is possible.

Description

description

Portable data carrier with a number of functional elements of different heights

The invention relates to a portable data carrier in which at least two electrical functional elements are inserted in a carrier body, each of which has at least one contact element. The functional elements are electrically connected to one another via these contact elements and via a conductor structure.

Portable media, such as B. chip cards or cash cards, will combine an ever increasing number of functions in the future. Different electrical components are arranged on or in a carrier body of the data carrier. In particular, controller chips, electrical display devices (display), input devices (eg keyboard) or the like come into consideration as electrical components. In many cases, these electrical components are already available as housed functional elements that only have to be arranged on the data carrier and electrically connected to one another. As a rule, the functional elements have a different overall height or thickness. This complicates the assembly of the functional elements in the carrier body if some functional elements of different thicknesses are to be accessible from the surface. The result would be that the functional elements are partially flush with the surface of the carrier body and partially located below or above the surface, which would result in an undesirable, stepped surface.

The functional elements, which must be integrated into a carrier body, are therefore adapted in terms of their overall height or thickness. The yardstick for the height to be achieved is the thickest functional element. The thinner functional elements u> ü co t M ¹

LΠ O LΠ o U1 o LΠ

This object is achieved with the features of claim 1. Advantageous configurations result from the dependent claims.

The data carrier according to the invention has at least two electrical functional elements which are inserted into a carrier body. Each of these electrical functional elements has at least one contact element. The functional elements are electrically connected to one another via these contact elements and via a conductor structure. The data carrier according to the invention also has an intermediate layer in the interior of the carrier body, the top and bottom of which form different card body levels. At least two of the electrical functional elements are located in these different card body planes with their undersides facing the inside of the carrier body. The electrical connection of the functional elements is ensured via the conductor structure, which is formed on or in the intermediate layer.

The data carrier designed according to the invention thus enables the use of conventionally constructed functional units. The necessary level compensation between functional elements of different heights is made possible by the intermediate layer that supports the conductor structure.

The top of the intermediate layer is in contact with the thinner of the functional elements. The underside of the thicker functional element lies in one plane with the underside of the intermediate layer. Preferably, the

Intermediate carrier at least one recess into which a functional element or several functional elements can be inserted.

If the functional elements are approximately flush with the upper side of the carrier body, as is provided in one embodiment of the invention, then this corresponds to Thickness of the intermediate carrier approximately the difference in the thickness of the two functional elements.

A particularly simple electrical contacting of the functional elements with the conductor structure is made possible in that a conductor structure is applied to the top and the bottom of the intermediate layer, which are electrically connected to one another via a via. The contact elements of each functional element are preferably attached to the underside of the functional element, since a contact can then already be produced when the functional elements are inserted into the carrier body. A fixed electrical and mechanical connection can e.g. realized by a solder connection or by gluing with conductive adhesives (ACF, ACP, silver conductive glue, ...). According to an advantageous embodiment of the invention, the functional element inserted into the recess of the intermediate carrier is contacted with conductor structures projecting into the recess on the underside of the intermediate layer.

The data carrier according to the invention is thus distinguished by a particularly simple structure. An intermediate layer is inserted into the carrier body, which has already been provided with conductor structures on its upper and lower sides in a previous method step. The electrical connection between these conductor structures is ensured by one or more vias. The conductor structures located on the underside of the intermediate carrier are made accessible for contacting by providing recesses in the intermediate layer at corresponding locations, which at least partially expose the conductor structure. The electrical contact is established simply by inserting a functional element into the intermediate layer.

The additional contacting of a third or further functional element with a different thickness is ß. ß ti ß.

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FIG. 1 shows a cross section of a first exemplary embodiment of the data carrier according to the invention,

FIG. 2 shows a second exemplary embodiment of the data carrier according to the invention in cross section,

Figure 3 shows a detail in which the electrical connection of conductor structures of different intermediate layers is shown.

A first exemplary embodiment of the portable data carrier according to the invention is shown in cross section in FIG. The data carrier has a carrier body 10. On its top 12, two electrical functional elements 20a, 20b are inserted into the carrier body, for example. The functional elements 20a, 20b are approximately flush with the upper side 12 of the carrier body 10. As can be clearly seen from FIG. 1, the electrical functional elements 20a, 20b are inserted into recesses 11a, 11b of the carrier body 10, which are adapted to the dimensions of the functional elements 20a, 20b. The functional element 20b has a greater overall height than the functional element 20a.

By means of the invention, a possibility is proposed to easily compensate for the difference in height between two functional elements. For this purpose, an intermediate layer 30 is provided in the interior of the carrier body 10, which has a thickness D. In the present example, the thickness D results from the difference between the respective overall height of the electrical functional element 20b and the functional element 20a.

Of course it is not absolutely necessary that both

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K Ti ε ß P ε 41 Di 41 rö Φ 4-JP> P 35 CQ 0 Φ 01 _^ -μ ß CQ -. φ CQ Φ φ

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-H rö ß Φ Ti 44 CQ PQ 44 φ 4P φ o rö Ti Φ ß N rö CQ 41 ro Φ 01 rö φ φ Φ 03

Φ N = 0 -μ -μ ß rH 5 rö X SH CM Φ ß ti Φ PQ ß SH φ -. \ ι -μ = rö X -μ Oi hl rö

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CQ Φ O Φ Φ 41 rH X υ rö 01 Φ rH CQ Φ> ß SH Φ Ti ß 44 4-J -μ 01 φ -μ -μ Φ

SH 44 rH 25 CQ u rö -H ß -μ Oi Ti r- \ • -μ φ T3 Φ CQ ß P X X φ 35 = rö CQ 41 Φ P

Φ CQ ε Φ Φ 5H 41 41 Φ -μ Φ ra φ 44 Φ 44 ε Φ Ti -μ rö Φ P rö 41 IM SH -μ U EH P

Oi ε -H CQ 4-J T5 P ti ü r-A 41 N n • μ N CQ SH • μ tsi Tj Ti 41 Ti SH 4-J U 44 φ CQ rö

= rö P ß P Ti φ -μ 01 ß 41 44 fi Φ SH CM ß CJ fi 44 ß CQ fi ^ 35 fi • r-t

SH -. 0 rö fi 4-J r-i CQ SH CM P U Φ 0 -μ CD Φ P φ CQ CQ Φ P CQ O -μ φ Φ CQ φ 4-> ti

44 ß ß -H 43 Φ Q 44 44 P Φ Ti CQ CQ -μ D φ 43 SH Φ Φ 5H 5H X SH SH 41 i 41 01 Φ

4-J CQ SH ß MH rö ß Φ CQ ε SH n ιμ 44 ß ß rö rA 4-J υ 4H rA rH 44 44 Φ -μ SH Φ -μ -μ SH -μ UH rö = P Φ PP 4-J • μ rA Φ P rö -μ 5H ß -μ P Φ Φ CQ -μ -μ Φ φ CQ ß 43 φ P r- Φ ä 0 SH CM

P ε fr rö S 43 £ tsi P fr Φ P Φ fr ti 5 • μ P P 35 3 -μ ra O l R Φ 35 N> N Φ ro

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LIST OF REFERENCE NUMBERS

10 carrier bodies

11 recess

12 top

D thickness of the intermediate layer

Dl thickness of the intermediate layer D2 thickness of the intermediate layer

20 Electrical functional element 21 Contact element 22 underside

30 intermediate layer

31 conductor structure 32 conductor structure

33 plated-through holes

34 top

35 bottom

36 recess

40 intermediate layer

41 ladder structure

42 conductor structure 43 plated-through hole

44 top

45 underside 46 recess

Claims

claims

1. Portable disk, at. in which at least two electrical functional elements (20a, 20b, 20c) are inserted into a carrier body (10), each of which has at least one contact element (21a, 21b, 21c) and wherein the functional elements (20a, 20b, 20c) via these contact elements and via a conductor structure (31, 32, 41, 42) is electrically connected to one another, characterized in that at least two of the electrical functional elements (20a, 20b, 20c) with their undersides (22a, 22b, 22c) facing the carrier body are located in different card body levels, an intermediate layer (30) is provided in the interior of the carrier body (10), the upper and lower sides (34, 35) of which form the different card body planes, and the intermediate layer (30) the conductor structure (31, 32, 41, 42) for connecting the has electrical functional elements.

2. Data carrier according to claim 1, so that the intermediate layer (30) has at least one recess (36) into which one or more functional elements (20a, 20b, 20c) is or are inserted.

3. Data carrier according to claim 1 or 2, so that a conductor structure (31, 32) is applied to the top (34) and the bottom (35) of the intermediate layer, which are electrically connected to one another via a via (33).

4. Data carrier according to one of claims 1 to 3, characterized in that the conductor structure (32) on the underside (35) of the intermediate layer (30) protrudes into the recess (36).

5. Data carrier according to one of claims 1 to 4, d a d u r c h g e k e n n z e i c h n e t that in the carrier body (10) at least one further intermediate layer (40) is provided, the top and bottom (44, 45) define card body planes.

6. Data carrier according to claim 5, characterized in that the intermediate layer (30) and the further intermediate layer (40) are arranged one above the other, so that the underside (35) of the intermediate layer (30) and the upper side (44) of the further intermediate layer (40) Define one of the card body planes, the further intermediate layer (40) on the upper side (44) and the lower side (45) each having a conductor structure (41, 42) which are electrically connected to one another via a plated-through hole (43).

7. A data carrier according to claim 6, dadurchgeke nn characterized in that the conductor structure (41) on the top (44) of the further intermediate layer (40) and the conductor structure (32) on the underside (35) of the intermediate layer (30) in electrically conductive contact stand.

8. Data carrier according to one of claims 1 to 7, characterized in that the conductor structure (31, 32; 41, 42) in the top and bottom (34, 35; 44, 45) of the intermediate layer or further intermediate layer (40) is embedded so that a flat surface is created.

9. Data carrier according to one of claims 1 to 8, characterized in that the functional elements (20a, 20b, 20c) are approximately flush with the top of the carrier body.

10. Data carrier according to claim 9, so that the intermediate carrier (30) or the further intermediate carrier (40) has a thickness (D, D1; D2) which corresponds to the difference in the thickness of two functional elements (20a, 20b, 20c).