WO2002073220A3 - Method and apparatus for retaining a spring probe - Google Patents

Method and apparatus for retaining a spring probe Download PDF

Info

Publication number
WO2002073220A3
WO2002073220A3 PCT/US2001/047640 US0147640W WO02073220A3 WO 2002073220 A3 WO2002073220 A3 WO 2002073220A3 US 0147640 W US0147640 W US 0147640W WO 02073220 A3 WO02073220 A3 WO 02073220A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
spring
housing
ground
retaining
Prior art date
Application number
PCT/US2001/047640
Other languages
French (fr)
Other versions
WO2002073220A2 (en
Inventor
Steven Feldman
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to EP01990085A priority Critical patent/EP1368666B1/en
Priority to JP2002572429A priority patent/JP4106273B2/en
Priority to DE60109499T priority patent/DE60109499T2/en
Priority to AT01990085T priority patent/ATE291234T1/en
Priority to KR1020037011837A priority patent/KR100831787B1/en
Publication of WO2002073220A2 publication Critical patent/WO2002073220A2/en
Publication of WO2002073220A3 publication Critical patent/WO2002073220A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Abstract

A spring probe block assembly includes an insulative housing (52). A probe connector (60) having a signal probe, an insulative layer, and a conductive shell is positioned within the housing. At least one ground probe (58) is also positioned within the housing. The ground probe and the conductive shell of the probe connector are electrically connected by a grounding portion (56) . The grounding portion is configured to elastically deform the ground probe in such a manner as to create spring energy in the ground probe. The spring energy generates a normal force between the ground probe and the grounding portion which maintains the ground probe in its position. Also, a method for retaining a spring probe in a housing by elastically deforming the spring probe to maintain a spring force between the spring probe and the housing.
PCT/US2001/047640 2001-03-13 2001-12-11 Method and apparatus for retaining a spring probe WO2002073220A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP01990085A EP1368666B1 (en) 2001-03-13 2001-12-11 Method and apparatus for retaining a spring probe
JP2002572429A JP4106273B2 (en) 2001-03-13 2001-12-11 Method and apparatus for holding a spring probe
DE60109499T DE60109499T2 (en) 2001-03-13 2001-12-11 METHOD AND DEVICE FOR RESERVING A FEATHERSTRAP TIP
AT01990085T ATE291234T1 (en) 2001-03-13 2001-12-11 METHOD AND DEVICE FOR RETAINING A SPRING TIP
KR1020037011837A KR100831787B1 (en) 2001-03-13 2001-12-11 Method and apparatus for retaining a spring probe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/804,782 2001-03-13
US09/804,782 US6447328B1 (en) 2001-03-13 2001-03-13 Method and apparatus for retaining a spring probe

Publications (2)

Publication Number Publication Date
WO2002073220A2 WO2002073220A2 (en) 2002-09-19
WO2002073220A3 true WO2002073220A3 (en) 2003-04-03

Family

ID=25189817

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/047640 WO2002073220A2 (en) 2001-03-13 2001-12-11 Method and apparatus for retaining a spring probe

Country Status (8)

Country Link
US (1) US6447328B1 (en)
EP (1) EP1368666B1 (en)
JP (1) JP4106273B2 (en)
KR (1) KR100831787B1 (en)
CN (1) CN1288449C (en)
AT (1) ATE291234T1 (en)
DE (1) DE60109499T2 (en)
WO (1) WO2002073220A2 (en)

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US6551126B1 (en) * 2001-03-13 2003-04-22 3M Innovative Properties Company High bandwidth probe assembly
US6902416B2 (en) 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6696850B1 (en) * 2002-10-02 2004-02-24 Interconnect Devices, Inc. Contact probe with off-centered back-drilled aperture
US6824427B1 (en) * 2003-05-13 2004-11-30 3M Innovative Properties Company Coaxial probe interconnection system
US7015708B2 (en) * 2003-07-11 2006-03-21 Gore Enterprise Holdings, Inc. Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
JP4053962B2 (en) * 2003-10-15 2008-02-27 株式会社東芝 Semiconductor device
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
KR100600482B1 (en) * 2004-06-22 2006-07-13 삼성전자주식회사 test probe for semiconductor package
JP4757531B2 (en) * 2005-04-28 2011-08-24 日本発條株式会社 Conductive contact holder and conductive contact unit
US7298153B2 (en) * 2005-05-25 2007-11-20 Interconnect Devices, Inc. Eccentric offset Kelvin probe
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US20100194419A1 (en) * 2009-02-05 2010-08-05 Chan Edward K Multi-contact probe assembly
US7997933B2 (en) 2009-08-10 2011-08-16 3M Innovative Properties Company Electrical connector system
US7909646B2 (en) * 2009-08-10 2011-03-22 3M Innovative Properties Company Electrical carrier assembly and system of electrical carrier assemblies
US7850489B1 (en) 2009-08-10 2010-12-14 3M Innovative Properties Company Electrical connector system
US7927144B2 (en) * 2009-08-10 2011-04-19 3M Innovative Properties Company Electrical connector with interlocking plates
US8905795B2 (en) 2011-10-12 2014-12-09 Apple Inc. Spring-loaded contacts
KR101968790B1 (en) 2011-10-24 2019-08-13 아덴트 컨셉트, 인코포레이티드 Controlled-impedance cable termination using compliant interconnect elements
USRE47459E1 (en) 2011-10-24 2019-06-25 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
USRE46958E1 (en) 2011-10-24 2018-07-17 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US20130330983A1 (en) * 2012-06-10 2013-12-12 Apple Inc. Spring-loaded contacts having sloped backside with retention guide
KR101403048B1 (en) * 2012-06-26 2014-06-09 주식회사 오킨스전자 Semiconductor device test socket having high frequency property
TWI555987B (en) * 2014-01-28 2016-11-01 Spring sleeve type probe and its manufacturing method
CN104280678B (en) * 2014-10-30 2018-11-27 通富微电子股份有限公司 Semiconductor test jig
CN106645809A (en) * 2016-10-14 2017-05-10 厦门大学 Preparation method for isolated needle point with housing layers wrapped in dual manner
US10705118B2 (en) * 2017-03-23 2020-07-07 Ford Global Technologies, Llc Power module testing apparatus
CN108663553B (en) * 2017-03-29 2022-01-25 上海中船电气有限公司 Contact type semiconductor material testing head
JP7346026B2 (en) * 2018-12-26 2023-09-19 株式会社日本マイクロニクス electrical connection device
CN218938344U (en) * 2020-04-22 2023-04-28 株式会社村田制作所 Connector for inspection and inspection unit
US11437747B2 (en) 2020-09-25 2022-09-06 Apple Inc. Spring-loaded contacts having capsule intermediate object
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
US11942722B2 (en) 2020-09-25 2024-03-26 Apple Inc. Magnetic circuit for magnetic connector
KR102503437B1 (en) * 2021-04-26 2023-02-24 주식회사 에이플러스알에프 Printed circuit board test connector

Citations (10)

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Publication number Priority date Publication date Assignee Title
US4062617A (en) * 1975-10-17 1977-12-13 Teradyne, Inc. Electrical test connector apparatus
GB2166913A (en) * 1984-11-13 1986-05-14 Tektronix Inc Impedance matched test probe
US4783624A (en) * 1986-04-14 1988-11-08 Interconnect Devices, Inc. Contact probe devices and method
EP0317191A2 (en) * 1987-11-13 1989-05-24 Hewlett-Packard Company Terminal connection device
US4843315A (en) * 1987-03-27 1989-06-27 International Business Machines Corporation Contact probe arrangement for electrically connecting a test system to the contact pads of a device to be tested
US5477159A (en) * 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
US5641315A (en) * 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
EP0915342A2 (en) * 1997-11-05 1999-05-12 Feinmetall GmbH Test head for microstructures with interface
WO1999045400A1 (en) * 1998-03-04 1999-09-10 Teradyne, Inc. Coaxial probe interface for automatic test equipment
JP2001004659A (en) * 1999-06-17 2001-01-12 Yokowo Co Ltd Coaxial probe for measurement

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US6196866B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Vertical probe housing

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062617A (en) * 1975-10-17 1977-12-13 Teradyne, Inc. Electrical test connector apparatus
GB2166913A (en) * 1984-11-13 1986-05-14 Tektronix Inc Impedance matched test probe
US4783624A (en) * 1986-04-14 1988-11-08 Interconnect Devices, Inc. Contact probe devices and method
US4843315A (en) * 1987-03-27 1989-06-27 International Business Machines Corporation Contact probe arrangement for electrically connecting a test system to the contact pads of a device to be tested
EP0317191A2 (en) * 1987-11-13 1989-05-24 Hewlett-Packard Company Terminal connection device
US5477159A (en) * 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
US5641315A (en) * 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
EP0915342A2 (en) * 1997-11-05 1999-05-12 Feinmetall GmbH Test head for microstructures with interface
WO1999045400A1 (en) * 1998-03-04 1999-09-10 Teradyne, Inc. Coaxial probe interface for automatic test equipment
JP2001004659A (en) * 1999-06-17 2001-01-12 Yokowo Co Ltd Coaxial probe for measurement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 16 8 May 2001 (2001-05-08) *

Also Published As

Publication number Publication date
JP2004530870A (en) 2004-10-07
US6447328B1 (en) 2002-09-10
JP4106273B2 (en) 2008-06-25
EP1368666B1 (en) 2005-03-16
DE60109499D1 (en) 2005-04-21
KR100831787B1 (en) 2008-05-28
EP1368666A2 (en) 2003-12-10
US20020132514A1 (en) 2002-09-19
DE60109499T2 (en) 2006-04-13
CN1288449C (en) 2006-12-06
ATE291234T1 (en) 2005-04-15
CN1555489A (en) 2004-12-15
KR20030081513A (en) 2003-10-17
WO2002073220A2 (en) 2002-09-19

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