WO2000002803A9 - Dual arm substrate handling robot with a batch loader - Google Patents
Dual arm substrate handling robot with a batch loaderInfo
- Publication number
- WO2000002803A9 WO2000002803A9 PCT/US1999/015484 US9915484W WO0002803A9 WO 2000002803 A9 WO2000002803 A9 WO 2000002803A9 US 9915484 W US9915484 W US 9915484W WO 0002803 A9 WO0002803 A9 WO 0002803A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- arm
- substrate
- batch loader
- substrates
- handling robot
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S294/00—Handling: hand and hoist-line implements
- Y10S294/907—Sensor controlled device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000559040A JP2002520830A (en) | 1998-07-10 | 1999-07-09 | Two-arm substrate handling robot with batch loader |
EP99932361A EP1133441A1 (en) | 1998-07-10 | 1999-07-09 | Dual arm substrate handling robot with a batch loader |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/113,599 | 1998-07-10 | ||
US09/113,599 US6450755B1 (en) | 1998-07-10 | 1998-07-10 | Dual arm substrate handling robot with a batch loader |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000002803A1 WO2000002803A1 (en) | 2000-01-20 |
WO2000002803A9 true WO2000002803A9 (en) | 2000-09-08 |
Family
ID=22350418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/015484 WO2000002803A1 (en) | 1998-07-10 | 1999-07-09 | Dual arm substrate handling robot with a batch loader |
Country Status (5)
Country | Link |
---|---|
US (3) | US6450755B1 (en) |
EP (1) | EP1133441A1 (en) |
JP (3) | JP2002520830A (en) |
KR (1) | KR100651305B1 (en) |
WO (1) | WO2000002803A1 (en) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6350097B1 (en) * | 1999-04-19 | 2002-02-26 | Applied Materials, Inc. | Method and apparatus for processing wafers |
US6582175B2 (en) * | 2000-04-14 | 2003-06-24 | Applied Materials, Inc. | Robot for handling semiconductor wafers |
US7891935B2 (en) | 2002-05-09 | 2011-02-22 | Brooks Automation, Inc. | Dual arm robot |
US7230441B2 (en) * | 2002-07-18 | 2007-06-12 | Rudolph Technologies, Inc. | Wafer staging platform for a wafer inspection system |
US20040013503A1 (en) * | 2002-07-22 | 2004-01-22 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
JP2004071730A (en) * | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | Reticle handling method, reticle handling unit, and exposure system |
EP1542524A4 (en) * | 2002-08-06 | 2009-02-25 | Panasonic Corp | Method and equipment for mounting part |
US6696367B1 (en) * | 2002-09-27 | 2004-02-24 | Asm America, Inc. | System for the improved handling of wafers within a process tool |
US7384907B2 (en) * | 2002-12-13 | 2008-06-10 | Duke University | Method of treating infection with ABl tyrosine kinase inhibitors |
JP4391744B2 (en) * | 2002-12-27 | 2009-12-24 | 東京エレクトロン株式会社 | Mobile probe card transport device, probe device, and probe card transport method to probe device |
KR100553685B1 (en) * | 2003-05-14 | 2006-02-24 | 삼성전자주식회사 | Transfer apparatus and method for unloading semiconductor devices from a container |
JP3999723B2 (en) * | 2003-10-08 | 2007-10-31 | 川崎重工業株式会社 | Substrate holding device |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
TWI274640B (en) * | 2004-04-08 | 2007-03-01 | Fabworx Solutions Inc | Hub assembly for robotic arm having pin spacers |
US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7255747B2 (en) | 2004-12-22 | 2007-08-14 | Sokudo Co., Ltd. | Coat/develop module with independent stations |
US20060182556A1 (en) * | 2005-01-10 | 2006-08-17 | Au Optronics Corporation | Substrate transportation device (wire) |
US7625027B2 (en) * | 2005-05-24 | 2009-12-01 | Aries Innovations | Vacuum actuated end effector |
JP2007005582A (en) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | Substrate transfer apparatus and semiconductor substrate manufacturing apparatus mounted with the same |
US8573919B2 (en) * | 2005-07-11 | 2013-11-05 | Brooks Automation, Inc. | Substrate transport apparatus |
JP4440178B2 (en) * | 2005-07-25 | 2010-03-24 | 東京エレクトロン株式会社 | Substrate transfer device |
US8701519B2 (en) * | 2006-06-28 | 2014-04-22 | Genmark Automation, Inc. | Robot with belt-drive system |
US8220354B2 (en) * | 2006-06-28 | 2012-07-17 | Genmark Automation, Inc. | Belt-driven robot having extended Z-axis motion |
US9117859B2 (en) * | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
KR100810488B1 (en) | 2006-11-15 | 2008-03-07 | 주식회사 로보스타 | Double arm type robot |
KR101601005B1 (en) * | 2006-11-27 | 2016-03-08 | 테크-셈 아크티엔게젤샤프트 | Transfer device for an overhead conveying system |
US8950998B2 (en) * | 2007-02-27 | 2015-02-10 | Brooks Automation, Inc. | Batch substrate handling |
US8317449B2 (en) * | 2007-03-05 | 2012-11-27 | Applied Materials, Inc. | Multiple substrate transfer robot |
GB2464841B (en) * | 2007-05-07 | 2012-01-18 | Symyx Solutions Inc | Apparatus and method for moving a substrate |
SG147353A1 (en) * | 2007-05-07 | 2008-11-28 | Mfg Integration Technology Ltd | Apparatus for object processing |
US8099190B2 (en) * | 2007-06-22 | 2012-01-17 | Asm International N.V. | Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured |
US8277165B2 (en) * | 2007-09-22 | 2012-10-02 | Dynamic Micro System Semiconductor Equipment GmbH | Transfer mechanism with multiple wafer handling capability |
DE102007047600A1 (en) * | 2007-10-05 | 2009-04-23 | Scolomatic Gmbh | Gripper system, particularly wafer gripper system, has primary gripping device and secondary gripping device, where secondary gripper device has support unit that is moved into primary moving direction |
KR20090041883A (en) * | 2007-10-25 | 2009-04-29 | 삼성전자주식회사 | Semiconductor production device and method for processing loading and unloading wafer by setting variable slot therefor |
TWI372717B (en) * | 2007-12-14 | 2012-09-21 | Prime View Int Co Ltd | Apparatus for transferring substrate |
JP2011119468A (en) * | 2009-12-03 | 2011-06-16 | Tokyo Electron Ltd | Conveying method of workpiece, and workpiece treating apparatus |
DE102010026209A1 (en) * | 2010-07-06 | 2012-01-12 | Baumann Gmbh | Gripper for gripping semiconductor wafer utilized during manufacturing e.g. integrated circuit, has contact elements made of elastic material and exhibiting different shapes such that contact area is moved relative to fastening region |
US8731718B2 (en) * | 2010-10-22 | 2014-05-20 | Lam Research Corporation | Dual sensing end effector with single sensor |
WO2012064949A1 (en) | 2010-11-10 | 2012-05-18 | Brooks Automation, Inc. | Dual arm robot |
US20120136472A1 (en) * | 2010-11-25 | 2012-05-31 | Li Yan-Ze | Dual-arm type robotic arm and its method of transporting panels |
KR20240005187A (en) | 2011-03-11 | 2024-01-11 | 브룩스 오토메이션 인코퍼레이티드 | Substrate processing apparatus |
US8958907B2 (en) * | 2011-03-31 | 2015-02-17 | Sinfonia Technology Co., Ltd. | Robot arm apparatus |
US9076829B2 (en) | 2011-08-08 | 2015-07-07 | Applied Materials, Inc. | Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing |
US9031700B2 (en) | 2011-10-11 | 2015-05-12 | Intermolecular, Inc. | Facilities manifold with proximity sensor |
JP6110612B2 (en) * | 2012-07-19 | 2017-04-05 | 川崎重工業株式会社 | Substrate transfer device |
US9079304B2 (en) * | 2012-10-31 | 2015-07-14 | Semes Co., Ltd. | Transfer unit, method for controlling the transfer unit, and apparatus and method for treating substrate using the transfer unit |
US9082608B2 (en) | 2012-12-03 | 2015-07-14 | Intermolecular, Inc. | Pneumatic clamping mechanism for cells with adjustable height |
US9149936B2 (en) * | 2013-01-18 | 2015-10-06 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
JP5889814B2 (en) * | 2013-02-20 | 2016-03-22 | 東京エレクトロン株式会社 | Substrate transport apparatus, substrate processing apparatus, and substrate accommodation method |
US9214369B2 (en) * | 2013-11-01 | 2015-12-15 | Varian Semiconductor Equipment Associates, Inc. | Dynamic pitch substrate lift |
EP3101684B1 (en) * | 2014-01-28 | 2023-08-16 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying system and method |
JP6378595B2 (en) * | 2014-09-19 | 2018-08-22 | 東京エレクトロン株式会社 | Substrate transfer device |
USD817878S1 (en) * | 2016-07-08 | 2018-05-15 | UBTECH Robotics Corp. | Servo |
USD817879S1 (en) * | 2016-07-08 | 2018-05-15 | UBTECH Robotics Corp. | Servo |
TWI768849B (en) | 2017-10-27 | 2022-06-21 | 美商應用材料股份有限公司 | Single wafer processing environments with spatial separation |
JP1612766S (en) * | 2018-03-29 | 2018-09-03 | ||
JP1612912S (en) * | 2018-03-29 | 2018-09-03 | ||
JP1619125S (en) * | 2018-03-29 | 2018-11-26 | ||
USD892881S1 (en) * | 2018-03-29 | 2020-08-11 | Daihen Corporation | Power transmission unit and power receiving unit of an industrial robot arm |
JP1612908S (en) * | 2018-03-29 | 2018-09-03 | ||
CN116097416A (en) * | 2020-09-03 | 2023-05-09 | 川崎重工业株式会社 | Substrate holding robot and substrate transfer robot |
TWI767556B (en) * | 2021-02-08 | 2022-06-11 | 鴻勁精密股份有限公司 | Sustainer mechanism and handler having the same |
Family Cites Families (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2442865C3 (en) * | 1974-09-06 | 1979-07-05 | Hagenuk Vormals Neufeldt & Kuhnke Gmbh, 2300 Kiel | Device, in particular a manipulator, for quickly moving and precisely positioning a load actuator along a predetermined path |
US4362978A (en) * | 1980-10-27 | 1982-12-07 | Unimation, Inc. | Control system for manipulator apparatus |
US4451197A (en) * | 1982-07-26 | 1984-05-29 | Advanced Semiconductor Materials Die Bonding, Inc. | Object detection apparatus and method |
US4603897A (en) * | 1983-05-20 | 1986-08-05 | Poconics International, Inc. | Vacuum pickup apparatus |
JPH0799486B2 (en) * | 1984-04-27 | 1995-10-25 | 松下電器産業株式会社 | Angular acceleration control method |
US5280983A (en) * | 1985-01-22 | 1994-01-25 | Applied Materials, Inc. | Semiconductor processing system with robotic autoloader and load lock |
JPS62113941A (en) * | 1985-11-13 | 1987-05-25 | Fujitsu Ltd | Method for assembling harmonic drive reduction gear |
JPS62132666U (en) * | 1986-02-12 | 1987-08-21 | ||
JPH0627860Y2 (en) * | 1986-03-27 | 1994-07-27 | 株式会社神戸製鋼所 | Rotation unevenness compensation device |
JPS62282885A (en) * | 1986-05-29 | 1987-12-08 | 株式会社東芝 | Robot hand |
JPS62198087U (en) * | 1986-06-05 | 1987-12-16 | ||
JPH0825151B2 (en) * | 1988-09-16 | 1996-03-13 | 東京応化工業株式会社 | Handling unit |
JPH07105357B2 (en) * | 1989-01-28 | 1995-11-13 | 国際電気株式会社 | Wafer transfer method and apparatus in vertical CVD diffusion apparatus |
JPH02209331A (en) * | 1989-02-10 | 1990-08-20 | Kokusai Electric Co Ltd | Wafer suction holder |
FR2656599B1 (en) * | 1989-12-29 | 1992-03-27 | Commissariat Energie Atomique | DEVICE FOR STORING FLAT OBJECTS IN A CASSETTE WITH INTERMEDIATE SHELVES. |
JP2654217B2 (en) * | 1990-01-31 | 1997-09-17 | 山形日本電気株式会社 | Wafer transfer method |
JPH0797599B2 (en) * | 1990-04-27 | 1995-10-18 | 株式会社芝浦製作所 | Substrate detection device |
US5135349A (en) * | 1990-05-17 | 1992-08-04 | Cybeq Systems, Inc. | Robotic handling system |
JP2825616B2 (en) * | 1990-05-21 | 1998-11-18 | 東京エレクトロン株式会社 | Plate transfer device |
JPH0461146A (en) * | 1990-06-22 | 1992-02-27 | Mitsubishi Electric Corp | Shifter for semiconductor wafer |
JP2825618B2 (en) * | 1990-06-26 | 1998-11-18 | 東京エレクトロン株式会社 | Wafer transfer method and wafer transfer apparatus |
FR2664525A1 (en) * | 1990-07-16 | 1992-01-17 | Villejuif Etudes Ind | Slice-handling robot with optical sensor |
WO1992005920A1 (en) * | 1990-09-27 | 1992-04-16 | Genmark Automation | Scanning end effector assembly |
US5297910A (en) * | 1991-02-15 | 1994-03-29 | Tokyo Electron Limited | Transportation-transfer device for an object of treatment |
US5180276A (en) * | 1991-04-18 | 1993-01-19 | Brooks Automation, Inc. | Articulated arm transfer device |
JPH05109866A (en) * | 1991-10-16 | 1993-04-30 | Nec Corp | Wafer transfer robot |
DE4238834A1 (en) * | 1991-11-18 | 1993-05-19 | Fusion Systems Corp | Robotic semiconductor wafer transporter with vertical photodetector array - scans detectors to determine which slots are occupied by wafers illuminated from emitter on robot arm |
JP2867194B2 (en) * | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | Processing device and processing method |
JPH06127621A (en) * | 1992-03-29 | 1994-05-10 | Tokyo Electron Tohoku Ltd | Substrate transfer equipment |
JP3241470B2 (en) * | 1992-12-10 | 2001-12-25 | 株式会社日立国際電気 | Semiconductor manufacturing equipment |
JPH06263219A (en) * | 1993-03-11 | 1994-09-20 | Nikon Corp | Carrying device |
JP2970308B2 (en) * | 1993-04-22 | 1999-11-02 | 神鋼電機株式会社 | Finger mounting structure of robot arm for batch transfer of wafers in semiconductor manufacturing equipment |
JP2739413B2 (en) * | 1993-05-26 | 1998-04-15 | ローツェ株式会社 | SCARA robot for substrate transfer |
JP2969034B2 (en) * | 1993-06-18 | 1999-11-02 | 東京エレクトロン株式会社 | Transfer method and transfer device |
US5697748A (en) * | 1993-07-15 | 1997-12-16 | Applied Materials, Inc. | Wafer tray and ceramic blade for semiconductor processing apparatus |
JPH0758191A (en) * | 1993-08-13 | 1995-03-03 | Toshiba Corp | Wafer stage device |
JPH07106402A (en) * | 1993-10-04 | 1995-04-21 | Tokyo Electron Ltd | Platelike material transfer system |
KR100280947B1 (en) * | 1993-10-04 | 2001-02-01 | 마쓰바 구니유키 | Plate Shape Carrier |
US5544421A (en) * | 1994-04-28 | 1996-08-13 | Semitool, Inc. | Semiconductor wafer processing system |
JPH0823022A (en) * | 1994-07-07 | 1996-01-23 | Hitachi Ltd | Wafer lifting equipment |
JP3249309B2 (en) * | 1994-09-13 | 2002-01-21 | 東京エレクトロン株式会社 | Substrate transfer apparatus, substrate transfer method, and coating and developing processing apparatus |
TW297910B (en) * | 1995-02-02 | 1997-02-11 | Tokyo Electron Co Ltd | |
TW309503B (en) * | 1995-06-27 | 1997-07-01 | Tokyo Electron Co Ltd | |
US6299404B1 (en) * | 1995-10-27 | 2001-10-09 | Brooks Automation Inc. | Substrate transport apparatus with double substrate holders |
US6231297B1 (en) * | 1995-10-27 | 2001-05-15 | Brooks Automation, Inc. | Substrate transport apparatus with angled arms |
US6481956B1 (en) * | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
KR100192959B1 (en) * | 1995-12-30 | 1999-06-15 | 윤종용 | Wafer transfer apparatus |
JP2829367B2 (en) * | 1996-03-08 | 1998-11-25 | 国際電気株式会社 | Wafer transfer method |
US5789890A (en) * | 1996-03-22 | 1998-08-04 | Genmark Automation | Robot having multiple degrees of freedom |
US5954472A (en) * | 1996-07-15 | 1999-09-21 | Brooks Automation, Inc. | Batch loader arm |
JPH1058359A (en) * | 1996-08-13 | 1998-03-03 | Yasuhito Itagaki | Carrying robot |
JPH10284577A (en) * | 1997-04-09 | 1998-10-23 | Tokyo Electron Ltd | Method for transferring substrate to be processed |
JPH10329059A (en) * | 1997-05-30 | 1998-12-15 | Daihen Corp | Conveying robot device for two-arm system |
CH692741A5 (en) * | 1997-07-08 | 2002-10-15 | Unaxis Trading Ltd C O Balzers | Vacuum processing system for work piece |
JPH1138909A (en) * | 1997-07-18 | 1999-02-12 | Toa Resin Kk | Signboard |
KR20010023014A (en) * | 1997-08-28 | 2001-03-26 | 씨브이씨 프로덕츠 인코포레이티드 | Wafer handler for multi-station tool |
US6315512B1 (en) * | 1997-11-28 | 2001-11-13 | Mattson Technology, Inc. | Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber |
US6155768A (en) * | 1998-01-30 | 2000-12-05 | Kensington Laboratories, Inc. | Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput |
US6132165A (en) * | 1998-02-23 | 2000-10-17 | Applied Materials, Inc. | Single drive, dual plane robot |
US6057662A (en) * | 1998-02-25 | 2000-05-02 | Applied Materials, Inc. | Single motor control for substrate handler in processing system |
US6547510B1 (en) * | 1998-05-04 | 2003-04-15 | Brooks Automation Inc. | Substrate transport apparatus with coaxial drive shafts and dual independent scara arms |
WO2000005761A1 (en) * | 1998-07-24 | 2000-02-03 | Mitsubishi Denki Kabushiki Kaisha | Wafer holding hand |
-
1998
- 1998-07-10 US US09/113,599 patent/US6450755B1/en not_active Expired - Lifetime
-
1999
- 1999-07-09 JP JP2000559040A patent/JP2002520830A/en active Pending
- 1999-07-09 KR KR1020017000444A patent/KR100651305B1/en not_active IP Right Cessation
- 1999-07-09 EP EP99932361A patent/EP1133441A1/en not_active Withdrawn
- 1999-07-09 WO PCT/US1999/015484 patent/WO2000002803A1/en active IP Right Grant
-
2000
- 2000-06-23 US US09/603,295 patent/US6632065B1/en not_active Expired - Fee Related
-
2002
- 2002-09-16 US US10/244,852 patent/US7179044B2/en not_active Expired - Lifetime
-
2010
- 2010-06-23 JP JP2010142639A patent/JP5543285B2/en not_active Expired - Lifetime
-
2013
- 2013-01-25 JP JP2013012443A patent/JP5567704B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6450755B1 (en) | 2002-09-17 |
JP5567704B2 (en) | 2014-08-06 |
US7179044B2 (en) | 2007-02-20 |
JP5543285B2 (en) | 2014-07-09 |
JP2010251790A (en) | 2010-11-04 |
WO2000002803A1 (en) | 2000-01-20 |
JP2013093615A (en) | 2013-05-16 |
EP1133441A1 (en) | 2001-09-19 |
US6632065B1 (en) | 2003-10-14 |
KR100651305B1 (en) | 2006-11-28 |
JP2002520830A (en) | 2002-07-09 |
US20030017044A1 (en) | 2003-01-23 |
KR20010053490A (en) | 2001-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7179044B2 (en) | Method of removing substrates from a storage site and a multiple substrate batch loader | |
JP2010251790A5 (en) | ||
CN110329710B (en) | Robot system with robot arm adsorption control mechanism and operation method thereof | |
US4813732A (en) | Apparatus and method for automated wafer handling | |
JP6179910B2 (en) | Substrate transfer apparatus having different holding end effectors | |
US6292708B1 (en) | Distributed control system for a semiconductor wafer processing machine | |
JP5100179B2 (en) | Substrate processing equipment | |
US7778721B2 (en) | Small lot size lithography bays | |
KR101184789B1 (en) | Coating, developing apparatus | |
JP3552178B2 (en) | Substrate storage cassette, interface mechanism and substrate processing device | |
JP2001244316A (en) | Apparatus and method for robotic alignment of substrates | |
GB2171978A (en) | Gripper apparatus and method for handling semi-conductor wafers using robotic arm | |
US6271657B1 (en) | Test head positioner for semiconductor device testing apparatus | |
GB2317499A (en) | Control system for use with semiconductor device transporting and handling apparatus | |
US6754554B2 (en) | Semiconductor manufacturing apparatus detecting state of connection between controllers | |
JPH0797564B2 (en) | Vertical semiconductor manufacturing equipment | |
JP2755101B2 (en) | Loading equipment | |
KR100318437B1 (en) | System for parallelly controlling auto guide vehicle and method using the same | |
JPH09246348A (en) | Substrate conveyor | |
JP7444134B2 (en) | Electronic component packaging manufacturing system | |
JP3797732B2 (en) | Particle measuring apparatus and measuring method | |
JPH0697263A (en) | Wafer transfer control system | |
CN113830472A (en) | Article storage device, method for calculating setting value according to priority order of article storage device and method for storing article | |
KR20210118744A (en) | Substrate treatment apparatus and substrate treatment method | |
JPH04343415A (en) | Wafer replacing system for diffusion furnace |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: C2 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: C2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
COP | Corrected version of pamphlet |
Free format text: PAGES 1/8-8/8, DRAWINGS, REPLACED BY NEW PAGES 1/6-6/6; DUE TO LATE TRANSMITTAL BY THE RECEIVING OFFICE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 2000 559040 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020017000444 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1999932361 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020017000444 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1999932361 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1020017000444 Country of ref document: KR |