WO2001044536A3 - Sputtering targets and method of making same - Google Patents

Sputtering targets and method of making same Download PDF

Info

Publication number
WO2001044536A3
WO2001044536A3 PCT/US2000/033997 US0033997W WO0144536A3 WO 2001044536 A3 WO2001044536 A3 WO 2001044536A3 US 0033997 W US0033997 W US 0033997W WO 0144536 A3 WO0144536 A3 WO 0144536A3
Authority
WO
WIPO (PCT)
Prior art keywords
making same
sputtering targets
manufacture
high quality
sputtering target
Prior art date
Application number
PCT/US2000/033997
Other languages
French (fr)
Other versions
WO2001044536A2 (en
Inventor
Vladimir Segal
Stephane Ferrasse
William B Willett
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Priority to KR1020027007767A priority Critical patent/KR20020074171A/en
Priority to EP00984408A priority patent/EP1242645A2/en
Priority to JP2001545613A priority patent/JP2003517101A/en
Priority to AU21030/01A priority patent/AU2103001A/en
Publication of WO2001044536A2 publication Critical patent/WO2001044536A2/en
Publication of WO2001044536A3 publication Critical patent/WO2001044536A3/en
Priority to HK03101933.5A priority patent/HK1050032A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C23/00—Extruding metal; Impact extrusion
    • B21C23/001—Extruding metal; Impact extrusion to improve the material properties, e.g. lateral extrusion
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering

Abstract

Described is a high quality sputtering target and method of manufacture which involves application of equal channel angular extrusion.
PCT/US2000/033997 1999-12-16 2000-12-15 Sputtering targets and method of making same WO2001044536A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020027007767A KR20020074171A (en) 1999-12-16 2000-12-15 High-strenth sputtering targets and method of making same
EP00984408A EP1242645A2 (en) 1999-12-16 2000-12-15 Sputtering targets and method of making same
JP2001545613A JP2003517101A (en) 1999-12-16 2000-12-15 High strength sputtering target and method for manufacturing the same
AU21030/01A AU2103001A (en) 1999-12-16 2000-12-15 High-strength sputtering targets and method of making same
HK03101933.5A HK1050032A1 (en) 1999-12-16 2003-03-17 Sputtering targets and method of making same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/465,492 US6878250B1 (en) 1999-12-16 1999-12-16 Sputtering targets formed from cast materials
US09/465,492 1999-12-16

Publications (2)

Publication Number Publication Date
WO2001044536A2 WO2001044536A2 (en) 2001-06-21
WO2001044536A3 true WO2001044536A3 (en) 2002-01-03

Family

ID=23848035

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/033997 WO2001044536A2 (en) 1999-12-16 2000-12-15 Sputtering targets and method of making same

Country Status (9)

Country Link
US (5) US6878250B1 (en)
EP (1) EP1242645A2 (en)
JP (1) JP2003517101A (en)
KR (1) KR20020074171A (en)
CN (1) CN1592797A (en)
AU (1) AU2103001A (en)
HK (1) HK1050032A1 (en)
TW (1) TW583327B (en)
WO (1) WO2001044536A2 (en)

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WO2001044536A2 (en) 2001-06-21
US6723187B2 (en) 2004-04-20
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US7767043B2 (en) 2010-08-03
US20020000272A1 (en) 2002-01-03
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US20090020192A1 (en) 2009-01-22
AU2103001A (en) 2001-06-25
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