WO2000041450A1 - Adapter kit to allow extended width wedgelock for use in a circuit card module - Google Patents
Adapter kit to allow extended width wedgelock for use in a circuit card module Download PDFInfo
- Publication number
- WO2000041450A1 WO2000041450A1 PCT/US1999/030458 US9930458W WO0041450A1 WO 2000041450 A1 WO2000041450 A1 WO 2000041450A1 US 9930458 W US9930458 W US 9930458W WO 0041450 A1 WO0041450 A1 WO 0041450A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit card
- chassis
- wedgelock
- card module
- cots
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 230000009467 reduction Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000003116 impacting effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003416 augmentation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/76—Joints and connections having a cam, wedge, or tapered portion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL14407899A IL144078A0 (en) | 1998-12-30 | 1999-12-20 | Adapter kit to allow extended width wedgelock for use in a circuit card module |
JP2000593075A JP2003526199A (en) | 1998-12-30 | 1999-12-20 | Adapter kit to enable extended width wedge locks to be used with circuit card modules |
DE69910848T DE69910848T2 (en) | 1998-12-30 | 1999-12-20 | ADAPTER KIT FOR EXTENDING A WEDGE LOCK IN A CARD MODULE |
CA002359101A CA2359101A1 (en) | 1998-12-30 | 1999-12-20 | Adapter kit to allow extended width wedgelock for use in a circuit card module |
EP99966508A EP1236385B1 (en) | 1998-12-30 | 1999-12-20 | Adapter kit to allow extended width wedgelock for use in a circuit card module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/223,289 | 1998-12-30 | ||
US09/223,289 US6212075B1 (en) | 1998-12-30 | 1998-12-30 | Adapter kit to allow extended width wedgelock for use in a circuit card module |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000041450A1 true WO2000041450A1 (en) | 2000-07-13 |
Family
ID=22835869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/030458 WO2000041450A1 (en) | 1998-12-30 | 1999-12-20 | Adapter kit to allow extended width wedgelock for use in a circuit card module |
Country Status (7)
Country | Link |
---|---|
US (1) | US6212075B1 (en) |
EP (1) | EP1236385B1 (en) |
JP (1) | JP2003526199A (en) |
CA (1) | CA2359101A1 (en) |
DE (1) | DE69910848T2 (en) |
IL (1) | IL144078A0 (en) |
WO (1) | WO2000041450A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010147727A3 (en) * | 2009-06-19 | 2011-07-14 | General Electric Company | Avionics chassis |
US8059409B2 (en) | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
US8222541B2 (en) | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
EP2451261A3 (en) * | 2010-11-04 | 2014-04-02 | GE Intelligent Platforms, Inc. | Wedge lock for use with a single board computer and method of assembling a computer system |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL130775A (en) * | 1999-07-02 | 2007-03-08 | Elta Systems Ltd | Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling |
US20030025966A1 (en) * | 2001-08-03 | 2003-02-06 | Ross Halgren | OSP hardened WDM network |
US6795316B2 (en) * | 2001-12-21 | 2004-09-21 | Redfern Broadband Networks, Inc. | WDM add/drop multiplexer module |
WO2003056736A1 (en) | 2001-12-21 | 2003-07-10 | Redfern Broadband Networks, Inc. | Wdm add/drop multiplexer module |
US6873528B2 (en) * | 2002-05-28 | 2005-03-29 | Dy 4 Systems Ltd. | Supplemental heat conduction path for card to chassis heat dissipation |
US6721182B1 (en) | 2002-10-10 | 2004-04-13 | Harris Corporation | Circuit card module including mezzanine card heat sink and related methods |
US6768642B2 (en) * | 2002-12-16 | 2004-07-27 | Lockheed Martin Corporation | VME circuit host card with triple mezzanine configuration |
US6678159B1 (en) * | 2002-12-23 | 2004-01-13 | Eastman Kodak Company | Method of transporting heat from a heat dissipating electrical assemblage |
US6765798B1 (en) * | 2003-06-19 | 2004-07-20 | Curtiss-Wright Controls, Inc. | Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between |
US6963490B2 (en) * | 2003-11-10 | 2005-11-08 | Honeywell International Inc. | Methods and apparatus for conductive cooling of electronic units |
US20050213306A1 (en) * | 2004-03-25 | 2005-09-29 | Lockheed Martin Corporation | Environmental control method and apparatus for electronic device enclosures |
US7031167B1 (en) * | 2004-11-24 | 2006-04-18 | Elta Systems Ltd. | Wedgelock for electronic circuit card module |
US7254025B2 (en) * | 2005-02-02 | 2007-08-07 | National Instruments Corporation | Cooling mechanisms associated with card adapter |
US7324336B2 (en) * | 2005-09-27 | 2008-01-29 | Lockheed Martin Corporation | Flow through cooling assemblies for conduction-cooled circuit modules |
US7505251B2 (en) * | 2005-10-28 | 2009-03-17 | International Business Machines Corporation | Actuation mechanism for mating electronic card interconnect systems |
US8703278B2 (en) * | 2006-03-28 | 2014-04-22 | Honeywell International Inc. | Light weight printed wiring board |
US20070253169A1 (en) * | 2006-05-01 | 2007-11-01 | Honeywell International Inc. | Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly |
US7349221B2 (en) * | 2006-07-20 | 2008-03-25 | Honeywell International Inc. | Device for increased thermal conductivity between a printed wiring assembly and a chassis |
US7408782B2 (en) * | 2007-01-04 | 2008-08-05 | Tellabs Bedford, Inc. | Multiple printed circuit board heat transfer guide plates |
US20090080163A1 (en) * | 2007-05-17 | 2009-03-26 | Lockheed Martin Corporation | Printed wiring board assembly |
US20090147472A1 (en) * | 2007-12-11 | 2009-06-11 | Honeywell International Inc. | Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System |
US7995346B2 (en) * | 2008-03-06 | 2011-08-09 | Northrop Grumman Systems Corporation | Ruggedized, self aligning, sliding air seal for removable electronic units |
JP4829279B2 (en) * | 2008-08-27 | 2011-12-07 | 株式会社東芝 | Circuit unit heat dissipation structure |
US7796384B2 (en) * | 2008-08-27 | 2010-09-14 | Honeywell International Inc. | Hybrid chassis cooling system |
US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
US8456846B2 (en) * | 2010-01-20 | 2013-06-04 | Wavetherm Corporation | Wedge based circuit board retainer |
US8270172B2 (en) * | 2010-04-23 | 2012-09-18 | GE Intelligent Platforms Embedded Systems, Inc. | Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system |
US8477500B2 (en) | 2010-05-25 | 2013-07-02 | General Electric Company | Locking device and method for making the same |
JP2012023329A (en) * | 2010-06-14 | 2012-02-02 | Toshiba Corp | Substrate unit and electronic device |
US9658000B2 (en) | 2012-02-15 | 2017-05-23 | Abaco Systems, Inc. | Flexible metallic heat connector |
US9417670B2 (en) | 2012-08-07 | 2016-08-16 | Lockheed Martin Corporation | High power dissipation mezzanine card cooling frame |
JP6479663B2 (en) | 2012-10-08 | 2019-03-06 | ビーエル テクノロジーズ、インコーポレイテッド | Prefilled test substrate for testing LAL reactive materials, method of use and method of preparation |
GB2529573B (en) | 2013-04-29 | 2017-04-19 | Ge Intelligent Platforms Embedded Systems Inc | Circuit card assembly with thermal energy removal |
US9826662B2 (en) | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
US9426931B2 (en) * | 2014-02-07 | 2016-08-23 | Lockheed Martin Corporation | Fluid-flow-through cooling of circuit boards |
US10136557B2 (en) | 2015-12-04 | 2018-11-20 | General Electric Company | Thermal management systems and methods for heat generating electronics |
WO2018132079A1 (en) * | 2017-01-10 | 2018-07-19 | Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi | A cooling system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2123638A5 (en) * | 1970-12-31 | 1972-09-15 | Lucas Industries Ltd | |
GB2103020A (en) * | 1981-07-30 | 1983-02-09 | Marconi Avionics | Clamp arrangements for cooling electrical circuits |
US4867235A (en) * | 1986-10-20 | 1989-09-19 | Westinghouse Electric Corp. | Composite heat transfer means |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59200495A (en) | 1983-04-27 | 1984-11-13 | 株式会社日立製作所 | Multichip module |
US4777561A (en) | 1985-03-26 | 1988-10-11 | Hughes Aircraft Company | Electronic module with self-activated heat pipe |
US4751963A (en) * | 1986-07-03 | 1988-06-21 | Hughes Aircraft Company | Thermal conductance retainer for electronic printed circuit boards and the like |
US4879634A (en) * | 1987-11-13 | 1989-11-07 | Plessey Overseas Limited | Rack mounted circuit board |
US4916575A (en) | 1988-08-08 | 1990-04-10 | Asten Francis C Van | Multiple circuit board module |
US4853829A (en) | 1988-11-09 | 1989-08-01 | Eaton Corporation | Electronic module locking mechanism |
JP2760829B2 (en) | 1989-01-13 | 1998-06-04 | 株式会社日立製作所 | Electronic substrate |
US4994937A (en) | 1989-12-22 | 1991-02-19 | Lockheed Corporation | Hydraulic thermal clamp for electronic modules |
DE4028003A1 (en) | 1990-09-04 | 1992-03-05 | Messerschmitt Boelkow Blohm | CLAMPING ELEMENT TO HOLD ELECTRONIC CARD |
US5253963A (en) | 1991-12-11 | 1993-10-19 | Honeywell Inc. | Snap together wedgelock |
FR2686213B1 (en) | 1992-01-14 | 1994-05-06 | Applications Gles Elect Meca | RECEIVER HOUSING FOR ELECTRONIC DISSIPATORS. |
US5485353A (en) * | 1993-02-26 | 1996-01-16 | Eg&G Birtcher, Inc. | Retainer assembly |
US5414592A (en) * | 1993-03-26 | 1995-05-09 | Honeywell Inc. | Heat transforming arrangement for printed wiring boards |
US5280411A (en) | 1993-05-10 | 1994-01-18 | Southwest Research Institute | Packaging for an electronic circuit board |
US5482109A (en) | 1994-03-15 | 1996-01-09 | E-Systems, Inc. | Modular heat exchanger |
US5625227A (en) | 1995-01-18 | 1997-04-29 | Dell Usa, L.P. | Circuit board-mounted IC package cooling apparatus |
US5559675A (en) | 1995-03-28 | 1996-09-24 | Twinhead International Corp. | Computer CPU heat dissipating and protecting device |
US5549155A (en) | 1995-04-18 | 1996-08-27 | Thermacore, Inc. | Integrated circuit cooling apparatus |
US5859764A (en) * | 1997-02-27 | 1999-01-12 | Raytheon Company | Electronics package employing a high thermal performance wedgelock |
US5892658A (en) * | 1998-05-12 | 1999-04-06 | Lockhead Martin Corporation | VME eurocard triple printed wiring board single slot module assembly |
-
1998
- 1998-12-30 US US09/223,289 patent/US6212075B1/en not_active Expired - Lifetime
-
1999
- 1999-12-20 JP JP2000593075A patent/JP2003526199A/en not_active Withdrawn
- 1999-12-20 DE DE69910848T patent/DE69910848T2/en not_active Expired - Fee Related
- 1999-12-20 IL IL14407899A patent/IL144078A0/en not_active IP Right Cessation
- 1999-12-20 WO PCT/US1999/030458 patent/WO2000041450A1/en active IP Right Grant
- 1999-12-20 EP EP99966508A patent/EP1236385B1/en not_active Expired - Lifetime
- 1999-12-20 CA CA002359101A patent/CA2359101A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2123638A5 (en) * | 1970-12-31 | 1972-09-15 | Lucas Industries Ltd | |
GB2103020A (en) * | 1981-07-30 | 1983-02-09 | Marconi Avionics | Clamp arrangements for cooling electrical circuits |
US4867235A (en) * | 1986-10-20 | 1989-09-19 | Westinghouse Electric Corp. | Composite heat transfer means |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010147727A3 (en) * | 2009-06-19 | 2011-07-14 | General Electric Company | Avionics chassis |
US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
US8059409B2 (en) | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
GB2484216A (en) * | 2009-06-19 | 2012-04-04 | Gen Electric | Avionics chassis |
US8222541B2 (en) | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
GB2484216B (en) * | 2009-06-19 | 2014-08-13 | Gen Electric | Avionics chassis |
EP2451261A3 (en) * | 2010-11-04 | 2014-04-02 | GE Intelligent Platforms, Inc. | Wedge lock for use with a single board computer and method of assembling a computer system |
Also Published As
Publication number | Publication date |
---|---|
EP1236385A1 (en) | 2002-09-04 |
CA2359101A1 (en) | 2000-07-13 |
EP1236385B1 (en) | 2003-08-27 |
JP2003526199A (en) | 2003-09-02 |
IL144078A0 (en) | 2002-05-23 |
DE69910848D1 (en) | 2003-10-02 |
US6212075B1 (en) | 2001-04-03 |
DE69910848T2 (en) | 2004-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6212075B1 (en) | Adapter kit to allow extended width wedgelock for use in a circuit card module | |
US6246582B1 (en) | Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module | |
AU2005308439B2 (en) | Wedgelock for electronic circuit card module | |
US5673176A (en) | Integrated circuit dual cooling paths and method for constructing same | |
US5838542A (en) | Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage | |
JP3336090B2 (en) | Apparatus and method for dissipating heat in integrated circuits | |
US6153932A (en) | Fix base of integrated circuit chipset and heat sink | |
US20040246680A1 (en) | Stack up assembly | |
US20010050844A1 (en) | Structure for mounting radiating plate | |
US6118656A (en) | Heat sink having a pressure gradient | |
US6542366B2 (en) | Circuit board support | |
US20040042178A1 (en) | Heat spreader with surface cavity | |
US6201699B1 (en) | Transverse mountable heat sink for use in an electronic device | |
US7248479B2 (en) | Thermal management for hot-swappable module | |
US7382615B2 (en) | Heat dissipation device | |
US6483704B2 (en) | Microprocessor heat sink retention module | |
US6310776B1 (en) | Transverse mountable heat sink for use in an electronic device | |
US9807905B2 (en) | Adapter cooling apparatus and method for modular computing devices | |
US7254029B2 (en) | Printed circuit board with a heat dissipation device | |
US6018460A (en) | Flexible thermal conductor with electromagnetic interference shielding capability for electronic components | |
US6330160B1 (en) | Component retention clip for a heat sink assembly | |
US6154367A (en) | Heat sink for printed circuit board | |
US6172873B1 (en) | Multi-electronic module mounting and retention mechanism | |
CN220307518U (en) | Antistatic PCBA mainboard | |
CN220271853U (en) | External computer host heat abstractor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CA IL JP |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
ENP | Entry into the national phase |
Ref document number: 2359101 Country of ref document: CA Ref country code: CA Ref document number: 2359101 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 144078 Country of ref document: IL |
|
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 2000 593075 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1999966508 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1999966508 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1999966508 Country of ref document: EP |