WO1999048139A3 - Apparatus for reducing heat loss - Google Patents
Apparatus for reducing heat loss Download PDFInfo
- Publication number
- WO1999048139A3 WO1999048139A3 PCT/US1999/003979 US9903979W WO9948139A3 WO 1999048139 A3 WO1999048139 A3 WO 1999048139A3 US 9903979 W US9903979 W US 9903979W WO 9948139 A3 WO9948139 A3 WO 9948139A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal cycling
- heat loss
- perimeter
- heat exchanger
- sensor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Abstract
An apparatus for reducing heat loss around the perimeter of a material substrate during thermal cycling is provided. The apparatus for reducing heat loss comprises a perimeter apparatus for surrounding the substrate. The apparatus rests in the same plane as a material substrate during thermal cycling and can be made of the same material as the substrate. Additionally, the apparatus can be one continuous piece or can be several perimeter pieces. To sense the temperature of a substrate during thermal cycling, a representative temperature can be obtained by embedding sensors in an auxiliary heater or in a heat exchanger, both of which are components of a thermal cycling module. A relatively flat sensor can be embedded between film layers in a foil heater. Additionally, sensors can be embedded inserted into a passageway in a heat exchanger so that they are flush with the each exchanger's top surface. The wires to the sensor can then be enclosed in casing that also removably secures the sensor in the heat exchanger.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4422298A | 1998-03-18 | 1998-03-18 | |
US09/044,222 | 1998-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999048139A2 WO1999048139A2 (en) | 1999-09-23 |
WO1999048139A3 true WO1999048139A3 (en) | 2000-03-09 |
Family
ID=21931158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/003979 WO1999048139A2 (en) | 1998-03-18 | 1999-02-23 | Apparatus for reducing heat loss |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1999048139A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8047643B2 (en) * | 2008-09-03 | 2011-11-01 | Xerox Corporation | Temperature sensor mount for melt plate |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US5184398A (en) * | 1991-08-30 | 1993-02-09 | Texas Instruments Incorporated | In-situ real-time sheet resistance measurement method |
JPH0637049A (en) * | 1992-07-17 | 1994-02-10 | Oki Electric Ind Co Ltd | Plasma etching apparatus |
EP0644578A2 (en) * | 1993-09-16 | 1995-03-22 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
EP0723141A1 (en) * | 1995-01-17 | 1996-07-24 | Applied Materials, Inc. | Sensors for measuring temperature and methods of measuring workpiece temperatures |
US5620560A (en) * | 1994-10-05 | 1997-04-15 | Tokyo Electron Limited | Method and apparatus for heat-treating substrate |
EP0821403A2 (en) * | 1996-07-24 | 1998-01-28 | Applied Materials, Inc. | Semiconductor wafer support with graded thermal mass |
WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
EP0915499A2 (en) * | 1997-11-05 | 1999-05-12 | Tokyo Electron Limited | Semiconductor wafer holding apparatus and semiconductor wafer storage chamber |
-
1999
- 1999-02-23 WO PCT/US1999/003979 patent/WO1999048139A2/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US5184398A (en) * | 1991-08-30 | 1993-02-09 | Texas Instruments Incorporated | In-situ real-time sheet resistance measurement method |
JPH0637049A (en) * | 1992-07-17 | 1994-02-10 | Oki Electric Ind Co Ltd | Plasma etching apparatus |
EP0644578A2 (en) * | 1993-09-16 | 1995-03-22 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
US5620560A (en) * | 1994-10-05 | 1997-04-15 | Tokyo Electron Limited | Method and apparatus for heat-treating substrate |
EP0723141A1 (en) * | 1995-01-17 | 1996-07-24 | Applied Materials, Inc. | Sensors for measuring temperature and methods of measuring workpiece temperatures |
EP0821403A2 (en) * | 1996-07-24 | 1998-01-28 | Applied Materials, Inc. | Semiconductor wafer support with graded thermal mass |
WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
EP0915499A2 (en) * | 1997-11-05 | 1999-05-12 | Tokyo Electron Limited | Semiconductor wafer holding apparatus and semiconductor wafer storage chamber |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 018, no. 252 (E - 1547) 13 May 1994 (1994-05-13) * |
Also Published As
Publication number | Publication date |
---|---|
WO1999048139A2 (en) | 1999-09-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69702477D1 (en) | Structured packing element with textured surface in two directions as well as mass and heat exchange processes using the same | |
EP0684462A3 (en) | Thermal sensor/actuator realised in semiconductor material. | |
CA2308422A1 (en) | Quartz substrate heater | |
EP0954948A4 (en) | Model based temperature controller for semiconductor thermal processors | |
WO2001018604A3 (en) | Method and apparatus for thermal processing a photosensitive element | |
CA2051861A1 (en) | Domestic cooking apparatus | |
DE69908965D1 (en) | HEAT TEMPERATURE SINGLE CRYSTAL SILICON WITH LOW ERROR DENSITY | |
DE59707558D1 (en) | SOLDERING IRON | |
AU674274B2 (en) | Temperature sensor element in temperature-measuring device | |
EP1029704A4 (en) | Biaxially oriented polyester film for ribbon for use in thermal transfer recording, and laminated film comprising the same and method for manufacture thereof | |
GB2351977B (en) | Radiation or thermally hardening adhesive with high thermal conductivity | |
FI956130A0 (en) | Manufacturing method for a mechanically loaded, flexible layer combination used as a low voltage heating element in a planar heat radiator and a planar, flexible heating element | |
ATE274233T1 (en) | DENSITY SENSOR FOR MONITORING LEAK RATES IN THE ENCAPSULATION OF AN ELECTRICAL DEVICE, WITH IMPROVED RELIABILITY | |
HK1040575A1 (en) | A method and an arrangement relating to temperature sensing in electric circuitry. | |
DK0894416T3 (en) | Method for heating a mold | |
WO1999048139A3 (en) | Apparatus for reducing heat loss | |
DE69614236D1 (en) | Heat sensitive recording material with protective layer | |
CA2494672A1 (en) | Process for making laminated film article having inflatable chambers | |
AU7618096A (en) | Device for controlling the temperature in building closing components with terrestrial heat and/or solar power | |
AU4695997A (en) | Method and device for thermal drying of a solid product in small pieces | |
DE69401573T2 (en) | Thermal printer with real-time temperature estimation | |
AU6361299A (en) | Water heater with heat sensitive air inlet | |
IL139871A0 (en) | Protective colloids in latices with improved film formation at low temperatures | |
TW340236B (en) | Manufacturing method of wiring | |
WO2000032991A3 (en) | Thermal heating board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
NENP | Non-entry into the national phase |
Ref country code: KR |
|
122 | Ep: pct application non-entry in european phase |