WO2001077241A3 - Composition for metal cmp with low dishing and overpolish insensitivity - Google Patents
Composition for metal cmp with low dishing and overpolish insensitivity Download PDFInfo
- Publication number
- WO2001077241A3 WO2001077241A3 PCT/US2001/011075 US0111075W WO0177241A3 WO 2001077241 A3 WO2001077241 A3 WO 2001077241A3 US 0111075 W US0111075 W US 0111075W WO 0177241 A3 WO0177241 A3 WO 0177241A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- overpolish
- insensitivity
- composition
- metal cmp
- low dishing
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title abstract 2
- 238000005498 polishing Methods 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Abstract
Polishing compositions for metal CMP with reduced dishing and overpolish insensitivity are formulated to have a low static etching rate at high temperatures, e.g., higher than 50 °C. Embodiments include abrasive-free polishing compositions comprising one or more chelating agents, one or more oxidizers, one or more corrosion inhibitors, one or more acids to achieve a pH of about 3 to about 10 and deionized water.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54377700A | 2000-04-05 | 2000-04-05 | |
US09/543,777 | 2000-04-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001077241A2 WO2001077241A2 (en) | 2001-10-18 |
WO2001077241A3 true WO2001077241A3 (en) | 2002-02-07 |
Family
ID=24169523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/011075 WO2001077241A2 (en) | 2000-04-05 | 2001-04-05 | Composition for metal cmp with low dishing and overpolish insensitivity |
Country Status (3)
Country | Link |
---|---|
US (1) | US20020148169A1 (en) |
TW (1) | TW574346B (en) |
WO (1) | WO2001077241A2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6432826B1 (en) * | 1999-11-29 | 2002-08-13 | Applied Materials, Inc. | Planarized Cu cleaning for reduced defects |
US20070290166A1 (en) * | 2001-03-14 | 2007-12-20 | Liu Feng Q | Method and composition for polishing a substrate |
US7160432B2 (en) * | 2001-03-14 | 2007-01-09 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US6899804B2 (en) * | 2001-12-21 | 2005-05-31 | Applied Materials, Inc. | Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
US7232514B2 (en) * | 2001-03-14 | 2007-06-19 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US6800218B2 (en) * | 2001-08-23 | 2004-10-05 | Advanced Technology Materials, Inc. | Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same |
JP2005518670A (en) * | 2002-02-26 | 2005-06-23 | アプライド マテリアルズ インコーポレイテッド | Method and composition for polishing a substrate |
KR100627510B1 (en) * | 2002-12-30 | 2006-09-22 | 주식회사 하이닉스반도체 | CMP slurry for nitride |
JP4394477B2 (en) * | 2003-03-27 | 2010-01-06 | Dowaホールディングス株式会社 | Method for producing metal / ceramic bonding substrate |
US7210988B2 (en) * | 2004-08-24 | 2007-05-01 | Applied Materials, Inc. | Method and apparatus for reduced wear polishing pad conditioning |
TW200720493A (en) * | 2005-10-31 | 2007-06-01 | Applied Materials Inc | Electrochemical method for ecmp polishing pad conditioning |
US20070158207A1 (en) * | 2006-01-06 | 2007-07-12 | Applied Materials, Inc. | Methods for electrochemical processing with pre-biased cells |
US20070227902A1 (en) * | 2006-03-29 | 2007-10-04 | Applied Materials, Inc. | Removal profile tuning by adjusting conditioning sweep profile on a conductive pad |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998049723A1 (en) * | 1997-04-30 | 1998-11-05 | Minnesota Mining And Manufacturing Company | Method of planarizing the upper surface of a semiconductor wafer |
WO2000000561A1 (en) * | 1998-06-26 | 2000-01-06 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrates |
-
2001
- 2001-04-05 WO PCT/US2001/011075 patent/WO2001077241A2/en active Application Filing
- 2001-04-20 TW TW90108353A patent/TW574346B/en not_active IP Right Cessation
-
2002
- 2002-04-03 US US10/117,272 patent/US20020148169A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998049723A1 (en) * | 1997-04-30 | 1998-11-05 | Minnesota Mining And Manufacturing Company | Method of planarizing the upper surface of a semiconductor wafer |
WO2000000561A1 (en) * | 1998-06-26 | 2000-01-06 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrates |
Also Published As
Publication number | Publication date |
---|---|
TW574346B (en) | 2004-02-01 |
US20020148169A1 (en) | 2002-10-17 |
WO2001077241A2 (en) | 2001-10-18 |
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