WO2001006543A2 - Microelectromechanical device with moving element - Google Patents
Microelectromechanical device with moving element Download PDFInfo
- Publication number
- WO2001006543A2 WO2001006543A2 PCT/IL2000/000431 IL0000431W WO0106543A2 WO 2001006543 A2 WO2001006543 A2 WO 2001006543A2 IL 0000431 W IL0000431 W IL 0000431W WO 0106543 A2 WO0106543 A2 WO 0106543A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- moving element
- substrate
- beams
- mems device
- actuating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 203
- 230000003287 optical effect Effects 0.000 claims abstract description 105
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000005459 micromachining Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 35
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 239000013013 elastic material Substances 0.000 claims description 24
- 230000005684 electric field Effects 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 15
- 230000003068 static effect Effects 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 11
- 239000006096 absorbing agent Substances 0.000 claims description 9
- 239000000411 inducer Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 7
- 239000000835 fiber Substances 0.000 description 45
- 230000033001 locomotion Effects 0.000 description 30
- 239000013307 optical fiber Substances 0.000 description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 12
- 229920005591 polysilicon Polymers 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 10
- 230000005291 magnetic effect Effects 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 238000004377 microelectronic Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 230000000930 thermomechanical effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000002178 crystalline material Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005292 diamagnetic effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002906 microbiologic effect Effects 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- HLXZNVUGXRDIFK-UHFFFAOYSA-N nickel titanium Chemical compound [Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni] HLXZNVUGXRDIFK-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00214—Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
- G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
- G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
- G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/045—Optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/051—Translation according to an axis parallel to the substrate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
- G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
- G02B6/3514—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element moving along a line so as to translate into and out of the beam path, i.e. across the beam path
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
- G02B6/3554—3D constellations, i.e. with switching elements and switched beams located in a volume
- G02B6/3556—NxM switch, i.e. regular arrays of switches elements of matrix type constellation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
- G02B6/357—Electrostatic force
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
- G02B6/3572—Magnetic force
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
- G02B6/3576—Temperature or heat actuation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
- G02B6/3578—Piezoelectric force
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
- H04Q2011/0007—Construction
- H04Q2011/0026—Construction using free space propagation (e.g. lenses, mirrors)
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
- H04Q2011/0007—Construction
- H04Q2011/0026—Construction using free space propagation (e.g. lenses, mirrors)
- H04Q2011/003—Construction using free space propagation (e.g. lenses, mirrors) using switches based on microelectro-mechanical systems [MEMS]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
- H04Q2011/0052—Interconnection of switches
- H04Q2011/0056—Clos
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
- H04Q2011/0052—Interconnection of switches
- H04Q2011/0058—Crossbar; Matrix
Definitions
- the present invention relates to the field of microelectromechanical systems and, more particularly, to microelectromechanical or micromechanical devices that actuate a moving element between operative positions to provide, for example, a switching operation.
- MEMS microelectromechanical system
- a MEMS device may be monolithically integrated with driving, control, and/or signal processing microelectronics to improve performance and further reduce the cost of manufacturing, packaging, and instrumenting the device.
- MEMS microelectromechanical
- the term microelectromechanical (MEMS) device is intended to embrace devices that arc physically small and have at least one component produced using micromachining
- MEMS device includes microactuators, micromechanical devices, and micromachine devices.
- information is transmitted as a light or laser
- Switches are needed to route signals at the backbone and gateway levels of these networks where one network connects with another, as well as at the sub-network level where data is being transported from its origin or to its destination.
- WDM wavelength division multiplexed
- many channels, each ⁇ occupying a distinct wavelength of light may share the same fiber.
- optical add-drop multiplexers and demultiplexers are used to introduce supplementary optical channels into the main optical fiber path and/or divert optical channels from the main fiber path.
- optical switching technologies have been employed.
- electrical cross connect switch technology the optical signal is transformed into an electrical signal, a switching operation is performed with an electronic switch, and the electrical signal is then transformed back into the optical domain.
- electrical cross connects are inefficient and costly.
- Another prior art solution is to use an optical switch or cross-connect (OXC) capable of connecting and disconnecting optical fibers in the optical domain.
- OXC optical switch or cross-connect
- optical OXC devices have been used for this purpose. These devices are constructed of a material, such as lithium iobate, generally in a planar waveguide configuration that allows switching action to take place between various input and output ports. These switching devices do not add a latency or delay to the optical data.
- integrated optical devices have several drawbacks: they are relatively expensive; their minimum size is limited by the physics of optical waveguides; their operation depends strongly on wavelength and is sensitive to polarization; and they result in considerable cross talk and signal attenuation in the fiber optic paths.
- optical switches based on emerging MEMS technology including
- micromechanical or micromachined systems boast considerable promise for overcoming many of the limitations associated with alternative prior art fiber-optic switching technologies.
- Optical MEMS systems also referred to as microoptoelectromechanical systems (MOEMS)
- MOEMS microoptoelectromechanical systems
- These types of optical switches can be made very compact and small, typically
- the insertion loss of a MOEMS switch interface is comparable to alternative technologies, and occurs mainly at the entry port of the switch where light leaves a first optical fiber and at the exit port of the switch where light re-enters a second optical fiber. These losses are due to the enlargement of the beam dimensions in free space, however, as will be appreciated by those skilled in the art, using appropriate
- the medium of a MOEMS switch is typically air, but a vacuum, inert gas, or other suitable fluid may also be used.
- the transmission of light within the switch medium amounts for only a small portion of the overall attenuation. Additionally, the non-blocking medium of the switch ensures that no interference occurs when different light paths cross, enabling light beams to traverse without mutual effect,
- micromachined optical switches often use small mirrors that move to 0 . . . . perform a switching operation.
- the moving element By actuating the moving element between a first position in which a light beam is allowed to pass unaffected by the mirror and a second mirror position in which the moving element reflects or interferes with the light beam, the path of an input light beam can be redirected into different outputs or otherwise interfered with.
- the use of mirrors in particular, is advantageous since they operate independently of wavelength when 5 reflecting an optical beam.
- MEMS switches or valves may also use other types of moving elements such as attenuators, filters, lenses, collimators, modulators, and absorbers to perform a desired switching operation.
- a mirror or other optical element should be very smooth and of optical grade.
- the principle and means used to actuate the moving element of a MEMS device should be fast, simple, and provide reproducible and accurate alignment of the moving element.
- the actuator must be able to move that element by a sufficient amount to accomplish the switching task.
- 5 5,995,688 also disclose several embodiments of a MEMS optical switching device having an actuator that is mechanically linked to an optical interrupter such as a modulator or mirror.
- the actuator is provided on a support substrate, and the optical interrupter is vertically or perpendicularly disposed to the surface of the substrate.
- the actuator which includes a moveable and a fixed electrode, imparts a motion to a mechanical linkage that in
- Jerman et al. in United States Patent No. 5,998,906 discloses an electrostatic microactuator having first and second electrode comb drive assemblies, one fixed to a substrate and the other moveable thereupon. A mirror aligned perpendicularly to the surface of the substrate is actuated between a retracted and an extended position to
- Riza et al. in United States Patent No. 5,208,880 discloses an optical micrc ⁇ iynamical switch having a mirror securely and mechanically coupled to a piezoelectric actuator which, in turn, is disposed on a substrate.
- the mirror is oriented perpendicularly to the substrate and at an angle of 45 "to incident light. By translating the mirror, reflected light is selectively directed into a desired
- the optical moving element or mirror of these MEMS switching devices is positioned vertically or perpendicularly with respect to the substrate surface, typically by etching into a wafer or substrate.
- the position of the optical moving element is subject to deviations from the desired normal angle of 90°, resulting in additional losses being inserted within the system as well as a possible reduction in accuracy and/or repeatability.
- the horizontal translation of a vertically positioned mirror may be considerably slowed by air resistance against the surface of the mirror.
- United States Patent No. 5,774,604 to McDonald discloses a reflective micromechanical structure positioned on the support surface of a well, between an input fiber and at least two output fibers. If the structure is in an unaddressed state, parallel to the
- Dhuler et al. in United States Patent No. 5,962,949 disclose a MEMS micro-positioning device designed to precisely position objects during micro- assembly, manipulation of microbiological specimens, or alignment of an optical fiber with another optical element.
- the device includes a reference surface/substrate, a support fixed to the surface, and a stage.
- the object, e.g. a fiber, that is to be manipulated or aligned is placed on the stage, preferably in a notch or other receptacle.
- the stage is suspended above the reference surface, and the support is disposed adjacent to at least one and preferably two sides of the stage by means of springs.
- First and second actuators on the support are used to move the stage, and objects carried by the stage, in perpendicular directions within a horizontal plane.
- the actuators include a number of thermally activated arched beams that are connected to an actuator member that extends toward the stage. When the beams are heated, they expand toward the stage causing the actuator member to push the stage in a fixed direction.
- One or more vertical actuators are used to bend the stage, and thereby move the specific portion of the surface of the stage on which the object is located in a desired vertical direction. Due to the nature, shape, and bending of the stage, the MEMS actuator disclosed by Dhuler ct al. is not suitable for precisely holding a generally flat or planar shaped element such as a mirror.
- the actuator is only capable of moving the stage within a small range of travel for alignment purposes. This is insufficient to accommodate a moving element that must be actuated along a relatively long travel path, as for example in an optical switch where the element is selectively actuated out of and into the path of an optical signal Consequently, the MEMS actuator disclosed by Dhuler et al. is inappropriate for use as an optical switch that actuates a moving element such as a mirror.
- the dynamic friction tends to wear the device components and reduce the reliability and positioning accuracy of the device.
- the moving element of these MEMS devices are generally attached to the substrate or a support component of the device by means of weights, springs, clamps, or other like mechanisms. Again, because these parts are in physical contact with one another, there is dynamical friction during actuation and the parts may wear, leading to reduced 0 device accuracy.
- the present invention provides a microelectromechanical (MEMS) device having a generally planar moving element disposed in parallel to the surface of a substrate; and an 0 actuator operatively engageable with the moving element for selectively moving the element between a first position in a plane horizontal to the surface of the substrate and a second position in that plane.
- the moving element preferably travels in a linear path, but others paths such as radial are also possible.
- the device is particularly suitable for use as an optical switch where the moving 5 element alters the characteristics of an optical beam when in the first position but does not affect the optical beam when in the second position.
- the moving element preferably comprises a mirror, but it may also comprise a modulator, lens, collimator, attenuator, filter, or absorber.
- the substrate may include a zone which is penetrable by the optical beam and the optical beam may be directed at the device so that the optical beam 0 passes through the penetrable zone when the moving element is in the second position.
- the penetrable zone may be an aperture formed within the substrate or it may comprise an optically transparent material.
- the actuator comprises an elastic material having a surface and positioned between the substrate and the moving element.
- the actuator further includes an -5 elastic wave inducer for generating a traveling elastic wave on the surface of the elastic material.
- the elastic wave inducer may comprise a first substrate electrode, a second substrate electrode, a ground electrode coupled between the moving element and the surface of the elastic material, and circuitry for providing a first AC electric signal between the first substrate electrode and the ground electrode and a second AC electric signal between the second substrate electrode and the ground electrode.
- the first and second AC electric signals are out of phase with one another so that a traveling elastic wave is generated.
- the actuator comprises a plurality of elongated actuating beams spaced perpendicularly to and along a travel path of the moving element.
- Each beam extends substantially parallel to the surface of the substrate and has a tip, and a base that is rigidly fixed with respect to the substrate.
- the actuator further includes a beam actuator that controllably moves the actuating beams so that the beams that are positioned along the portion of the travel path in which the moving element is located intermittently engage the moving element and thereby move the moving element in a desired direction along the travel path.
- the beams are preferably conductive and the beam actuator preferably comprises, for each actuating beam: a first electrode connected to the substrate and positioned vertically from that actuating beam with respect to the surface of the substrate; a second electrode connected to the substrate and positioned horizontally from the actuating beam with respect to the surface of the substrate; and circuitry for controllably generating a first electric field between the first electrode and the actuating beam to move that actuating beam in a vertical direction with respect to the surface of the substrate, and a second electric field between the second electrode and the actuating beam to move that actuating beam in a horizontal direction with respect to the surface of the substrate.
- the plurality of actuating beams preferably comprises a first set of actuating beams spaced along the first edge of the travel path: and a second set of actuating beams spaced along the second edge of the travel path, the beam actuator controllably moving the tips of the beams in the first set synchronously with the tips of the beams in the second set.
- adjacent ones of the actuating beams that are located along the edge of the portion of the travel path in which the moving element is located may rotate out of phase so that the intermittent engagement of the moving element by adjacent tips in each set is successive.
- the actuating beams that are located along the edge of the portion of the travel path in which the moving element is located may rotate in phase so that the intermittent engagement of the moving element by said beams in each set is simultaneous.
- the moving element preferably includes a conductive component
- the device further comprises at least one substrate electrode and circuitry for generating an electric field between the conductive component and the substrate electrode or electrodes to hold the moving element by means of static friction.
- the device is preferably fabricated using micromachining techniques, and with the moving element fabricated in a position parallel to the surface of the substrate. More preferably, surface micromachining techniques are employed in which a plurality of material layers are sequentially deposited and etched. Arrays of the devices may also be provided on a common substrate, each device having its own moving element and actuator.
- Fig. 1 is an isometric view of the general configuration of a MEMS device in accordance with the present invention
- Fig.lA is a cross-sectional view of the device taken along the line 1 A-1A in Fig. 1;
- Fig. 2 shows the shape and motion of a moving element of the device in a preferred embodiment of the present invention
- Fig. 3 shows an alternative shape and motion of the moving element
- Fig. 4 shows the substrate of an optical switch MEMS device
- Fig. 5 shows a MEMS optical cross connect switch
- Figs 6A-6D illustrate the operation of the device as a lxl (ON/OFF) optical switch
- Figs. 7 A and 7B illustrate the operation of the device as a 1x2 optical switch
- Figs. 8A-8D illustrate another embodiment of a 1x2 optical switch
- Figs. 9A and 9B illustrate an adaption of the 1x2 switch of Figs. 8A-8D to form a
- Figs. 10A-10D show a preferred actuator for the MEMS device of the present invention based upon the inducement of elastic or stress waves in an elastic material;
- Fig. 1 1 shows a preferred configuration for holding the moving element to the actuator of the device;
- Fig. 12 is a top plan view of the MEMS device of the present invention comprising another preferred actuator that uses actuating beams;
- Figs.l3A-13B illustrate the relative positioning of an actuating beam and corresponding electrodes for electrostatically actuating the beam
- Figs. 14A-14B show cross-sectional side views of the device and actuator of Fig. 12;
- Figs. 15A-15F show and illustrate the operation of the actuator of Fig. 12;
- Figs. 16A-16B illustrate the operation of an actuator based on a variation of the actuator of Fig. 12;
- Fig. 17 illustrates a possible adaption to the actuator of Figs 16A-16B to ensure that the moving element's motion is linear;
- Figs. 18A-18D illustrate the operation of another possible actuator for use in the MEMS device of the present invention
- Fig. 19 shows an isometric view of the MEMS device use as an optical switch and comprising an actuator operating as described above in connection with Figs. 16A-16B;
- Fig. 20 shows a 3 x 3 common substrate array of the switches shown in Fig. 19;
- Figs 21 A-21I illustrate possible steps in fabricating the MEMS device of the present invention.
- Fig. 1 shows an isometric view of the general configuration of a MEMS switch or valve device 100 in accordance with the present invention.
- the device 100 includes a substrate 102 having a surface 104.
- a moving or switching element 106 has a generally flat main portion is disposed in parallel to the substrate 102, above the surface 104.
- moving element 106 may also have support wings, legs or other appendage-like members that are connected to the main portion of element 106 (not shown in Fig.1 ).
- a cross-sectional view of the device 100 taken along the line 1 A-l A in Fig. 1 is shown in Fig. 1 A.
- the main portion of moving element 106 has a first major surface 108 facing away from substrate 102 and a second major surface 110 that faces substrate 102, and more specifically surface 104 of substrate 102.
- moving element 106 or more specifically the main portion thereof, is preferably separated from substrate 102 by a short distance h.
- element 106 when device 100 performs a switching or actuation operation, element 106 is selectively moved to a different operative position in the horizontal plane located a distance h above substrate 102. While moving between operative positions in the horizontal plane, i.e. during actuation, moving element 106 may temporarily leave the horizontal plane.
- moving element 106 may be located on the surface 104 of substrate 102 above an aperture therein (i.e. h may equal zero), moving element 106 may be recessed within an aperture of substrate 102 (i.e. h may be slightly negative), or moving element 106 may be located on the other side of substrate 102 (i.e. h may have a relatively large negative value).
- moving element 106 is disposed horizontally or in parallel to substrate 102.
- MEMS device 100 is particularly suitable for use as an optical switch or valve in a fiber optic communication network, however the advantages of MEMS device 100 of the present invention may also be exploited in many other applications.
- device for example, device
- moving element 106 may be used as a conveyor, an acoustic wave switch with moving element 106 being an acoustic wave mirror or absorber.
- moving element 106 is used to selectively reflect, diffract, refract, collimate, absorb, attenuate, or otherwise alter or modulate the properties and/or path of a light beam. Consequently, moving element 106 may be an optical mirror, modulator, lens, collimator, attenuator, filter, or absorber for
- moving element 106 may preferably be a reflective mirror.
- moving element 106 may be rectangular and may move in a linear direction within a travel path, defining a range of travel, in the horizontal plane.
- element 106 may have a travel path along the line defined by 0 arrows 112 or the line defined by arrows 114. More generally, moving element 106 may move in any linear direction within the horizontal plane.
- the moving element may be sector-shaped, as shown at 116, and may move in a radial or pendulum- like motion about a point 120, as shown by arrows 118.
- the motion of element may 106 may be a combination of rotational and 5 translational motion.
- the main portion of moving element 106 is generally flat but otherwise may be of a shape other than those shown in Figs. 2 and 3, such as circular or elliptical.
- Substrate 102 is a semiconductor wafer substrate which may be fabricated using well known integrated circuit processing techniques.
- the substrate is preferably silicon based, 0 but other materials such as glass, polymers, or metals may also be used.
- An actuator which may comprise microelectronic components, is preferably built in or on substrate 102 and serves to actuate the desired movement of moving element 106, as described in detail below.
- Substrate 102 is preferably produced with atom smooth surfaces and a high degree of parallelism and linearity.
- substrate 5 102 may include a first zone 130 through which light 150 from an optical fiber 155 does not penetrate, and a second zone 140 which is transparent to light beam 150.
- a baseline 135 separates the zones 130 and 140.
- the switching or actuation of element 106 preferably occurs at least partially above the second zone 140, and in a direction parallel to or perpendicular to baseline 135.
- the second zone 140 may, for example, comprise a
- the substrate may simply be absent in zone 140, as long as sufficient structural support for device 100 is otherwise provided.
- zone 140 may be a hole or aperture etched through substrate 102, and which is surrounded by zone 130 (e.g. see Fig. 8 A).
- the zones 130 and 140 may be located on substrate 102 in any number of ways, and it is also possible for substrate 102 to have more than one zone
- substrate 102 may comprise an optically transparent material such as glass.
- device 100 when device 100 is configured as a MEMS optical cross connect switching device 160, it may have a support structure 165 which receives M input optical
- Fibers 170 and 180 may, for example, be standard 125 ⁇ m fibers, and each of N and M may be greater than or equal to 1.
- Any support structure 165 is preferably integrated with substrate 102, and is at least connected thereto. Where the medium of switch 1 0 is a vacuum or contains an inert gas,
- support structure 165 is a closed structure. To minimize dispersion of the light outside the confinement of the optical fibers, fibers 170 and 180 are carefully aligned and also placed as close as possible to the moving element of the switch without affecting or impeding the movement of that element.
- Figs 6A-6D illustrate the operation of device 100 as a lxl (ON/OFF) optical switch
- Figs 6A and 6B show the switch 200 in a first or ON position in which light beam 150 exits input fiber 170, travels through zone 140 of substrate 102, and re-enters output fiber 180, unaffected by the moving element 106 of switch 200.
- Fig. 6B is a top view of switch 200 along the direction of arrows 6B-6B in Fig. 6A. As described above, light 150 passes through the penetrable zone 140 of substrate 102 before entering output fiber 180 as shown
- Figs. 6C and 6D show the switch 200 in a second or OFF position in which moving element 106 has moved, parallel to substrate 102, into the path of light 150 so that light 150 is now incident thereupon.
- Fig. 6D is a top view of switch 200 along the direction of arrows 6D-6D in Fig. 6C. Since switch 200 is functioning simply as an on/off switch and since the light 150 is directly or normally incident on moving element 106 (i.e.
- moving element 106 is preferably an optical absorber that takes up and dissipates the light 1 0 when in the OFF position (as opposed to a mirror that would reflect light 150 back into input fiber 170 when in that position).
- Figs. 7A and 7B illustrate the operation of device 100 as a 1x2 (single-pole
- moving element 106 is preferably a mirror.
- moving element 106 is in a first position and light 150 from input fiber 170 travels into a first output fiber 180-1.
- light 150 from input fiber 170 reflects off of the surface of mirror 106 and is directed into a second output fiber 180-2.
- light 150 is not normally incident upon the surface of mirror 106 but rather has an angle of incidence (i.e. the angle between the normal to the mirror surface and the light) that is greater than zero.
- the angle of incidence of the light 150 is about 45°.
- Switch 210 of Figs 7A and 7B could be converted into a lxl (ON/OFF) switch by,
- Light 150 may also optionally be directed at the horizontal plane in which element 106 moves at an angle of incidence that is greater than zero (e.g. 45 °), as in Figs 7A and 7B.
- Figs. 8A-8D illustrate another embodiment of a 1x2 optical switch 220 in which
- Fig. 8A shows a top view of the switch 220
- Fig. 8B shows a cross- sectional view along the line 8B-8B in Fig. 8A
- Fig. 8C shows a cross- sectional view along the line 8C-8C in Fig. 8 A.
- the moving element 106 is a mirror, and the mirror's movement in the horizontal plane is
- zone 140 is a free space hole or aperture in substrate 102
- moving element 106 may be located within zone 140, e.g. moving element 106 may be flush with the surface 104 of substrate 102.
- the actuator (not shown in Figs 8A-8D) for switch 220 is preferably located in or on zone 130 of substrate 102. and any support structure for switch
- Figs. 9A and 9B illustrate an adaption of the 1x2 switch 220 of Figs. 8A-8D to form a (Ix2)x2 switch 230.
- switch 230 includes two input optical fibers 170-1 and 170-2 carrying light beams 150-1 and 150-2 respectively.
- Switch 230 also includes four output optical fibers 180-1 to 180-4.
- Moving element 106 of switch 230 is again preferably a mirror.
- Fig. 9A shows moving element 106 in a first position in which light 150-1 from input fiber 170-1 reflects off of mirror 106 and is redirected into output fiber 180-2. and in which light 1,50-2 from input fiber 170-2 travels, unobstructed, through substrate zone 140 and into output fiber 180-3.
- moving element 106 is in a second position, shown in Fig.
- light 150-2 from input fiber 170-2 reflects off of mirror 106 and is redirected into output fiber 180-4, and light 150-1 from input fiber 170-1 travels through substrate zone 140 and into output fiber 180-1.
- switch 230 may be converted into a lxl (ON/OFF) x 2 switch, in which one and only one of the light beams 150-1 and 150-2 is transmitted through switch 230.
- the light beams may travel through any of the switches described above in the reverse direction to that illustrated, that is with the input and output fibers reversed.
- moving element 106 is a mirror
- either one or both of surfaces 108 and 110 of element 106 may be reflective.
- moving element 106 of MEMS device 100 operates in at least a first position and a second position to provide, for example, a switching function.
- a moving element may also operate to perform a switching function in more than two positions.
- the present invention may use a number of different types of actuation approaches for selectively changing the position of each moving element 106 in device 100.
- the actuator transforms electrical or thermal energy into controllable motion (as indicated above, at least part of the actuator is preferably located in or on substrate 102). The preferred actuation approach may depend on the type of moving element used.
- the actuator may be based on the following types of actuation principles: the ⁇ nomechanical; shape memory alloys (SMA) with thermal actuation; electromagnetic; electrostatic; or piezoelectric (other actuation principles such as those based on magnetic, diamagnetic, mechanical, or phase change principles may also be used).
- SMA shape memory alloys
- piezoelectric other actuation principles such as those based on magnetic, diamagnetic, mechanical, or phase change principles may also be used.
- microactuation principles are well known in the art: see generally R.G. Gilbertson et al, "A survey of Micro- Actuator Technologies for Future Spacecraft Missions", Practical Robotic Interstellar Flight: Are We Ready? Conference, New York, (August-September 1994), the contents of which are incorporated herein by virtue of this reference.
- thermomechanical actuation is based on the physical expansion or contraction that occurs in materials when they undergo temperature variations.
- Shape memory effect actuation is based on changes in material properties that arise in some metal alloys (such as nitinol) when they are cycled above or below a certain transition temperature. SMA effect shape changes are generally much greater and occur over a much smaller temperature range compared to thermal expansion contraction. Both these types of thermally driven actuators require cooling, either passive or active, to reverse their actuation action.
- Electromagnetic actuation is based on electric current moving through a conducting material. Advantages of electromagnetic actuation include the very rapid generation of forces and operation which is relatively independent of temperature. However the efficiency of electromagnetic actuation decreases significantly on the micro-scale, and it may be difficult to fabricate and appropriately position small electromagnetic coils in a MEMS device. Electrostatic actuation is based on the attraction of oppositely charged objects and repulsion between similarly charged objects. Electrostatic forces also arise very rapidly and are relatively temperature-independent. Electrostatic actuation is also highly efficient over small distances. Piezoelectric actuation is based on the mechanical force and motion that arise from the dimensional changes generated in certain crystalline materials when subjected to voltage or charge. Typical piezoelectric materials include quartz, lead ziconate titanate, and lithium niobate. Piezoelectric materials respond very quickly and with high forces to changes in voltage potentials.
- the actuator should provide for stable and accurate positioning of the moving element 106 at each of its operative (or stable state) positions, such as at the two end points within the range of travel of element 106.
- the same or a different principle may be used to maintain the moving element in one of its stable states.
- electrostatic means are used to hold the moving element in its desired position as described in connection with Fig. 11 below.
- Figs. 10A-10D show a first possible actuator 250 for the MEMS device 100 of the present invention based upon the inducement of elastic (or stress) waves in an elastic material or membrane 260 placed on the surface 104 of substrate 102.
- elastic or stress
- a solid elastic material changes its shape and size under the action of opposing forces, but recovers its original configuration when the forces are removed.
- An elastic wave propagates through the elastic material when displaced particles transfer momentum to adjoining particles, and thereafter the momentum-transferring particles are themselves
- a standing elastic wave 255 may be induced by any of the above-described actuation principles capable of producing a modification to the dimensions of the elastic membrane 260, including thermal expansion (thermomechanical), piezoelectric, magnetic, or electrostatic.
- thermal expansion thermomechanical
- piezoelectric piezoelectric
- magnetic magnetic
- electrostatic electrostatic actuation
- Electrode 275 is also made of a elastic material.
- a cyclic or standing wave motion 255 may be generated by applying an appropriate AC electrical signal
- a second substrate electrode 290 is also included in substrate 102 underneath surface 104.
- Another AC electrical signal 300 preferably an AC voltage signal, is provided across electrodes 290 and 275.
- 25 of the travelling wave 310 may be selectively adjusted, and correspondingly so can the speed and direction of moving element 106.
- microelectronic circuitry for providing the AC electric signals 280 and 300 can be readily provided in or substrate 102 using standard integrated circuit fabrication techniques.
- electrode 275 is preferably comprised of a material that is transparent to light.
- the elastic material 260 may be provided in two segments separated by a hole or gap 265. Each segment of elastic material 260 includes an electrode 275 on the top surface thereof.
- the penetrable zone 140 of substrate 102 5 (not shown in Fig. 10D) lies beneath gap 265.
- moving element must be held on to the elastic material 260 on which the wave 310 propagates, i.e. through contact and friction.
- the moving element is generally attached to an actuator by way of weight, springs, or clamps which during actuation of the MEMS produce considerable
- the moving element 106 is preferably "attached" to the actuator by means of a magnetic and/or electrostatic force.
- the moving element 106 may be made of a magnetic material, with the surrounding parts of the actuator and/or the
- substrate also comprising a reversely polarized magnetic or ferromagnetic material.
- substrate also comprising a reversely polarized magnetic or ferromagnetic material.
- an attractive magnetic force appears between moving element 106 and the substrate and/or actuator.
- the magnetic force induces static friction and holds or attaches element 106 to the surface 265 of elastic material 260.
- the attachment of moving element 106 can be made sufficiently strong so that the device 100 functions even
- MEMS device 100 when oriented against the direction of gravity, allowing MEMS device 100 to operate in any desired orientation.
- the magnetic material in either moving element 106 or the substrate/actuator can be replaced with electromagnets.
- a further preferable attachment technique, illustrated in Fig. 11, provides an electrostatic attraction between moving element
- element 106 can comprise a single component of a material capable of providing both the conducting and the desired optical function.
- moving element 106 rests on two posts 350 located on top of
- Posts 350 may be formed by etching within the substrate 102 or may be deposited on top of substrate 102 during fabrication, for example.
- An elastic material may be deposited between posts 350 or, alternatively, posts 350 may comprise elastic material 260 in which a travelling wave is generated, for example as described in connection with Fig. 10D above.
- posts 350 may be actuating beams as
- two electrodes 360 are also located on top of substrate surface 104 (alternatively electrodes 360 may be located underneath or within surface 104). Although electrodes 360 are shown to be positioned between posts 350, they may generally be positioned anywhere along surface 104 as long as they are at least approximately underneath moving element 106 (for instance, electrodes 360 may be positioned outwardly of posts 350 in Fig. 11).
- suitable voltage difference 370 the conducting component 330 can be made more positively charged and substrate electrodes 360 more negatively charged (or vice versa), resulting in an electrostatic field that maintains moving element 106 against posts 350.
- conducting component 330 can be charged to a voltage above a certain reference level (i.e. ground), and substrate electrodes 360 can be charged to a voltage below that reference level.
- Signal 370 can again be provided by suitable microelectronic circuitry located in or on substrate wafer 102.
- fixed electrodes 360 are oppositely charged by connecting a potential difference between them. Localized charges are thereby induced on conducting component 330 so that element 106 is electrostatically sustained and attached to posts 350.
- the upper direction in Fig. 11 is not necessarily against the direction of gravity, and the device 100 can be positioned in any orientation, with the electrostatic force between electrodes 360 and conducting component 330 providing a "virtual gravity" effect on moving element 106.
- a further advantage of the attachment configuration of Fig. 11 is the absence of a direct electrical contact between moving element 106 and the substrate electrodes 360. Additionally, moving element 106 is not restricted to particular connecting points, and the attachment force provided by the potential difference 370 can be adjusted as desired.. As a result, this preferred attachment mechanism for element 106 permits device 100 to function in any orientation, without relying on gravity and without requiring the use of springs (or other connection components) that may produce dynamic friction during actuation, resulting in wear, or the use of bearing-like parts that are difficult to fabricate in micro dimensions.
- the actuator may comprise a number of independently controllable (or actuable) members for selectively engaging moving element 106.
- Each member preferably has a base end connected to substrate 102 an another free end or tip that is selectively or operatively engageable with moving element 106.
- the members, or their free ends may be controllably moved by way of any one of the actuation principles mentioned above (e.g. electrostatic, piezoelectric, thermomechanical, etc.) to carry moving element 106 in a desired direction. In doing so, the actuator members may engage moving element 106 in succession or simultaneously depending on the specific details of actuator operation.
- Fig. 12 shows a top plan view of a preferred configuration of MEMS device 100 having an actuator 400 having two sets 410 and 420 of actuating beams 430.
- Beams 430 which act as fingers or cantilevers, are generally elongated, and preferably of a rectangular or square cross-section, at least near the tips thereof.
- Each set 410, 420 comprises a number of beams 430, although, for clarity of illustration in Fig. 12, only two beams 430 are shown in each of sets 410 and 420. However, the presence of additional beams is intended to be indicated by the ellipses, as shown, so that, in general, beams 430 extend along substantially the entire travel path of element 106, preferably near the edge or side of that path.
- the line of travel of element 106 is represented by the double-headed arrow 404, and the associated travel path of moving element 104 has edges at 406, as shown in Fig. 12.
- moving element 106 is of 300 ⁇ m in length (L), 300 ⁇ m in width (W), and about 2 ⁇ m in thickness and travels a horizontal distance of about 300 ⁇ m between operative positions (e.g. ON and OFF positions for an optical switch).
- each set 410, 420 of actuating beams may have between 15-20 equally spaced apart beams 430, each having a length of 150 ⁇ m and a 2 ⁇ m by 2 ⁇ m cross-section.
- any number of beams of different shapes and sizes may be used, depending on the size and application of device 100 and element 106, and the above example is in no way intended to be restrictive.
- moving element 106 preferably includes wings 126 extending perpendicular to the line of travel of element 106 from opposite ends thereof.
- Each wing 126 is supported by a subset of the beams 430 in set 410 or set 420.
- element 106 is supported by different subsets of beams 430.
- Electrodes 360 located in or on substrate 102 serve to hold or attach element 106 in place.
- element 106 may include a conductive component as described in connection with Fig. 1 1 (but not shown in Fig. 12).
- MEMS device 100 is an optical switch
- the portion of substrate 102 between electrodes 360 may be penetrable, i.e. transparent, to light, as described above in connection with Fig. 4.
- each beam 430 is preferably connected to a single anchor or base portion 460 on substrate 102.
- the base of each beam 430 may be connected to an individual anchor portion that is separately connected to substrate 102.
- Other configurations may also be used to rigidly fix the base of each actuating beam 430 with respect to substrate 102.
- moving element 106 may include fin-like legs 128 extending toward substrate 102, and similarly, each beam 430
- leg 5 may include a fin like leg 432 at the tip of the beam (i.e. the end of the beam away from base portion 460) also extending toward substrate 102. These legs ensure that there is no physical contact between beams 430 or moving element 106 and the electrodes on the surface 104 of substrate 102 (or substrate 102 itself). Legs 128 and 432 thereby serve to avoid any stiction, but may be omitted if this is not a concern.
- Beams 430 may be actuated by any suitable actuation principle, however, electrostatic actuation is preferably used, and therefore actuating beam 430 are preferably conductive. As illustrated in Fig. 12, to provide electrostatic actuation, each beam 430 has a bottom electrode 440 and a side electrode 450 associated therewith. The corresponding bottom electrode 440 preferably lies along substrate 102, underneath each beam 430, as is
- Fig. 13B further illustrates the positioning of a corresponding side electrode 450 for each actuating beam 430.
- Side electrode 450 preferably includes a support 455 so that side electrode 450 is generally at the same height as beam 430 with respect to the surface 104 of substrate 102.
- the tip of the actuating beam can be actuated away from substrate 102 by making both the beam 430 and bottom electrode 440 more positively (or
- the tip of the actuating beam can be actuated towards substrate 102 by making one of beam 430 and bottom electrode 440 more positively charged than a reference and the other more negatively charged than the reference.
- the tip of the actuating beam can be actuated in the direction towards side electrode 450 by making one of beam 430 and side electrode 450 more positively
- Electrodes 30 may be readily and conveniently provided in substrate 102. Furthermore, to provide the desired actuation of beams 430, electrodes could be positioned at both sides of an actuating beam, and it is also possible to provide an electrode above each actuating beam 430 (in addition to or instead of bottom electrode 440).
- 35 440 and 450 preferably extend in parallel along a considerable portion of each beam 430.
- the stress in beams 430 is low during actuation since only relatively small displacements are required.
- the tips of beams 430 preferably remain generally parallel to the surface 104 of substrate 102, as illustrated by Fig. 14A which shows a cross-sectional side view of the MEMS device of Fig. 12 with opposing beams 430 in an unactuated position and Fig.
- FIG. 5 14B which shows the same cross-sectional side view with the opposing beams 430 in actuated towards substrate 102.
- a side electrode 450 is generally positioned in close proximity to its corresponding beam 430, while being far enough way from the next closest beam 430 so that any electrostatic force between the side electrode 450 and the next closest beam is negligible. In this manner, a particular side
- Figs. 1 A-15F illustrate the operation of beam actuator 400 illustrated in Fig. 12.
- the beams 430 in set 410 are actuated synchronously or in tandem with corresponding beams in set 420, so that moving element 106 is transported in a straight path, as shown in Fig. 12.
- Figs. 15A-15F showthe actuation of the tips of four beams 430-1,
- each set 410 and 420 may include any number of beams 430, but generally only a subset of those beams holds mirror element wing 126 at any one time.
- the tips of beams 430-1, 430-2. 430-3, and 430-4 are in a first level position in which all four beam tips are at the same height above substrate 102 and all four
- beam tips are supporting wing 126 of moving element 106.
- a desired operative position e.g. an OFF switch position
- beams 430-1, 430-2. 430-3, and 430-4 are in such a level position.
- the tips of beams 430-2 and 430-4 upon actuation, begin to move away from substrate 102 so that only members 430-2 and 430-4 support wing 126. Subsequently, the tips of beams 430-2 and 430-4 begin
- Fig. 15D a second level position is reached in Fig. 15D.
- all four beam tips support wing 126 of moving element 106 in the second level position of Fig.l5D, and moving element 106 lies in the same horizontal plane as in Fig. 15 A.
- the tips of beams 430-1 and 430-3 are then actuated up and away from substrate 102 so that they begin to 5 support wing 126 on their own.
- the tips of beams 430-1 and 430-3 are subsequently actuated to the left as shown in Fig.l5E, with wing 126 and element 106 moving in tandem.
- the actuation of that beam tip may end.
- wing 126 has moved on top or within the range of another beam tip, e.g. that of a beam immediately to the left of beam 430-1 in Fig. 15F, that beam tip begins to be actuated as described above.
- the tips of alternate beams effectively undergo a rotation-like motion (resembling the rotation-like motion of the surface of the elastic material as shown at point 320 in Fig. 10C) to successively and repeatedly actuate moving element 106.
- the rotation of the tips of the first pair of beams 430-1 and 430-3 and the rotation of tips of the second pair of beams 430- 2 and 430-4 are out of phase so that each pair successively acts to transport moving element in the desired direction.
- the amount of motion in each step depends on the horizontal amplitude of the beams.
- a 2 x 2 ⁇ m beam that is 150 ⁇ m long preferably has a horizontal and vertical amplitude of about 1 ⁇ m (or less).
- the rotation-like motion of the beams is preferably rectilinear, it may also be circular or elliptical, for instance.
- the rotation of the beam tips can simply be reversed.
- the actuated motion of the beam tips may be more complex.
- the beam tips may be actuated as three separate groups or pairs whose rotation-like motions are generally 120° out of phase with one another.
- electrostatic beam actuation is preferably used because of the efficiency and ease of implementation of electrostatic forces in a microelectromechanical system.
- the tips of the actuating beams may be controllably rotated in a clockwise or anti-clockwise direction, translating moving element 106 as described above.
- Associated control circuitry used for this purpose is preferably microelectronically implemented within MEMS device 100, using convention integrated circuit fabrication techniques well known in the art. The frequency and phase relationship between applied voltage pulse signals, controls the direction and travelling speed of the movement of element 106.
- beams 430 may comprise a piezoelectric crystalline material.
- beams 430 may be manipulated to mechanically bend in the horizontal and vertical directions, and thereby transport moving element 106 in a desired direction in the manner just described.
- the orientation and structure of beams 430 may vary, in particular depending on the type of actuation method used.
- a plurality of elongated actuating beams 430 are spaced perpendicularly to the travel path of the moving element 106..
- Each beam 430 extends above and preferably substantially parallel to surface 104 of substrate 102, and each beam has a base rigidly fixed with respect to substrate 102 (i.e. via anchor portion 460) and a tip that is preferably proximate or near an edge 406 of the moving element's travel path.
- Actuator 400 controllably causes the tips of the actuating beams 430 to rotate, so that the tips of the actuating beams that are located along the edge of the portion of the travel path in which the moving element is located intermittently engage the moving clement. By intermittently engaging moving element 106 during their rotation. The tips serve to actuate the moving element in a desired direction along the travel path.
- actuator 400 can be adapted to actuate element 106 along other types of travel paths.
- moving element 106 is sector-shaped and moves in a radial or pendulum-like motion about a point 120 (see Fig. 3)
- beams 430 may be positioned to extend perpendicularly to and along substantially the entire radial travel path of element 106 (with element 106 rotatably fixed with respect to substrate 102 at point 120).
- only a single set of actuating beams 430 is required since the travel path only has a single, arc-shaped, outer edge.
- Figs. 16A-16B illustrate a possible modification to the operation of the actuator 400.
- the tips of the beams 430-1, 430-2, 430-3 in beam set 410 (and beam set 420) rotate in unison, i.e. all in phase with one another.
- Posts 470 preferably extend upwardly from surface 104 of substrate 102, but optionally posts 470 may be replaced with static beams that are not actuated. As shown in Fig. 16A, during actuation, the tips of beams 430-1, 430-2, 430-3
- Fig. 17 illustrates a possible adaption of an actuator 400 operating as described in connection with Figs. 16A-16B which serves to ensure that the motion of element 106 is linear and that element 106 is not undesirably tilted.
- element 106 is actuated at opposite ends by two synchronously operating sets 410 and 420 of beams 430 extending from base portions 460. As shown in Fig. 17, the tips of beams 430 in each set
- connecting support beam 480 which supports and holds a wing 126 of element 106.
- Connecting support beams 480 increase the cumulative actuation force generated by the individual tips of beams 430 and also act to further synchronize the operation and movement of the beam tips. As a result, moving element 106 is evenly held and supported from both sides.
- 25 group are actuated in phase during actuation of moving element 106, regardless of the position of element 106 within its range of travel.
- One or more additional synchronization beams 490, linking the connecting support beams 480, may also be used to further synchronize the actuation operation of each set 410, 420 of beams 430.
- at least two synchronization beams 490 are used, one near each end of beams 480 (only one beam
- Figs. 18A-18D illustrate the operation of another possible actuator 500 for use in MEMS device 100 of the present invention.
- element 106 when element 106 is in an operative position, e.g. the OFF position for an optical switch MEMS device 100, element 106 is held on static posts 510 extending from surface 104 of substrate 102, as shown in Fig. 18 A.
- moving element 106 may have legs 510 that rest on surface 104 of substrate 102.
- Actuator 500 further includes beams 520 whose tips are located above and apart from moving element 106 (or a wing or other appendage thereof) when the latter is in an un-actuated or operative state.
- beams 520 are preferably attached to substrate 102 by way of an anchor or base portion (not shown).
- moving element 106 is raised from the posts 510 and attaches to beams 520.
- beams 520 are conductive allowing an attractive electrostatic force to be generated between beams 520 and a conducting component of element 106 (also not shown).
- magnetic attraction may also be used for this purpose.
- Beams 520 are preferably relatively rigid in vertical direction, so that the tips of beams 520 do not bend substantially when attracting element 106. Once element 106 is attached to the tips of beams 520, the tips of beams 520 are actuated in a desired horizontal or sideways direction (Fig. 18B). The combination of the attraction of element 106 and actuation of the tips of beams 520 moves element 106 in a desired direction.
- Fig. 19 shows an isometric view of a MEMS device 100 for use as an optical switch and comprising a mirror as moving element 106 and actuator 250 operating as described above in connection with Figs. 16A-16B (again, for clarity, the entire actuator 250 is not shown in Fig. 19 as indicated by the ellipses).
- the optical switch is shown in Fig. 19 in an OFF position in which an input light signal 150 travels through penetrable zone 140 of substrate 102 comprising a hole or aperture formed within the substrate. It should be noted that the thin rectangular portion 432 of substrate 102 that lies underneath element 106 when it is in the OFF position is optional and may be removed.
- the present invention is capable of providing switching devices with a number of inputs M and outputs N for a variety of applications, such as optical cross-connects, by employing a plurality of switches.
- the moving elements in the switches are actuated and move in directions that are parallel to one another.
- the switches may share a common substrate so that the moving elements of each switch are generally coplanar.
- Fig. 20 shows such a two-dimensional switching device comprising a 3 x 3 array 600 of switches 100, each of the switches being as shown in Fig. 19.
- Switches 100 provide a 3 x 3 array of inputs and outputs arranged in rows and columns.
- each switch in Fig. 12 is shown in an OFF position in which an input light beam or optical signal passes through substrate 102 by way of a penetrable zone 140, however each switch 100 in array configuration 300 is independently actuable.
- Mor complex switching configurations may also be provided.
- the moving elements of switches 100 on a common substrate may move in horizontal planes that are parallel, i.e. at different heights above the surface 104 of substrate 102 - possibly with one moving element directly on top of another.
- a desired optical switching configuration can be achieved.
- several substrate layers having switches may be combined to provide two- and three-dimensional cross-connect configurations as described in applicant's co-pending PCT Application No. , entitled "Switching Device and Method of Fabricating the
- MEMS device 100 and its various components may be achieved using conventional macromachining, mesomachining, or micromachining techniques.
- micromachining technology including the well-known photolithography, deposition, and etching fabrication methods used in the microelectronics and micromachining industries - is used to manufacture all of the components of device 100. See generally, Chertkow et al., "Opportunities and Limitations of Existing MicroFabrication Methods for Microelectromechanical Devices",Proc. 25 th Israel Conf. on Mechanical Engineering, Technion City, Haifa, Israel, p. 431 (May 1994) and Petersen, "Silicon as a Mechanical Material", Proceedings of the IEEE, vol. 70, no. 5 ( May 1982), the contents of which are hereby incorporated herein by virtue of this reference. Batch manufacturing of MEMS devices in integrated circuit fabs or foundries permits the production of large volumes of devices at extremely low cost.
- Micromachining fabrication technology includes both bulk and surface micromachining processes. With bulk micromachining techniques, micro structures are formed by etching away the bulk of a silicon wafer to produce the desired structure. On the other hand, surface micromachining techniques build up the structure in layers of thin films on the surface of a suitable wafer substrate. Typically, films of a structural material and a sacrificial material are deposited and etched in sequence. Generally, the more mechanical
- polysilicon i.e. polycrystalline silicon
- Figs. 21 A-21I illustrate a preferred method of fabricating the mechanical structure of the MEMS device 100, including actuator 400, of Fig. 12 using surface micromachining techniques. More specifically, Figs. 21A-21I show a cross-sectional side view of device 100 during the various steps in the fabrication process.
- substrate 102 is selected and prepared. Generally, 20 substrates of different materials, dimensions, thickness, and surface preparation may be used, although the physical dimensions of substrate 102 may be dictated by the purpose and operation of device 100. Furthermore, as described above, in the case of an optical switch device part of substrate 102 may be removed (bulk etched) to provide a transparent or penetrable zone 140 in substrate 102 (see Fig. 4). Furthermore, where MEMS device 100 is an optical switch and moving element 106 is a mirror, the surface preparation of substrate
- the mirror can also be provided with a high degree of surface quality, especially in terms of flatness and parallelism.
- a first polysilicon layer 610 is 30 deposited on the surface 104 thereof.
- Polysilicon layer 610 is photolithographically patterned before undergoing chemical etching. As is well known in integrated circuit fabrication processes, a two-dimensional mask may be used to define the patterns to be etched. As illustrated in Fig. 21 A, the deposition and patterning of polysilicon layer 610 -, ⁇ - forms bottom electrodes 440 and substrate electrodes 360 used for electrostatic attachment.
- an oxide (e.g. silicon dioxide) layer 620 is deposited on top of substrate 102 and the remaining polysilicon layer 610.
- Oxide layer 620 is then patterned and etched to provide slots 660 for the subsequent deposition of anchor portions 460, dimples 670 for fin legs 432 of beams 430. and dimples 680 for fin legs 128 of moving element 106. This is shown in Fig. 21 C.
- a second polysilicon layer 630 is deposited on top of oxide layer 620 and into slots 660, 670, and 680 to form anchor portions 460, fin legs 432, and fin legs 128 respectively. Further patterning and etching of polysilicon layer 630 produces beams 430 and moving element 106, as shown in Fig. 2 IE. Where moving element 106 is a mirror, its top surface 108 may be coated with gold or aluminum, for example, using standard deposition and patterning methods to render surface 108 reflective. As indicated, to minimize losses, any mirror or other optical element used in MEMS device 100 should be designed to be very smooth.
- the mirror is provided above substrate 102 in an area in which input light beams will be directed, below which substrate 102 is either absent or transparent.
- moving element 106 may be fabricated in other positions above substrate 102.
- a further oxide layer 640 is deposited, as shown. Patterning and etching of layer 640 is carried out to provide slots 690 for wings 126 of moving element 106.
- Polysilicon layer 650 is subsequently deposited, as shown in Fig. 21G; and patterning and etching of layer 650 results in wings 126, as shown in Fig. 21H.
- the deposition and patterning of the mechanical layers is complete. As a result, in Fig. 211, the remainder of oxide layers 620 and 640 is chemically removed, leaving behind the desired polysilicon mechanical structures. Alternatively, release of the mechanical structures may be accomplished by etching steps.
- fabrication of the associated microelectronics (not shown) for MEMS device 100 may be performed simultaneously with, before, or after, the above described surface machining steps. It will be appreciated that alternative and further fabrication steps will be required for different types of actuators and/or different types of actuation and/or attachment principles. In addition, different configurations and applications of MEMS device 100 may alter or vary the fabrication details and materials used. Furthermore, other fabrication processes may also be used, although it is highly preferable that the fabrication of moving element 106 take place above the highly smooth and planar surface 104 of substrate 102, as explained above. It will be appreciated that the MEMS device of present invention, which includes a generally flat moving element such as a mirror disposed horizontally above a smooth wafer substrate, provides several advantages.
- the device 100 allows for a fast actuation response, low losses, compact structure, and relatively large actuation displacements, unlike prior art devices that form the moving element by etching into the substrate wafer.
- the actuation of the moving element in the present invention effectively occurs in parallel to the substrate as a translation, thus minimizing any air resistance and providing more favorable actuation performance from the stand point of mertia and energy considerations.
- the design and positioning of the moving element in the present invention avoids small deviations that can significantly affect device operation accuracy, as may occur in prior art devices in which a moving element or mirror is disposed vertically with respect to the substrate or in prior art devices in which the moving element tilts with respect to the substrate.
- MEMS device 100 may have a relatively long travel path, so that there is no overlap between operative positions of moving element 106 in terms of the location of these positions in the plane above substrate 102.
- actuation embodiments uses surface elastic wave motion or actuating beams to translate the moving element from a first operative position in a horizontal plane above the substrate to a second operative position in that horizontal plane
- actuators based on other actuation techniques can also be used.
- the physical phenomenon used to generate the required actuation forces may be based on various physical principles including: thermomechanical; shape memory alloys (SMA) and thermal actuation; electromagnetic; electrostatic; or piezoelectric, magnetic, diamagnetic, mechanical, or material phase change.
- SMA shape memory alloys
- electrostatic electrostatic
- piezoelectric magnetic, diamagnetic, mechanical, or material phase change.
- the moving element is preferably held by static friction induced by an electrostatic or magnetic force, as described above, other support and attachment configurations for the moving element may also be used.
- MEMS device 100 may be advantageously implemented for applications relating to fiber optic communication, such as optical switches, valves, collimators, attenuators, and the like.
- MEMS device 100 of the present invention can be used as an optical switching element, and such elements can be further combined to form large optical switching arrays and cross-connects as described, for example, in applicant's co-pending
- the present invention is also suitable for other applications requiring relatively large micro-actuation of a generally flat moving element, such as in a micro-conveyor system, or a switch for other types of waves - e.g. an acoustic wave switch in which the moving element is an acoustic mirror (the acoustic mirror may be a metallic plate, as will be appreciated).
- a generally flat moving element such as in a micro-conveyor system
- a switch for other types of waves - e.g. an acoustic wave switch in which the moving element is an acoustic mirror (the acoustic mirror may be a metallic plate, as will be appreciated).
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU60125/00A AU6012500A (en) | 1999-07-20 | 2000-07-20 | Microelectromechanical device with moving element |
IL14747500A IL147475A0 (en) | 1999-07-20 | 2000-07-20 | Microelectromechanincal device with moving element |
EP00946255A EP1218790A2 (en) | 1999-07-20 | 2000-07-20 | Microelectromechanical device with moving element |
CA002379537A CA2379537A1 (en) | 1999-07-20 | 2000-07-20 | Microelectromechanical device with moving element |
JP2001511714A JP2003523833A (en) | 1999-07-20 | 2000-07-20 | Micro-electromechanical device with moving elements |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14462899P | 1999-07-20 | 1999-07-20 | |
US60/144,628 | 1999-07-20 | ||
US17049499P | 1999-12-13 | 1999-12-13 | |
US17049299P | 1999-12-13 | 1999-12-13 | |
US60/170,492 | 1999-12-13 | ||
US60/170,494 | 1999-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001006543A2 true WO2001006543A2 (en) | 2001-01-25 |
WO2001006543A3 WO2001006543A3 (en) | 2001-05-25 |
Family
ID=27386137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IL2000/000431 WO2001006543A2 (en) | 1999-07-20 | 2000-07-20 | Microelectromechanical device with moving element |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1218790A2 (en) |
JP (1) | JP2003523833A (en) |
AU (1) | AU6012500A (en) |
CA (1) | CA2379537A1 (en) |
IL (1) | IL147475A0 (en) |
WO (1) | WO2001006543A2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003029860A1 (en) * | 2001-10-04 | 2003-04-10 | Megasense Inc. | A variable optical attenuator with a moveable focusing mirror |
US6556739B1 (en) | 2001-02-13 | 2003-04-29 | Omm, Inc. | Electronic damping of MEMS devices using a look-up table |
US6571029B1 (en) | 2001-02-13 | 2003-05-27 | Omm, Inc. | Method for determining and implementing electrical damping coefficients |
WO2004046807A1 (en) * | 2002-11-19 | 2004-06-03 | Baolab Microsystems S.L. | Miniature electro-optic device and corresponding uses thereof |
US7190245B2 (en) | 2003-04-29 | 2007-03-13 | Medtronic, Inc. | Multi-stable micro electromechanical switches and methods of fabricating same |
US7388459B2 (en) | 2003-10-28 | 2008-06-17 | Medtronic, Inc. | MEMs switching circuit and method for an implantable medical device |
US7782026B2 (en) | 2004-05-19 | 2010-08-24 | Baolab Microsystems S.L. | Regulator circuit and corresponding uses |
JP2015184293A (en) * | 2014-03-20 | 2015-10-22 | 北陸電気工業株式会社 | Display element and display device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4634057B2 (en) * | 2004-03-17 | 2011-02-16 | アンリツ株式会社 | Optical cavity |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914801A (en) * | 1996-09-27 | 1999-06-22 | Mcnc | Microelectromechanical devices including rotating plates and related methods |
-
2000
- 2000-07-20 IL IL14747500A patent/IL147475A0/en unknown
- 2000-07-20 CA CA002379537A patent/CA2379537A1/en not_active Abandoned
- 2000-07-20 WO PCT/IL2000/000431 patent/WO2001006543A2/en not_active Application Discontinuation
- 2000-07-20 EP EP00946255A patent/EP1218790A2/en not_active Withdrawn
- 2000-07-20 JP JP2001511714A patent/JP2003523833A/en active Pending
- 2000-07-20 AU AU60125/00A patent/AU6012500A/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914801A (en) * | 1996-09-27 | 1999-06-22 | Mcnc | Microelectromechanical devices including rotating plates and related methods |
US6134042A (en) * | 1996-09-27 | 2000-10-17 | Mcnc | Reflective mems actuator with a laser |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6556739B1 (en) | 2001-02-13 | 2003-04-29 | Omm, Inc. | Electronic damping of MEMS devices using a look-up table |
US6571029B1 (en) | 2001-02-13 | 2003-05-27 | Omm, Inc. | Method for determining and implementing electrical damping coefficients |
WO2003029860A1 (en) * | 2001-10-04 | 2003-04-10 | Megasense Inc. | A variable optical attenuator with a moveable focusing mirror |
US7446300B2 (en) | 2002-11-19 | 2008-11-04 | Baolab Microsystems, S. L. | Miniature electro-optic device having a conductive element for modifying the state of passage of light between inlet/outlet points and corresponding uses thereof |
WO2004046807A1 (en) * | 2002-11-19 | 2004-06-03 | Baolab Microsystems S.L. | Miniature electro-optic device and corresponding uses thereof |
US7876182B2 (en) | 2002-11-19 | 2011-01-25 | Baolab Microsystems S. L. | Miniaturized relay and corresponding uses |
CN100375921C (en) * | 2002-11-19 | 2008-03-19 | 宝兰微系统公司 | Miniature electro-optic device and corresponding uses thereof |
CN100410165C (en) * | 2002-11-19 | 2008-08-13 | 宝兰微系统公司 | Miniature relay and corresponding uses thereof |
US7688166B2 (en) | 2003-04-29 | 2010-03-30 | Medtronic, Inc. | Multi-stable micro electromechanical switches and methods of fabricating same |
US7190245B2 (en) | 2003-04-29 | 2007-03-13 | Medtronic, Inc. | Multi-stable micro electromechanical switches and methods of fabricating same |
US8111118B2 (en) | 2003-04-29 | 2012-02-07 | Medtronic, Inc. | Multi-stable micro electromechanical switches and methods of fabricating same |
US7388459B2 (en) | 2003-10-28 | 2008-06-17 | Medtronic, Inc. | MEMs switching circuit and method for an implantable medical device |
EP1697956B1 (en) * | 2003-10-28 | 2014-03-05 | Medtronic, Inc. | Mems switching circuit for an implantable medical device |
US7782026B2 (en) | 2004-05-19 | 2010-08-24 | Baolab Microsystems S.L. | Regulator circuit and corresponding uses |
JP2015184293A (en) * | 2014-03-20 | 2015-10-22 | 北陸電気工業株式会社 | Display element and display device |
Also Published As
Publication number | Publication date |
---|---|
JP2003523833A (en) | 2003-08-12 |
AU6012500A (en) | 2001-02-05 |
CA2379537A1 (en) | 2001-01-25 |
EP1218790A2 (en) | 2002-07-03 |
IL147475A0 (en) | 2002-08-14 |
WO2001006543A3 (en) | 2001-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6535663B1 (en) | Microelectromechanical device with moving element | |
US6215222B1 (en) | Optical cross-connect switch using electrostatic surface actuators | |
EP1130442B1 (en) | Optical switches using dual axis micromirrors | |
Yeow et al. | MEMS optical switches | |
Li et al. | Advanced fiber optical switches using deep RIE (DRIE) fabrication | |
US6108466A (en) | Micro-machined optical switch with tapered ends | |
US6813412B2 (en) | Mems element having perpendicular portion formed from substrate | |
US7030537B2 (en) | Movable MEMS-based noncontacting device | |
US20040022483A1 (en) | Systems and methods for overcoming stiction using a lever | |
US6614581B2 (en) | Methods and apparatus for providing a multi-stop micromirror | |
EP1211544A2 (en) | A variable optical attenuator and beam splitter | |
WO2002021195A2 (en) | Method and system for ultra-fast switching of optical signals | |
WO2001006543A2 (en) | Microelectromechanical device with moving element | |
Patterson et al. | Scanning micromirrors: An overview | |
EP1146360A2 (en) | Fiber optic switch using micro-electro-mechanical systems (MEMS) | |
EP2162801A1 (en) | Optical switch | |
US6788843B2 (en) | Optical crossconnect and mirror systems | |
Robinson | MEMS technology-micromachines enabling the" all optical network" | |
Biswas et al. | MEMS‐based Optical Switches | |
EP1151335A2 (en) | Opto-mechanical valve and valve array for fiber-optic communication | |
US20040033011A1 (en) | Optical attenuator | |
WO2003086954A1 (en) | Micromachined torsional mirror unit for optical switching and fabrication method therefor | |
CA2379936A1 (en) | Opto-mechanical valve and valve array for fiber-optic communication | |
Kim et al. | Design of micro-photonic beam steering systems | |
Wong et al. | MEMS-based optical switches |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 147475 Country of ref document: IL |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2379537 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2000946255 Country of ref document: EP |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWP | Wipo information: published in national office |
Ref document number: 2000946255 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2000946255 Country of ref document: EP |