WO2002081783A1 - Workpiece wet processing - Google Patents
Workpiece wet processing Download PDFInfo
- Publication number
- WO2002081783A1 WO2002081783A1 PCT/IB2002/000779 IB0200779W WO02081783A1 WO 2002081783 A1 WO2002081783 A1 WO 2002081783A1 IB 0200779 W IB0200779 W IB 0200779W WO 02081783 A1 WO02081783 A1 WO 02081783A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- fingers
- underside
- sealing bead
- periphery
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Definitions
- the present invention relates generally to workpiece wet processing, such as electrodeposition, electro-etching, and electroless deposition and the like; being particularly, though not exclusively, concerned with electrodeposition onto substantially planar think workpieces, such as silicon wafers and the like, and in a manner suitable for high-volume manufacturing.
- the invention is directed to apparatus for reproducibly making a fluid seal to the outer perimeter of a face of such a workpiece, and in a manner conducive for simultaneously making uniform electrical contact along the workpiece perimeter.
- Electroplating and electroless plating are two major forms of wet chemistry deposition that are used in manufacturing for the application of copper, gold, lead-tin, indium-tin, nickel-iron, nickel and other types of metals or alloys of metals to workpiece surfaces such as semiconductor wafers, printed circuit board substrates, thin-film heads, and flat panel displays and the like, requiring high precision wet chemistry-based deposition.
- workpiece surfaces such as semiconductor wafers, printed circuit board substrates, thin-film heads, and flat panel displays and the like, requiring high precision wet chemistry-based deposition.
- An important requirement of machines used for producing thin deposited films on such workpieces is that they be capable of prohibiting contamination of the backside and edge of the workpiece with process solution or deposited metal.
- the most common and challenging of these deposition processes is electrodeposition, and, accordingly, the present discussion will center around such electrodeposition as an example, although the invention, as will later be made evident, may equally be used' advantageously for electroless deposition, as well.
- the present invention provides a novel integrated seal having elastomer molded directly to the electrical contacts in a shape suitable for admirably achieving a reliable seal while compliantly supporting electrical contacts within such narrow peripheral regions.
- An additional object is to provide such a novel sealed electrical contact that is robust and can withstand many thousand workpiece electrodeposition cycles, and even in a high temperature process solution, such as electroless nickel at 93 degrees Centigrade - all without attention, repair or maintenance.
- the invention embraces a method of fluid sealing while electrically contacting the face of a workpiece at its perimeter for wet-processing, that comprises, providing an elastomer-covered ring inwardly terminating in an upwardly projecting peripheral elastomeric sealing bead and covering an assembly of inwardly extending flexible fingers each having an upwardly projecting terminal electrical contact and upon the elastomer-covered inner ends of which fingers the perimeter of the underside of the workpiece is to engage along the sealing bead during the wet processing of the workpiece; resting the underside of the workpiece within the ring and forcing the underside periphery of the workpiece against the sealing bead and the inner ends of the elastomer-covered finger assembly, with said inner ends flexibly deflecting downwardly and resiliently creating a fluid seal around the workpiece- underside periphery at the sealing bead; providing a ring of peripheral openings in the elastomeric covering of the fingers inward of the sealing be
- the invention includes a plurality of narrow flexible fingers that form an assembly and are embedded in the elastomeric material; for example, 360 fingers may be used to seal and contact the perimeter of a 200 millimenter wafer.
- a small region of each flexible finger, the contact tip surface may be exposed through the surface of the elastomer, with this small contact region preferably coated with a film of gold, platinum, palladium, or other low-resistence electrical contact metal.
- a sealing bead is defined in said elastomer during the molding over the flexible finger assembly, with such sealing bead positioned adjacent to the contact region, toward the workpiece center — preferably, in practice, less than 0.021" away from the contact region, as later more fully explained.
- force is applied between the backside of the workpiece and the flexible finger assembly so that the elastomeric sealing bead is compressed against the workpiece surface to create a temporary fluid seal, and the flexible contact tips are pressed against the workpiece surface to create a plurality of low resistance electrical contacts that form a virtually continuous path of current entry around the workpiece perimeter region.
- the flexible fingers deform, they each slide a small amount radially along the workpiece surface which serves beneficially to break up any oxides or contamination on the workpiece surface and enables a very low contact resistance temporary connection to be achieved between the flexible fingers and the workpiece surface.
- Figure 1 is an isometric view of an illustrative sealing contact ring assembly and a workpiece
- Figure 2 is an isometric view of a cross section, upon an enlarged scale, of a sealed contact ring of the invention, showing the contact tips and the surrounding elastomeric sealing material;
- Figure 3 is a cross section, again on an enlarged scale, of the sealed contact ring
- Figure 4 shows an isometric view of the contact metal assembly portion
- Figure 5 illustrates a close-up isometric view of the contact tip region
- Figures 6 A, 6B and 6C show cross sections of the novel sealing and contacting action of the invention in successive positions of sealing and contact operations
- Figures 7A and B illustrate cross sections of prior art sealing and contacting action, contrasting from the operation of the invention as depicted in Figures . 6 A, B and C.
- the invention as applied to the before-mentioned illustrative and important field of electrodeposition of circular wafers and the like, comprises a sealing ring assembly 10 primarily comprised of a flexure assembly 12 that is molded into a sealing element 14.
- the sealing ring assembly 10 is configured completely to surround the wafer workpiece 20.
- both the workpiece 20 and the sealing ring assembly 10 will be of circular or rectangular shape.
- a useful application of the invention is for processing semiconductor wafers, which are circular. That circular shape is illustratively shown in the drawings; it being noted, however, as before explained, that the invention is also applicable to rectangular workpieces such as printed circuit boards, package substrate panels, or flat panel displays or the like.
- connection rods 15 are shown attached to the flexure assembly 12, providing a path through which electrical current, schematically illustrated by the flow line i at 17, can flow into the core ring in applications requiring electrical contact to the workpiece during the compliant fluid sealing of the workpiece.
- the connection rods 15 may also be used to apply upward mechanical force to the sealing ring 10, indicated by the heavy arrow F at 19.
- the flexure assembly 12 is advantageously constructed from two elements; a thin flexible flexure plate 30, and a thick and stiff support plate 32 therebelow.
- the flexure plate 30, for example, is preferably titanium or stainless steel between 0.010" and 0.030" thick.
- the support plate 32 is also preferably of titanium or stainless steel, but thicker, as between 0.1" and 0.25" thick.
- the support plate 32 may be positioned on the side of the flexure plate 30 facing the workpiece 20, as shown in the figures, or it may be positioned on the opposite side the flexure plate 30 from the workpiece 20. Suitable means, such as bolting, peening, or welding may be used for attaching the flexure plate 30 to the support plate 32 prior to molding the encasement 14 over the entire contact finger assembly.
- An upper backing plate 21, Figure 3 enables the mechanical force F at 19 to be downwardly directed between the underside periphery of the workpiece 20 and the sealing ring 10 upon which the peripheral underside annular region 24 of the workpiece 20 rests. Details of the novel action resulting from the application of such mechanical force 19 between the underside workpiece perimeter 24 and the sealing ring 10 will later be discussed with particular reference to Figures 6 A-C.
- the plate 32 supporting the contact plate 30 is encased in a preferably elastomer molding 14, such as a fluorelastomer (for example, "Niton” manufactured by Dupont Corporation).
- a fluorelastomer for example, "Niton” manufactured by Dupont Corporation.
- the inner (right-hand) peripheral region of the contact plate 30 is formed, commencing at region 38, with a plurality of radially extending flexure fingers 36 of reduced thickness (or recessed) at 40, each terminally carrying raised contact tips 26, shown as of circular quadrant shape in Figure 5.
- the fingers 36 have gaps 34 therebetween, and their reduced thickness portions 40 serve as flexible thin beam sections, flexurally bendible from the main contact plate 30 at their bases at 38, as supported therebelow by the support plate 32, Figure 2.
- the flexure of the fingers 36 will cause correspondingly deflecting of the terminal contact tips 26, with a supporting ledge 44 extending therebeyond.
- circumferentially formed openings 25 may be preserved in the regions where the circumferentially positioned projecting electrical contact tips 26, Figure 2, are provided in the peripheral fingers 36 of the pressure plate 30, and are to be exposed for applications requiring electrical contact to the workpiece, as later more fully explained.
- Several important shapes are molded into the sealing element 14 such that their position and size with respect to the flexure assembly 12 is precisely controlled.
- An upwardly projecting peripheral sealing boss or bead 28, Figure 2 is positioned adjacent to and outside the contact tips 26.
- a recess 29 in the molding is positioned inward of the contact tips for a purpose later explained. In applications not requiring electrical contact to the workpiece, however, the contact tip 26 and formed openings 25 may be omitted.
- Figure 6A shows a workpiece 20 resting within and making initial contact to the sealing ring 10, the workpiece underside perimeter 24 touching said ring at the upper surface of the sealing bead 28.
- the sealing ring 10 will be considered fixed in space and the upper backing disk 21 will be forcibly pushed against said ring.
- the invention may equally well be used in a manner where the backing disk 21 is held fixed and the sealing ring 10 is forcibly moved toward the backing disk; or some combination of these two movements may be used.
- the elastomer 14 may be soft, enough sealing force 50 can be applied to the elastomer 14 to ensure that it fully distorts and fills microscopic valleys on the workpiece perimeter 24 through which fluid would otherwise leak. If the sealing bead 28 had not been so locally supported and it were made from soft elastic material, it would simply bend away from the workpiece surface and not incur the microscopic deformations required for a dependable fluid seal and attainable in accordance with the construction of the invention.
- the novel action of the structure of the invention for making a sealed resilient electrical contact to the workpiece may be understood in the showing of the exaggerated downward deflection of the fingers of the sealing ring 10.
- the applied force 19(F) is increased to Fi plus F 2> causing the workpiece 20 to move into the sealing ring 10 until the deflection 62 of the flexure fingers 36 causes a reaction force Fc at 51 that, in combination with the elastomer deformation force 50 (Fs), is equal to the applied force F at 19.
- the deflection 62 is primarily a rotation around the root 38 of the flexure finger 36 and may be considered as the resilient deflection of a cantilever beam fixed at its base.
- the depth of the recess or thinned finger region 40 may be adjusted to provide an optimum flexure force 51 for a given deflection 62. A useful depth in practice is 0.01".
- the before-mentioned recess 29 in the molded encasement adjacent to the contact surface 26 insures that, as the flexure finger 36 deflects at 62, the workpiece edge 23 does not contact the sealing element 14 and does not lift the workpiece 20 off of the metal contact surface 26.
- This rotational deflection 62 may be considered to have a horizontal component 64 and a vertical component 66.
- the horizontal component of motion 64 is small, less than 0.001" in practice, it is large on the microscopic scale of surface atoms, and fortuitously causes a scraping or cleaning wiping action at the interface 68 between the contact finger tip 26 and the workpiece surface 22.
- This scraping action improves the conductivity of the electrical contact by causing a large shearing force (on a microscopic scale) at the surface 22, thereby breaking apart any dirt or oxides that may be present on either the workpiece surface 22 or the contact finger tip surface 26.
- a large shearing force on a microscopic scale
- the vertical motion 66 may be different for each flexure finger 36 since each flexure finger 36 may move independently and thereby accommodate for deviations from planarity in both the workpiece surface 22 and the average position of all contact surfaces 26.
- the support plate 32 and flexure plate 30, moreover, are fabricated in a manner that positions all contact surfaces 26 substantially within a single plane.
- the applied force 19 is set to a level where the smallest deflection 62 among all flexure fingers 36 is well above the minimum required to establish a low resistance electrical contact.
- the capability of the flexure fingers 36 to adjust themselves to a non-flat workpiece surface 22 is also important for ensuring that the sealing bead 28 is compressed against the workpiece surface 22 around the entire workpiece perimeter 24 so that leakage does not occur when non-flat workpieces, are involved .
- Figures 7 A and 7B are presented to illustrate the prior art uses of a rigid contact ring 101 and a resilient sealing ring 102 that are assembled together.
- Figure 7 A shows the workpiece 120 just contacting the resilient sealing ring 102 at a sealing surface 112, such that the applied force 119 is zero.
- a distinct improvement of the present invention over such prior art can be seen in the precision and repeatability of the relative positioning between the sealing surface 28 and the contact surface 26 by the intimate mating that results from the flexure finger assembly 12 of the invention being molded into the sealing element elastomer 14.
- FIG. 7B shows how, as the applied force 119 is increased in the prior art, and the workpiece 120 is moved toward the contact ring 101 until the workpiece surface 123 contacts the ring surface 111, an electrical contact 130 is formed, causing a reaction force 132. Because the contact ring 101 is continuous rather than a plurality of flexure fingers, however, it can not deflect a significant distance unless the applied force 119 is very large, which would, of course, risk damage to the workpiece 120. The lack of horizontal movement at the contact interface 130 in such prior art operation, moreover, causes disadvantageous ⁇ higher electrical contact resistance than the present invention.
- Figure 7B shows the movement 134 of the resilient sealing ring 102 that creates a reaction force 136 due to deflection of said ring 102 to cause a fluid seal at the interface 112 between the resilient sealing ring 102 and the workpiece surface 123.
- a further disadvantage of this prior art operation is that if the material for the sealing ring 102 were made elastic enough to fill the microscopic valleys that are likely to occur in both the workpiece surface 123 and the sealing surface 112 at the sealing interface 140, it would not be sufficiently stiff to apply a deformation reaction force 134 large enough to cause the deformation on a microscale at the interface 140; hence, the sealing interface 140 is likely to allow fluid leakage.
- the sealing surface 28 is comprised of a soft elastomer 14 and it is forced against the workpiece surface 23 by a deformation reaction force 50 that results primarily from compression of the elastomer 14 across a short distance.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7013050A KR20040019286A (en) | 2001-04-05 | 2002-03-15 | Workpiece wet processing |
JP2002579542A JP3955532B2 (en) | 2001-04-05 | 2002-03-15 | Wet processing of workpieces |
EP02703809.0A EP1412561B1 (en) | 2001-04-05 | 2002-03-15 | Workpiece wet processing |
HK04110152.9A HK1067157A1 (en) | 2001-04-05 | 2004-12-22 | Workpiece wet processing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/827,084 | 2001-04-05 | ||
US09/827,084 US6540899B2 (en) | 2001-04-05 | 2001-04-05 | Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002081783A1 true WO2002081783A1 (en) | 2002-10-17 |
Family
ID=25248275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2002/000779 WO2002081783A1 (en) | 2001-04-05 | 2002-03-15 | Workpiece wet processing |
Country Status (7)
Country | Link |
---|---|
US (1) | US6540899B2 (en) |
EP (1) | EP1412561B1 (en) |
JP (1) | JP3955532B2 (en) |
KR (1) | KR20040019286A (en) |
CN (1) | CN100415943C (en) |
HK (1) | HK1067157A1 (en) |
WO (1) | WO2002081783A1 (en) |
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US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
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US9455139B2 (en) | 2009-06-17 | 2016-09-27 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
US9677188B2 (en) | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
US8962085B2 (en) | 2009-06-17 | 2015-02-24 | Novellus Systems, Inc. | Wetting pretreatment for enhanced damascene metal filling |
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US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
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US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
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US9435049B2 (en) | 2013-11-20 | 2016-09-06 | Lam Research Corporation | Alkaline pretreatment for electroplating |
JP6315092B2 (en) * | 2014-06-26 | 2018-04-25 | 株式会社村田製作所 | Plating jig |
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US9481942B2 (en) | 2015-02-03 | 2016-11-01 | Lam Research Corporation | Geometry and process optimization for ultra-high RPM plating |
US9617648B2 (en) | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
US10053793B2 (en) | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
US10113245B2 (en) * | 2016-03-24 | 2018-10-30 | Applied Materials, Inc. | Electroplating contact ring with radially offset contact fingers |
US11274377B2 (en) * | 2018-04-20 | 2022-03-15 | Applied Materials, Inc. | Seal apparatus for an electroplating system |
US11201079B2 (en) * | 2018-05-30 | 2021-12-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer chuck |
CN110735175B (en) * | 2019-10-27 | 2020-08-14 | 国营四达机械制造公司 | Chrome plating clamp and method for flap slide rail |
US11791192B2 (en) * | 2020-01-19 | 2023-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Workpiece holder, wafer chuck, wafer holding method |
US20230009502A1 (en) * | 2021-07-09 | 2023-01-12 | Medtronic, Inc. | Electrical contact for a medical device lead |
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2001
- 2001-04-05 US US09/827,084 patent/US6540899B2/en not_active Expired - Lifetime
-
2002
- 2002-03-15 WO PCT/IB2002/000779 patent/WO2002081783A1/en active Application Filing
- 2002-03-15 JP JP2002579542A patent/JP3955532B2/en not_active Expired - Lifetime
- 2002-03-15 KR KR10-2003-7013050A patent/KR20040019286A/en not_active Application Discontinuation
- 2002-03-15 EP EP02703809.0A patent/EP1412561B1/en not_active Expired - Lifetime
- 2002-03-15 CN CNB028102150A patent/CN100415943C/en not_active Expired - Fee Related
-
2004
- 2004-12-22 HK HK04110152.9A patent/HK1067157A1/en not_active IP Right Cessation
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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) * |
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 03 3 April 2002 (2002-04-03) * |
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 07 3 July 2002 (2002-07-03) * |
Also Published As
Publication number | Publication date |
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KR20040019286A (en) | 2004-03-05 |
CN1509348A (en) | 2004-06-30 |
JP2004525263A (en) | 2004-08-19 |
US20020144900A1 (en) | 2002-10-10 |
CN100415943C (en) | 2008-09-03 |
EP1412561B1 (en) | 2017-02-15 |
US6540899B2 (en) | 2003-04-01 |
JP3955532B2 (en) | 2007-08-08 |
HK1067157A1 (en) | 2005-04-01 |
EP1412561A1 (en) | 2004-04-28 |
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