WO2001046664A3 - Verfahren zur herstellung mikromechanischer strukturen - Google Patents
Verfahren zur herstellung mikromechanischer strukturen Download PDFInfo
- Publication number
- WO2001046664A3 WO2001046664A3 PCT/EP2000/012672 EP0012672W WO0146664A3 WO 2001046664 A3 WO2001046664 A3 WO 2001046664A3 EP 0012672 W EP0012672 W EP 0012672W WO 0146664 A3 WO0146664 A3 WO 0146664A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- micromechanical structures
- producing micromechanical
- producing
- micromechanical structure
- sawing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49813—Shaping mating parts for reassembly in different positions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0581—Cutting part way through from opposite sides of work
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Manufacture Of Switches (AREA)
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00993537A EP1240529B1 (de) | 1999-12-22 | 2000-12-13 | Verfahren zur herstellung mikromechanischer strukturen |
DE50007326T DE50007326D1 (de) | 1999-12-22 | 2000-12-13 | Verfahren zur herstellung mikromechanischer strukturen |
AT00993537T ATE272845T1 (de) | 1999-12-22 | 2000-12-13 | Verfahren zur herstellung mikromechanischer strukturen |
JP2001547522A JP3651888B2 (ja) | 1999-12-22 | 2000-12-13 | 微細機械構造の製造方法 |
KR1020027008064A KR20020097142A (ko) | 1999-12-22 | 2000-12-13 | 마이크로미케니컬 구조물의 제조방법 |
US10/178,253 US6839962B2 (en) | 1999-12-22 | 2002-06-24 | Method of producing micromechanical structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19962231A DE19962231A1 (de) | 1999-12-22 | 1999-12-22 | Verfahren zur Herstellung mikromechanischer Strukturen |
DE19962231.0 | 1999-12-22 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/178,253 Continuation US6839962B2 (en) | 1999-12-22 | 2002-06-24 | Method of producing micromechanical structures |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001046664A2 WO2001046664A2 (de) | 2001-06-28 |
WO2001046664A3 true WO2001046664A3 (de) | 2001-12-27 |
Family
ID=7933951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/012672 WO2001046664A2 (de) | 1999-12-22 | 2000-12-13 | Verfahren zur herstellung mikromechanischer strukturen |
Country Status (7)
Country | Link |
---|---|
US (1) | US6839962B2 (de) |
EP (1) | EP1240529B1 (de) |
JP (1) | JP3651888B2 (de) |
KR (1) | KR20020097142A (de) |
AT (1) | ATE272845T1 (de) |
DE (2) | DE19962231A1 (de) |
WO (1) | WO2001046664A2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2830125B1 (fr) * | 2001-09-24 | 2006-11-17 | Commissariat Energie Atomique | Procede de realisation d'une prise de contact en face arriere d'un composant a substrats empiles et composant equipe d'une telle prise de contact |
DE10153319B4 (de) * | 2001-10-29 | 2011-02-17 | austriamicrosystems AG, Schloss Premstätten | Mikrosensor |
KR100442830B1 (ko) * | 2001-12-04 | 2004-08-02 | 삼성전자주식회사 | 저온의 산화방지 허메틱 실링 방법 |
DE10232190A1 (de) * | 2002-07-16 | 2004-02-05 | Austriamicrosystems Ag | Verfahren zur Herstellung eines Bauelements mit tiefliegenden Anschlußflächen |
US7754537B2 (en) | 2003-02-25 | 2010-07-13 | Tessera, Inc. | Manufacture of mountable capped chips |
GB0306721D0 (en) * | 2003-03-24 | 2003-04-30 | Microemissive Displays Ltd | Method of forming a semiconductor device |
JPWO2005062356A1 (ja) * | 2003-12-24 | 2007-07-19 | 株式会社日立製作所 | 装置とその製造方法 |
US7026189B2 (en) * | 2004-02-11 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Wafer packaging and singulation method |
US7422962B2 (en) * | 2004-10-27 | 2008-09-09 | Hewlett-Packard Development Company, L.P. | Method of singulating electronic devices |
US7300812B2 (en) * | 2004-10-29 | 2007-11-27 | Hewlett-Packard Development Coompany, L.P. | Micro electrical mechanical system |
DE102004058880B4 (de) * | 2004-12-06 | 2007-12-13 | Austriamicrosystems Ag | Integrierter Mikrosensor und Verfahren zur Herstellung |
FR2879183B1 (fr) * | 2004-12-15 | 2007-04-27 | Atmel Grenoble Soc Par Actions | Procede de fabrication collective de microstructures a elements superposes |
DE102005002304B4 (de) * | 2005-01-17 | 2011-08-18 | Austriamicrosystems Ag | Mikroelektromechanischer Sensor und Verfahren zu dessen Herstellung |
TWI267927B (en) * | 2005-01-19 | 2006-12-01 | Touch Micro System Tech | Method for wafer level package |
US8143095B2 (en) | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
FI119728B (fi) | 2005-11-23 | 2009-02-27 | Vti Technologies Oy | Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti |
US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
US7936062B2 (en) * | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
KR100786848B1 (ko) * | 2006-11-03 | 2007-12-20 | 삼성에스디아이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
US7491581B2 (en) * | 2006-12-22 | 2009-02-17 | Honeywell International Inc. | Dicing technique for flip-chip USP wafers |
US8604605B2 (en) * | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
US7954215B2 (en) * | 2007-03-19 | 2011-06-07 | Epson Toyocom Corporation | Method for manufacturing acceleration sensing unit |
DE102016113347A1 (de) * | 2016-07-20 | 2018-01-25 | Infineon Technologies Ag | Verfahren zum produzieren eines halbleitermoduls |
Citations (3)
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US5668033A (en) * | 1995-05-18 | 1997-09-16 | Nippondenso Co., Ltd. | Method for manufacturing a semiconductor acceleration sensor device |
EP0828346A2 (de) * | 1996-08-29 | 1998-03-11 | Harris Corporation | Einkapselung durch Verbindung einer Abdeckungshalbleiterscheibe und Mikrobearbeitung |
US5923995A (en) * | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
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-
1999
- 1999-12-22 DE DE19962231A patent/DE19962231A1/de not_active Withdrawn
-
2000
- 2000-12-13 KR KR1020027008064A patent/KR20020097142A/ko not_active Application Discontinuation
- 2000-12-13 EP EP00993537A patent/EP1240529B1/de not_active Expired - Lifetime
- 2000-12-13 JP JP2001547522A patent/JP3651888B2/ja not_active Expired - Fee Related
- 2000-12-13 DE DE50007326T patent/DE50007326D1/de not_active Expired - Fee Related
- 2000-12-13 WO PCT/EP2000/012672 patent/WO2001046664A2/de not_active Application Discontinuation
- 2000-12-13 AT AT00993537T patent/ATE272845T1/de not_active IP Right Cessation
-
2002
- 2002-06-24 US US10/178,253 patent/US6839962B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5668033A (en) * | 1995-05-18 | 1997-09-16 | Nippondenso Co., Ltd. | Method for manufacturing a semiconductor acceleration sensor device |
EP0828346A2 (de) * | 1996-08-29 | 1998-03-11 | Harris Corporation | Einkapselung durch Verbindung einer Abdeckungshalbleiterscheibe und Mikrobearbeitung |
US5923995A (en) * | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
Also Published As
Publication number | Publication date |
---|---|
EP1240529B1 (de) | 2004-08-04 |
EP1240529A2 (de) | 2002-09-18 |
DE19962231A1 (de) | 2001-07-12 |
ATE272845T1 (de) | 2004-08-15 |
US6839962B2 (en) | 2005-01-11 |
US20020170175A1 (en) | 2002-11-21 |
JP3651888B2 (ja) | 2005-05-25 |
WO2001046664A2 (de) | 2001-06-28 |
KR20020097142A (ko) | 2002-12-31 |
DE50007326D1 (de) | 2004-09-09 |
JP2003517946A (ja) | 2003-06-03 |
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