WO2001077409A3 - Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore - Google Patents

Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore Download PDF

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Publication number
WO2001077409A3
WO2001077409A3 PCT/EP2001/004195 EP0104195W WO0177409A3 WO 2001077409 A3 WO2001077409 A3 WO 2001077409A3 EP 0104195 W EP0104195 W EP 0104195W WO 0177409 A3 WO0177409 A3 WO 0177409A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal
wet
selective
external current
substrate surfaces
Prior art date
Application number
PCT/EP2001/004195
Other languages
German (de)
French (fr)
Other versions
WO2001077409A2 (en
Inventor
Stephan Lange
Veniamin Galius
Stephan Fiedler
Monika Hannemann
Wolfgang Scheell
Herbert Reichl
Original Assignee
Fraunhofer Ges Forschung
Stephan Lange
Veniamin Galius
Stephan Fiedler
Monika Hannemann
Wolfgang Scheell
Herbert Reichl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2000117887 external-priority patent/DE10017887C1/en
Priority claimed from DE2001113857 external-priority patent/DE10113857A1/en
Application filed by Fraunhofer Ges Forschung, Stephan Lange, Veniamin Galius, Stephan Fiedler, Monika Hannemann, Wolfgang Scheell, Herbert Reichl filed Critical Fraunhofer Ges Forschung
Priority to EP01929548A priority Critical patent/EP1274880A2/en
Publication of WO2001077409A2 publication Critical patent/WO2001077409A2/en
Publication of WO2001077409A3 publication Critical patent/WO2001077409A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/04—Making microcapsules or microballoons by physical processes, e.g. drying, spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Abstract

The invention relates to a method for the selective metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current. The inventive method is characterised in that the substrate surface is activated by means of an activator metal which, as such or in the form of a precursor, has been selectively transported to the location of the surface by means of vesicles, whereby said location has to be activated. The invention also relates to a vesicle mixture comprising vesicles that are filled with an activator metal precursor and to vesicles that are filled with a reaction partner for the activator metal precursor. The reaction partner can convert the activator metal precursor into activator metal as soon as the vesicle membranes are opened. Said vesicle mixture is present as such or suspended in a suspension agent and is suitable for use in said method.
PCT/EP2001/004195 2000-04-11 2001-04-11 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore WO2001077409A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01929548A EP1274880A2 (en) 2000-04-11 2001-04-11 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10017887.1 2000-04-11
DE2000117887 DE10017887C1 (en) 2000-04-11 2000-04-11 Selective, metal-based activation of substrates for wet-chemical, electroless plating, especially on circuit board for microelectronic device, uses vesicles to transport activator metal or precursor to selected area
DE2001113857 DE10113857A1 (en) 2001-03-21 2001-03-21 Selective, metal-based activation of substrates for wet-chemical, electroless plating, especially on circuit board for microelectronic device, uses vesicles to transport activator metal or precursor to selected area
DE10113857.1 2001-03-21

Publications (2)

Publication Number Publication Date
WO2001077409A2 WO2001077409A2 (en) 2001-10-18
WO2001077409A3 true WO2001077409A3 (en) 2002-07-18

Family

ID=26005267

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/004195 WO2001077409A2 (en) 2000-04-11 2001-04-11 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore

Country Status (2)

Country Link
EP (1) EP1274880A2 (en)
WO (1) WO2001077409A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958048A (en) * 1974-04-22 1976-05-18 Crown City Plating Company Aqueous suspensions for surface activation of nonconductors for electroless plating
US5332646A (en) * 1992-10-21 1994-07-26 Minnesota Mining And Manufacturing Company Method of making a colloidal palladium and/or platinum metal dispersion
US5560960A (en) * 1994-11-04 1996-10-01 The United States Of America As Represented By The Secretary Of The Navy Polymerized phospholipid membrane mediated synthesis of metal nanoparticles
DE19747377A1 (en) * 1996-10-25 1998-05-28 Fraunhofer Ges Forschung Production of structured metal layers on substrate
DE19740431C1 (en) * 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Metallising non-conductive substrate regions especially circuit board hole walls

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958048A (en) * 1974-04-22 1976-05-18 Crown City Plating Company Aqueous suspensions for surface activation of nonconductors for electroless plating
US5332646A (en) * 1992-10-21 1994-07-26 Minnesota Mining And Manufacturing Company Method of making a colloidal palladium and/or platinum metal dispersion
US5560960A (en) * 1994-11-04 1996-10-01 The United States Of America As Represented By The Secretary Of The Navy Polymerized phospholipid membrane mediated synthesis of metal nanoparticles
DE19747377A1 (en) * 1996-10-25 1998-05-28 Fraunhofer Ges Forschung Production of structured metal layers on substrate
DE19740431C1 (en) * 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Metallising non-conductive substrate regions especially circuit board hole walls

Also Published As

Publication number Publication date
WO2001077409A2 (en) 2001-10-18
EP1274880A2 (en) 2003-01-15

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