WO2001082334A3 - Semiconductor handler for rapid testing - Google Patents

Semiconductor handler for rapid testing Download PDF

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Publication number
WO2001082334A3
WO2001082334A3 PCT/US2001/012243 US0112243W WO0182334A3 WO 2001082334 A3 WO2001082334 A3 WO 2001082334A3 US 0112243 W US0112243 W US 0112243W WO 0182334 A3 WO0182334 A3 WO 0182334A3
Authority
WO
WIPO (PCT)
Prior art keywords
channels
plate
temperature
zones
hold
Prior art date
Application number
PCT/US2001/012243
Other languages
French (fr)
Other versions
WO2001082334A2 (en
Inventor
Andreas C Pfahnl
John D Moore
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Priority to AU2001255389A priority Critical patent/AU2001255389A1/en
Publication of WO2001082334A2 publication Critical patent/WO2001082334A2/en
Publication of WO2001082334A3 publication Critical patent/WO2001082334A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Abstract

A strip, leadframe or panel type handling device for use in testing semiconductor components. The handling device has a thermal plate assembly with embedded electrical resistance heaters. The heaters are separately controlled in zones to provide uniform temperature across the plate for elevated temperature testing. Cooling channels are formed in the plate. Intermingling channels are provided to allow different types of cooling fluids to be used to cool at different rates or hold a cold temperature at different levels. The cooling channels can likewise be provided in zones to promote temperature uniformity. Vacuum channels are used to hold the semiconductor parts under test in close contact with the thermal plate.
PCT/US2001/012243 2000-04-25 2001-04-13 Semiconductor handler for rapid testing WO2001082334A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001255389A AU2001255389A1 (en) 2000-04-25 2001-04-13 Semiconductor handler for rapid testing

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US19948700P 2000-04-25 2000-04-25
US60/199,487 2000-04-25
US09/585,453 2000-06-01
US09/585,453 US6717115B1 (en) 2000-04-25 2000-06-01 Semiconductor handler for rapid testing

Publications (2)

Publication Number Publication Date
WO2001082334A2 WO2001082334A2 (en) 2001-11-01
WO2001082334A3 true WO2001082334A3 (en) 2002-06-06

Family

ID=26894826

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/012243 WO2001082334A2 (en) 2000-04-25 2001-04-13 Semiconductor handler for rapid testing

Country Status (4)

Country Link
US (1) US6717115B1 (en)
CN (1) CN1272830C (en)
AU (1) AU2001255389A1 (en)
WO (1) WO2001082334A2 (en)

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US7274005B2 (en) * 2004-12-22 2007-09-25 Sokudo Co., Ltd. Bake plate having engageable thermal mass
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US20070210037A1 (en) * 2006-02-24 2007-09-13 Toshifumi Ishida Cooling block forming electrode
KR100789699B1 (en) 2006-10-10 2008-01-02 (주) 쎄믹스 Wafer prober station being capable of testing in low and high temperature
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KR100888054B1 (en) * 2008-03-12 2009-03-10 (주) 쎄믹스 Wafer testing system comprising chiller
US20100071883A1 (en) * 2008-09-08 2010-03-25 Jan Vetrovec Heat transfer device
US9155134B2 (en) * 2008-10-17 2015-10-06 Applied Materials, Inc. Methods and apparatus for rapidly responsive heat control in plasma processing devices
JP5416570B2 (en) * 2009-12-15 2014-02-12 住友電気工業株式会社 Heating / cooling device and apparatus equipped with the same
EP2574157A1 (en) * 2011-09-23 2013-03-27 AEG Power Solutions B.V. High-power electronics component and assembly comprising at least one such high-power electronics component
JP5942459B2 (en) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 Handler and parts inspection device
US9224626B2 (en) 2012-07-03 2015-12-29 Watlow Electric Manufacturing Company Composite substrate for layered heaters
US9673077B2 (en) 2012-07-03 2017-06-06 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
KR101936348B1 (en) * 2012-09-17 2019-01-08 삼성전자주식회사 test handler for realizing rapid temperature transition and semiconductor device test method using the same
US20160314997A1 (en) * 2015-04-22 2016-10-27 Applied Materials, Inc. Loadlock apparatus, cooling plate assembly, and electronic device processing systems and methods
IT201700091338A1 (en) * 2017-08-07 2019-02-07 Samec S P A DEPRESSION WORKING PLAN FOR A PANTOGRAPH
US10612122B2 (en) * 2017-08-25 2020-04-07 Vladimir E. Belashchenko Plasma device and method for delivery of plasma and spray material at extended locations from an anode arc root attachment
CN110362127B (en) * 2018-04-11 2021-03-02 北京北方华创微电子装备有限公司 Wafer temperature control method, temperature control system and semiconductor processing equipment
KR20210043040A (en) 2019-10-10 2021-04-21 삼성전자주식회사 Apparatus for testing semiconductor device

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Also Published As

Publication number Publication date
AU2001255389A1 (en) 2001-11-07
CN1426595A (en) 2003-06-25
CN1272830C (en) 2006-08-30
US6717115B1 (en) 2004-04-06
WO2001082334A2 (en) 2001-11-01

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