WO2000022565A1 - Fingerprint image optical input apparatus - Google Patents

Fingerprint image optical input apparatus Download PDF

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Publication number
WO2000022565A1
WO2000022565A1 PCT/CA1999/000936 CA9900936W WO0022565A1 WO 2000022565 A1 WO2000022565 A1 WO 2000022565A1 CA 9900936 W CA9900936 W CA 9900936W WO 0022565 A1 WO0022565 A1 WO 0022565A1
Authority
WO
WIPO (PCT)
Prior art keywords
platen
light
imaging apparatus
interior surface
array
Prior art date
Application number
PCT/CA1999/000936
Other languages
French (fr)
Inventor
Keith Antonelli
Geoffrey Vanderkooy
Timothy Vlaar
Guy B. Immega
Original Assignee
Kinetic Sciences Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinetic Sciences Inc. filed Critical Kinetic Sciences Inc.
Priority to AT99947151T priority Critical patent/ATE301853T1/en
Priority to EP99947151A priority patent/EP1119824B1/en
Priority to DE69926645T priority patent/DE69926645T2/en
Priority to AU60735/99A priority patent/AU6073599A/en
Priority to CA002386973A priority patent/CA2386973C/en
Priority to JP2000576403A priority patent/JP2002527832A/en
Publication of WO2000022565A1 publication Critical patent/WO2000022565A1/en
Priority to US09/833,262 priority patent/US6355937B2/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
    • A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • This invention relates to a method of creating electronic images of a finger or other object with ridges and the like, and a compact optical apparatus to project high contrast image slices of a finge ⁇ rint onto sensors.
  • a high contrast image may be obtained by viewing the finge ⁇ rint through the transparent platen at an oblique angle; the finge ⁇ rint image is then focused by a GRIN lens array onto a linear sensor array.
  • the GRIN lens or other focusing means can be arranged to view reflected images of the finge ⁇ rint, and to project reflected images onto the linear array sensor.
  • To provide a high contrast image of the finge ⁇ rint light is directed at an angle to the top interior surface of the platen (typically 45 degrees or more to a line normal to the surface of the platen, depending on the index of refraction of the platen, which is advantageously greater than 1.5), where it is reflected by TIR if no finge ⁇ rint is present.
  • the high contrast finge ⁇ rint image is viewed by a GRIN lens array, or alternatively a relay lens pair array, or any other functionally equivalent means that creates a series of coherent overlapping images.
  • the GRIN lens array looks at an oblique angle to the platen; the narrow finge ⁇ rint strip image is focused by the GRIN lens array onto the width of a linear array sensor, which may have one linear array of light sensing pixels or two or more parallel linear arrays of light sensing pixels.
  • the CIS sensor for finge ⁇ rint imaging can be arranged in several novel configurations, which can be optimized for different applications and manufacturing techniques.
  • the different features of various configurations may be utilized or combined, and other materials, components or technologies may used or combined to achieve substantially similar finge ⁇ rint imaging systems.
  • Figure IA shows a cut-away, isometric depiction of a side view of the prior art contact image sensor, similar to those commonly used in facsimile machines, viewing a horizontally moving sheet of paper through a GRIN rod lens array and projecting a narrow strip image onto a linear array sensor.
  • Figure IB shows a comparison of a prior art GRIN rod lens array with a functionally equivalent array of relay lens pairs, with an optical ray diagram which depicts the well known image transfer function of relay lenses.
  • Figure 3 shows a cross-sectional depiction of a side view of a illuminated finge ⁇ rint, with light introduced from the bottom and reflected by total internal reflection, a GRIN lens array mounted at an angle less than 45 degrees to the horizontal, with the projected high contrast image from the GRIN lens array reflected one time by total internal reflection and then directed onto a linear array sensor.
  • Figure 4 shows a cross-sectional depiction of a side view of a vertically mounted GRIN lens array viewing a finge ⁇ rint, with light introduced from the bottom and reflected by total internal reflection to the fmge ⁇ rint, the image of the finge ⁇ rint reflected to the GRIN lens array by total internal reflection, which then projects a high contrast image of a finge ⁇ rint directly onto the linear array sensor.
  • Figure 5 shows a view of an optical system identical to that in Figure 4, with the exception that an array of small relay optics lens pairs has been substituted equivalently for the GRIN lens.
  • Figure 6 shows a cross-sectional depiction of a side view of a horizontally deployed GRIN lens array viewing an illuminated finge ⁇ rint, with light introduced horizontally from the side and reflected by total internal reflection to the finge ⁇ rint, and the image of the finge ⁇ rint reflected by total internal reflection to the GRIN lens array and thereafter reflected again by total internal reflection down onto the linear array sensor.
  • Figure 7 shows a cross-sectional depiction of a side view of a horizontally deployed GRIN lens array viewing an illuminated finge ⁇ rint, with light introduced from the bottom and reflected by total internal reflection to the finge ⁇ rint, and the high contrast image of the finge ⁇ rint reflected by total internal reflection to the GRIN lens array and thereafter reflected again by total internal reflection down onto the linear array sensor.
  • Figure 8 shows a cross-sectional perspective view of an optical system identical to that shown in Figure 7.
  • Figure 9 shows a cross-sectional view of an optical system similar to that shown in Figure 7, with the exception that the GRIN lens array is supported by two transparent optical elements.
  • Figure 10 shows a cross-sectional view of an optical system similar to that shown in Figure 7, with the exception that the linear array sensor is mounted directly on the PC board, as a chip-on-board mounting, eliminating the need for a package for the linear array sensor.
  • Figure 11 shows a cross-sectional view of an optical system similar to that shown in Figure 7, with the exception that the optical elements are attached directly to the PC board, and the linear array sensor is mounted as a flip-chip on the opposite side of the PC board, over a slot in the board, which allows light to reach the linear array sensor surface.
  • Figure 12 shows a cross-sectional view of an optical system similar to that shown in Figure 3, with a side view of a illuminated finge ⁇ rint, with light introduced from the bottom and refracted in the direction substantially normal to the imaging surface of the platen, a GRIN lens array mounted at an angle of approximately 45 degrees to the platen, with the projected high contrast image from the GRIN lens array reflected one time by total internal reflection and then directed onto a linear array sensor.
  • FIG. 1 A basic CIS (Contact Image Sensor) is shown, which is commonly used in prior art facsimile machines and sheet-feed document scanners.
  • a CIS imager is comprised of four basic components, which include a transparent platen, light source, lens array, and linear array sensor.
  • the platen 1 is made of transparent glass or plastic, or other suitable transparent material.
  • the light source 2 is conveniently an array of light emitting diodes (LEDs) or any other suitable source of light such as an electro-luminescent strip or miniature fluorescent tube.
  • the lens system is typically a GRIN lens array 3, or it could be replaced by a relay lens array 6 as shown in Figure IB.
  • the linear array optical sensor 4, with a single linear array, or two or more parallel rows of light sensing pixels, may use CCD (charge coupled device) pixels, or may use CMOS (complementary metal oxide semiconductor) APS (active pixel sensing) pixels, photo-diode pixels, or any other linear array of light sensing or infrared sensing pixel technology.
  • the width of platen 1, light source 2, GRIN lens array 3 and linear array sensor 4 may be any convenient length, suited to the imaging task at hand.
  • the CIS sensor is shown imaging a printed sheet of paper 5 which is moved across the platen 1.
  • paper 5 is mechanically moved across the platen; alternatively, the CIS sensor may be mechanically moved beneath paper 5 on a fixed platen.
  • light source 2 shines light beam 2a through transparent platen 1 and illuminates the object, such as printed letters on paper 5. Some light 2b is then scattered and reflected from paper 5 and is viewed by GRIN lens array 3 and focused as light 2c onto linear array sensor 4.
  • An electronic gray scale image is gathered line by line by the linear array sensor 4, and is subsequently stored, altered, processed, inte ⁇ reted, transmitted, displayed, printed or otherwise used.
  • Figure IB compares GRIN lens array 3 with relay lens array 6, which is comprised of a linear array of relay lens pairs.
  • relay lens array 6 is the functional equivalent of GRIN lens array 3, which is a 1:1 imager (no magnification, de-magnification or image inversion).
  • the GRIN lens array 3 and relay lens array 6 both create a series of overlapping coherent images to create a single narrow image the width of the array.
  • the general optical properties of a relay lens is shown schematically with relay lens pair 7, whereby an image is transmitted, or relayed, to the focal plane without change in size or orientation.
  • GRIN lens array 3 utilizes optical fibers as rod lenses to refract the image, to achieve the same optical result.
  • a suitably designed relay lens array may be substituted for a GRIN lens array.
  • FIG 2 a general embodiment of the finge ⁇ rint sensor is shown.
  • Surface mount technology SMT is used to mount the electronic components of linear array sensor package 8 and linear array light emitting diode (LED) light source 2 onto printed circuit board (PCB) 9.
  • the linear array sensor 4 silicon chip is supported by sensor package 8, and connected by wire bonds 4a.
  • Linear array sensor 4 may have one linear array of light sensing pixels, or two or more parallel linear arrays.
  • Sensor package 8 also supports transparent platen 1. Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear array sensor 4.
  • GRIN lens array 3 is fitted or otherwise attached to platen 1 such that GRIN lens array 3 is at the appropriate position that it is able to focus on interior surface la of platen 1 and also on linear sensor array 4.
  • linear array LED light source 2 generates light beam 2a, which ideally is a collimated sheet of monochromatic light which is the width of the finge ⁇ rint.
  • Light beam 2a shines upward into the transparent platen 1 where it is reflected by TIR on interior surface lc and then is directed towards the top interior surface la of the transparent platen 1.
  • the skin of finge ⁇ rint 5 touches the exterior surface of the platen 1 above position la, which causes FTIR where the finge ⁇ rint ridges touch the platen, resulting in dark regions for finge ⁇ rint ridges and bright regions for finge ⁇ rint valleys.
  • the linear strip of high contrast finge ⁇ rint image 2b is directed towards GRIN lens array 3, which then focuses light 2c of the finge ⁇ rint strip on the width linear array sensor 4.
  • Figure 2 also shows several optional refinements which can improve performance.
  • the top of platen 1 has a slightly raised strip lb which provides increased pressure of the finge ⁇ rint on the platen, improving image quality by causing the skin to contact the platen more firmly.
  • Interior surface lc of platen 1 is roughened to act as a reflective diffuser to light beam 2a to provide more constant illumination across the width of the finge ⁇ rint.
  • Surface If of platen 1 is blackened to eliminate stray light from reaching linear array 4.
  • sponge or other absorbent or capillary material 11 On the top surface of platen 1 is sponge or other absorbent or capillary material 11, which optionally is glued into a recess in platen 1 and which can be loaded with water or oil or other lubricating fluid.
  • sponge 11 The function of sponge 11 is to wet the skin of finge ⁇ rint 5 before it passes over platen 1 on raised strip lb, providing a higher contrast image and compensating for dry skin on the finge ⁇ rint.
  • a particular advantage of sponge 11 is that it automatically lubricates the finger in a single swiping motion, as the finge ⁇ rint image is being taken.
  • linear array sensor 4 generates an electronic signal representative of the current strip of the finge ⁇ rint image being viewed by the CIS optical system in platen 1.
  • a CIS sensor for fmge ⁇ rint imaging must accommodate variable and unknown speed of motion of the finger as it is wiped over platen 1.
  • a simple method to measure the speed of motion of the fmger is to employ an external sensor. The measurement of the speed of finger motion can used to rectify the image data from linear array sensor 4 to obtain geometrically correct finge ⁇ rint images.
  • a second preferred method of measuring fmger speed is to compare successive scans of parallel linear arrays in linear array sensor 4. This method of estimating fmger speed from linear array sensors is disclosed in commonly owned United States patent application 08/892,577 filed 16 July, 1997 for an invention called "Linear Sensor Imaging Method and Apparatus.”
  • Figure 3 shows a cross sectional view of another practical embodiment of a finge ⁇ rint sensor, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9.
  • the linear array sensor 4 silicon chip is supported by sensor package 8, which also supports transparent platen 1.
  • GRIN lens array 3 is fitted or otherwise attached to platen 1 such that the focal distance is appropriate for imaging the finge ⁇ rint onto linear array sensor 4.
  • Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear sensor array 4.
  • the top surface of platen 1 of the finge ⁇ rint sensor protrudes slightly through a hole in cover surface 12, which represents part of the sensor enclosure.
  • the linear array LED light source 2 shines collimated sheet of light 2a upward into the transparent platen 1 where it is bounced by TIR or mirror reflection on interior surface lc towards interior surface la.
  • the skin of finge ⁇ rint 5 touches the exterior surface of the platen 1 above position la, which causes FTIR reflection of a linear strip of the finge ⁇ rint image 2b towards GRIN lens array 3.
  • Light 2c from GRIN lens array 3 is reflected by TIR or a mirrored surface on the interior surface le of platen 1, and is then directed downward and focused across the width of linear array sensor 4. If a mirrored surface is employed at surface le, the reflective layer may be applied to the external surface of platen 1.
  • Figure 3 also shows several optional refinements which can improve performance.
  • the top of platen 1 has a slightly raised strip lb, made from silicone rubber or other flexible or rigid transparent material, which provides increased local pressure of the finge ⁇ rint on the platen and also increased optical contact between the fmge ⁇ rint and the flexible top of the platen, improving image quality.
  • Surface If of platen 1 is blackened to reduce stray light reaching linear array 4.
  • surface lg inside platen 1 acts as a barrier to eliminate stray light from beam 2a reaching linear array 4.
  • Figure 4 shows a cross sectional view of another practical embodiment of a fmge ⁇ rint sensor, employing through-hole technology electronic components: linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9.
  • the skin of finge ⁇ rint 5 touches the exterior surface of the platen 1 above position 1 a, which causes FTIR reflection of a linear strip of the finge ⁇ rint image 2b towards interior surface Id where it is reflected by TIR or a mirrored surface towards GRIN lens array 3. If a mirrored surface is employed at surface Id, the reflective layer may be applied to the external surface of platen 1. Light 2c from GRIN lens array 3 is then directed downward and focused across the width of linear array sensor 4.
  • Figure 4 also shows two optional refinements which can improve performance.
  • Surface If of platen 1 is blackened to reduce stray light reaching linear array 4.
  • Interior surface lc of platen 1 is roughened to act as a reflective diffuser to light beam 2a to provide more constant illumination across the width of the fmge ⁇ rint.
  • Figure 5 shows a cross sectional view of another practical embodiment of a finge ⁇ rint sensor, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9.
  • the linear array sensor 4 silicon chip is supported by sensor package 8, which also supports transparent platen 1.
  • Relay lens array 6 is fitted or otherwise attached inside platen 1 such that it projects an image of finge ⁇ rint 4 on linear array sensor 4.
  • Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear sensor array 4 and relay lens array 6.
  • the fmge ⁇ rint image is acquired in a manner identical to Figure 4, with the exception that relay lens array 6 is used in place of a GRIN lens array.
  • surface If of platen 1 is blackened to reduce stray light reaching linear array 4.
  • Figure 7 shows a cross sectional view of another compact embodiment of a fmge ⁇ rint sensor, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9.
  • the linear array sensor 4 silicon chip is sealed inside sensor package 8 by transparent plastic or glass cover 10.
  • Platen 1 is supported over cover 10 by glue or other attachment or support means.
  • GRIN lens array 3 is fitted or otherwise attached to platen 1.
  • Linear array LED light source 2 shines upward into the transparent platen 1, through curved surface lh, which serves as a lens to collimate light inside platen 1 , increasing the amount of light available for imaging the finge ⁇ rint.
  • Light from light source 2 is bounced by TIR or mirror reflection on interior surface lc towards the top interior surface la of the transparent platen 1.
  • the skin of finge ⁇ rint 5 touches the exterior surface of the platen 1 above position la, which causes a linear strip of the finge ⁇ rint image to be reflected by FTIR from la towards interior surface Id, where it is again reflected by TIR or mirror reflection towards GRIN lens array 3.
  • the narrow strip image from GRIN lens array 3 is then reflected by TIR or mirror reflection on interior surface le, which directs the image downward through cover 10 where it is focused across the width of linear sensor array 4.
  • the reflective layer may be applied to the external surface of platen 1.
  • the upper interior surface la of the platen 1 is contained in a slightly raised strip lb which provides increased pressure of the finge ⁇ rint onto the platen imaging surface above la, improving image quality.
  • the image on linear array 4 is foreshortened but not reversed in direction.
  • Figure 8 shows a perspective view of the embodiment shown in Figure 7, with the electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9; in this perspective view, the ends of the sensor package are cut off for display pu ⁇ oses.
  • the width of the finge ⁇ rint sensor as measured along the width of transparent platen 1 and raised strip lb, is about 19 mm, or the approximate width of the human finger, although variations in this dimension will also function satisfactorily.
  • GRIN lens array 3 is at least the width of linear sensor array 4 and is fitted or otherwise attached to platen 1 to properly focus the finge ⁇ rint image on linear sensor array 4.
  • Light source 2 can be seen as a linear bar of multiple linear array LEDs, or any other elongated light source, providing an upwardly directed sheet of approximately collimated light 2a, which is also the width of the finge ⁇ rint sensor.
  • the sheet of light of light beam 2a is directed into platen 1 and reflected internally by TIR or mirror reflection at internal surface lc in platen 1 onto interior surface la, illuminating the width of raised strip lb of platen 1.
  • the finge ⁇ rint ridges cause FTIR and absorb light at position la, while the valleys of the finge ⁇ rint do not touch the platen and thus allow light to be reflected by TIR from interior surface la.
  • the narrow strip finge ⁇ rint image from the width surface la is reflected by TIR or mirror reflection along the width of interior surface Id and is directed towards GRIN lens array 3.
  • GRIN lens array 3 acts in the manner of a relay lens and refracts the finge ⁇ rint strip image and sends the image to be reflected again by TIR or mirror reflection along the width interior surface le, which then directs the image downward through glass or plastic cover 10 where the image of the narrow finge ⁇ rint strip is focused across the width of linear sensor array 4. If a mirrored surface is employed at surface le and/or Id, the reflective layer may be applied to the external surface of platen 1.
  • Figure 9 shows a cross sectional view of a practical embodiment similar to that shown in Figure 7, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9.
  • the function of the transparent platen is separated into two parts.
  • Platen 1 is attached to cover 10 by glue or other attachment means.
  • the linear array sensor 4 silicon chip is sealed inside sensor package 8 by transparent plastic or glass cover 10, which also serves as part of the optical path to reflect the finge ⁇ rint image from interior surface le.
  • GRIN lens array 3 is fitted or otherwise attached between platen 1 and cover 10; opaque layer If serves to limit unwanted light from reaching linear array sensor 4.
  • the top surface of platen 1 of the finge ⁇ rint sensor protrudes slightly through a hole in cover surface 12, which is part of an enclosure for the sensor.
  • Linear array LED light source 2 shines upward into the transparent platen 1.
  • the collimated sheet of light 2a is bounced by TIR or mirror reflection on interior surface lc towards top interior surface la of the transparent platen 1.
  • the skin of finge ⁇ rint 5 touches the exterior surface of the platen 1 above position la, which causes a linear strip of the finge ⁇ rint image to be reflected by FTIR from la towards interior surface Id, where it is again reflected by TIR or mirror reflection towards GRIN lens array 3.
  • the narrow strip image from GRIN lens array 3 is then reflected by TIR or mirror reflection on interior surface le, which directs the image downward through cover 10 where it is focused across the width of linear sensor array 4. If a mirrored surface is employed at surface le and/or Id, the reflective layer may be applied to the external surface of platen 1. As in Figure 7, the image on linear array 4 is foreshortened but not reversed in direction.
  • Figure 10 shows a cross sectional view of a practical miniaturized embodiment, employing chip-on-board (COB) mounting with wire-bonding 4a for the linear array sensor 4 and SMT for the linear array LED light source 2, both attached to PCB 9.
  • COB chip-on-board
  • the elimination of a package for linear array sensor 4 allows for further miniaturization of the finge ⁇ rint sensor.
  • platen 1 is designed to be glued or otherwise attached to PCB 9 and to completely cover linear array sensor 4, protecting it from the environment.
  • GRIN lens array 3 is fitted or otherwise attached to platen 1.
  • the finge ⁇ rint is optically sensed in a manner identical to that shown in Figure 7.
  • the upper interior surface la of the platen 1 is contained in a slightly raised strip lb which provides increased pressure of the finge ⁇ rint onto the platen imaging surface above la, improving image quality.
  • a sponge or other absorbent or capillary material 11 serves to supply a fluid to the skin of the finge ⁇ rint, providing increased optical contact with platen 1.
  • the top surface of platen 1 of the finge ⁇ rint sensor protrudes slightly through a hole in cover surface 12, which encloses the sensor.
  • Figure 11 show a cross sectional view of a practical sub-miniaturized finge ⁇ rint sensor.
  • Components are mounted on both sides of PCB 9.
  • linear array LED light source 2 which shines a sheet of light upward through a slotted hole 9a or multiple single holes.
  • linear array sensor 4 which is mounted using "flip-chip” technology, which either bonds the chip to the printed circuit board with pressure-welds which also provide the required electrical contacts, or is mounted using special conductive glue to bond the electrical contacts and hold the chip to the printed circuit board; epoxy coating 4b, or other suitable material, may be used to protect linear array sensor 4.
  • Figure 12 shows a cross sectional view of another practical embodiment of a finge ⁇ rint sensor, employing surface-mount technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9.
  • the linear array sensor 4 silicon chip is supported by sensor package 8, which is sealed by transparent cover 10 which also supports transparent platen 1.
  • GRIN lens array 3 is fitted or otherwise attached to platen 1 such that the focal distance is appropriate for imaging the finge ⁇ rint onto linear array sensor 4.
  • the top surface of platen 1 of the finge ⁇ rint sensor protrudes slightly through a hole in cover surface 12, which represents part of the sensor enclosure.
  • the linear array LED light source 2 shines through refractive surface lh upward into the transparent platen 1 providing a substantially collimated sheet of light 2a that is substantially normal to the interior platen surface la.
  • the skin of finge ⁇ rint 5 touches the exterior surface of the platen 1 above position la, which causes the fmge ⁇ rint ridges to glow from light source 2a.
  • the GRIN lens array 3 views a linear strip of the finge ⁇ rint image at la along light path 2b.
  • the finge ⁇ rint image from la is not viewed by means of TIR or FTIR, but rather by scattered light from the finge ⁇ rint ridges.
  • Figure 12 also shows several optional refinements which improve performance.
  • Surface If of platen 1 is blackened to reduce stray light reaching linear array 4 when no finger is present on platen 1.
  • surface lg inside platen 1 acts as a barrier to eliminate stray light from beam 2a reaching linear array 4.

Abstract

A fingerprint optical input apparatus comprises a contact image sensor for viewing a moving finger and providing a high contrast image. A narrow strip of the fingerprint touching a transparent platen is illuminated by sheet of collimated light normal to or at an oblique angle to the surface. The fingerprint image is viewed at an oblique angle by partially scattered light or by frustrated total internal reflection by a GRIN rod lens array and projected onto a linear array sensor. Various embodiments of the platen provide a compact design by using TIR or mirror reflections of the fingerprint image.

Description

FINGERPRINT IMAGE OPTICAL INPUT APPARATUS
Technical Field
This invention relates to a method of creating electronic images of a finger or other object with ridges and the like, and a compact optical apparatus to project high contrast image slices of a fingeφrint onto sensors.
Background
The prior art for contact image sensors is exemplified by United States Patent No. 5,214,273 ("the '273 patent") which issued 25 May, 1993 for an invention called "Contact Image Sensor." A second example of prior art is United States Patent No. 5,331,146 ("the '146 patent") which issued 19 July 1994 for an invention called "Contact-type Image Sensor for Generating Electric Signals Corresponding to an Image Formed on a Document." Unlike the present invention, the '273 patent and the '146 patent do not employ frustrated total internal reflection (FTIR) to view a high contrast fingerprint.
The prior art for fingerprint sensors is exemplified by United States Patent No. 4,784,484 ("the '484 patent") which issued 4 December 1986 for an invention called "Method and Apparatus for Automatic Scanning of Fingerprints." Unlike the present invention, the '484 patent uses a separate sensing means to measure the speed of finger motion. Also, unlike the present invention, the '484 patent does not teach the use of FTIR to view a high contrast image of the fingerprint. Finally, unlike the present invention, the '484 patent does not employ a gradient index rod lens array or an array of relay lens pairs.
The prior art for fingeφrint sensors is also exemplified by United States Patent No. 5,619,586 ("the '586 patent") which issued 3 May, 1995 for an invention called "Method and Apparatus for Producing a Directly Viewable Image of a Fingeφrint." The '586 patent shows prior art employing FTIR to obtain a high contrast fingeφrint image. However, unlike the present invention, the '586 patent shows imaging of the entire fingeφrint at once as an area image, instead of a narrow strip image projected onto a linear array sensor. Also, unlike the present invention, the '586 patent does not show the use of gradient index rod lenses or relay lenses to image the fmgeφrint.
The prior art for fingeφrint sensors is also exemplified by United States Patent No. 5,762,200 ("the '200 patent") which issued 27 August, 1990 for an "Apparatus for Imaging Fingeφrint Using Transparent Optical Means Having Elastic Material Layer." Unlike the present invention, the '200 patent is covers an elastic layer for the entire area of the fingeφrint, rather than a narrow strip of the fingeφrint.
Summary of Invention
The invention provides a fingeφrint image optical input apparatus in the form of a contact image sensor (CIS) which projects high contrast image slices onto a linear array sensor. Novel optics are employed to provide a high contrast image by means of FTIR or direct illumination of ridges of the fingeφrint which is projected by a GRIN (GRadient INdex of refraction) lens array onto a linear array sensor.
The generally preferred embodiment is a miniaturized CIS sensor arranged to view the width of the moving fingeφrint as it is wiped over the optically transparent platen of the sensor. To view the fingeφrint, light must be introduced inside the platen. Light from the light source may be introduced inside the transparent platen through a flat or curved surface, which acts as a lens to direct the light and help collimate the light so that it forms a flat sheet of light the width of the linear array sensor. Once introduced, the light may optionally be directed inside the platen by using total internal reflection (TIR) or reflections from a mirrorlike surface or surfaces. The use of reflections to direct the light inside the platen allows the light source to be located anywhere convenient, such as on a printed circuit board; the location of the light source can alter the form of the platen, or allow the platen to be made more compactly. The reflective surfaces or TIR surfaces of the platen can be slightly rough, not perfectly flat, to partially diffuse the light beam and thus cause more even lighting of the fingeφrint.
A high contrast image may be obtained by viewing the fingeφrint through the transparent platen at an oblique angle; the fingeφrint image is then focused by a GRIN lens array onto a linear sensor array. Alternatively, the GRIN lens or other focusing means can be arranged to view reflected images of the fingeφrint, and to project reflected images onto the linear array sensor. To provide a high contrast image of the fingeφrint, light is directed at an angle to the top interior surface of the platen (typically 45 degrees or more to a line normal to the surface of the platen, depending on the index of refraction of the platen, which is advantageously greater than 1.5), where it is reflected by TIR if no fingeφrint is present. Where the fingeφrint ridges touch the top surface of the platen, light is not reflected, due to FTIR at the surface of the platen causing absoφtion of light, resulting in a dark pattern for the fingeφrint ridges and bright light at the fingeφrint valleys, which are reflected by TIR from the interior of the platen. Foreshortening effects can be accommodated by image processing.
A high contrast image may also be obtained by viewing the fingeφrint through the transparent platen at an oblique angle, but with direct illumination of the finger by light directed substantially normal to the internal imaging surface of the platen. The fingeφrint image is then focused by a GRIN lens array onto a linear sensor array. Alternatively, the GRIN lens or other focusing means can be arranged to view reflected images of the fingeφrint, and to project reflected images onto the linear array sensor. When no finger is present, the light escapes through the surface of the platen, while the GRIN lens sees a black surface by TIR from the platen. A high contrast image of the fingeφrint is obtained by when a finger is placed on the platen and the fingeφrint ridges are selectively illuminated due to physical contact with the surface of the platen. Where the fingeφrint ridges touch the top surface of the platen, the fmgeφrint ridges glow with scattered light, resulting in a bright pattern for the fingeφrint ridges and darker regions at the fingeφrint valleys. The oblique viewing angle of the GRIN lens enhances contrast, while allowing limited viewing of fingeφrint ridge details that are near to, but not touching, the platen.
The angled surface of the platen can be a raised strip to increase the pressure of the finger on the imaging surface, thereby giving better contact for total internal reflection. The platen surface or raised portion can also be constructed of silicone or some other material with optical wetting or low friction properties to improve imaging or finger movement respectively. A liquid reservoir can be integrated into the platen or an adjacent surface to allowing wetting of the fmger with oil or other liquid to improve the total FTIR or fingeφrint ridge glow imaging, as well as lubricating the fmger for smooth motion. The platen itself can be part of the protective housing of the sensing elements. Surfaces of the platen can be coated in a light absorbing material to absorb stray light, thus reducing the noise at the sensor element.
The high contrast fingeφrint image is viewed by a GRIN lens array, or alternatively a relay lens pair array, or any other functionally equivalent means that creates a series of coherent overlapping images. The GRIN lens array looks at an oblique angle to the platen; the narrow fingeφrint strip image is focused by the GRIN lens array onto the width of a linear array sensor, which may have one linear array of light sensing pixels or two or more parallel linear arrays of light sensing pixels. The advantages of this arrangement are that a very compact optical system can be achieved which provides fingeφrint images which have low distortion, high resolution and large format size.
The CIS sensor for fingeφrint imaging can be arranged in several novel configurations, which can be optimized for different applications and manufacturing techniques. For those skilled in the art of design of optical components, the different features of various configurations may be utilized or combined, and other materials, components or technologies may used or combined to achieve substantially similar fingeφrint imaging systems. Brief Description of Figures
Further objects, features and advantages of the present invention will become more readily apparent to those skilled in the art from the following description of the invention when taken in conjunction with the accompanying drawings, in which:
Figure IA shows a cut-away, isometric depiction of a side view of the prior art contact image sensor, similar to those commonly used in facsimile machines, viewing a horizontally moving sheet of paper through a GRIN rod lens array and projecting a narrow strip image onto a linear array sensor.
Figure IB shows a comparison of a prior art GRIN rod lens array with a functionally equivalent array of relay lens pairs, with an optical ray diagram which depicts the well known image transfer function of relay lenses.
Figure 2 shows a cross-sectional depiction of a side view of a GRIN lens array at 45 degrees viewing a fingeφrint image illuminated at 45 degrees, providing a high contrast strip image on a linear array sensor.
Figure 3 shows a cross-sectional depiction of a side view of a illuminated fingeφrint, with light introduced from the bottom and reflected by total internal reflection, a GRIN lens array mounted at an angle less than 45 degrees to the horizontal, with the projected high contrast image from the GRIN lens array reflected one time by total internal reflection and then directed onto a linear array sensor.
Figure 4 shows a cross-sectional depiction of a side view of a vertically mounted GRIN lens array viewing a fingeφrint, with light introduced from the bottom and reflected by total internal reflection to the fmgeφrint, the image of the fingeφrint reflected to the GRIN lens array by total internal reflection, which then projects a high contrast image of a fingeφrint directly onto the linear array sensor. Figure 5 shows a view of an optical system identical to that in Figure 4, with the exception that an array of small relay optics lens pairs has been substituted equivalently for the GRIN lens.
Figure 6 shows a cross-sectional depiction of a side view of a horizontally deployed GRIN lens array viewing an illuminated fingeφrint, with light introduced horizontally from the side and reflected by total internal reflection to the fingeφrint, and the image of the fingeφrint reflected by total internal reflection to the GRIN lens array and thereafter reflected again by total internal reflection down onto the linear array sensor.
Figure 7 shows a cross-sectional depiction of a side view of a horizontally deployed GRIN lens array viewing an illuminated fingeφrint, with light introduced from the bottom and reflected by total internal reflection to the fingeφrint, and the high contrast image of the fingeφrint reflected by total internal reflection to the GRIN lens array and thereafter reflected again by total internal reflection down onto the linear array sensor.
Figure 8 shows a cross-sectional perspective view of an optical system identical to that shown in Figure 7.
Figure 9 shows a cross-sectional view of an optical system similar to that shown in Figure 7, with the exception that the GRIN lens array is supported by two transparent optical elements.
Figure 10 shows a cross-sectional view of an optical system similar to that shown in Figure 7, with the exception that the linear array sensor is mounted directly on the PC board, as a chip-on-board mounting, eliminating the need for a package for the linear array sensor.
Figure 11 shows a cross-sectional view of an optical system similar to that shown in Figure 7, with the exception that the optical elements are attached directly to the PC board, and the linear array sensor is mounted as a flip-chip on the opposite side of the PC board, over a slot in the board, which allows light to reach the linear array sensor surface. Figure 12 shows a cross-sectional view of an optical system similar to that shown in Figure 3, with a side view of a illuminated fingeφrint, with light introduced from the bottom and refracted in the direction substantially normal to the imaging surface of the platen, a GRIN lens array mounted at an angle of approximately 45 degrees to the platen, with the projected high contrast image from the GRIN lens array reflected one time by total internal reflection and then directed onto a linear array sensor.
Description
In Figure 1 A a basic CIS (Contact Image Sensor) is shown, which is commonly used in prior art facsimile machines and sheet-feed document scanners. A CIS imager is comprised of four basic components, which include a transparent platen, light source, lens array, and linear array sensor.
In Figure IA the platen 1 is made of transparent glass or plastic, or other suitable transparent material. The light source 2, is conveniently an array of light emitting diodes (LEDs) or any other suitable source of light such as an electro-luminescent strip or miniature fluorescent tube. The lens system is typically a GRIN lens array 3, or it could be replaced by a relay lens array 6 as shown in Figure IB. The linear array optical sensor 4, with a single linear array, or two or more parallel rows of light sensing pixels, may use CCD (charge coupled device) pixels, or may use CMOS (complementary metal oxide semiconductor) APS (active pixel sensing) pixels, photo-diode pixels, or any other linear array of light sensing or infrared sensing pixel technology. The width of platen 1, light source 2, GRIN lens array 3 and linear array sensor 4 may be any convenient length, suited to the imaging task at hand.
In Figure IA, the CIS sensor is shown imaging a printed sheet of paper 5 which is moved across the platen 1. For facsimile machines and document scanners, paper 5 is mechanically moved across the platen; alternatively, the CIS sensor may be mechanically moved beneath paper 5 on a fixed platen. In the generic configuration of the CIS sensor, light source 2 shines light beam 2a through transparent platen 1 and illuminates the object, such as printed letters on paper 5. Some light 2b is then scattered and reflected from paper 5 and is viewed by GRIN lens array 3 and focused as light 2c onto linear array sensor 4. An electronic gray scale image is gathered line by line by the linear array sensor 4, and is subsequently stored, altered, processed, inteφreted, transmitted, displayed, printed or otherwise used.
When a finger is dragged across platen 1 of Figure IA (instead of a paper document), an additional sensing means must be used to measure the speed of the fmger across the platen and the fingeφrint image which is obtained by the CIS sensor will have very low contrast between the fingeφrint ridges and valleys. The low contrast causes difficulties in inteφreting the significant features of the fingeφrint image, making such an image not optimum for fingeφrint matching or verification. However, image enhancement techniques may by used to produce a fingeφrint imaging system using a standard CIS sensor.
Figure IB compares GRIN lens array 3 with relay lens array 6, which is comprised of a linear array of relay lens pairs. In this diagram, relay lens array 6 is the functional equivalent of GRIN lens array 3, which is a 1:1 imager (no magnification, de-magnification or image inversion). The GRIN lens array 3 and relay lens array 6 both create a series of overlapping coherent images to create a single narrow image the width of the array. The general optical properties of a relay lens is shown schematically with relay lens pair 7, whereby an image is transmitted, or relayed, to the focal plane without change in size or orientation. In contrast, GRIN lens array 3 utilizes optical fibers as rod lenses to refract the image, to achieve the same optical result. For all CIS imaging systems, including those designed for imaging the fingeφrint, a suitably designed relay lens array may be substituted for a GRIN lens array.
In Figure 2, a general embodiment of the fingeφrint sensor is shown. Surface mount technology (SMT) is used to mount the electronic components of linear array sensor package 8 and linear array light emitting diode (LED) light source 2 onto printed circuit board (PCB) 9. The linear array sensor 4 silicon chip is supported by sensor package 8, and connected by wire bonds 4a. Linear array sensor 4 may have one linear array of light sensing pixels, or two or more parallel linear arrays. Sensor package 8 also supports transparent platen 1. Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear array sensor 4. GRIN lens array 3 is fitted or otherwise attached to platen 1 such that GRIN lens array 3 is at the appropriate position that it is able to focus on interior surface la of platen 1 and also on linear sensor array 4. [Since GRIN lens array 3 projects a narrow strip image onto linear array sensor 4, the orientation of linear array sensor 4 may be varied from that depicted in Figure 2; for example, the pixel sensing surface of linear array sensor 4 may also tilted so that it is normal to the axis of light 2c coming from GRIN lens array 3.] The top surface of platen 1 of the fingeφrint sensor protrudes slightly through a hole in cover surface 12, which may be part of an enclosure for the sensor. A finger with fingeφrint 5 is wiped over the top of the sensor platen to obtain a fingeφrint image.
In the embodiment shown in Figure 2, linear array LED light source 2 generates light beam 2a, which ideally is a collimated sheet of monochromatic light which is the width of the fingeφrint. Light beam 2a shines upward into the transparent platen 1 where it is reflected by TIR on interior surface lc and then is directed towards the top interior surface la of the transparent platen 1. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position la, which causes FTIR where the fingeφrint ridges touch the platen, resulting in dark regions for fingeφrint ridges and bright regions for fingeφrint valleys. The linear strip of high contrast fingeφrint image 2b is directed towards GRIN lens array 3, which then focuses light 2c of the fingeφrint strip on the width linear array sensor 4.
Figure 2 also shows several optional refinements which can improve performance. The top of platen 1 has a slightly raised strip lb which provides increased pressure of the fingeφrint on the platen, improving image quality by causing the skin to contact the platen more firmly. Interior surface lc of platen 1 is roughened to act as a reflective diffuser to light beam 2a to provide more constant illumination across the width of the fingeφrint. Surface If of platen 1 is blackened to eliminate stray light from reaching linear array 4. On the top surface of platen 1 is sponge or other absorbent or capillary material 11, which optionally is glued into a recess in platen 1 and which can be loaded with water or oil or other lubricating fluid. The function of sponge 11 is to wet the skin of fingeφrint 5 before it passes over platen 1 on raised strip lb, providing a higher contrast image and compensating for dry skin on the fingeφrint. A particular advantage of sponge 11 is that it automatically lubricates the finger in a single swiping motion, as the fingeφrint image is being taken.
In Figure 2, and in all embodiments of the invention shown in Figure 3 through Figure 11, linear array sensor 4 generates an electronic signal representative of the current strip of the fingeφrint image being viewed by the CIS optical system in platen 1. However, unlike a document scanner, where paper 5 is moved over the CIS sensor at a predetermined regular speed by an electric motor, a CIS sensor for fmgeφrint imaging must accommodate variable and unknown speed of motion of the finger as it is wiped over platen 1. A simple method to measure the speed of motion of the fmger is to employ an external sensor. The measurement of the speed of finger motion can used to rectify the image data from linear array sensor 4 to obtain geometrically correct fingeφrint images. A second preferred method of measuring fmger speed is to compare successive scans of parallel linear arrays in linear array sensor 4. This method of estimating fmger speed from linear array sensors is disclosed in commonly owned United States patent application 08/892,577 filed 16 July, 1997 for an invention called "Linear Sensor Imaging Method and Apparatus."
Figure 3 shows a cross sectional view of another practical embodiment of a fingeφrint sensor, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9. The linear array sensor 4 silicon chip is supported by sensor package 8, which also supports transparent platen 1. GRIN lens array 3 is fitted or otherwise attached to platen 1 such that the focal distance is appropriate for imaging the fingeφrint onto linear array sensor 4. Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear sensor array 4. The top surface of platen 1 of the fingeφrint sensor protrudes slightly through a hole in cover surface 12, which represents part of the sensor enclosure. In this embodiment, the linear array LED light source 2 shines collimated sheet of light 2a upward into the transparent platen 1 where it is bounced by TIR or mirror reflection on interior surface lc towards interior surface la. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position la, which causes FTIR reflection of a linear strip of the fingeφrint image 2b towards GRIN lens array 3. Light 2c from GRIN lens array 3 is reflected by TIR or a mirrored surface on the interior surface le of platen 1, and is then directed downward and focused across the width of linear array sensor 4. If a mirrored surface is employed at surface le, the reflective layer may be applied to the external surface of platen 1. The optical design shown in Figure 3, with a single TIR or mirrored reflection of the fingeφrint image on the interior surface le of platen 1, causes the image of the fingeφrint on linear array sensor 4 to be both foreshortened and directionally reversed in relation to the direction of motion of the fingeφrint; the foreshortening and directional reversal are easily characterized and accommodated for by adjustments in the electronic readout of linear array sensor 4.
Figure 3 also shows several optional refinements which can improve performance. The top of platen 1 has a slightly raised strip lb, made from silicone rubber or other flexible or rigid transparent material, which provides increased local pressure of the fingeφrint on the platen and also increased optical contact between the fmgeφrint and the flexible top of the platen, improving image quality. Surface If of platen 1 is blackened to reduce stray light reaching linear array 4. Lastly, surface lg inside platen 1 acts as a barrier to eliminate stray light from beam 2a reaching linear array 4. Figure 4 shows a cross sectional view of another practical embodiment of a fmgeφrint sensor, employing through-hole technology electronic components: linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9. The linear array sensor 4 silicon chip is supported by sensor package 8, which also supports transparent platen 1. GRIN lens array 3 is fitted or otherwise attached to platen 1. Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear sensor array 4 and GRIN lens array 3. The top surface of platen 1 of the fmgeφrint sensor protrudes slightly through a hole in cover surface 12, which encloses the sensor. In this embodiment, the linear array LED light source 2 shines collimated sheet of light 2a upward into the transparent platen 1 where it is bounced by TIR on interior surface lc towards interior surface la. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position 1 a, which causes FTIR reflection of a linear strip of the fingeφrint image 2b towards interior surface Id where it is reflected by TIR or a mirrored surface towards GRIN lens array 3. If a mirrored surface is employed at surface Id, the reflective layer may be applied to the external surface of platen 1. Light 2c from GRIN lens array 3 is then directed downward and focused across the width of linear array sensor 4. The optical design shown in Figure 4, with a single TIR or mirror reflection of the fingeφrint image on the interior surface Id of platen 1, causes the image of the fingeφrint on linear array sensor 4 to be both foreshortened and directionally reversed, in relation to the direction of motion of the fmgeφrint; the foreshortening and directional reversal are easily characterized and accommodated for by adjustments in the electronic readout of linear array sensor 4.
Figure 4 also shows two optional refinements which can improve performance. Surface If of platen 1 is blackened to reduce stray light reaching linear array 4. Interior surface lc of platen 1 is roughened to act as a reflective diffuser to light beam 2a to provide more constant illumination across the width of the fmgeφrint. Figure 5 shows a cross sectional view of another practical embodiment of a fingeφrint sensor, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9. The linear array sensor 4 silicon chip is supported by sensor package 8, which also supports transparent platen 1. Relay lens array 6 is fitted or otherwise attached inside platen 1 such that it projects an image of fingeφrint 4 on linear array sensor 4. Platen 1 also serves as a cover for package 8, providing a sealed enclosure for linear sensor array 4 and relay lens array 6. In this embodiment, the fmgeφrint image is acquired in a manner identical to Figure 4, with the exception that relay lens array 6 is used in place of a GRIN lens array. As an optional refinement, surface If of platen 1 is blackened to reduce stray light reaching linear array 4.
Figure 6 shows a cross sectional view of a more compact embodiment of a fingeφrint sensor. The linear array sensor 4 silicon chip is sealed inside sensor package 8 by transparent glass or plastic cover 10. Platen 1 is held in place over sensor package 8 and cover 10 by glue or other attachment or supporting means. GRIN lens array 3 and linear array LED light source 2 are fitted or otherwise attached to platen 1. Linear array LED light source 2 shines collimated light sheet 2a sideways into the transparent platen 1 where it is bounced by TIR or mirror reflection on interior surface lc towards the top interior surface la of the transparent platen 1. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position la, which causes a linear strip of the fmgeφrint image to be reflected by FTIR from la towards interior surface Id, where it is again reflected by TIR or a mirror surface towards GRIN lens array 3. The light from GRIN lens array 3 is then reflected by TIR or mirror reflection by interior surface le, which then directs the light downward through cover 10 where the image is focused across the width of linear array sensor 4. If a mirrored surface is employed at surface le and/or Id, the reflective layer may be applied to the external surface of platen 1. The optical design shown in Figure 6, with two TIR or mirror reflections of the fingeφrint image on interior surfaces Id and le of platen 1, causes the image of the fingeφrint on linear array sensor 4 to be foreshortened in relation to the direction of finger motion but not directionally reversed; the foreshortening is easily characterized and accommodated by adjustments in the electronic readout of linear array sensor 4.
Figure 7 shows a cross sectional view of another compact embodiment of a fmgeφrint sensor, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9. The linear array sensor 4 silicon chip is sealed inside sensor package 8 by transparent plastic or glass cover 10. Platen 1 is supported over cover 10 by glue or other attachment or support means. GRIN lens array 3 is fitted or otherwise attached to platen 1. Linear array LED light source 2 shines upward into the transparent platen 1, through curved surface lh, which serves as a lens to collimate light inside platen 1 , increasing the amount of light available for imaging the fingeφrint. Light from light source 2 is bounced by TIR or mirror reflection on interior surface lc towards the top interior surface la of the transparent platen 1. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position la, which causes a linear strip of the fingeφrint image to be reflected by FTIR from la towards interior surface Id, where it is again reflected by TIR or mirror reflection towards GRIN lens array 3. The narrow strip image from GRIN lens array 3 is then reflected by TIR or mirror reflection on interior surface le, which directs the image downward through cover 10 where it is focused across the width of linear sensor array 4. If a mirrored surface is employed at surface le and/or Id, the reflective layer may be applied to the external surface of platen 1. In this embodiment, the upper interior surface la of the platen 1 is contained in a slightly raised strip lb which provides increased pressure of the fingeφrint onto the platen imaging surface above la, improving image quality. As in Figure 6, the image on linear array 4 is foreshortened but not reversed in direction.
Figure 8 shows a perspective view of the embodiment shown in Figure 7, with the electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9; in this perspective view, the ends of the sensor package are cut off for display puφoses. In this view, the width of the fingeφrint sensor, as measured along the width of transparent platen 1 and raised strip lb, is about 19 mm, or the approximate width of the human finger, although variations in this dimension will also function satisfactorily. GRIN lens array 3 is at least the width of linear sensor array 4 and is fitted or otherwise attached to platen 1 to properly focus the fingeφrint image on linear sensor array 4. Light source 2 can be seen as a linear bar of multiple linear array LEDs, or any other elongated light source, providing an upwardly directed sheet of approximately collimated light 2a, which is also the width of the fingeφrint sensor. The sheet of light of light beam 2a is directed into platen 1 and reflected internally by TIR or mirror reflection at internal surface lc in platen 1 onto interior surface la, illuminating the width of raised strip lb of platen 1. When the skin of a fingeφrint is pressed against the raised surface of strip lb, the fingeφrint ridges cause FTIR and absorb light at position la, while the valleys of the fingeφrint do not touch the platen and thus allow light to be reflected by TIR from interior surface la. The narrow strip fingeφrint image from the width surface la is reflected by TIR or mirror reflection along the width of interior surface Id and is directed towards GRIN lens array 3. GRIN lens array 3 acts in the manner of a relay lens and refracts the fingeφrint strip image and sends the image to be reflected again by TIR or mirror reflection along the width interior surface le, which then directs the image downward through glass or plastic cover 10 where the image of the narrow fingeφrint strip is focused across the width of linear sensor array 4. If a mirrored surface is employed at surface le and/or Id, the reflective layer may be applied to the external surface of platen 1.
Figure 9 shows a cross sectional view of a practical embodiment similar to that shown in Figure 7, employing through-hole technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9. In this embodiment, the function of the transparent platen is separated into two parts. Platen 1 is attached to cover 10 by glue or other attachment means. The linear array sensor 4 silicon chip is sealed inside sensor package 8 by transparent plastic or glass cover 10, which also serves as part of the optical path to reflect the fingeφrint image from interior surface le. GRIN lens array 3 is fitted or otherwise attached between platen 1 and cover 10; opaque layer If serves to limit unwanted light from reaching linear array sensor 4. The top surface of platen 1 of the fingeφrint sensor protrudes slightly through a hole in cover surface 12, which is part of an enclosure for the sensor. Linear array LED light source 2 shines upward into the transparent platen 1. The collimated sheet of light 2a is bounced by TIR or mirror reflection on interior surface lc towards top interior surface la of the transparent platen 1. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position la, which causes a linear strip of the fingeφrint image to be reflected by FTIR from la towards interior surface Id, where it is again reflected by TIR or mirror reflection towards GRIN lens array 3. The narrow strip image from GRIN lens array 3 is then reflected by TIR or mirror reflection on interior surface le, which directs the image downward through cover 10 where it is focused across the width of linear sensor array 4. If a mirrored surface is employed at surface le and/or Id, the reflective layer may be applied to the external surface of platen 1. As in Figure 7, the image on linear array 4 is foreshortened but not reversed in direction.
Figure 10 shows a cross sectional view of a practical miniaturized embodiment, employing chip-on-board (COB) mounting with wire-bonding 4a for the linear array sensor 4 and SMT for the linear array LED light source 2, both attached to PCB 9. The elimination of a package for linear array sensor 4 allows for further miniaturization of the fingeφrint sensor. In this embodiment, platen 1 is designed to be glued or otherwise attached to PCB 9 and to completely cover linear array sensor 4, protecting it from the environment. GRIN lens array 3 is fitted or otherwise attached to platen 1. The fingeφrint is optically sensed in a manner identical to that shown in Figure 7. In this embodiment, the upper interior surface la of the platen 1 is contained in a slightly raised strip lb which provides increased pressure of the fingeφrint onto the platen imaging surface above la, improving image quality. As in Figure 2, a sponge or other absorbent or capillary material 11 serves to supply a fluid to the skin of the fingeφrint, providing increased optical contact with platen 1. The top surface of platen 1 of the fingeφrint sensor protrudes slightly through a hole in cover surface 12, which encloses the sensor.
Figure 11 show a cross sectional view of a practical sub-miniaturized fingeφrint sensor. Components are mounted on both sides of PCB 9. On the bottom surface of PCB 9 is mounted linear array LED light source 2, which shines a sheet of light upward through a slotted hole 9a or multiple single holes. Also on the bottom surface of PCB 9 is linear array sensor 4, which is mounted using "flip-chip" technology, which either bonds the chip to the printed circuit board with pressure-welds which also provide the required electrical contacts, or is mounted using special conductive glue to bond the electrical contacts and hold the chip to the printed circuit board; epoxy coating 4b, or other suitable material, may be used to protect linear array sensor 4. Since linear array sensor 4 must be bonded to the PCB with pixels directed towards the opposite side of the board, slotted hole 9b is provided to allow light to shine on the pixels. On the top surface of PCB 9 is glued or otherwise mounted platen 1. GRIN lens array 3 is fitted or otherwise attached to platen 1. In this configuration, the optical path is otherwise similar to that shown in Figure 7.
Figure 12 shows a cross sectional view of another practical embodiment of a fingeφrint sensor, employing surface-mount technology electronic components of linear array sensor package 8 and linear array LED light source 2 soldered to PCB 9. The linear array sensor 4 silicon chip is supported by sensor package 8, which is sealed by transparent cover 10 which also supports transparent platen 1. GRIN lens array 3 is fitted or otherwise attached to platen 1 such that the focal distance is appropriate for imaging the fingeφrint onto linear array sensor 4. The top surface of platen 1 of the fingeφrint sensor protrudes slightly through a hole in cover surface 12, which represents part of the sensor enclosure. In this embodiment, the linear array LED light source 2 shines through refractive surface lh upward into the transparent platen 1 providing a substantially collimated sheet of light 2a that is substantially normal to the interior platen surface la. The skin of fingeφrint 5 touches the exterior surface of the platen 1 above position la, which causes the fmgeφrint ridges to glow from light source 2a. The GRIN lens array 3 views a linear strip of the fingeφrint image at la along light path 2b. The fingeφrint image from la is not viewed by means of TIR or FTIR, but rather by scattered light from the fingeφrint ridges. A high contrast image of the fingeφrint is obtained by positioning the GRIN lens to view platen surface la at an oblique angle, typically 45 degrees, so that very little light from the fingeφrint valleys is transmitted. Light 2c from GRIN lens array 3 is reflected by TIR or a mirrored surface on the interior surface le of platen 1, and is then directed downward and focused across the width of linear array sensor 4. If a mirrored surface is employed at surface le, the reflective layer may be applied to the external surface of platen 1. The optical design shown in Figure 12, with a single TIR or mirrored reflection of the fingeφrint image on the interior surface le of platen 1, causes the image of the fingeφrint on linear array sensor 4 to be both foreshortened and directionally reversed in relation to the direction of motion of the fingeφrint; the foreshortening and directional reversal are easily characterized and accommodated for by adjustments in the electronic readout of linear array sensor 4.
Figure 12 also shows several optional refinements which improve performance. Surface If of platen 1 is blackened to reduce stray light reaching linear array 4 when no finger is present on platen 1. Lastly, surface lg inside platen 1 acts as a barrier to eliminate stray light from beam 2a reaching linear array 4.
The above descriptions of apparatus are examples of means to implement the method of creating an electronic image of a fmger.
While the principles of the invention have now been made clear in the illustrated embodiments, there will be immediately obvious to those skilled in the art, many modifications of structure, arrangements, proportions, the elements, materials and components used in the practice of the invention, and otherwise, which are particularly adapted for specific environments and operational requirements without departing from those principles. The claims are therefore intended to cover and embrace such modifications within the limits only of the true spirit and scope of the invention. In particular, it will be appreciated that while a finger has been described for the creation of an electronic image of a fingeφrint, other objects having ridges or varied surfaces (e.g. toes, noses and other human parts as well as inanimate surfaces) are encompassed by the present invention.

Claims

What is claimed is:
1. Imaging apparatus, comprising: a. platen composed of a clear, optically transparent material with a surface for the skin of the fmger; b. light source, shining so as to direct light to or reflect light off the interior surface of the platen adjacent to the skin of the finger; c. linear sensor array; d. GRIN lens array, situated at an oblique angle with respect to the platen to focus the light from the top interior surface of the platen onto the linear sensor array.
2. Imaging apparatus, comprising: a. platen composed of a clear, optically transparent material with a surface for the skin of the fmger; b. light source, shining so as to direct light to or reflect light off the interior surface of the platen adjacent to the skin of the fmger, such light partially scattered or reflected by total internal reflection or frustrated total internal reflection; c. linear sensor array; d. GRIN lens array, situated to focus the light scattered or reflected from the top interior surface of the platen onto the linear sensor array.
3. Imaging apparatus of claims 1-2, further having multiple parallel linear sensor arrays.
4. Imaging apparatus of claims 1-3, further having the light from the light source redirected by a reflection on an interior surface of the platen using a mirror or total internal reflection.
5. Imaging apparatus of claims 1-4, further having the light from the light source redirected by a reflection on an interior surface of the platen which is roughened
6. Imaging apparatus of claims 1-5, further having the light from the light source collimated by lens molded into the platen where the light enters
7. Imaging apparatus of claims 1-6, further having a ridge on the top of the platen, either formed from the platen material or a different optically transparent material.
8. Imaging apparatus of claims 1-7, further having a relay lens pair array replacing the GRIN lens.
9. Imaging apparatus of claims 1-8, further having the light from the platen surface reflected on an interior surface using a mirror or total internal reflection before entering the focus means.
10. Imaging apparatus of claims 1-9, further having the light from the focusing means reflected on an interior surface using a mirror or total internal reflection before arriving at the linear sensor array.
11. Imaging apparatus of claims 1-11, further having a reservoir for liquid embedded in the platen surface
12. Imaging apparatus of claims 1-12, further having blackened faces on the platen.
13. Imaging apparatus of claims 1-13 further employing a method of sensing and measuring fmger motion speed and correcting for geometric errors in the electronic output image.
14. A method of creating an image of an object with a varied surface, comprising the steps of:
(a) moving the object along a transparent platen;
(b) shining a light from underneath;
(c) collecting the resulting total internal reflection and frustrated total internal reflection and partially scattered light and directing it to a linear array sensor to create an electronic image of the object thereon.
15. The method of claim 14 further comprising the step of:
(d) measuring object motion speed and correcting for geometric errors in said electronic image.
16. A method of creating an image of an object with a varied surface, comprising the steps of:
(a) moving the object along a transparent platen;
(b) shining a light from underneath at an oblique angle to the platen;
(c) collecting the resulting light from the platen and directing it to a linear array sensor to create an electronic image of the object thereon.
AMENDED CLAIMS
[received by the International Bureau on 14 March 2000 (14.03.00) original claims 1-16 replaced by new claims 1 -40 (6 pages)]
1. Imaging apparatus, comprising: a. a platen composed of a transparent material with an exterior surface for the skin of a finger and an opposed interior surface; b. a light source, for directing light to or reflecting light off said interior surface of said platen adjacent to the skin of the finger; c. a stationary linear sensor array; d. a stationary GRIN lens array, situated at an oblique angle with respect to said platen for focusing the light from the top interior surface of the platen onto the linear sensor array.
2. Imaging apparatus, comprising: a. a platen composed of a transparent material with an exterior surface for the skin of the fmger and an opposed interior surface; b. a light source for directing light to or reflecting light off said interior surface of said platen adjacent to the skin of the finger, said light partially scattered or reflected by total internal reflection or frustrated total internal reflection; c. a linear sensor array; d. a GRIN lens array, situated to focus the light scattered or reflected from the top interior surface of the platen onto the linear sensor array.
3. Imaging apparatus of claims 1 or 2, further having multiple parallel linear sensor arrays.
4. Imaging apparatus of one of claims 1 through 3, further having said light from said light source redirected by a reflection on an interior surface of the platen using a mirror or total internal reflection.
-23-
5. Imaging apparatus of one of claims 1 through 4, further having the light from the light source redirected by a reflection on an interior surface of the platen which is roughened
6. Imaging apparatus of one of claims 1 through 5, further having the light from the light source collimated by a lens molded into the platen where the light enters
7. Imaging apparatus of one of claims 1 through 6, further having a ridge on the top of the platen, either formed from the platen material or a different optically transparent material.
8. Imaging apparatus of one of claims 1 through 7, further having a relay lens pair array replacing the GRIN lens.
9. Imaging apparatus of one of claims 1 through 8, further having the light from the platen surface reflected on an interior surface using a mirror or total internal reflection before entering the focus means.
10. Imaging apparatus of one of claims 1 through 9, further having the light from the focusing means reflected on an interior surface using a mirror or total internal reflection before arriving at the linear sensor array.
11. Imaging apparatus of one of claims 1 through 11, further having a reservoir for liquid embedded in the platen surface
12. Imaging apparatus of one of claims 1 through 12, further having blackened faces on the platen.
13. Imaging apparatus of one of claims 1 through 13 further employing a method of sensing and measuring fmger motion speed and correcting for geometric errors in the electronic output image.
14. A method of creating an image of an object with a varied surface, comprising the steps of:
(a) moving the object along a stationary transparent platen;
(b) shining a light from a stationary light source underneath the platen; (c) collecting the resulting total internal reflection and frustrated total internal reflection and partially scattered light and directing it to a linear array sensor to create an electronic image of the object thereon.
15. The method of claim 14 further comprising the step of:
(d) measuring object motion speed and correcting for geometric errors in said electronic image.
16. A method of creating an image of an object with a varied surface, comprising the steps of:
(a) moving the object along a stationary transparent platen;
(b) shining a light from a stationary light source underneath the platen at an oblique angle to the platen;
(c) collecting the resulting light from the platen and directing it to a linear array sensor to create an electronic image of the object thereon.
17. Imaging apparatus, comprising : a. a platen composed of a transparent material with an exterior surface for the skin of a fmger and an opposed interior surface; said exterior surface having one and only one raised portion; b. a light source, for directing light to or reflecting light off said interior surface of said platen adjacent to the skin of the fmger; c. a linear sensor array; d. a GRIN lens array, situated at an oblique angle with respect to said platen for focusing the light from the top interior surface of the platen onto the linear sensor array.
18. Imaging apparatus of claim 17, further having multiple parallel linear sensor arrays.
19. Imaging apparatus of one of claims 17 or 18, further having said light from said light source redirected by a reflection on an interior surface of the platen using a mirror or total internal reflection.
20. Imaging apparatus of one of claims 17 through 19, further having the light from the light source redirected by a reflection on an interior surface of the platen which is roughened
21. Imaging apparatus of one of claims 17 through 20, further having the light from the light source collimated by a lens molded into the platen where the light enters
22. Imaging apparatus of one of claims 17 through 21, further having a ridge on the top of the platen, either formed from the platen material or a different optically transparent material.
23. Imaging apparatus of one of claims 17 through 22, further having a relay lens pair array replacing the GRIN lens.
24. Imaging apparatus of one of claims 17 through 23, further having the light from the platen surface reflected on an interior surface using a mirror or total internal reflection before entering the focus means.
25. Imaging apparatus of one of claims 17 through 24, further having the light from the focusing means reflected on an interior surface using a mirror or total internal reflection before arriving at the linear sensor array.
26. Imaging apparatus of one of claims 17 through 25, further having a reservoir for liquid embedded in the platen surface.
27. Imaging apparatus of one of claims 17 through 26, further having blackened faces on the platen.
28. Imaging apparatus of one of claims 17 through 27 further employing a method of sensing and measuring finger motion speed and correcting for geometric errors in the electronic output image.
29. Imaging apparatus, comprising: a. a platen composed of a transparent material with an exterior surface for the skin of a fmger and an opposed interior surface; b. a light source, for directing light to or reflecting light off said interior surface of said platen adjacent to the skin of the finger; c. a linear sensor array; d. a GRIN lens array positioned at least partially within said platen, for focusing the light from the top interior surface of the platen onto the linear sensor array.
30 Imaging apparatus of claim 29, further having multiple parallel linear sensor arrays.
31. Imaging apparatus of one of claims 29 or 30, further having said light from said light source redirected by a reflection on an interior surface of the platen using a mirror or total internal reflection.
32. Imaging apparatus of one of claims 29 through 31, further having the light from the light source redirected by a reflection on an interior surface of the platen which is roughened
33. Imaging apparatus of one of claims 29 through 32, further having the light from the light source collimated by a lens molded into the platen where the light enters.
34. Imaging apparatus of one of claims 29 through 33, further having a ridge on the top of the platen, either formed from the platen material or a different optically transparent material.
35. Imaging apparatus of one of claims 29 through 34, further having a relay lens pair array replacing the GRIN lens.
36. Imaging apparatus of one of claims 29 through 35, further having the light from the platen surface reflected on an interior surface using a mirror or total internal reflection before entering the focus means.
37. Imaging apparatus of one of claims 29 through 36, further having the light from the focusing means reflected on an interior surface using a mirror or total internal reflection before arriving at the linear sensor array.
38. Imaging apparatus of one of claims 29 through 37, further having a reservoir for liquid embedded in the platen surface
39. Imaging apparatus of one of claims 29 through 38, further having blackened faces on the platen.
40. Imaging apparatus of one of claims 29 through 39 further employing a method of sensing and measuring finger motion speed and correcting for geometric errors in the electronic output image.
-28-
PCT/CA1999/000936 1998-10-09 1999-10-08 Fingerprint image optical input apparatus WO2000022565A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT99947151T ATE301853T1 (en) 1998-10-09 1999-10-08 DEVICE FOR OPTICAL FINGERPRINT ENTRY
EP99947151A EP1119824B1 (en) 1998-10-09 1999-10-08 Fingerprint image optical input apparatus
DE69926645T DE69926645T2 (en) 1998-10-09 1999-10-08 DEVICE FOR OPTICAL FINGERPRINT INPUT
AU60735/99A AU6073599A (en) 1998-10-09 1999-10-08 Fingerprint image optical input apparatus
CA002386973A CA2386973C (en) 1998-10-09 1999-10-08 Fingerprint image optical input apparatus
JP2000576403A JP2002527832A (en) 1998-10-09 1999-10-08 Fingerprint image optical input device
US09/833,262 US6355937B2 (en) 1998-10-09 2001-04-09 Fingerprint image optical input apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/169,008 US6259108B1 (en) 1998-10-09 1998-10-09 Fingerprint image optical input apparatus
US09/169,008 1998-10-09

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09/169,008 Continuation-In-Part US6259108B1 (en) 1998-10-09 1998-10-09 Fingerprint image optical input apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US09/833,262 Continuation US6355937B2 (en) 1998-10-09 2001-04-09 Fingerprint image optical input apparatus

Publications (1)

Publication Number Publication Date
WO2000022565A1 true WO2000022565A1 (en) 2000-04-20

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Application Number Title Priority Date Filing Date
PCT/CA1999/000936 WO2000022565A1 (en) 1998-10-09 1999-10-08 Fingerprint image optical input apparatus

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US (2) US6259108B1 (en)
EP (1) EP1119824B1 (en)
JP (1) JP2002527832A (en)
KR (1) KR100668361B1 (en)
AT (1) ATE301853T1 (en)
AU (1) AU6073599A (en)
CA (1) CA2386973C (en)
DE (1) DE69926645T2 (en)
WO (1) WO2000022565A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004021278A1 (en) * 2002-08-27 2004-03-11 Matsushita Electric Industrial Co., Ltd. Optical element and reading device
EP1541086A1 (en) * 2002-09-17 2005-06-15 Fujitsu Limited Biological information acquiring apparatus and authentication apparatus using biological information
JP2008036058A (en) * 2006-08-04 2008-02-21 Hitachi Maxell Ltd Image pickup device and biological authentication
US8031916B2 (en) 2006-01-06 2011-10-04 Fujitsu Limited Biometric information input apparatus
US8086918B2 (en) 2005-12-15 2011-12-27 Fujitsu Limited High-speed serial transfer device test data storage medium and device
US9462150B2 (en) 2012-12-06 2016-10-04 Mitsubishi Electric Corporation Image read-in device with fastener to fasten transparent member retaining lens array assembly and light shield to board

Families Citing this family (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6178255B1 (en) * 1998-04-28 2001-01-23 Cross Match Technologies, Inc. Individualized fingerprint scanner
US6259108B1 (en) * 1998-10-09 2001-07-10 Kinetic Sciences Inc. Fingerprint image optical input apparatus
US7268814B1 (en) * 1999-10-05 2007-09-11 California Institute Of Technology Time-delayed-integration imaging with active pixel sensors
US6632512B1 (en) * 1999-11-10 2003-10-14 Ibiden Co., Ltd. Ceramic substrate
US6538243B1 (en) * 2000-01-04 2003-03-25 Hewlett-Packard Company Contact image sensor with light guide having least reflectivity near a light source
US20030016848A1 (en) * 2000-03-08 2003-01-23 Hideki Kitajima Image reader
US6628377B1 (en) * 2000-04-04 2003-09-30 Stmicroelectronics, Inc. Scanning optical semiconductor fingerprint detector
NO20003006L (en) * 2000-06-09 2001-12-10 Idex Asa Mouse
US7289649B1 (en) * 2000-08-10 2007-10-30 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Fingerprint imager
EP1312040B1 (en) * 2000-08-18 2006-04-05 Cross Match Technologies, Inc. Fingerprint scanner auto-capture system and method
DE60131205T2 (en) * 2000-12-05 2008-08-14 Validity Sensors Inc., Phoenix Capacitive speedometer
US6928195B2 (en) * 2000-12-18 2005-08-09 Cross Match Technologies, Inc. Palm scanner using a programmable nutating mirror for increased resolution
US7072034B2 (en) * 2001-06-08 2006-07-04 Kla-Tencor Corporation Systems and methods for inspection of specimen surfaces
US20030016427A1 (en) * 2001-04-26 2003-01-23 Arnold Joe F. Silicon rubber surfaces for biometric print TIR prisms
US20020181750A1 (en) * 2001-05-30 2002-12-05 Kwell Hung Fingerprint identification apparatus
JP2003006627A (en) * 2001-06-18 2003-01-10 Nec Corp Fingerprint input device
CN1509895A (en) * 2001-06-22 2004-07-07 ��Τ����˹ Color copying method
US7272248B2 (en) * 2001-07-16 2007-09-18 Activcard Ireland Limited Biometric imaging device compensating for non-biometric parameters
JP4154874B2 (en) * 2001-07-30 2008-09-24 カシオ計算機株式会社 Fingerprint reader and fingerprint reading method
US6646244B2 (en) * 2001-12-19 2003-11-11 Hewlett-Packard Development Company, L.P. Optical imaging device with speed variable illumination
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
ATE406626T1 (en) 2002-01-17 2008-09-15 Cross Match Technologies Inc FINGERPRINT WORKSTATION AND METHOD
US6954260B2 (en) * 2002-01-17 2005-10-11 Cross Match Technologies, Inc. Systems and methods for illuminating a platen in a print scanner
US6867850B2 (en) * 2002-01-17 2005-03-15 Cross Match Technologies, Inc. Light wedge for illuminating a platen in a print scanner
US7088872B1 (en) * 2002-02-14 2006-08-08 Cogent Systems, Inc. Method and apparatus for two dimensional image processing
JP2003242489A (en) * 2002-02-20 2003-08-29 Canon Inc Image input device and fingerprint recognizing device
TWI243339B (en) * 2002-03-19 2005-11-11 Casio Computer Co Ltd Image reading apparatus and drive control method
EP1353292B1 (en) * 2002-04-12 2011-10-26 STMicroelectronics (Research & Development) Limited Biometric sensor apparatus and methods
US7073711B2 (en) * 2002-04-19 2006-07-11 Cross Match Technologies, Inc. Mobile handheld code reader and print scanner system and method
US7079007B2 (en) * 2002-04-19 2006-07-18 Cross Match Technologies, Inc. Systems and methods utilizing biometric data
US7019872B2 (en) * 2002-06-19 2006-03-28 Hewlett-Packard Development Company, L.P. Compact scanner and scanning method
AU2003254280A1 (en) * 2002-08-02 2004-02-23 Cross Match Technologies, Inc. System and method for counting ridges in a captured print image
US20040028262A1 (en) * 2002-08-09 2004-02-12 Kuo-Liang Lin Optical system of fingerprint image capture apparatus
US6904326B2 (en) * 2002-10-17 2005-06-07 Hewlett-Packard Development Company, Lp. Light responsive data entry system
US20040101172A1 (en) * 2002-11-26 2004-05-27 Stmicroelectronics, Inc. Imaging system with locator bar for accurate fingerprint recognition
EP1437677A1 (en) * 2002-12-30 2004-07-14 Nokia Corporation Optical user interface for controlling portable electric device
US7164440B2 (en) * 2003-02-28 2007-01-16 Cross Match Technologies, Inc. Dynamic image adaptation method for adjusting the quality of digital prints
JP2005018594A (en) * 2003-06-27 2005-01-20 Canon Inc Fingerprint input device, its manufacturing method, and personal identification system
JP2005038406A (en) * 2003-06-27 2005-02-10 Canon Inc Fingerprint input apparatus and personal identification system using it
JP3891572B2 (en) * 2003-06-30 2007-03-14 キヤノン株式会社 Fingerprint input device, personal authentication system and electronic device
AU2003255025A1 (en) * 2003-08-13 2005-03-07 Hitachi, Ltd. Personal identification device
US20050047631A1 (en) * 2003-08-26 2005-03-03 Cross Match Technologies, Inc. Method and apparatus for rolled fingerprint image capture with variable blending
CA2552650C (en) 2004-01-07 2014-09-30 Identification International, Inc. Low power fingerprint capture system, apparatus, and method
JP2005198843A (en) * 2004-01-15 2005-07-28 Mitsumi Electric Co Ltd Image detector
US8175345B2 (en) 2004-04-16 2012-05-08 Validity Sensors, Inc. Unitized ergonomic two-dimensional fingerprint motion tracking device and method
US8447077B2 (en) 2006-09-11 2013-05-21 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array
US8131026B2 (en) 2004-04-16 2012-03-06 Validity Sensors, Inc. Method and apparatus for fingerprint image reconstruction
US8165355B2 (en) 2006-09-11 2012-04-24 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array for use in navigation applications
US8358815B2 (en) 2004-04-16 2013-01-22 Validity Sensors, Inc. Method and apparatus for two-dimensional finger motion tracking and control
US8229184B2 (en) 2004-04-16 2012-07-24 Validity Sensors, Inc. Method and algorithm for accurate finger motion tracking
WO2005104012A1 (en) * 2004-04-16 2005-11-03 Validity Sensors, Inc. Finger position sensing methods and apparatus
WO2005106774A2 (en) * 2004-04-23 2005-11-10 Validity Sensors, Inc. Methods and apparatus for acquiring a swiped fingerprint image
GB0415447D0 (en) * 2004-07-09 2004-08-11 Tiger Telematics Inc Portable electronic device
JP2008507787A (en) * 2004-07-29 2008-03-13 クルシアルテック シーオー．，エルティーディー Optical pointing device and personal portable terminal
DE602005022900D1 (en) 2004-10-04 2010-09-23 Validity Sensors Inc FINGERPRINTER CONSTRUCTIONS WITH ONE SUBSTRATE
TW200612353A (en) * 2004-10-15 2006-04-16 Lite On Semiconductor Corp Optical sensing module, optical sensing, image-capturing structure and optical print sensing method of handheld communication system
US7616788B2 (en) * 2004-11-12 2009-11-10 Cogent Systems, Inc. System and method for fast biometric pattern matching
US7558410B2 (en) * 2004-12-01 2009-07-07 Ultra-Scan Corporation Fingerprint scanning station
TWM267551U (en) * 2004-12-21 2005-06-11 Lite On Semiconductor Corp Contact image sensing module with fingerprint scanning function
TWM268675U (en) * 2004-12-24 2005-06-21 Lite On Semiconductor Corp Touch type image sensing module with motion detection function
JP4582406B2 (en) * 2004-12-28 2010-11-17 ソニー株式会社 Biological imaging device
TWM268676U (en) * 2004-12-28 2005-06-21 Lite On Semiconductor Corp Fingerprint scan device and electric equipment with fingerprint scan function
US7705835B2 (en) * 2005-03-28 2010-04-27 Adam Eikman Photonic touch screen apparatus and method of use
US20060250605A1 (en) * 2005-05-04 2006-11-09 Chuan Liang Industrial Co., Ltd. Compact-thin contact image sensor
US7460697B2 (en) * 2005-07-19 2008-12-02 Validity Sensors, Inc. Electronic fingerprint sensor with differential noise cancellation
KR100760061B1 (en) 2005-07-25 2007-09-18 추안 리앙 인더스트리얼 코., 엘티디. Fingerprint identification assembly using total reflection to identify pattern of the fingerprint
WO2007047816A1 (en) * 2005-10-18 2007-04-26 Authentec, Inc. Finger sensor including flexible circuit and associated methods
US8131477B2 (en) 2005-11-16 2012-03-06 3M Cogent, Inc. Method and device for image-based biological data quantification
KR100729007B1 (en) * 2006-01-19 2007-06-14 일렉비젼 인크. Contact image capturing structure
RU2412460C2 (en) * 2006-04-10 2011-02-20 Электролюкс Хоум Продактс Корпорейшн Н.В. Household electric appliance incorporating fingerprint identification sensor
TW200744000A (en) * 2006-05-18 2007-12-01 Pixart Imaging Inc Optical module with a linear sensor for identifying images
US7671976B2 (en) * 2006-06-05 2010-03-02 Lockheed Martin Corporation Systems and methods of using a flexible imaging surface to capture a rolled fingerprint
JP2008065440A (en) * 2006-09-05 2008-03-21 Fuji Denki Kogyo Kk Fingerprint authentication device
JP4864632B2 (en) * 2006-10-12 2012-02-01 株式会社リコー Image input device, image input method, personal authentication device, and electronic device
JP4341670B2 (en) * 2006-11-17 2009-10-07 ミツミ電機株式会社 Image input device
KR100917598B1 (en) * 2006-11-24 2009-09-17 한국전자통신연구원 Contact image sensor
US7812936B2 (en) * 2007-04-09 2010-10-12 Identification International, Inc. Fingerprint imaging system
US8107212B2 (en) 2007-04-30 2012-01-31 Validity Sensors, Inc. Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge
US8275179B2 (en) * 2007-05-01 2012-09-25 3M Cogent, Inc. Apparatus for capturing a high quality image of a moist finger
US8290150B2 (en) 2007-05-11 2012-10-16 Validity Sensors, Inc. Method and system for electronically securing an electronic device using physically unclonable functions
US8411916B2 (en) * 2007-06-11 2013-04-02 3M Cogent, Inc. Bio-reader device with ticket identification
EP2587345A3 (en) 2007-08-19 2013-06-26 Ringbow Ltd. Finger-worn devices and related methods of use
EP2254477B1 (en) * 2007-09-28 2013-05-29 Nivasonix, LLC. Handheld transducer scanning speed guides and position detectors
US8204281B2 (en) 2007-12-14 2012-06-19 Validity Sensors, Inc. System and method to remove artifacts from fingerprint sensor scans
US8276816B2 (en) 2007-12-14 2012-10-02 Validity Sensors, Inc. Smart card system with ergonomic fingerprint sensor and method of using
DE102008017125A1 (en) * 2008-04-03 2009-10-15 Rudi Schael Light scanning system, has objectives equipped with component that produces additional image rotation apart from natural image rotation with which both partial illustration and total illustration comprise identical image of scanning line
US8116540B2 (en) 2008-04-04 2012-02-14 Validity Sensors, Inc. Apparatus and method for reducing noise in fingerprint sensing circuits
US8005276B2 (en) 2008-04-04 2011-08-23 Validity Sensors, Inc. Apparatus and method for reducing parasitic capacitive coupling and noise in fingerprint sensing circuits
DE102008029467A1 (en) * 2008-06-20 2009-12-24 Osram Opto Semiconductors Gmbh Semiconductor device, use of a semiconductor device as a proximity sensor and method for detecting objects
WO2010036445A1 (en) 2008-07-22 2010-04-01 Validity Sensors, Inc. System, device and method for securing a device component
US8391568B2 (en) 2008-11-10 2013-03-05 Validity Sensors, Inc. System and method for improved scanning of fingerprint edges
US8278946B2 (en) 2009-01-15 2012-10-02 Validity Sensors, Inc. Apparatus and method for detecting finger activity on a fingerprint sensor
US8600122B2 (en) 2009-01-15 2013-12-03 Validity Sensors, Inc. Apparatus and method for culling substantially redundant data in fingerprint sensing circuits
US8374407B2 (en) 2009-01-28 2013-02-12 Validity Sensors, Inc. Live finger detection
US8605960B2 (en) * 2009-03-02 2013-12-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Fingerprint sensing device
US8124953B2 (en) * 2009-03-12 2012-02-28 Infineon Technologies Ag Sensor device having a porous structure element
CN101848299B (en) * 2009-03-26 2014-04-16 海德堡印刷机械股份公司 Device for imaging a flat object
GB2470554A (en) * 2009-05-26 2010-12-01 St Microelectronics Ltd Optical navigation device with housing and optical transmission element to a mousing surface
GB2470553A (en) * 2009-05-26 2010-12-01 St Microelectronics Ltd Optical computer input with single frustrated total internal reflection mousing surface
TWM372050U (en) * 2009-09-09 2010-01-01 Azurewave Technologies Inc Image capturing module capable of simplifying optical component
TWM377018U (en) * 2009-09-09 2010-03-21 Azurewave Technologies Inc Flip chip type image capturing module
US9336428B2 (en) 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
US9400911B2 (en) 2009-10-30 2016-07-26 Synaptics Incorporated Fingerprint sensor and integratable electronic display
WO2011059496A1 (en) * 2009-11-11 2011-05-19 Cross Match Technologies, Inc. Apparatus and method for determining sequencing of fingers in images to a two-finger scanner of fingerprint images
JP4842363B2 (en) * 2009-11-17 2011-12-21 シャープ株式会社 Pointing device and electronic device
US8791792B2 (en) 2010-01-15 2014-07-29 Idex Asa Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
TW201126385A (en) * 2010-01-25 2011-08-01 Maxemil Photonics Corp Optical position indication input apparatus
US9666635B2 (en) 2010-02-19 2017-05-30 Synaptics Incorporated Fingerprint sensing circuit
US8716613B2 (en) 2010-03-02 2014-05-06 Synaptics Incoporated Apparatus and method for electrostatic discharge protection
US9001040B2 (en) 2010-06-02 2015-04-07 Synaptics Incorporated Integrated fingerprint sensor and navigation device
US8331096B2 (en) 2010-08-20 2012-12-11 Validity Sensors, Inc. Fingerprint acquisition expansion card apparatus
JP2012133455A (en) * 2010-12-20 2012-07-12 Mitsumi Electric Co Ltd Pointing device
US8538097B2 (en) 2011-01-26 2013-09-17 Validity Sensors, Inc. User input utilizing dual line scanner apparatus and method
US8594393B2 (en) 2011-01-26 2013-11-26 Validity Sensors System for and method of image reconstruction with dual line scanner using line counts
GB2489100A (en) 2011-03-16 2012-09-19 Validity Sensors Inc Wafer-level packaging for a fingerprint sensor
US9082188B2 (en) 2011-04-11 2015-07-14 Hid Global Corporation Optical topographic imaging
GB201110218D0 (en) 2011-06-16 2011-08-03 St Microelectronics Res & Dev Optical navigation device
US10043052B2 (en) 2011-10-27 2018-08-07 Synaptics Incorporated Electronic device packages and methods
US9195877B2 (en) 2011-12-23 2015-11-24 Synaptics Incorporated Methods and devices for capacitive image sensing
US9785299B2 (en) 2012-01-03 2017-10-10 Synaptics Incorporated Structures and manufacturing methods for glass covered electronic devices
US9137438B2 (en) 2012-03-27 2015-09-15 Synaptics Incorporated Biometric object sensor and method
US9268991B2 (en) 2012-03-27 2016-02-23 Synaptics Incorporated Method of and system for enrolling and matching biometric data
US9251329B2 (en) 2012-03-27 2016-02-02 Synaptics Incorporated Button depress wakeup and wakeup strategy
US9600709B2 (en) 2012-03-28 2017-03-21 Synaptics Incorporated Methods and systems for enrolling biometric data
US9152838B2 (en) 2012-03-29 2015-10-06 Synaptics Incorporated Fingerprint sensor packagings and methods
EP2836960B1 (en) 2012-04-10 2018-09-26 Idex Asa Biometric sensing
TWI518306B (en) * 2012-10-04 2016-01-21 原相科技股份有限公司 Image retrieving device and optical motion estimation device
US9665762B2 (en) 2013-01-11 2017-05-30 Synaptics Incorporated Tiered wakeup strategy
WO2014119503A1 (en) * 2013-01-31 2014-08-07 日本電気株式会社 Authentication device, prism body for authentication, and authentication method
US10574944B2 (en) * 2013-03-08 2020-02-25 Gelsight, Inc. Continuous contact-based three-dimensional measurement
US9136258B1 (en) * 2013-11-26 2015-09-15 Maxim Integrated Products, Inc. Stacked LED for optical sensor devices
US9773151B2 (en) 2014-02-06 2017-09-26 University Of Massachusetts System and methods for contactless biometrics-based identification
US10713521B2 (en) * 2016-08-05 2020-07-14 Gingy Technology Inc. Image capturing apparatus and manufacturing method thereof
CN107392196A (en) * 2016-08-05 2017-11-24 金佶科技股份有限公司 Image capturing device and manufacturing method thereof
FR3027730B1 (en) * 2014-10-22 2017-12-22 New Imaging Tech DEVICE FOR ACQUIRING DIGITAL IMPRESSIONS
US10192856B2 (en) * 2014-12-30 2019-01-29 Pixart Imaging Inc. Optical navigation module capable of performing lateral detection and adjusting tracking distance
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US10181070B2 (en) 2015-02-02 2019-01-15 Synaptics Incorporated Low profile illumination in an optical fingerprint sensor
CN104751121B (en) * 2015-03-05 2019-04-05 上海交通大学 Light wave conduction fingerprint recognition system based on optical grating construction
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
US9915776B2 (en) * 2015-09-04 2018-03-13 Concraft Holding Co., Ltd. Light guide mechanism of fingerprint recognition plate
CN108140125B (en) * 2015-09-15 2021-11-02 上海箩箕技术有限公司 Optical fingerprint imaging system and area array sensor
CN108351966A (en) * 2015-09-18 2018-07-31 辛纳普蒂克斯公司 Optical fingerprint sensor encapsulates
US9934418B2 (en) * 2015-12-03 2018-04-03 Synaptics Incorporated Display integrated optical fingerprint sensor with angle limiting reflector
US10169630B2 (en) 2015-12-03 2019-01-01 Synaptics Incorporated Optical sensor for integration over a display backplane
US10176355B2 (en) 2015-12-03 2019-01-08 Synaptics Incorporated Optical sensor for integration in a display
CN105354561A (en) * 2015-12-08 2016-02-24 开发晶照明（厦门）有限公司 Fingerprint image acquisition apparatus
KR102091657B1 (en) * 2015-12-11 2020-04-23 주식회사 이랜텍 method for manufacturing the camera module package
US10282583B2 (en) 2015-12-22 2019-05-07 Gemalto Sa Fingerprint imaging systems comprising self-wetting adhesive, films and methods
US9454259B2 (en) * 2016-01-04 2016-09-27 Secugen Corporation Multi-level command sensing apparatus
WO2017198764A1 (en) * 2016-05-20 2017-11-23 Sentech Instruments Gmbh Device and method for measuring layer thicknesses and indices of refraction of layers on rough and smooth surfaces
TWI584201B (en) * 2016-07-17 2017-05-21 金佶科技股份有限公司 Identification apparatus and identification method
WO2018064563A1 (en) * 2016-09-29 2018-04-05 Synaptics Incorporated Low profile illumination in an optical fingerprint sensor
KR20180039222A (en) 2016-10-07 2018-04-18 삼성디스플레이 주식회사 Display device comprising fingerprint sensor
US11730372B2 (en) * 2016-10-18 2023-08-22 Koninklijke Philips N.V. Accessory device and imaging device
CN108009467A (en) * 2016-10-27 2018-05-08 金佶科技股份有限公司 Image capturing device and manufacturing method thereof
CN108241833A (en) * 2016-12-23 2018-07-03 创智能科技股份有限公司 Biometric recognition device.It
CN108304751A (en) * 2017-01-13 2018-07-20 致伸科技股份有限公司 Identification of fingerprint module with instruction function
TWI649696B (en) * 2017-01-13 2019-02-01 致伸科技股份有限公司 Fingerprint identifying module with indicating function
US10235557B1 (en) * 2018-01-08 2019-03-19 Secugen Corporation Method and apparatus for sensing fingerprint
KR102195081B1 (en) * 2019-03-12 2020-12-24 (주)파트론 Fingerprint recognition sensor package
KR102195088B1 (en) * 2019-04-17 2020-12-24 (주)파트론 Fingerprint recognition sensor package
KR20210019641A (en) 2019-08-12 2021-02-23 삼성전자주식회사 Biometric information sensing module and electronic device including the same
CN112449034A (en) * 2019-08-30 2021-03-05 北京小米移动软件有限公司 Mobile terminal
DE102021112447A1 (en) * 2021-05-12 2022-11-17 Infineon Technologies Ag Smart card biometrics sensor device, smart card, method of forming a smart card biometrics sensor device and method of forming a smart card

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0098607A2 (en) * 1982-07-09 1984-01-18 Fingermatrix Inc. Fingerprint image refinement
US4832485A (en) * 1982-09-03 1989-05-23 Commonwealth Technology, Inc. Image enhancer
US5448649A (en) * 1994-05-24 1995-09-05 Chen; Wang S. Apparatus for imaging fingerprint or topographic relief pattern on the surface of an object
WO1996013742A1 (en) * 1994-10-28 1996-05-09 The National Registry, Inc. Uneven surface image transfer apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK155242C (en) * 1985-05-02 1989-07-31 Jydsk Telefon As METHOD AND APPARATUS FOR AUTOMATIC DETECTION OF FINGERPRINT
JPH0648494B2 (en) * 1987-04-28 1994-06-22 富士通株式会社 Uneven surface information input device
US5619586A (en) * 1990-12-20 1997-04-08 Thorn Emi Plc Method and apparatus for producing a directly viewable image of a fingerprint
JPH07325901A (en) * 1991-03-18 1995-12-12 Fujitsu Ltd Fingerprint sensor
JPH08154921A (en) * 1994-12-06 1996-06-18 Nippon Telegr & Teleph Corp <Ntt> Finger print camera apparatus
JPH08279035A (en) * 1995-04-06 1996-10-22 Nippon Telegr & Teleph Corp <Ntt> Fingerprint input device
US5942761A (en) * 1995-06-07 1999-08-24 Tuli; Raja Singh Enhancement methods and devices for reading a fingerprint image
JPH09198495A (en) * 1996-01-16 1997-07-31 Micro Net:Kk Fingerprint image pickup device for fingerprint collator
JPH10289304A (en) * 1997-02-12 1998-10-27 Nec Corp Fingerprint image input device
US6259108B1 (en) * 1998-10-09 2001-07-10 Kinetic Sciences Inc. Fingerprint image optical input apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0098607A2 (en) * 1982-07-09 1984-01-18 Fingermatrix Inc. Fingerprint image refinement
US4832485A (en) * 1982-09-03 1989-05-23 Commonwealth Technology, Inc. Image enhancer
US5448649A (en) * 1994-05-24 1995-09-05 Chen; Wang S. Apparatus for imaging fingerprint or topographic relief pattern on the surface of an object
WO1996013742A1 (en) * 1994-10-28 1996-05-09 The National Registry, Inc. Uneven surface image transfer apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
FUJIEDA I ET AL: "Fingerprint input based on scattered-light detection", APPLIED OPTICS, 10 DEC. 1997, OPT. SOC. AMERICA, USA, vol. 36, no. 35, pages 9152 - 9156, XP002126727, ISSN: 0003-6935 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004021278A1 (en) * 2002-08-27 2004-03-11 Matsushita Electric Industrial Co., Ltd. Optical element and reading device
EP1541086A1 (en) * 2002-09-17 2005-06-15 Fujitsu Limited Biological information acquiring apparatus and authentication apparatus using biological information
EP1541086A4 (en) * 2002-09-17 2007-07-18 Fujitsu Ltd Biological information acquiring apparatus and authentication apparatus using biological information
US7627150B2 (en) 2002-09-17 2009-12-01 Fujitsu Limited Biometric information obtaining apparatus and biometric information verification apparatus
US8086918B2 (en) 2005-12-15 2011-12-27 Fujitsu Limited High-speed serial transfer device test data storage medium and device
US8031916B2 (en) 2006-01-06 2011-10-04 Fujitsu Limited Biometric information input apparatus
JP2008036058A (en) * 2006-08-04 2008-02-21 Hitachi Maxell Ltd Image pickup device and biological authentication
US9462150B2 (en) 2012-12-06 2016-10-04 Mitsubishi Electric Corporation Image read-in device with fastener to fasten transparent member retaining lens array assembly and light shield to board

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