WO2001010788A1 - Methods for forming a glass-ceramic article - Google Patents

Methods for forming a glass-ceramic article Download PDF

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Publication number
WO2001010788A1
WO2001010788A1 PCT/US2000/021866 US0021866W WO0110788A1 WO 2001010788 A1 WO2001010788 A1 WO 2001010788A1 US 0021866 W US0021866 W US 0021866W WO 0110788 A1 WO0110788 A1 WO 0110788A1
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WIPO (PCT)
Prior art keywords
powder
glass
binder
ceramic
pressure
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Application number
PCT/US2000/021866
Other languages
French (fr)
Inventor
Liang A. Xue
Laura Lindberg
Grenville Hughes
Anthony J. Bernot
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Alliedsignal Inc.
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Filing date
Publication date
Application filed by Alliedsignal Inc. filed Critical Alliedsignal Inc.
Priority to AU66297/00A priority Critical patent/AU6629700A/en
Publication of WO2001010788A1 publication Critical patent/WO2001010788A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0075Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • C03C10/0045Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents

Definitions

  • This invention relates generally to glass-ceramic sensors and transducers and in particular to methods for making the glass-ceramic components of such sensors.
  • Using a ceramic or glass-ceramic has the advantage that its coefficient of thermal expansion can be tailored through composition and firing condition modification to closely match the coefficient of thermal expansion of the alumino-silicate sensor glass plates. Further strengthening and toughening of the glass-ceramic can be achieved with the addition of second phase ceramic fillers.
  • Several glass-ceramic materials have been used to fabricate prototype headers by machining. However, machining is a relatively expensive process.
  • An object of the present invention is to provide a method for fabricating a sensor header or cover from a glass-ceramic.
  • the present invention accomplishes this object by providing an dry pressing process and a slip casting process for fabrication these glass- ceramic components. Both process start with a powder composition of Si0 2 (42-59 wt.%), Al 2 0 3 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0- 20 wt.%), Ti0 2 (0-12 wt.%), ZnO (0-10 wt.%), CaO (0-10 wt.%), B 2 O 3 (0-5 wt%), P 2 0 5 (0-5 wt.%), Zr0 2 (0-5 wt.%), alkali oxides such as K 2 0, Na 2 O (0-3 wt.%) and other small amounts (0-1 wt.%) of additives such as Fe 2 0 3 , V 2 O 5 , As 2 O 3 .
  • ingredients e.g. Mg, Ba, Ca
  • fluoride e.g., MgF 2 , BaF 2 , CaF 2
  • Additional ceramic additives up to 30 wt.% which are as second phase
  • the powder is milled, blended with a binder and then subjected to a drying/granulation process. A die cavity of a desired shape is then filled with the powder. Pressure is then applied to die for a period of time. After the pressure is removed, the green ceramic part is ejected and then sintered at high temperatures to become a dense, finished ceramic cover or header.
  • the powder is milled and dispersed in a water.
  • the slip is then poured or pumped into a permeable casting mold of a desired shape made of Gypsum.
  • the cast green ceramic part is removed from the mold after partial drying. After completely drying under controlled conditions, the green ceramic part can be sintered at high temperatures to become a finished ceramic cover or header.
  • FIG. 1 is a top view of a glass pressure transducer.
  • FIG. 2 is a side view of the pressure transducer of FIG. 1.
  • FIG. 3 is a side view of a glass accelerometer.
  • FIG. 4 is a schematic of the sensor of FIG. 1 mounted in a ceramic housing as contemplated by the present invention.
  • a glass pressure transducer 10 contemplated by the present invention is shown in Figs. 1 and 2.
  • the transducer or sensor 10 includes a top diaphragm 12 and a bottom diaphragm 14 which may be of different thickness made from a glass preferably aluminosilicate glass such CORNING #1723 or # 1737F.
  • Ground shields 18 and 24 are deposited on the outer surfaces of the diaphragms 12 and 14.
  • Electrodes 20 and 22 are deposited in the inner surfaces of the diaphragms 12 and 14.
  • a crossover metal tab 26 preferably made of silver acts as a conductor from the electrode 20 to a top electrode lead 21 .
  • the crossover tab 26 can be made from other metals such as platinum, palladium, or gold.
  • the electrode 22 is connected to a bottom electrode lead 23.
  • a ground lead 25 may also be added.
  • the leads 21 , 23, and 25 are preferably made of a noble metal, preferably platinum. Wires, not shown, may be connected to these leads.
  • the geometry of the electrodes 20, and 22 can be round, square, or other shape. In addition the electrodes can be configured as multiple reference capacitor or pressure capacitors.
  • the ground shields 18, 24 and the electrodes 20, 22 are made of a noble metal preferably platinum.
  • the diaphragms 12 and 14 are bonded together such that the electrodes 20 and 22 form a capacitor.
  • the bond is formed by hydrate bonding, glass friting, or other adhesives.
  • the frit glass 30 acts as a spacer between the diaphragms 12 and 14 and also as a seal to form a cavity 32 between the diaphragms.
  • the cavity 32 can be evacuated to form either a vacuum, some other reference pressure, or left open for gauge pressure measurement.
  • a three piece glass accelerometer 40 can be formed from the pressure transducer 10 by mounting a glass, preferably aluminum silicate, seismic mass 42 between the top and bottom diaphragms 12,14.
  • the seismic mass 42 has an electrode 44 in opposed relationship with electrode 20 and an electrode 46 in opposed relationship with electrode 22.
  • the seismic mass 42 is bonded to the diaphragms 12,14 by frit 48 in such a way as to form cavity 49.
  • the sensor 10 is mounted within a two part glass ceramic housing having a cover 24 and a header or base 36 that define an interior chamber 35.
  • the cover 24 can be made of metal or polymer.
  • the cover 24 and base 36 can be sealed together with glass or ceramic frit 37 or an organic adhesive or a mechanical sealing method.
  • the cover 24 has a pressure inlet port 28 that is in fluid communication with a source of fluid pressure to be measured and with the chamber 35.
  • the base 36 is mounted to electronic circuitry 33.
  • the base 36 has at least one hole through the integral pillar 50 which extends into the chamber 35.
  • the top diaphragm 12 is mounted to the end of the pillar 50 with glass or ceramic frit 37 or other adhesive. At least two metal conducting pins 52 or films, electrically connect top diaphragm 12 through the pillar 50 to the optional electronic circuitry 33 on the base 36.
  • the cover 24 and base 36 can have a variety of shapes such as square, rectangular or circular.
  • the combination of the glass diaphragms and ceramic housing provides high accuracy over a wide range of temperature, because the thermal coefficient of expansion of glass and ceramic are matched.
  • Hermetic sealing of the sensor electrical circuitry ensures long term compatibility with the sensed environment. Capsule mounting techniques minimizes mechanically induced stresses and hysteresis thus maximizing sensor performance. Thus the sensor is made more robust than those in the prior art and can be used with sensing mediums that contain gas or liquid contaminants.
  • a powder of the desired composition is selected.
  • this powder comprises Si0 2 (42-59 wt.%), Al 2 0 3 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0-20 wt.%), Ti0 2 (0-12 wt.%), ZnO (0-10 wt.%), CaO (0-10 wt.%), B 2 0 3 (0-5 wt%), P 2 0 5 (0-5 wt.%), Zr0 2 (0-5 wt.%) alkali oxides such as K 2 O, Na 2 0 (0-3 wt.%) and other small amounts (0-1 wt.%) of additives such as Fe 2 0 3 , As 2 0 3 and V 2 O 5 .
  • ingredients can also be present in the form of fluoride, e.g., BaF 2 , CaF 2 , to up to 10 wt.%.
  • Additional ceramic additives up to 30 wt.% which are as second phase (e.g., Al 2 0 3 , Y 2 0 3 doped Zr0 2 , mullite, zircon, carbides, nitrides and combinations thereof) are not part of the composition, but are introduced to enhance both the mechanical strength and toughness and to further modify the coefficient of thermal expansion.
  • the powder is milled and then blended with a binder (e.g., polyvinyl alcohol, polyvinyl butyral, polyethylene glycol, cellulose, acrylic resins, waxes including microcrystalline wax such as Mobile RD55, the amount of binder being 1 - 8 wt%).
  • a binder e.g., polyvinyl alcohol, polyvinyl butyral, polyethylene glycol, cellulose, acrylic resins, waxes including microcrystalline wax such as Mobile RD55, the amount of binder being 1 - 8 wt
  • the mixture is made more flowable by a drying/granulation process such as spray drying.
  • a die cavity of a desired shape is then filled with the powder. Pressure is then applied to die in a uniaxial, preferably vertical, direction. The die transfers this pressure load onto the powder. The pressure is removed, the die opened, and the green (i.e. unfired) ceramic part is ejected.
  • the green ceramic part can then be sintered at high temperatures to become a dense, finished ceramic cover 24 or header 36.
  • the burnout step can be incorporated into the sintering step.
  • a second method of fabrication the cover 24 and header 36 is a slip casting process that includes the following steps. Starting with the same powder composition as in the dry pressing process previously described, the powder is first milled and dispersed in a liquid, preferably water, with the help of a dispersant or surfactant (preferably polyacrylate or polymethacrylate polymer based dispersant such as Darvan 821A or Darvan C, the amount of which being about 0.1 wt% to 2 wt%), and maybe an additional pH adjustment that is controlling the pH of the slip within the range of about 8 to 1 1 , preferably with the addition of tetramethylammonium hydroxide or ammonium hydroxide.
  • a dispersant or surfactant preferably polyacrylate or polymethacrylate polymer based dispersant such as Darvan 821A or Darvan C, the amount of which being about 0.1 wt% to 2 wt%
  • an additional pH adjustment that is controlling the pH of the slip within the range of about 8 to 1 1 ,
  • a binder may also be introduced at this point in the process
  • the slip is then poured or pumped into a permeable casting mold of a desired shape.
  • the mold is made of Gypsum. Capillary suction of the mold causes the liquid to be filtered from the suspending medium, resulting in a densely packed layer of particles deposited against the mold wall, thus forming a green part. External gas, air or nitrogen, prerssure can be applied to accelerate the process.
  • the cast green ceramic part is removed from the mold for drying under controlled conditions first in a humidity controlled chamber such as a Blue M Vapor- Temp, chamber at 40°C with 85% relative humidity). After completely drying under controlled conditions the green ceramic part can be sintered at high temperatures to become a dense, finished ceramic cover 24 or header 36.
  • a humidity controlled chamber such as a Blue M Vapor- Temp, chamber at 40°C with 85% relative humidity.
  • a glass powder with composition of 49 wt.% Si0 2 , 23 wt% AI 2 O 3 , 23 wt.% MgO, 2 wt.% B 2 0 3 , 2 wt% P 2 0 5 , and 1 wt.% Ti0 2 was mixed with a small amount of CaB 2 0 4 to make a mixture that contained 0.4 wt.% of the latter.
  • the powder mixture was processed and shaped into green sensor support bases by the dry pressing process described in the specification with the sintering at about 1050°C for 1 hour to produce the final dense pressure sensor bases.
  • this powder mixture was processed using the slip casting process described in the specification with the sintering at about 1050°C for 1 hour to produce the final dense pressure sensor base.
  • a number of prototype support bases made in accordance with the methods set forth in this example were proof tested in a pressure sensor assembly. This was done by mounting sensor glass capsules onto the bases using glass frit and testing them over the pressure range of 0-40 inches of mercury and the temperature range of -54 to 107 °C, with high accuracy results.
  • a glass powder was composed of 45 wt.% Si0 2 , 26 wt% Al 2 0 3 , 5 wt.% MgO, 18 wt.% BaO, 5 wt% ZnO, and 1 wt.% Ti0 2 and was processed to produce green sensor bases and then sintered to obtain the final products using both processes as described in Example 1 .
  • a glass powder with composition of 49 wt.% Si0 2 , 28 wt% Al 2 0 3 , 16 wt.% MgO, 3 wt.% CaO, 1 wt.% B 2 0 3 , 1 t% P 2 0 5 , 1 wt.% Ti0 2 and 1 wt.% Zr0 2 was mixed with a small amount of CaB 2 0 4 to make a mixture that contained 0.2 wt.% of the latter.
  • Example 5 A glass powder with composition of 49 wt.% Si0 2 , 23 wt% Al 2 0 3 , 23 wt.% MgO, 2 wt.% B 2 0 3 , 2 wt% P 2 0 5 , and 1 wt.% Ti0 2 was mixed with alumina ceramic powder to make a mixture that contained 10 wt.% alumina ceramic.
  • the mixture was processed to produce green sensor bases and then sintered to obtain the final products using both processes as described in Example 1 , except that the maximum sintering temperature used was 1200°C.

Abstract

A dry pressing and slip casting process is provided for the manufacture of glass-ceramic components of the type used in sensors. Both processes start with a powder composition of SiO2 (42-59 wt.%), Al2O3 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0-20 wt.%), TiO2 (0-12 wt.%), ZnO (0-10 wt.%), CaO (0-10 wt.%), B2O3 (0-5 wt.%), P2O5 (0-5 wt.%), ZrO2 (0-5 wt.%).

Description

METHODS FOR FORMING A GLASS-CERAMIC ARTICLE
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of application Serial No. 08/986,253, filed December 5, 1997.
TECHNICAL FIELD
This invention relates generally to glass-ceramic sensors and transducers and in particular to methods for making the glass-ceramic components of such sensors.
BACKGROUND OF THE INVENTION
Ohnesorge et al, U.S. Patent No. 4,422,335 discloses a pressure transducer made using quartz plates and Bernot, U.S. Patent No. 5, 189,591 discloses a pressure transducer using alumino-silicate glass plates. Whether glass or quartz, these sensors have generally been mounted to headers made of aluminum or stainless steel. Besides being expensive to machine, another disadvantage to these aluminum and stainless steel headers is that it is difficult to hermetically seal the electrical connections to these sensors. Without a hermetic seal, liquid and gas contaminants in the sensing medium can enter and ruin the sensor. As a result these types of sensors can only be used where the pressure medium is contaminant free such as dry gasses. A further advance in sensor technology is disclosed in Bernot et al, U.S. Patent Application Serial Number 08/986,253, filed December 5, 1997, entitled, (as amended), "Capacitive Pressure Sensor Housing Having a Ceramic Base" which is assigned to the assignee of this application. This application discloses a sensor in which the prior art aluminum or stainless steel headers, (also referred to as bases), are replaced with a ceramic header and a cover that is either ceramic or metallic. The cover and header are sealed together with glass frit to define an interior chamber. A capacitive pressure sensor with alumino-silicate glass plates is mounted within the chamber.
Using a ceramic or glass-ceramic has the advantage that its coefficient of thermal expansion can be tailored through composition and firing condition modification to closely match the coefficient of thermal expansion of the alumino-silicate sensor glass plates. Further strengthening and toughening of the glass-ceramic can be achieved with the addition of second phase ceramic fillers. Several glass-ceramic materials have been used to fabricate prototype headers by machining. However, machining is a relatively expensive process.
Accordingly, there is a need for a more economical method of fabricating the sensor header and cover.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a method for fabricating a sensor header or cover from a glass-ceramic. The present invention accomplishes this object by providing an dry pressing process and a slip casting process for fabrication these glass- ceramic components. Both process start with a powder composition of Si02 (42-59 wt.%), Al203 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0- 20 wt.%), Ti02 (0-12 wt.%), ZnO (0-10 wt.%), CaO (0-10 wt.%), B2O3 (0-5 wt%), P205 (0-5 wt.%), Zr02 (0-5 wt.%), alkali oxides such as K20, Na2O (0-3 wt.%) and other small amounts (0-1 wt.%) of additives such as Fe203, V2O5, As2O3. Some of the ingredients (e.g. Mg, Ba, Ca) can also be present in the form of fluoride, e.g., MgF2, BaF2, CaF2, to ups to 10 wt.%. Additional ceramic additives up to 30 wt.% which are as second phase
(e.g., Al203, Y203 doped Zr02, Si02, mullite, zircon, carbides, nitrides, and a combination of the above), are not part of the glass composition, but are introduced to enhance both the mechanical strength and toughness and to further modify the coefficient of thermal expansion. In the dry pressing process the powder is milled, blended with a binder and then subjected to a drying/granulation process. A die cavity of a desired shape is then filled with the powder. Pressure is then applied to die for a period of time. After the pressure is removed, the green ceramic part is ejected and then sintered at high temperatures to become a dense, finished ceramic cover or header.
In the slip casting process, the powder is milled and dispersed in a water. The slip is then poured or pumped into a permeable casting mold of a desired shape made of Gypsum. When either the liquid has been completely sucked away by the mold or the desired depositing thickness has been reached, the cast green ceramic part is removed from the mold after partial drying. After completely drying under controlled conditions, the green ceramic part can be sintered at high temperatures to become a finished ceramic cover or header. These and other objects, features and advantages of the present invention are specifically set forth in or will become apparent from the following detailed description of a preferred embodiment of the invention when read in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a top view of a glass pressure transducer.
FIG. 2 is a side view of the pressure transducer of FIG. 1.
FIG. 3 is a side view of a glass accelerometer.
FIG. 4 is a schematic of the sensor of FIG. 1 mounted in a ceramic housing as contemplated by the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Bernot, U.S. Patent No. 5, 189,591 which issued on February 23,
1993 and is assigned to AlliedSignal Inc. is hereby incorporated by reference. This patent discloses a capacitive pressure transducer having aluminosilicate glass plates.
A glass pressure transducer 10 contemplated by the present invention is shown in Figs. 1 and 2. The transducer or sensor 10 includes a top diaphragm 12 and a bottom diaphragm 14 which may be of different thickness made from a glass preferably aluminosilicate glass such CORNING #1723 or # 1737F. Ground shields 18 and 24 are deposited on the outer surfaces of the diaphragms 12 and 14. Electrodes 20 and 22 are deposited in the inner surfaces of the diaphragms 12 and 14. A crossover metal tab 26 preferably made of silver acts as a conductor from the electrode 20 to a top electrode lead 21 . Alternatively, the crossover tab 26 can be made from other metals such as platinum, palladium, or gold. The electrode 22 is connected to a bottom electrode lead 23. A ground lead 25 may also be added. The leads 21 , 23, and 25 are preferably made of a noble metal, preferably platinum. Wires, not shown, may be connected to these leads. The geometry of the electrodes 20, and 22 can be round, square, or other shape. In addition the electrodes can be configured as multiple reference capacitor or pressure capacitors. The ground shields 18, 24 and the electrodes 20, 22 are made of a noble metal preferably platinum.
The diaphragms 12 and 14 are bonded together such that the electrodes 20 and 22 form a capacitor. The bond is formed by hydrate bonding, glass friting, or other adhesives. The frit glass 30 acts as a spacer between the diaphragms 12 and 14 and also as a seal to form a cavity 32 between the diaphragms. The cavity 32 can be evacuated to form either a vacuum, some other reference pressure, or left open for gauge pressure measurement.
Referring to FIG. 3, a three piece glass accelerometer 40 can be formed from the pressure transducer 10 by mounting a glass, preferably aluminum silicate, seismic mass 42 between the top and bottom diaphragms 12,14. The seismic mass 42 has an electrode 44 in opposed relationship with electrode 20 and an electrode 46 in opposed relationship with electrode 22. The seismic mass 42 is bonded to the diaphragms 12,14 by frit 48 in such a way as to form cavity 49. Referring to FIG. 4, the sensor 10 is mounted within a two part glass ceramic housing having a cover 24 and a header or base 36 that define an interior chamber 35. Alternatively, the cover 24 can be made of metal or polymer. The cover 24 and base 36 can be sealed together with glass or ceramic frit 37 or an organic adhesive or a mechanical sealing method. The cover 24 has a pressure inlet port 28 that is in fluid communication with a source of fluid pressure to be measured and with the chamber 35. In a manner familiar to those skilled in the art, the base 36 is mounted to electronic circuitry 33. The base 36 has at least one hole through the integral pillar 50 which extends into the chamber 35. The top diaphragm 12 is mounted to the end of the pillar 50 with glass or ceramic frit 37 or other adhesive. At least two metal conducting pins 52 or films, electrically connect top diaphragm 12 through the pillar 50 to the optional electronic circuitry 33 on the base 36. The cover 24 and base 36 can have a variety of shapes such as square, rectangular or circular.
The combination of the glass diaphragms and ceramic housing provides high accuracy over a wide range of temperature, because the thermal coefficient of expansion of glass and ceramic are matched.
Hermetic sealing of the sensor electrical circuitry ensures long term compatibility with the sensed environment. Capsule mounting techniques minimizes mechanically induced stresses and hysteresis thus maximizing sensor performance. Thus the sensor is made more robust than those in the prior art and can be used with sensing mediums that contain gas or liquid contaminants.
One method of fabrication the cover 24 and header 36 is a dry pressing process that includes the following steps. A powder of the desired composition is selected. In the preferred embodiment, this powder comprises Si02 (42-59 wt.%), Al203 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0-20 wt.%), Ti02 (0-12 wt.%), ZnO (0-10 wt.%), CaO (0-10 wt.%), B203 (0-5 wt%), P205 (0-5 wt.%), Zr02 (0-5 wt.%) alkali oxides such as K2O, Na20 (0-3 wt.%) and other small amounts (0-1 wt.%) of additives such as Fe203, As203 and V2O5. Some of the ingredients, (e.g. Mg, Ba or Ca) can also be present in the form of fluoride, e.g., BaF2, CaF2, to up to 10 wt.%. Additional ceramic additives up to 30 wt.% which are as second phase (e.g., Al203, Y203 doped Zr02, mullite, zircon, carbides, nitrides and combinations thereof) are not part of the composition, but are introduced to enhance both the mechanical strength and toughness and to further modify the coefficient of thermal expansion.
The powder is milled and then blended with a binder (e.g., polyvinyl alcohol, polyvinyl butyral, polyethylene glycol, cellulose, acrylic resins, waxes including microcrystalline wax such as Mobile RD55, the amount of binder being 1 - 8 wt%). The mixture is made more flowable by a drying/granulation process such as spray drying. A die cavity of a desired shape is then filled with the powder. Pressure is then applied to die in a uniaxial, preferably vertical, direction. The die transfers this pressure load onto the powder. The pressure is removed, the die opened, and the green (i.e. unfired) ceramic part is ejected. After a binder burnout step which is a firing at 400 - 600°C in air, the green ceramic part can then be sintered at high temperatures to become a dense, finished ceramic cover 24 or header 36. Alternateively, the burnout step can be incorporated into the sintering step.
A second method of fabrication the cover 24 and header 36 is a slip casting process that includes the following steps. Starting with the same powder composition as in the dry pressing process previously described, the powder is first milled and dispersed in a liquid, preferably water, with the help of a dispersant or surfactant (preferably polyacrylate or polymethacrylate polymer based dispersant such as Darvan 821A or Darvan C, the amount of which being about 0.1 wt% to 2 wt%), and maybe an additional pH adjustment that is controlling the pH of the slip within the range of about 8 to 1 1 , preferably with the addition of tetramethylammonium hydroxide or ammonium hydroxide. A binder may also be introduced at this point in the process The slip is then poured or pumped into a permeable casting mold of a desired shape. Preferably the mold is made of Gypsum. Capillary suction of the mold causes the liquid to be filtered from the suspending medium, resulting in a densely packed layer of particles deposited against the mold wall, thus forming a green part. External gas, air or nitrogen, prerssure can be applied to accelerate the process. When either the liquid has been completely sucked away by the mold or the desired depositing thickness has been reached (in the latter case any extra slip left over is immediately removed), the cast green ceramic part is removed from the mold for drying under controlled conditions first in a humidity controlled chamber such as a Blue M Vapor- Temp, chamber at 40°C with 85% relative humidity). After completely drying under controlled conditions the green ceramic part can be sintered at high temperatures to become a dense, finished ceramic cover 24 or header 36.
Example 1
A glass powder with composition of 49 wt.% Si02, 23 wt% AI2O3, 23 wt.% MgO, 2 wt.% B203, 2 wt% P205, and 1 wt.% Ti02 was mixed with a small amount of CaB204 to make a mixture that contained 0.4 wt.% of the latter.
The powder mixture was processed and shaped into green sensor support bases by the dry pressing process described in the specification with the sintering at about 1050°C for 1 hour to produce the final dense pressure sensor bases. In a second demonstration, this powder mixture was processed using the slip casting process described in the specification with the sintering at about 1050°C for 1 hour to produce the final dense pressure sensor base. A number of prototype support bases made in accordance with the methods set forth in this example were proof tested in a pressure sensor assembly. This was done by mounting sensor glass capsules onto the bases using glass frit and testing them over the pressure range of 0-40 inches of mercury and the temperature range of -54 to 107 °C, with high accuracy results.
Example 2
A glass powder was composed of 45 wt.% Si02, 26 wt% Al203, 5 wt.% MgO, 18 wt.% BaO, 5 wt% ZnO, and 1 wt.% Ti02 and was processed to produce green sensor bases and then sintered to obtain the final products using both processes as described in Example 1 .
Example 3
A glass powder with composition of 49 wt.% Si02, 28 wt% Al203, 16 wt.% MgO, 3 wt.% CaO, 1 wt.% B203, 1 t% P205, 1 wt.% Ti02 and 1 wt.% Zr02 was mixed with a small amount of CaB204 to make a mixture that contained 0.2 wt.% of the latter.
The material was processed to produce green sensor bases and then sintered to obtain the final products using both processes as described in Example 1. Example 4
A glass powder with composition of 51 wt.% Si02, 21 wt% Al203, 20 wt.% MgO, 1.8 wt.% B203, 1.8 wt% P205, 1.5 wt.% BaO, 1 wt% K20, 0.9 wt.% Ti02, 0.5 wt% Na20 and 0.5 wt.% Li20 was processed to produce green sensor bases and then sintered to obtain the final products using both processes as described in Example 1.
Example 5 A glass powder with composition of 49 wt.% Si02, 23 wt% Al203, 23 wt.% MgO, 2 wt.% B203, 2 wt% P205, and 1 wt.% Ti02 was mixed with alumina ceramic powder to make a mixture that contained 10 wt.% alumina ceramic.
The mixture was processed to produce green sensor bases and then sintered to obtain the final products using both processes as described in Example 1 , except that the maximum sintering temperature used was 1200°C.
Thus processes for the fabrication of ceramic or glass ceramic headers and covers for pressure sensors is provided that replaces the more expensive prior art processes that require machining and finishing operations.
Various modifications and alterations to the above-described preferred embodiment and examples will be apparent to those skilled in the art. Accordingly, these descriptions of the invention should be considered exemplary and not as limiting the scope and spirit of the invention as set forth in the following claims.

Claims

What is claimed is:
1. A method for forming a glass-ceramic article comprising the steps of: a) providing a powder comprising Si02 (42-59 wt.%), Al203 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0-20 wt.%), Ti02 (0-12 wt.%),
ZnO (0-10 wt.%), CaO (0-10 wt.%), B203 (0-5 wt%), P205 (0-5 wt.%),
Zr02 (0-5 wt.%); b) dispersing the milled powder in a liquid to form a slip; c) moving the slip into a permeable casting mold having a desired shape; d) removing a cast green ceramic part from the mold; e) drying the green ceramic part; and f) sintering the green ceramic part until it forms a dense, finished ceramic article.
2. The method of claim 1 wherein said liquid in step (b ) is water.
3. The method of claim 1 wherein step (b) includes adding a dispersant or surfactant.
4. The method of claim 3 wherein step (b) includes the step of adding a pH adjustment.
5. The method of claim 1 further comprising the step of adding binder after step (b).
6. The method of claim 1 wherein step (d) occurs after the liquid has been completely sucked away by the mold.
7. The method of claim 1 wherein step (d) occurs after a desired depositing thickness is reached.
8. The method of claim 7 further including the step removing any excess slip.
9. The method of claim 1 further comprising after step (a) the step of milling the powder.
10. The method of claim 1 further comprising after step (c) the step of applying an external pressure to the mold to accelerate the casting process.
1 1. A method for forming a glass-ceramic article comprising the steps of: a) providing a powder comprising Si02 (42-59 wt.%), Al203 (17-35 wt.%), MgO (2-25 wt.%) and also BaO (0-20 wt.%), Ti02 (0-12 wt.%), ZnO (0-10 wt.%), CaO (0-10 wt.%), B203 (0-5 wt%), P205 (0-5 wt.%), ZrOz (0-5 wt.%); b) mixing the powder with a binder; c) drying and granulating the mixture; d) filling a die cavity of a desired shape with the dried and granulated mixture; e) applying pressure to the die; f) removing the pressure; g) removing the green ceramic from the die; and h) sintering green ceramic part until it forms a dense finished ceramic article.
12. The method of claim 1 1 wherein the binder in step (b) is selected from a group comprising polyvinyl alcohol, polyvinyl butyral, polyethylene glycol, cellulose, acrylic resins, waxes, and microcrystalline wax such as Mobile RD55,
13. The method of claim 12 wherein the amount of binder is between 1 - 8 t%.
14. The method of claim 11 wherein the pressure in step (e) is applied in a uniaxial direction.
15. The method of claim 11 further comprising after step (g) the step of burning out the binder.
16. The method of claim 15 wherein the burning step occurs in air and at a temperature in the range of 400 - 600CC
17. The method of claim 11 further comprising after step (a) the step of milling the powder.
PCT/US2000/021866 1999-08-10 2000-08-10 Methods for forming a glass-ceramic article WO2001010788A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7947214B1 (en) * 2004-11-06 2011-05-24 Rapp Jame E Process and product for making ceramic materials for semiconductor doping

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006018049B4 (en) * 2006-04-10 2008-10-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ceramic pressure sensors and process for their preparation
DE102007035997A1 (en) * 2007-07-30 2009-02-05 Innovative Sensor Technology Ist Ag Device for determining and / or monitoring a process variable
US8795581B2 (en) * 2010-05-31 2014-08-05 Council Of Scientific & Industrial Research Process for manufacturing high density slip-cast fused silica bodies
CN102336566A (en) * 2010-07-28 2012-02-01 鸿富锦精密工业(深圳)有限公司 Composite target and preparation method thereof
DE102011081887A1 (en) * 2011-08-31 2013-02-28 Robert Bosch Gmbh Polymer layer system pressure sensor device and polymer layer system pressure sensor method
DE102014219442A1 (en) * 2014-09-25 2016-03-31 Schott Ag Non-porous ceramic component
FR3032791B1 (en) * 2015-02-18 2018-09-07 L'essor Francais Electronique MINIATURE METAL MEMBRANE PRESSURE SENSOR AND METHOD FOR MANUFACTURING THE SAME
CN111908797B (en) * 2020-07-28 2022-05-03 电子科技大学 Low-thermal-expansion cordierite-based microcrystalline glass material and preparation method thereof
CN113121116B (en) * 2021-05-11 2022-11-22 景德镇陶瓷大学 Microcrystalline glass solder, preparation method thereof and method for connecting alumina ceramics
CN113480179A (en) * 2021-08-03 2021-10-08 闻喜县英发玻璃制品有限公司 Microcrystalline ceramic articles and methods of making the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940255A (en) * 1974-08-05 1976-02-24 Ferro Corporation Process for making cordierite glass-ceramic having nucleating agent and increased percent cordierite crystallinity
US4649070A (en) * 1984-12-14 1987-03-10 Ngk Spark Plug Co., Ltd. Substrate for an integrated circuit
JPH059039A (en) * 1991-06-28 1993-01-19 Hoya Corp Crystallized glass
US5189591A (en) * 1992-06-12 1993-02-23 Allied-Signal Inc. Aluminosilicate glass pressure transducer
US5250474A (en) * 1991-02-07 1993-10-05 Schott Glaswerke Glass powder which is crystallizable to yield a sintered glass ceramic containing hexagonal cordierite as the principal crystalline phase
WO1998041830A1 (en) * 1997-03-20 1998-09-24 Alliedsignal Inc. Ceramic pressure sensor capsule

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3232114A (en) 1962-06-15 1966-02-01 Acton Lab Inc Pressure transducer
US3715220A (en) * 1969-03-19 1973-02-06 Corning Glass Works Ceramic article and method of making it
GB1354025A (en) 1970-05-25 1974-06-05 Medicor Muevek Capacitive pressure transducer
US3962921A (en) 1972-02-04 1976-06-15 The Garrett Corporation Compensated pressure transducer
US3965746A (en) 1974-11-04 1976-06-29 Teledyne Industries, Inc. Pressure transducer
US3966449A (en) 1975-02-10 1976-06-29 International Business Machines Corporation Sealing glass composition and process
US4426673A (en) 1976-03-12 1984-01-17 Kavlico Corporation Capacitive pressure transducer and method of making same
US4101952A (en) 1976-08-17 1978-07-18 Sprague Electric Company Monolithic base-metal glass-ceramic capacitor
US4200445A (en) * 1977-04-28 1980-04-29 Corning Glass Works Method of densifying metal oxides
US4184189A (en) 1978-08-14 1980-01-15 Motorola, Inc. Capacitive pressure sensor and method of making it
US4221047A (en) 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4364883A (en) * 1979-04-23 1982-12-21 Owens-Corning Fiberglas Corporation Ceramic products and method of drying same
JPS57143203A (en) 1981-02-27 1982-09-04 Taiyo Yuden Kk Conductive paste for forming conductive layer by baking on porcelain
US4422335A (en) 1981-03-25 1983-12-27 The Bendix Corporation Pressure transducer
US4396721A (en) 1981-08-05 1983-08-02 Lawless William N Glass ceramic materials having controllable temperature coefficients of dielectric constant
US4405970A (en) 1981-10-13 1983-09-20 United Technologies Corporation Silicon-glass-silicon capacitive pressure transducer
FI75426C (en) 1984-10-11 1988-06-09 Vaisala Oy ABSOLUTTRYCKGIVARE.
US4689999A (en) 1985-07-26 1987-09-01 The Garrett Corporation Temperature compensated pressure transducer
US4926696A (en) 1986-11-19 1990-05-22 Massachusetts Institute Of Technology Optical micropressure transducer
FI872049A (en) 1987-05-08 1988-11-09 Vaisala Oy KONDENSATORKONSTRUKTION FOER ANVAENDNING VID TRYCKGIVARE.
US4876892A (en) 1988-04-19 1989-10-31 Allied-Signal Inc. Pressure sensor
DE3901492A1 (en) 1988-07-22 1990-01-25 Endress Hauser Gmbh Co PRESSURE SENSOR AND METHOD FOR THE PRODUCTION THEREOF
US5049421A (en) 1989-01-30 1991-09-17 Dresser Industries, Inc. Transducer glass bonding technique
US4998179A (en) 1989-02-28 1991-03-05 United Technologies Corporation Capacitive semiconductive sensor with hinged diaphragm for planar movement
DE3909185A1 (en) 1989-03-21 1990-09-27 Endress Hauser Gmbh Co CAPACITIVE PRESSURE SENSOR AND METHOD FOR THE PRODUCTION THEREOF
US5189916A (en) 1990-08-24 1993-03-02 Ngk Spark Plug Co., Ltd. Pressure sensor
JP2724419B2 (en) 1990-08-28 1998-03-09 日本特殊陶業株式会社 Pressure sensor
JPH04143627A (en) 1990-10-05 1992-05-18 Yamatake Honeywell Co Ltd Capacitance type pressure sensor and manufacture thereof
US6012304A (en) * 1991-09-30 2000-01-11 Loxley; Ted A. Sintered quartz glass products and methods for making same
JP2896725B2 (en) 1991-12-26 1999-05-31 株式会社山武 Capacitive pressure sensor
US5317919A (en) 1992-06-16 1994-06-07 Teledyne Industries, Inc. A precision capacitor sensor
EP0596711B1 (en) 1992-11-06 1998-01-21 Texas Instruments Incorporated Method of fabricating a capacitive pressure transducer
US5440931A (en) 1993-10-25 1995-08-15 United Technologies Corporation Reference element for high accuracy silicon capacitive pressure sensor
US5436795A (en) 1994-03-28 1995-07-25 Texas Instruments Incorporated Pressure transducer apparatus and method for making same
US5446616A (en) 1994-03-28 1995-08-29 Litton Systems, Inc. Electrode structure and method for anodically-bonded capacitive sensors
US5485345A (en) 1994-11-14 1996-01-16 Texas Instruments Incorporated Pressure transducer apparatus
US5499158A (en) 1994-11-14 1996-03-12 Texas Instruments Incorporated Pressure transducer apparatus with monolithic body of ceramic material
US5486976A (en) 1994-11-14 1996-01-23 Texas Instruments Incorporated Pressure transducer apparatus having a rigid member extending between diaphragms
US5528452A (en) 1994-11-22 1996-06-18 Case Western Reserve University Capacitive absolute pressure sensor
DE19509250C1 (en) 1995-03-15 1996-09-12 Bosch Gmbh Robert Method of manufacturing a pressure sensor
US5578528A (en) 1995-05-02 1996-11-26 Industrial Technology Research Institute Method of fabrication glass diaphragm on silicon macrostructure
JP3114570B2 (en) 1995-05-26 2000-12-04 オムロン株式会社 Capacitive pressure sensor
US5757608A (en) 1996-01-25 1998-05-26 Alliedsignal Inc. Compensated pressure transducer
DE19622522C1 (en) * 1996-06-05 1998-01-22 Schott Glaswerke Production of sealed sintered glass ceramic for household equipment
US5740594A (en) 1996-07-22 1998-04-21 Texas Instruments Incorporated Method for making a fluid pressure transducer
US5954850A (en) 1996-11-22 1999-09-21 Bernot; Anthony J. Method for making glass pressure capacitance transducers in batch
US5840107A (en) 1998-03-25 1998-11-24 Motorola, Inc. Binder solution for a sealing composition and method of use
US6248680B1 (en) 1999-06-01 2001-06-19 Alliedsignal, Inc. Low temperature burnout screen printing frit vehicles and pastes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940255A (en) * 1974-08-05 1976-02-24 Ferro Corporation Process for making cordierite glass-ceramic having nucleating agent and increased percent cordierite crystallinity
US4649070A (en) * 1984-12-14 1987-03-10 Ngk Spark Plug Co., Ltd. Substrate for an integrated circuit
US5250474A (en) * 1991-02-07 1993-10-05 Schott Glaswerke Glass powder which is crystallizable to yield a sintered glass ceramic containing hexagonal cordierite as the principal crystalline phase
JPH059039A (en) * 1991-06-28 1993-01-19 Hoya Corp Crystallized glass
US5189591A (en) * 1992-06-12 1993-02-23 Allied-Signal Inc. Aluminosilicate glass pressure transducer
WO1998041830A1 (en) * 1997-03-20 1998-09-24 Alliedsignal Inc. Ceramic pressure sensor capsule

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
KIM B H ET AL: "CRYSTALLIZATION AND SINTERABILITY OF CORDIERITE-BASED GLASS POWDERSCONTAINING CEO2", JOURNAL OF MATERIALS SCIENCE,GB,CHAPMAN AND HALL LTD. LONDON, vol. 29, no. 24, 15 December 1994 (1994-12-15), pages 6592 - 6598, XP000484657, ISSN: 0022-2461 *
MARGHUSSIAN V K ET AL: "Fabrication of cordierite glass ceramics by slip casting of glass powders", BR CERAM TRANS;BRITISH CERAMIC TRANSACTIONS 1999 INST OF MATERIALS, LONDON, ENGL, vol. 98, no. 3, June 1999 (1999-06-01), pages 133 - 140, XP002152456 *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 270 (C - 1063) 26 May 1993 (1993-05-26) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7947214B1 (en) * 2004-11-06 2011-05-24 Rapp Jame E Process and product for making ceramic materials for semiconductor doping

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