WO2002029390A3 - Method and apparatus to provide for automated process verification and hierarchical substrate examination - Google Patents

Method and apparatus to provide for automated process verification and hierarchical substrate examination Download PDF

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Publication number
WO2002029390A3
WO2002029390A3 PCT/US2001/042483 US0142483W WO0229390A3 WO 2002029390 A3 WO2002029390 A3 WO 2002029390A3 US 0142483 W US0142483 W US 0142483W WO 0229390 A3 WO0229390 A3 WO 0229390A3
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
optical
substrate
optical inspection
systems
Prior art date
Application number
PCT/US2001/042483
Other languages
French (fr)
Other versions
WO2002029390A2 (en
Inventor
Reginald Hunter
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/685,191 external-priority patent/US7012684B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2002532913A priority Critical patent/JP2004529485A/en
Priority to KR1020037004935A priority patent/KR100871495B1/en
Publication of WO2002029390A2 publication Critical patent/WO2002029390A2/en
Publication of WO2002029390A3 publication Critical patent/WO2002029390A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Abstract

The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one embodiment, a substrate process inspection system (100) comprises a plurality of optical inspection systems (105) each configured to perform an optical inspection process at a first degree of optical resolution and an inspection platform (150) configured to perform an optical inspection process at a second degree of optical resolution. The plurality of optical inspection systems each comprises a transmitter unit and a receiver unit. The substrate process inspection system further comprises a controller system (102) connected to the plurality of optical inspection systems and the inspection platform. The controller system is configured to (i) process optical signal information indicative of a topographical condition on a substrate inspected by at least one of the plurality of optical inspection systems and (ii) in response to the topographical condition, cause execution of one of a plurality of subsequent substrate handling steps. In one embodiment, a first substrate handling step comprises transferring the substrate to the inspection platform for further optical inspection.
PCT/US2001/042483 2000-10-06 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination WO2002029390A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002532913A JP2004529485A (en) 2000-10-06 2001-10-05 Method and apparatus for defining automated process inspection and hierarchical substrate testing
KR1020037004935A KR100871495B1 (en) 2000-10-06 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/685,191 US7012684B1 (en) 1999-09-07 2000-10-06 Method and apparatus to provide for automated process verification and hierarchical substrate examination
US09/685,191 2000-10-06

Publications (2)

Publication Number Publication Date
WO2002029390A2 WO2002029390A2 (en) 2002-04-11
WO2002029390A3 true WO2002029390A3 (en) 2003-04-17

Family

ID=24751113

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/042483 WO2002029390A2 (en) 2000-10-06 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Country Status (4)

Country Link
JP (1) JP2004529485A (en)
KR (1) KR100871495B1 (en)
TW (1) TW533526B (en)
WO (1) WO2002029390A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7265382B2 (en) * 2002-11-12 2007-09-04 Applied Materials, Inc. Method and apparatus employing integrated metrology for improved dielectric etch efficiency
JP5322257B2 (en) * 2005-12-06 2013-10-23 芝浦メカトロニクス株式会社 Surface roughness inspection device
JP5002367B2 (en) * 2007-08-10 2012-08-15 浜松ホトニクス株式会社 Optical inspection device, pinhole inspection device, film thickness inspection device, and surface inspection device
JP6245445B2 (en) * 2014-07-07 2017-12-13 Smc株式会社 Actuator tact measurement device and sensor signal detection device
US10269545B2 (en) * 2016-08-03 2019-04-23 Lam Research Corporation Methods for monitoring plasma processing systems for advanced process and tool control
WO2021076320A1 (en) 2019-10-15 2021-04-22 Tokyo Electron Limited Systems and methods for monitoring one or more characteristics of a substrate
US20210129166A1 (en) 2019-11-04 2021-05-06 Tokyo Electron Limited Systems and Methods for Spin Process Video Analysis During Substrate Processing
CN114616657A (en) 2019-11-04 2022-06-10 东京毅力科创株式会社 System and method for calibrating a plurality of Wafer Inspection System (WIS) modules
US11276157B2 (en) 2019-11-14 2022-03-15 Tokyo Electron Limited Systems and methods for automated video analysis detection techniques for substrate process
US11624607B2 (en) 2020-01-06 2023-04-11 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
TWI757907B (en) * 2020-10-07 2022-03-11 財團法人國家實驗研究院 A cluster real-time online process and analysis transmission system in a vacuum environment
KR20220133102A (en) * 2021-03-24 2022-10-04 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus, analysis method, display device and program

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049500A1 (en) * 1998-03-24 1999-09-30 Applied Materials, Inc. Cluster tool
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
EP1083424A2 (en) * 1999-09-07 2001-03-14 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049500A1 (en) * 1998-03-24 1999-09-30 Applied Materials, Inc. Cluster tool
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
EP1083424A2 (en) * 1999-09-07 2001-03-14 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput

Also Published As

Publication number Publication date
KR20040012667A (en) 2004-02-11
TW533526B (en) 2003-05-21
JP2004529485A (en) 2004-09-24
WO2002029390A2 (en) 2002-04-11
KR100871495B1 (en) 2008-12-05

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