WO2002099848A3 - Formation of printed circuit board structures using piezo microdeposition - Google Patents

Formation of printed circuit board structures using piezo microdeposition Download PDF

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Publication number
WO2002099848A3
WO2002099848A3 PCT/US2002/017369 US0217369W WO02099848A3 WO 2002099848 A3 WO2002099848 A3 WO 2002099848A3 US 0217369 W US0217369 W US 0217369W WO 02099848 A3 WO02099848 A3 WO 02099848A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
board substrate
surface layer
formation
Prior art date
Application number
PCT/US2002/017369
Other languages
French (fr)
Other versions
WO2002099848A2 (en
Inventor
Charles O Edwards
David Albertalli
Original Assignee
Litrex Corp
Charles O Edwards
David Albertalli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litrex Corp, Charles O Edwards, David Albertalli filed Critical Litrex Corp
Priority to KR10-2003-7015752A priority Critical patent/KR20040024558A/en
Priority to US10/479,314 priority patent/US20040173144A1/en
Priority to EP02752021A priority patent/EP1399950A4/en
Priority to JP2003502863A priority patent/JP2004533121A/en
Priority to AU2002346735A priority patent/AU2002346735A1/en
Publication of WO2002099848A2 publication Critical patent/WO2002099848A2/en
Publication of WO2002099848A3 publication Critical patent/WO2002099848A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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    • B41J2/04558—Control methods or devices therefor, e.g. driver circuits, control circuits detecting presence or properties of a dot on paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0456—Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04573—Timing; Delays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
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    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04575—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of acoustic type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/01—Ink jet
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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    • B41J2/01—Ink jet
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J3/54—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements
    • B41J3/543—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements with multiple inkjet print heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • Optical Filters (AREA)
  • Air Bags (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Telephone Function (AREA)
  • Gripping On Spindles (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Ink Jet (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Networks Using Active Elements (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Radiation-Therapy Devices (AREA)

Abstract

A method for manufacturing structure on a printed circuit board substrate according to the invention includes positioning a printed circuit board substrate (38) in a machine (10) capable of performing piezoelectric deposition of a fluid manufacturing material. The printed circuit board substrate (38) is aligned with a piezoelectric deposition head (16) of the machine (10). Computer numeric control of the relative motion of the printed circuit board substrate (38) and the piezoelectric deposition head (16) allows droplets of the fluid manufacturing material to be deposited at selected locations of the printed circuit board substrate (38). The printed circuit board substrate (38) includes a conductive surface layer and a masking structure that exposes selected portions of the surface layer, thereby forming traces upon removal of selected portions of the surface layer. Further, the structure manufactured on the printed circuit board may be a resistor.
PCT/US2002/017369 2001-06-01 2002-05-31 Formation of printed circuit board structures using piezo microdeposition WO2002099848A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR10-2003-7015752A KR20040024558A (en) 2001-06-01 2002-05-31 Formation of printed circuit board structures using piezo microdeposition
US10/479,314 US20040173144A1 (en) 2002-05-31 2002-05-31 Formation of printed circuit board structures using piezo microdeposition
EP02752021A EP1399950A4 (en) 2001-06-01 2002-05-31 Formation of printed circuit board structures using piezo microdeposition
JP2003502863A JP2004533121A (en) 2001-06-01 2002-05-31 Formation of printed circuit board structure using piezoelectric microdeposition
AU2002346735A AU2002346735A1 (en) 2001-06-01 2002-05-31 Formation of printed circuit board structures using piezo microdeposition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29511801P 2001-06-01 2001-06-01
US29510001P 2001-06-01 2001-06-01
US60/295,100 2001-06-01
US60/295,118 2001-06-01

Publications (2)

Publication Number Publication Date
WO2002099848A2 WO2002099848A2 (en) 2002-12-12
WO2002099848A3 true WO2002099848A3 (en) 2003-07-24

Family

ID=26968921

Family Applications (8)

Application Number Title Priority Date Filing Date
PCT/US2002/017522 WO2002099851A2 (en) 2001-06-01 2002-05-31 Temperature controlled vacuum chuck
PCT/US2002/017521 WO2002098575A1 (en) 2001-06-01 2002-05-31 Over-clocking in a microdeposition control system to improve resolution
PCT/US2002/017369 WO2002099848A2 (en) 2001-06-01 2002-05-31 Formation of printed circuit board structures using piezo microdeposition
PCT/US2002/017519 WO2002098574A1 (en) 2001-06-01 2002-05-31 Microdeposition apparatus
PCT/US2002/017370 WO2002099849A2 (en) 2001-06-01 2002-05-31 Apparatus for microdeposition of multiple fluid materials
PCT/US2002/017375 WO2002098573A1 (en) 2001-06-01 2002-05-31 Waveform generator for microdeposition control system
PCT/US2002/017373 WO2002099850A2 (en) 2001-06-01 2002-05-31 Interchangeable microdeposition head apparatus and method
PCT/US2002/017523 WO2002098576A1 (en) 2001-06-01 2002-05-31 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/US2002/017522 WO2002099851A2 (en) 2001-06-01 2002-05-31 Temperature controlled vacuum chuck
PCT/US2002/017521 WO2002098575A1 (en) 2001-06-01 2002-05-31 Over-clocking in a microdeposition control system to improve resolution

Family Applications After (5)

Application Number Title Priority Date Filing Date
PCT/US2002/017519 WO2002098574A1 (en) 2001-06-01 2002-05-31 Microdeposition apparatus
PCT/US2002/017370 WO2002099849A2 (en) 2001-06-01 2002-05-31 Apparatus for microdeposition of multiple fluid materials
PCT/US2002/017375 WO2002098573A1 (en) 2001-06-01 2002-05-31 Waveform generator for microdeposition control system
PCT/US2002/017373 WO2002099850A2 (en) 2001-06-01 2002-05-31 Interchangeable microdeposition head apparatus and method
PCT/US2002/017523 WO2002098576A1 (en) 2001-06-01 2002-05-31 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like

Country Status (9)

Country Link
US (1) US7270712B2 (en)
EP (7) EP1399269B1 (en)
JP (9) JP4342303B2 (en)
KR (8) KR20040026659A (en)
CN (7) CN1289207C (en)
AT (3) ATE486663T1 (en)
AU (4) AU2002346735A1 (en)
DE (3) DE60238189D1 (en)
WO (8) WO2002099851A2 (en)

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