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Publication numberWO2001062517 A1
Publication typeApplication
Application numberPCT/JP2001/001253
Publication date30 Aug 2001
Filing date21 Feb 2001
Priority date22 Feb 2000
Also published asCN1200822C, CN1404445A, DE60137117D1, DE60144452D1, EP1258370A1, EP1258370A4, EP1258370B1, EP1843280A1, EP1843280B1, US6779733, US20030029921
Publication numberPCT/2001/1253, PCT/JP/1/001253, PCT/JP/1/01253, PCT/JP/2001/001253, PCT/JP/2001/01253, PCT/JP1/001253, PCT/JP1/01253, PCT/JP1001253, PCT/JP101253, PCT/JP2001/001253, PCT/JP2001/01253, PCT/JP2001001253, PCT/JP200101253, WO 0162517 A1, WO 0162517A1, WO 2001/062517 A1, WO 2001062517 A1, WO 2001062517A1, WO-A1-0162517, WO-A1-2001062517, WO0162517 A1, WO0162517A1, WO2001/062517A1, WO2001062517 A1, WO2001062517A1
InventorsMasanori Akita, Koji Ito, Toshihiro Mori, Yoshio Nogami, Yoshio Kuramoto
ApplicantToray Engineering Company,Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: Patentscope, Espacenet
Noncontact id card or the like and method of manufacturing the same
WO 2001062517 A1
Abstract
This noncontact ID card or the like is constituted by an antenna circuit board having an antenna formed on a substrate and an interposer board on the substrate of which expanding electrodes connected to electrodes of an IC chip embedded in a substrate are formed, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the enlarged electrodes.
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
JPH1050709A * Title not available
JPH1134553A * Title not available
JPH06120296A * Title not available
JPH09186163A * Title not available
JPH09321391A * Title not available
JPH10203060A * Title not available
JPH10329462A * Title not available
Non-Patent Citations
Reference
1 *See also references of EP1258370A4
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
WO2004038793A1 *23 Oct 20036 May 2004Toray Engineering Company,LimitedNon-contact id card and the like and method for manufacturing same
WO2005045919A1 *9 Nov 200419 May 2005Toray Engineering Co.,Ltd.Non-contact id card and manufacturing method thereof
US688254513 Mar 200319 Apr 2005Toray Engineering Company, LimitedNoncontact ID card and method of manufacturing the same
US727569623 Oct 20032 Oct 2007Toray Engineering Company, LimitedNon-contact ID card and the like and method for manufacturing same
US768820610 Jan 200530 Mar 2010Alien Technology CorporationRadio frequency identification (RFID) tag for an item having a conductive layer included or attached
US783889229 Apr 200523 Nov 2010Osram Opto Semiconductors GmbhOptoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip
US891290728 Dec 201216 Dec 2014Alien Technology, LlcRFID tags and processes for producing RFID tags
US907006327 Aug 201230 Jun 2015Ruizhang Technology Limited CompanyRadio frequency identification (RFID) tag for an item having a conductive layer included or attached
US94956327 Aug 201215 Nov 2016Avery Dennison CorporationRFID label technique
Classifications
International ClassificationG06K19/077
Cooperative ClassificationH01L2924/01078, G06K19/07718, H01L2224/16, H01L2224/73204, G06K19/07749, G06K19/07722, H01L2924/01079, G06K19/07752, H01L2224/05026, H01L2224/05001, H01L2224/05022, H01L2224/05571
European ClassificationG06K19/077D, G06K19/077E2, G06K19/077T2A, G06K19/077T
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