WO2001073844A1

WO2001073844A1 - Lighting module unit

Info

Publication number: WO2001073844A1
Application number: PCT/EP2001/001948
Authority: WO
Inventors: Johannes Hackl; Michael Waldner; Thomas Scharfenberger
Original assignee: Gebr. Swoboda Gmbh
Priority date: 2000-03-24
Filing date: 2001-02-21
Publication date: 2001-10-04
Also published as: DE10014804A1

Abstract

The invention relates to a lighting module which is designed to be used as a component for lamps, comprising a support (4) that consists of conductor strips (1, 2) and insulating support material (3) and light-emitting diodes (5) which are electrically connected to the conductor strips (1, 2). To achieve increased luminance, the heat of the light-emitting diodes must be dissipated effectively. To achieve this, the inventive conductor strips (1, 2) have a material thickness (8) and radiation surface that are suitable for dissipating and radiating the heat that has been generated by the light-emitting diodes.

Description

LIGHTING MODULE UNIT

The invention relates to a luminaire module as a component for luminaires, with a carrier consisting of conductor tracks and insulating carrier material and with light-emitting diodes which are electrically connected to the conductor tracks.

Luminaire modules are already known in which light-emitting diodes are on one

Printed circuit boards are mounted, with printed conductors applied to the printed circuit board used for the electrical connection of the light-emitting diodes to an external power supply. Such lamp modules are used in particular for the production of lamps for motor vehicles. However, the luminance of known luminaire modules is limited by their ability to dissipate the heat generated in the light-emitting diodes.

The object of the invention is to provide a luminaire module that is inexpensive to manufacture with a simple structure and is improved with regard to the heat to be dissipated.

The invention solves the problem in that the conductor tracks have a material thickness and radiation area suitable for dissipating and radiating the heat generated in the light-emitting diodes. This simple measure allows the heat generated to be dissipated without additional cooling plates or similar devices. The conductor tracks must be provided anyway for the electrical connection of the light-emitting diodes to a current source. Your design according to the invention requires no additional components and does not cause any significant additional costs. so that the lamp module according to the invention is simple and inexpensive to manufacture.

In an embodiment of the invention it is provided that the conductor tracks have a material thickness of 0.1 mm to 0.8 mm, preferably 0.5 mm. With such a material thickness, the heat generated in the light-emitting diodes is generated by the Effectively derived conductor tracks. The material thickness according to the invention is far above that of conductor tracks on ordinary printed circuit boards, the maximum thickness of which is limited to approximately 0.035 mm.

To improve the radiation effect, it is proposed that the conductor tracks have one or more sections serving as a radiation surface with dimensions of several mm to several cm. Such dimensions can be produced without any special additional effort. They significantly improve the radiation behavior and therefore contribute to cooling the luminaire module. Known conductor tracks on printed circuit boards usually do not have such dimensions.

In an embodiment of the invention it is therefore provided that the conductor tracks are punched out of a sheet of suitable thickness. This measure is particularly useful given the required strength. Conductor tracks on printed circuit boards cannot be produced in the thickness according to the invention.

To form a carrier for the light-emitting diodes, it is recommended to partially overmold the conductor tracks with an insulating carrier material, a plastic suitable for injection molding being used as the carrier material. In this simple manner, the carrier material is brought into the required shape and at the same time firmly connected to the conductor tracks. If the carrier material is also still elastic, the resulting luminaire module can be bent into the desired shape or adapted to the specified shape of a luminaire housing. This is not possible with the known luminaire modules because the circuit boards used there do not have sufficient elasticity.

The carrier can also consist of a plastic frame that is connected to the conductor tracks e.g. is connected by riveting, gluing or locking.

To further improve the heat dissipation, it is proposed that the carrier material consist of a thermally conductive plastic. The luminaire module according to the invention can be further improved by providing the carrier on its rear side facing away from the light-emitting diodes with molded anchor pins for fastening the luminaire module to a luminaire housing. In the luminaire module according to the invention, such anchor pins can be integrally molded onto the carrier material during the extrusion coating of the conductor tracks without additional work steps being required. In contrast, required fasteners would have to be attached to the printed circuit board in the known light modules, which causes additional work steps and costs.

The luminaire module can be improved with regard to improved heat dissipation by providing the carrier with a cooling plate on its rear side facing away from the light-emitting diodes. The heat sink can be overmolded in the same step without any additional effort when overmolding the conductor tracks.

A modified embodiment of the lamp module provides that, starting from the front side of the carrier provided with the light-emitting diodes, at least one conductor track is bent in a U-shape around a side edge of the carrier and extends as a cooling plate over at least part of the rear side of the carrier. In this embodiment, the conductor track provided for cooling is formed in one piece on the front of the lamp module and the cooling plate provided for additional cooling on the rear of the lamp module. A special attachment of the cooling plate on the back is therefore not absolutely necessary, but can still be provided if necessary.

A preferred embodiment of the lamp module provides that the carrier is designed essentially in the form of a rectangle and the light-emitting diodes are arranged essentially in a row. Such strip-shaped lamp modules with a row of light-emitting diodes only require two relatively easily designed conductor tracks that extend on both sides of the row of light emitting diodes over the length of the rectangle. Most common lamp shapes can be assembled from the strip-shaped lamp modules. In a further embodiment of the invention, the conductor tracks terminate at least on one narrow side of the carrier in one or more connecting pins which project laterally beyond the carrier material. This measure makes connection pins available without an additional work step, because the connection pins are produced without further effort when the conductor tracks are punched out. In contrast, special pins are to be attached to the circuit board in an additional step in known luminaire modules.

Luminaire modules in which the conductor track is connected to the light-emitting diodes by soldering can be further improved by providing an embossed notch between the area of the soldering point and the further course of the conductor track as a flow stop for the liquid solder. When soldering, solder has a tendency to spread over as large an area of the conductor track as possible. However, only the wetting of the area around the soldering point is desired. In order to prevent the solder from wetting other areas of the conductor track, it is known to cover the areas of the conductor track that are not to be wetted by a lacquer or a plastic coating. However, an additional operation is required to apply the lacquer, which increases the manufacturing costs. In contrast to this, the notch provided as a flow stop in the invention can be stamped in a simple manner when punching out the conductor track, without a special working step being necessary for this. Another possibility is to simultaneously carry out a plastic coating that serves as a flow stop when the plastic is molded onto the conductor tracks.

The invention also includes a method for producing the luminaire module described above, which comprises the following method steps: The conductor tracks are punched out of a metal sheet, leaving connecting webs for the preliminary mechanical connection of the conductor tracks.

- The conductor tracks are partially extrusion-coated with plastic, thus creating a permanent mechanical connection between the conductor tracks, the conductor tracks remaining completely or partially free of plastic on the side provided for fastening the light-emitting diodes.

The connecting steps are removed, preferably by stamping, and the light-emitting diodes are attached to the conductor tracks, preferably soldered.

The invention also includes a method in which the connecting webs are removed after the light-emitting diodes have been attached.

The connecting webs initially ensure that the conductor tracks that are necessarily separated in the finished luminaire module are held together so that their later position is fixed to one another. After extrusion-coating with electrically non-conductive plastic, the temporary connecting webs can be removed, since the plastic as the carrier material now ensures a mechanical connection of the conductor tracks. On the one hand, the conductor tracks must be free of plastic, at least in certain areas, so that they can come into electrical contact with the light-emitting diodes to be fastened thereon. As a rule, the heat radiation behavior of the conductor tracks is better, the larger the area uncovered by plastic.

The manufacturing method according to the invention is well suited on the one hand for the production of a lighting module according to the invention and on the other hand consists of a few simple process steps. Known manufacturing methods for known lighting modules are not suitable for manufacturing the lighting modules according to the invention. This applies in particular to the Printed circuit board technology, which is unsuitable for producing the thick conductor tracks according to the invention.

If the lamps to be fitted with the lamp modules according to the invention require curved lamp modules due to their shape, the method according to the invention can be supplemented by a further method step in which the lamp modules are subsequently brought into a predetermined shape by bending. With conventional luminaire elements, the variety of shapes of the luminaires to be equipped with them is limited, because the circuit boards of the luminaire elements cannot be bent significantly. In contrast to this, the present invention allows any curved surface elements to be produced which should be used in particular in exotic lamp shapes, for example designer lamps.

In an embodiment of the method according to the invention, it is provided that the light-emitting diodes are attached to the conductor tracks by SMD soldering technology, the conductor tracks first being provided with a solder paste, then being fitted with the light-emitting diodes, and the actual soldering being carried out by subsequently introducing the lamp module into a melting furnace. The SMD soldering technology allows the light-emitting diodes to be attached to the conductor track surface from one side without a hole to the other side or soldering on the other side being required. This is particularly advantageous here because the back of the conductor tracks is overmolded with plastic and is therefore difficult to access.

The manufacturing process can be improved even further by the fact that when the conductor tracks are encapsulated with plastic from the carrier material, anchor pins are formed for fastening the lamp module in a lamp housing. In this way, the anchor pins can be generated without a special process step. In a variant it is provided that the conductor tracks have lateral tabs which are bent over a side edge of the carrier and serve as fastening anchors for fastening the light module.

In an analogous manner, the notches in FIG. 5, which are intended as a flow stop for liquid solder, can be formed in the conductor tracks when the conductor tracks are punched out, without an additional operation being necessary. This has a particularly favorable effect on the manufacturing costs.

An advantageous embodiment of the method according to the invention provides that the conductor tracks with lateral extensions that act as an additional cooling plate

10 serve, punched out and that the extensions are bent after the extrusion coating of the conductor tracks with plastic and the removal of the temporary connecting webs on the back of the lamp module. These measures only require an additional effort to bend the extensions serving as a cooling plate, while the cooling plates themselves without additional

15 effort is generated when punching out the conductor tracks.

A significant improvement in the manufacturing process in terms of an inexpensive and automated process can be achieved in that the. Conductor tracks made of any length ("endless") metal strip

20. are punched out that two lateral perforated transport strips are formed, which are connected to each other by the conductor tracks and which in turn connect the conductor tracks to one another in a chain, that the conductor tracks are then transported by means of the transport strips through further processing stations, where they are encapsulated with plastic and with LEDs equipped

25, and that the connecting webs and transport strips are removed by punching in a subsequent processing station. The transport strips according to the invention allow the conductor tracks or the semi-finished luminaire modules to be easily transported through the various processing stations, with the fitting and adjustment of the objects to be treated being amazingly simple in the work stations. In an equally amazingly simple way, the transport strips are removed in the last working step when punching out the connecting webs, without additional effort being required for this.

According to an advantageous development, it is provided that the conductor tracks consist of several metal clips. This advantageously achieves that

Luminaire modules of any length with any number of LEDs can be manufactured. With conventional manufacturing methods, it was previously necessary to produce special punching tools for the production of luminaire modules of different lengths for each luminaire module. The associated costs and the loss of time in the production changeover are enormous. Because the conductor tracks can be assembled from several, usually similarly constructed, metal clips, it is possible to assemble the required conductor track length from several metal clips. Only a few punching tools are required for the different design of the metal clips. Theoretically, it is conceivable that the conductor tracks are assembled from identical metal clips, which results in a further reduction in the investment volume.

It is advantageously provided that the carrier has indentations for receiving the metal clips. This measure ensures that the metal clips are exactly fixed in position after being applied to the carrier. The indentations in the carrier are injected directly during the production of the carrier. An advantageous embodiment provides that the carrier has connecting lugs. The metal clips are attached to the carrier during production. The connecting lugs additionally fix the metal clips and serve as an attachment aid.

It is particularly expedient if the metal clips have fastening openings. Some of the fastening openings serve to receive the connecting lugs of the carrier, as a result of which the metal clips are additionally fixed on the carrier. It is provided that the connecting lugs are melted after the metal clips have been applied, so that the metal clips can no longer slide off the support even in the event of strong vibrations. This measure is necessary because the finished light modules are used in vehicles.

Characterized in that the carrier has openings, which are preferably congruent with at least some fastening openings in the metal brackets, it is possible to apply the finished luminaire module to any surface that has corresponding projections. The carriers with the openings are advantageously placed on projections with a snap lock. This ensures that the carrier is fixed on the mounting surface.

In order to establish an electrical connection between the metal brackets, it is advantageously provided that at least some of the metal brackets on the carrier are connected via metal webs. This also has the advantage that any switching of the metal clamps is made possible by means of the metal webs.

So that the light-emitting diodes can be supplied with electrical energy, it is advantageously provided that one light-emitting diode is connected in an electrically conductive manner to at least two metal clips. An advantageous embodiment provides that the metal webs for dissipating and radiating the heat generated in the light-emitting diodes are punched out of a sheet of suitable material thickness. With this simple measure, the heat generated can not only be given off with the aid of the conductor tracks. The entire radiator area is significantly enlarged by the special design of the metal bars.

It is provided that the metal webs have a material thickness of 0.1 mm to 0.8 mm, preferably 0.5 mm. This results in an effective heat release to the environment.

In an embodiment of the invention, it is provided that the light-emitting diodes are connected in series on one carrier half and the carrier halves are connected in parallel to one another. For example, it is possible to supply eight LEDs on a carrier with a voltage supply of 12 volts.

The invention also includes a further method for producing the prescribed lighting module, which comprises the following method steps:

The metal clips are punched out of a sheet.

The metal bars are also punched out of ^" a sheet.

The carrier is made of plastic, preferably injection molded.

The metal bars and the metal clips are applied to the carrier in such a way that an electrically conductive connection is created between certain metal clips and metal bars.

The LEDs are attached to the metal clips. The method according to the invention makes it possible for the first time to produce luminaire modules of any length without having to produce expensive punching tools. As a result, it is possible to react to certain manufacturer specifications very quickly and inexpensively. If, for example, a very long ^lamp module is required, only a corresponding plastic carrier has to be injection molded. However, metal clips with the same dimensions as the metal clips of shorter luminaire modules can be used. By lining up the metal brackets and establishing an electrical connection between certain metal brackets and metal bars, a luminaire module of any length is created. Which metal clips are electrically connected to which metal webs depends on the desired electrical circuit of the lamp module. This process enables the manufacture of luminaire modules in a very simple manner with very few process steps.

In an embodiment of the method according to the invention, it is provided that the metal clips are applied to the carrier by laterally pushing prestressed metal clips. The already clamped metal clips improve the fixation of the metal clips on the carrier. The preloading of the metafl clamps can be done by a simple bending process. The preload is to be selected so that the metal clips adhere to the carrier due to the preload.

An advantageous embodiment of the method provides that the metal clips are applied by sliding them on and pressing them on, combined with at least one-sided heating, of the metal clips. In this process step, the metal clips do not necessarily have to be prestressed. The pressing serves to fix the metal clips on the carrier. The at least one-sided heating of the metal clips ensures that the carrier material located under the metal clip melts This creates an undercut with simultaneous pressing, thereby improving the adhesion of the metal clips to the carrier.

It is advantageously provided that, after being pushed on, the metal clips are fixed by melting the connecting lugs. This leads to a thickening of the connecting lugs when the metal clip is pushed on, which advantageously prevents the metal clips from slipping off the carrier. The connection lugs can be melted simultaneously with the at least one-sided heating of the metal plates during the slide-on process.

An advantageous development of the method according to the invention provides that the light-emitting diodes are attached to the metal clamps by soldering technology, for example SMD soldering technology, the metal clamps first being provided with a solder paste, then being equipped with the light-emitting diodes and the actual soldering being carried out by subsequently introducing the light module in a melting furnace. The SMD soldering technology allows the light-emitting diodes to be attached to the metal plates from one side without having to drill to the other side or soldering on the other side. This is of particular advantage here because the back of the metal plate rests on the carrier and is therefore difficult to access.

It is particularly advantageous that the light-emitting diodes are soldered to the metal clips in the same process step as the metal bars to the metal clips. For this purpose, the required solder paste is applied in one work step and then soldered in a soldering oven. This saves production time.

Exemplary embodiments of the invention are explained in more detail below with reference to the drawings. Show it: Figure 1 is a perspective view of an inventive

Luminaire module with a view of the front;

Figure 2: the same lamp module with a view of the back;

Figure 3: an intermediate product in the manufacture of the invention; Luminaire module, namely a sheet metal strip, from which two lateral perforated transport strips and the conductor tracks are already punched out;

Figure 4 is a view of another intermediate, in which the

Conductor tracks are equipped with LEDs and overmolded with plastic; • - -.

Figure 5: two views of the lamp modules, made up of several

Metal brackets;

Figure 6: a detailed representation of the lamp module from metal brackets in

Top view and

Figure 7: a detailed representation of the lamp module from metal brackets in

Bottom view.

The luminaire module according to the invention shown in FIG. 1 has two essentially strip-shaped conductor tracks 1, 2, which extend over the entire length of the essentially rectangular luminaire module. The conductor tracks 1, 2 are held together mechanically by a carrier material 3. The

Conductor tracks 1, 2 and the carrier material 3 together form a carrier 4 for four light-emitting diodes 5, which are arranged in a row on the front side of the lamp module shown in FIG. 1 and are fastened to the conductor tracks 1, 2 by soldering.

The light-emitting diodes are fastened using SMD soldering technology, in which the conductor tracks 1, 2 are first provided with a solder paste, then with the light-emitting diodes 5 equipped and then heated by the infrared radiation of a melting furnace, not shown, so that the solder paste melts and connect to the conductor tracks 1, 2 on the one hand and the connection contacts 6, 7 of the LEDs 5 on the other. Of course, all other known soldering methods, such as vapor phase soldering, can also be used.

The conductor tracks 1, 2 have a material thickness 8 of 0.5 mm, as a result of which they absorb the heat generated in the LEDs 5 during operation and can dissipate them particularly well. The heat is therefore rapidly distributed over relatively large areas of the conductor tracks 1, 2. On the other hand, the conductor tracks 1, 2 have relatively large surfaces with dimensions 9, which are in the range between a few mm and cm. A typical width 9 of a conductor track 1, 2 is approximately 1 cm. Because of the large areas, the heat derived from the conductor tracks 1, 2 can be effectively emitted to the environment by radiation. The conductor tracks 1, 2 thus serve not only to supply power to the light-emitting diodes 5, but also as a radiator to radiate the waste heat. The side of the conductor tracks 1, 2 provided with the light-emitting diodes 5 remains free for better heat radiation. The conductor tracks 1, 2 are encapsulated by the carrier material 3 only from the rear.

The conductor tracks 1, 2 protrude beyond the narrow sides 10, 11 of the lamp module and form projections 14, 15 which are used to fasten the

Luminaire module are determined in a lamp, not shown. The projection 14 is provided with three even further projecting connection pins 16, which serve for the electrical connection of the conductor track 1. The same applies to the two projecting connection pins 17 of the projection 15 with respect to the conductor track 2.

As can best be seen in FIG. 2, the carrier 4 of the lamp module is provided on its rear side with four anchor pins 18 which are molded into the carrier material 3. The anchor pins 18 also serve to attach the Luminaire module in a lamp, not shown, and are intended to snap into corresponding openings in the lamp housing. Bent tabs 12 of the conductor tracks 1, 2 have the same function.

The carrier material 3 consists of a thermally particularly conductive plastic, which is also elastic. This makes it possible to bend the luminaire module to remove it from its essentially strip-shaped straight basic shape

\ X ^■ to adapt to the shape of the luminaire in which it is to be installed.

A method according to the invention for producing the luminaire module described above begins with the production of the conductor tracks 1, 2, which are punched out from an “endless” sheet metal strip. As can be seen in FIG. 3, after the first punching process, not only the conductor tracks 1, 2, but also two lateral transport strips 20, 21 provided with transport holes 19, which are still mechanically connected to the unfinished conductor tracks 1, 2. Furthermore, the conductor tracks 1, 2 are also provisionally connected to one another with a plurality of connecting webs 22 in order to provide a mechanical one The connecting webs 22 are removed in a later process step, as a result of which the conductor tracks 1, 2 are separated electrically but also mechanically.

The pairs of conductor tracks 1, 2 connected by the transport strips 20, 21 to form a chain are moved by means of the transport strips 20, 21 through the further processing stations which are in the. individual are not shown here, transported. In a second production step, the conductor tracks 1, 2 are extrusion-coated with a plastic serving as carrier material 3. A permanent mechanical connection is established between the conductor tracks 1, 2. The side of the conductor tracks 1, 2 provided for the assembly with the light-emitting diodes 5 remains free of plastic. In the lower part of FIG. 4, the state of manufacture after the overmolding of the conductor tracks 1, 2 with the carrier material 3 is shown. Here you can already see the contact areas provided for the attachment of the light-emitting diodes 5, which are provided with notches 23. The notches 23 are embossed into the conductor tracks 1, 2 during the first stamping process. They serve as a flow stop for the liquid solder in the subsequent work step.

In the subsequent operation, the conductor tracks 1, 2 are equipped with the light-emitting diodes 5 and these are soldered on. The associated production state is shown in the upper part of Figure 4. The connecting webs 22 between the printed circuit boards 1, 2 are then punched out in a further processing station, not shown, and the transport strips 20, 21 are removed.

In the lower part of Figure 3, a modified embodiment is shown. Two modified conductor tracks 24, 25 differ from the above-mentioned conductor tracks 1, 2 in that they have lateral extensions 26, 27 which extend into the otherwise free spaces between successive ones

Extend conductor pairs. The extensions 26, 27 are designed in one piece with the modified conductor tracks 24, 25 and are produced together with these in the first stamping process. They serve as additional cooling plates for the rear of the finished luminaire module. The further production takes place essentially as already described, but is followed by a further work step after the work steps described above, which consists in bending the extensions 26, 27 in accordance with the arrows 28, 29 shown in FIG. 3, so that they cover the back of the lamp module.

This embodiment has the advantage that the heat generated in the LEDs 5 from the conductor tracks 24, 25 not only on the front of the

Luminaire module, but is also emitted on the back. The cooling effect can be significantly improved. Another improvement The cooling effect could be that the rear extensions 26, 27 of the conductor tracks 24, 25 are in thermal contact with the luminaire housing and thus effective heat dissipation can take place.

In the luminaire module shown in FIG. 5, the conductor tracks 1, 2 are composed of a plurality of metal clips 30. Depending on the intended use, the metal clips have different configurations in this exemplary embodiment. However, a uniform design for saving punching tools is conceivable. The metal clips 30 are applied to a carrier 4 made of plastic. The metal plates have openings 31. Connection lugs 32 of the carrier 4 are partially passed through these openings 31. This results in the metal clips 30 being fixed on the carrier 4.

FIG. 6 shows a top view of a lamp module according to the invention. Here, indentations 33 can be clearly seen on the carrier 4. These serve to hold the metal clips 30 and ensure that the metal clips 30 are adequately fixed on the carrier 4.

It can be clearly seen in FIG. 6 that the carrier also has 4 openings 34.

These openings 34 are congruent with some openings 31 on the metal plates 30. They serve to accommodate protrusions on surfaces on which the finished luminaire modules are attached. The use of projections, not shown, with snap locks is expedient in order to make it simple

To ensure installation of the luminaire modules on the desired surfaces. i The metal clips 30 are applied to the carrier 4 by being pushed laterally. A possible variant is that the metal clips 30 a

Have preload. By means of this pretension they adhere to the carrier after being pushed on from the side. Another method of application provides that

Slide metal clips laterally onto the carrier 4, the

Link tabs penetrate some openings 31 in the metal plate. An undercut is produced by heating the metal clips 30 on at least one side. The connecting tabs can be melted by heating after the metal plates have been pushed on. As a result, the metal clips 30 are fixed on the carrier 4.

With the help of metal bars of different lengths, the metal clips are connected to one another in an electrically conductive manner. Which metal clips are connected to which metal bars depends on the desired electrical circuit. All possible variations are conceivable. In this exemplary embodiment, the metal webs have a material thickness of 0.5 mm. They therefore not only serve to conduct the electrical current but at the same time act as a radiator for dissipating the heat generated during the operation of the light-emitting diodes 5. The light-emitting diodes 5 are electrically conductively connected to at least two metal clips 30. The light-emitting diodes 5 are attached to the metal clips 30, for example, by SMD soldering technology. The solder paste for fastening the metal bars 35 and the light-emitting diodes 5 is applied with great advantage in one working step, whereupon the light-emitting diodes 5 are soldered together with metal clips 30 and metal bars 35 with metal clips 30 in one process step.

FIG. 7 shows the lamp module from FIG. 6 from the bottom view. The openings 31 in the metal clips 30 can also be clearly seen here. The metal webs 35 are applied to the carrier 4 in the bottom view shown in FIG. A heating of the underside of the metal clamps 30 shown here is not provided when the metal clamps 30 are pushed onto the carrier 4, since an undercut on the underside of the carrier 4 is not desirable, since this side should lie as flat as possible on the fastening surface. LIST OF REFERENCE NUMBERS

conductor path

support material

carrier

led

connection contact

material thickness

dimension

narrow side

Tabs ^;

head Start

terminal pins

Ankerpins

sprocket holes

transport strip

connecting webs

Notches trace

conductor path renewal

renewal

arrow

metal clip

opening

connection tab

indentation

opening

metal webs

Claims

1. luminaire module as a component for luminaires, with a carrier (4) consisting of conductor tracks (1, 2, 24, 25) and insulating carrier material (3) and with light-emitting diodes (5) which are connected to the conductor tracks (1, 2, 24, 25) are electrically connected, characterized in that the conductor tracks (1, 2, 24, 25) have a material thickness (8) and radiation surface suitable for dissipating and radiating the heat generated in the light-emitting diodes (5).

!

2. Luminaire module according to claim 1, characterized in that the

Conductor tracks (1, 2, 24, 25) have a material thickness (8) of 0.1 mm to 0.8 mm, preferably 0.5 mm.

3. candlestick module according to claim 1 or 2, characterized in that the

Conductor tracks (1, 2, 24, 25) one or more sections serving as radiation surface with dimensions (9) from several mm to. have several cm.

4. Luminaire module according to one of the preceding claims, characterized in that the conductor tracks (1, 2, 24, 25) are punched from a sheet of suitable thickness.

5. Luminaire module according to one of the preceding claims, characterized in that the carrier material (3) is a plastic suitable for injection molding and that the conductor tracks (1, 2, 24, 25) are partially overmolded by the insulating carrier material (3).

6. Luminaire module according to one of the preceding claims, characterized in that the carrier material (3) is elastic

7. Luminaire module according to one of claims 1 to 4, characterized in that the carrier consists of a plastic frame which is connected to the conductor tracks, preferably by riveting, gluing or locking.

8. Luminaire module according to one of the preceding claims, characterized in that the carrier material (3) consists of a thermally conductive plastic.

9. Luminaire module according to one of the preceding claims, characterized in that the carrier (4) on its rear side facing away from the light-emitting diodes (5) is provided with molded-on anchor pins (18) for fastening the luminaire module to a luminaire housing

10. Luminaire module according to one of the preceding claims, characterized in that the conductor tracks have lateral tabs (12) which are bent around a side edge of the carrier (4) and as

Fastening anchors are used to fasten the light module.

11. Luminaire module according to one of the preceding claims, characterized in that the carrier (4) on its rear side facing away from the light-emitting diodes (5) is provided with a cooling plate (26, 27).

12. Luminaire module according to claim 11, characterized in that the

Cooling plate is at least partially overmolded by the carrier material.

13. Luminaire module according to claim 11 or 12, characterized in that at least one conductor track (24, 25) from the front side of the carrier (4) provided with the light-emitting diodes (5) starting from a side edge of the Carrier (4) is bent into a U-shape and extends as a cooling plate (26, 27) over at least part of the back of the carrier (4).

14. Luminaire module according to one of the preceding claims, characterized in that the carrier (4) is designed essentially in the form of a rectangle and the light-emitting diodes (5) are arranged essentially in a row.

15. Luminaire module according to claim 14, characterized in that the

Conductor tracks (1, 2, 24, 25) run out at least on one narrow side (10) of the carrier (4) into one or more connection pins (16, 17) which project laterally beyond the carrier material (3).

16. Luminaire module according to one of the preceding claims, characterized in that the conductor tracks (1, 2, 24, 25) are connected to the light-emitting diodes (5) by soldering and that between the area of the soldering point

, and the further course of the conductor track (1, 2, 24, 25) an embossed notch (23) is provided as a flow stop for the liquid solder.

'. ^"' I

17. A method for producing a lamp module according to one of the preceding claims, characterized by the following steps:

- The conductor tracks (1, 2, 24, 25) are punched out of a sheet metal, connecting webs (22) for the preliminary mechanical connection of the conductor tracks (1, 2, 24, 25) are left standing.

- The conductor tracks are partially overmolded with plastic (3) and thus a permanent mechanical connection between the conductor tracks (1, 2, 24, 25), the conductor tracks (1, 2, 24, 25) remaining completely or partially free of plastic (3) on the side provided for fastening the light-emitting diodes (5).

- The connecting webs (22) are removed, preferably by stamping, and the light-emitting diodes (5) are attached to the conductor tracks (1, 2, 24, 25), preferably soldered, the connecting webs (22) also after the light-emitting diodes have been attached (5) can be removed.

18. The method according to claim 17, characterized in that the

Luminaire modules are then brought into a predetermined shape by bending.

19. The method according to claim 17 or 18, characterized in that the light-emitting diodes (5) by SMD soldering technology are attached to the conductor tracks (1, 2, 24, 25), the conductor tracks (1, 2, 24, 25) first Provide with a solder paste, then be equipped with the light emitting diodes (5) and the actual soldering is carried out by subsequently inserting the lamp module into a melting furnace.

20. The method according to any one of claims 17 to 19, characterized in that when molding the conductor tracks (1, 2, 24, 25) with plastic (3) from the carrier material (3) anchor pins (18) for fastening the lamp module in one Luminaire housing can be molded.

21. The method according to any one of claims 17 to 20, characterized in that when punching out the conductor tracks (1, 2, 24, 25), the notches (23) intended as a flow stop for liquid solder are formed.

22. The method according to any one of claims 17 to 21, characterized in that the conductor tracks (24, 25) with side extensions (26, 27), which serve as an additional cooling plate, are punched out and that the extensions (26, 27) after Overmoulding the conductor tracks (24, 25) with plastic (3) and removing the temporary connecting webs (22) on the back of the lamp module.

23. The method according to any one of claims 17 to 22, characterized in that the conductor tracks (1, 2, 24, 25) are punched out of any length of sheet metal strip in such a way that two lateral perforated transport strips (20, 21) are formed, which by the Conductor tracks (1, 2, 24, 25) are connected to one another and which in turn are the. Connect conductor tracks (1, 2, 24, 25) to one another to form a chain that the conductor tracks (1, 2, 24, 25) are then connected using the

I.

Transport strips (20, 21) are transported through further processing stations, where they are encapsulated with plastic (3) and equipped with light-emitting diodes (5), and that in a subsequent processing station the connecting webs (22) and the transport strips (20, 21) are punched be removed.

24. Light module according to one of claims 1 to 14, characterized in that the conductor tracks (1) consist of several metal clips (30).

25. Luminous module according to one of claims 1 to 14 and 24, characterized in that the carrier (4) has indentations (33) for receiving the metal clips (30).

26. Light module according to one of claims 1 to 14 and 24 to 25, characterized in that the carrier (4) has connecting lugs (32).

27. Light module according to one of claims 1 to 14 and 24 to 26, characterized in that the metal brackets (30) have fastening openings (31).

28. Light module according to one of claims 1 to 14 and 24 to 27, characterized in that the carrier (4) has openings (34) which are preferably congruent with at least some fastening openings (31) in the metal brackets (30).

29. Luminous module according to one of claims 1 to 14, and 24 to 28, characterized in that at least a part of the metal clips (30) on the carrier (4) are partially connected via metal webs (35).

30. light module according to one of claims 1 to 14 and 24 to 29, characterized in that in each case one light-emitting diode (5) * with at least two metal clips (30) is electrically conductively connected.

31. Luminous module according to one of claims 1 to 14 and 24 to 30, characterized in that the metal webs (35) for dissipating and radiating the heat generated in the light-emitting diodes (5) are punched out of a sheet of suitable material thickness.

32. light module according to one of claims 1 to 14 and 24 to 31, characterized in that the metal webs (35) have a material thickness of 0.1 mm to 0.8 mm, preferably 0.5 mm.

33. Luminous module according to one of claims 1 to 14 and 24 to 32, characterized in that the light-emitting diodes (5) are connected in series on a respective carrier half and the carrier halves are connected in parallel to one another.

4. A method for producing a light module according to one of claims 24 to 33, characterized by the following method steps:

- The metal clips (30) are punched out of a sheet.

- The metal webs (35) are punched out of a sheet.

- The carrier (4) is made of plastic, preferably injection molded.

- The metal webs (35) and the metal brackets (30) are applied to the carrier (4) in such a way that an electrically conductive connection is formed between certain metal brackets (30) and metal webs (35).

- The LEDs (5) are applied to the metal clips (30).

35. The method according to claim 34, characterized in that the application of the metal brackets (30) to the carrier (4) is carried out by laterally sliding prestressed metal brackets (30).

36. The method according to claim 34, characterized in that the application of the metal clips (30) by lateral pushing and pressing, combined with at least one-sided heating of the metal clips (30).

37. The method according to any one of claims 34 to 36, characterized in that after being pushed on, the metal clips (30) are fixed by melting the connecting lugs (32).

38. The method according to any one of claims 34 to 37, characterized in that the light-emitting diodes (5) by soldering technology on the metal clamps (35) are fastened, the metal clips (30) first being provided with a solder paste, then being fitted with the light-emitting diodes (5) and the actual soldering being carried out by subsequently inserting the lamp module into a melting furnace.

39. The method according to any one of claims 34 to 38, characterized in that the light-emitting diodes (5) are soldered to the metal clips (30) in the same process step as the metal webs (35) to the metal clips (30).