WO1998050757A2 - Three dimensional inspection system - Google Patents
Three dimensional inspection system Download PDFInfo
- Publication number
- WO1998050757A2 WO1998050757A2 PCT/US1998/008950 US9808950W WO9850757A2 WO 1998050757 A2 WO1998050757 A2 WO 1998050757A2 US 9808950 W US9808950 W US 9808950W WO 9850757 A2 WO9850757 A2 WO 9850757A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- image
- values
- reticle
- camera
- transparent reticle
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 83
- 230000003287 optical effect Effects 0.000 claims description 56
- 238000005259 measurement Methods 0.000 claims description 15
- 238000004141 dimensional analysis Methods 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000003708 edge detection Methods 0.000 claims description 2
- 238000012935 Averaging Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- VQOXZBDYSJBXMA-NQTDYLQESA-N nystatin A1 Chemical compound O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/CC/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 VQOXZBDYSJBXMA-NQTDYLQESA-N 0.000 description 2
- 229940099960 nystop Drugs 0.000 description 2
- 230000026676 system process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Quality & Reliability (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Geometry (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54828598A JP2002515124A (en) | 1997-05-05 | 1998-05-04 | 3D inspection system |
EP98920153A EP1017962B1 (en) | 1997-05-05 | 1998-05-04 | Three dimensional inspection of electronic leads with optical element attached to the top surface of a transparent reticle |
DE69819027T DE69819027T2 (en) | 1997-05-05 | 1998-05-04 | 3D inspection of electronic pins with an optical element, which is arranged on the top of a transparent marker plate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/850,473 | 1997-05-05 | ||
US08/850,473 US6055054A (en) | 1997-05-05 | 1997-05-05 | Three dimensional inspection system |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998050757A2 true WO1998050757A2 (en) | 1998-11-12 |
WO1998050757A3 WO1998050757A3 (en) | 2002-01-03 |
Family
ID=25308209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/008950 WO1998050757A2 (en) | 1997-05-05 | 1998-05-04 | Three dimensional inspection system |
Country Status (6)
Country | Link |
---|---|
US (1) | US6055054A (en) |
EP (1) | EP1017962B1 (en) |
JP (2) | JP2002515124A (en) |
KR (1) | KR20010012293A (en) |
DE (1) | DE69819027T2 (en) |
WO (1) | WO1998050757A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1025418A1 (en) * | 1997-10-21 | 2000-08-09 | BEATY, Elwin M. | Three-dimensional inspection system |
JP2003504607A (en) * | 1999-07-13 | 2003-02-04 | ビーティ エルウィン エム | Apparatus and method for three-dimensional inspection of electronic components |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1137731A (en) * | 1997-07-24 | 1999-02-12 | Sumitomo Kinzoku Erekutorodebaisu:Kk | Image taking-in system |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6915007B2 (en) | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6072898A (en) | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
AU5925300A (en) * | 1999-07-10 | 2001-01-30 | Tay Bok Her | Post-seal inspection system and method |
US6445518B1 (en) * | 2000-11-28 | 2002-09-03 | Semiconductor Technologies & Instruments, Inc. | Three dimensional lead inspection system |
US6547409B2 (en) | 2001-01-12 | 2003-04-15 | Electroglas, Inc. | Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer |
WO2003012368A1 (en) * | 2001-07-30 | 2003-02-13 | Topcon Corporation | Surface shape measurement apparatus, surface shape measurement method, surface state graphic apparatus |
WO2003032252A2 (en) * | 2001-10-09 | 2003-04-17 | Dimensional Photonics, Inc. | Device for imaging a three-dimensional object |
WO2004049267A1 (en) * | 2002-11-23 | 2004-06-10 | Odas Gmbh | Method for photographically recording a cylindrical, especially plate-shaped, object |
US7340085B2 (en) * | 2003-09-03 | 2008-03-04 | Microview Technologies Pte Ltd. | Rotating prism component inspection system |
SG138491A1 (en) * | 2006-06-21 | 2008-01-28 | Generic Power Pte Ltd | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
KR101380653B1 (en) * | 2008-06-12 | 2014-04-04 | 한미반도체 주식회사 | Vision inspection method for Vision inspection equipment |
CN102012607B (en) * | 2010-09-29 | 2011-12-28 | 卓盈微电子(昆山)有限公司 | Flexible circuit board imaging device |
JP5854680B2 (en) * | 2011-07-25 | 2016-02-09 | キヤノン株式会社 | Imaging device |
FR3004571B1 (en) * | 2013-04-11 | 2015-04-10 | Vit | METHOD OF CORRECTING A THREE-DIMENSIONAL IMAGE OF AN ELECTRONIC CIRCUIT |
EP3281219B1 (en) * | 2015-06-05 | 2021-09-29 | KLA - Tencor Corporation | Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices |
CN107889522B (en) | 2015-08-26 | 2020-08-28 | Abb瑞士股份有限公司 | Object multi-view detection device and method thereof |
CN105588841A (en) * | 2016-01-28 | 2016-05-18 | 浙江工业大学 | Stitch inclination defect detection device based on machine vision |
JP7194055B2 (en) * | 2019-03-22 | 2022-12-21 | 日立Astemo株式会社 | Joint inspection method and joint inspection device |
CN112985275B (en) * | 2021-05-14 | 2021-08-20 | 苏州鼎纳自动化技术有限公司 | Product inner wall size detection mechanism |
Citations (4)
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US5140643A (en) * | 1989-12-28 | 1992-08-18 | Matsushita Electric Industries Co., Ltd. | Part mounting apparatus with single viewing camera viewing part from different directions |
US5176796A (en) * | 1988-12-13 | 1993-01-05 | Jujo Paper Co., Ltd. | Avoiding pitch troubles using acylgerol lipase |
US5420691A (en) * | 1991-03-15 | 1995-05-30 | Matsushita Electric Industrial Co., Ltd. | Electric component observation system |
US5452080A (en) * | 1993-06-04 | 1995-09-19 | Sony Corporation | Image inspection apparatus and method |
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AU553069B2 (en) * | 1981-07-17 | 1986-07-03 | W.R. Grace & Co.-Conn. | Radial scan, pulsed light article inspection ccv system 0 |
US4731855A (en) * | 1984-04-06 | 1988-03-15 | Hitachi, Ltd. | Pattern defect inspection apparatus |
US4825394A (en) * | 1985-05-07 | 1989-04-25 | General Dynamics Corporation | Vision metrology system |
NL8501665A (en) * | 1985-06-10 | 1987-01-02 | Philips Nv | OPTICAL SCANNER WITH POSITION AND POSITION DETECTION SYSTEM FOR AN ELECTROMAGNETICALLY BEARING OBJECTIVE. |
JPS61293657A (en) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | Method for inspecting soldering appearance |
GB8622976D0 (en) * | 1986-09-24 | 1986-10-29 | Trialsite Ltd | Scanning electron microscopes |
US4886958A (en) * | 1988-03-25 | 1989-12-12 | Texas Instruments Incorporated | Autofocus system for scanning laser inspector or writer |
US5095447A (en) * | 1988-03-25 | 1992-03-10 | Texas Instruments Incorporated | Color overlay of scanned and reference images for display |
WO1989011093A1 (en) * | 1988-05-09 | 1989-11-16 | Omron Corporation | Substrate examining apparatus and method of operating same |
US5113581A (en) * | 1989-12-19 | 1992-05-19 | Matsushita Electric Industrial Co., Ltd. | Outer lead bonding head and method of bonding outer lead |
US5058178A (en) * | 1989-12-21 | 1991-10-15 | At&T Bell Laboratories | Method and apparatus for inspection of specular, three-dimensional features |
DE4003983C1 (en) * | 1990-02-09 | 1991-08-29 | Abos Automation, Bildverarbeitung, Optische Systeme Gmbh, 8057 Eching, De | Automated monitoring of space=shape data for mfg. semiconductors - compares image signals for defined illumination angle range with master signals, to determine defects |
US4959898A (en) * | 1990-05-22 | 1990-10-02 | Emhart Industries, Inc. | Surface mount machine with lead coplanarity verifier |
DE4032327A1 (en) * | 1990-10-11 | 1992-04-16 | Abos Automation Bildverarbeitu | METHOD AND DEVICE FOR THE AUTOMATED MONITORING OF THE PRODUCTION OF SEMICONDUCTOR COMPONENTS |
US5173796A (en) * | 1991-05-20 | 1992-12-22 | Palm Steven G | Three dimensional scanning system |
US5133601A (en) * | 1991-06-12 | 1992-07-28 | Wyko Corporation | Rough surface profiler and method |
US5204734A (en) * | 1991-06-12 | 1993-04-20 | Wyko Corporation | Rough surface profiler and method |
US5563702A (en) * | 1991-08-22 | 1996-10-08 | Kla Instruments Corporation | Automated photomask inspection apparatus and method |
JPH05312549A (en) * | 1992-02-06 | 1993-11-22 | Hitachi Ltd | Method and device for detecting pattern |
US5600150A (en) * | 1992-06-24 | 1997-02-04 | Robotic Vision Systems, Inc. | Method for obtaining three-dimensional data from semiconductor devices in a row/column array and control of manufacturing of same with data to eliminate manufacturing errors |
US5818061A (en) * | 1992-06-24 | 1998-10-06 | Robotic Vision Systems, Inc. | Apparatus and method for obtaining three-dimensional data from objects in a contiguous array |
US5420689A (en) * | 1993-03-01 | 1995-05-30 | Siu; Bernard | High speed illumination system for microelectronics inspection |
US5307149A (en) * | 1992-08-14 | 1994-04-26 | Elwin M. Beaty | Method and apparatus for zero force part placement |
EP0638801B1 (en) * | 1993-08-12 | 1998-12-23 | International Business Machines Corporation | Method of inspecting the array of balls of an integrated circuit module |
US5652658A (en) * | 1993-10-19 | 1997-07-29 | View Engineering, Inc. | Grid array inspection system and method |
US5648853A (en) * | 1993-12-09 | 1997-07-15 | Robotic Vision Systems, Inc. | System for inspecting pin grid arrays |
CA2113752C (en) * | 1994-01-19 | 1999-03-02 | Stephen Michael Rooks | Inspection system for cross-sectional imaging |
JPH07253311A (en) * | 1994-03-15 | 1995-10-03 | Fujitsu Ltd | Calibration method, pattern inspection method and pattern position decision method for pattern inspection device and manufacture of semiconductor device |
US5581632A (en) * | 1994-05-02 | 1996-12-03 | Cognex Corporation | Method and apparatus for ball bond inspection system |
US5550763A (en) * | 1994-05-02 | 1996-08-27 | Michael; David J. | Using cone shaped search models to locate ball bonds on wire bonded devices |
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US5513276A (en) * | 1994-06-02 | 1996-04-30 | The Board Of Regents Of The University Of Oklahoma | Apparatus and method for three-dimensional perspective imaging of objects |
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US5617209A (en) * | 1995-04-27 | 1997-04-01 | View Engineering, Inc. | Method and system for triangulation-based, 3-D imaging utilizing an angled scaning beam of radiant energy |
US5801966A (en) * | 1995-07-24 | 1998-09-01 | Cognex Corporation | Machine vision methods and articles of manufacture for determination of convex hull and convex hull angle |
US5859924A (en) * | 1996-07-12 | 1999-01-12 | Robotic Vision Systems, Inc. | Method and system for measuring object features |
US5734475A (en) * | 1996-10-15 | 1998-03-31 | Ceridian Corporation | Process of measuring coplanarity of circuit pads and/or grid arrays |
US5828449A (en) * | 1997-02-26 | 1998-10-27 | Acuity Imaging, Llc | Ring illumination reflective elements on a generally planar surface |
US5859698A (en) * | 1997-05-07 | 1999-01-12 | Nikon Corporation | Method and apparatus for macro defect detection using scattered light |
-
1997
- 1997-05-05 US US08/850,473 patent/US6055054A/en not_active Expired - Fee Related
-
1998
- 1998-05-04 DE DE69819027T patent/DE69819027T2/en not_active Expired - Fee Related
- 1998-05-04 KR KR1019997010245A patent/KR20010012293A/en not_active Application Discontinuation
- 1998-05-04 JP JP54828598A patent/JP2002515124A/en not_active Ceased
- 1998-05-04 EP EP98920153A patent/EP1017962B1/en not_active Expired - Lifetime
- 1998-05-04 WO PCT/US1998/008950 patent/WO1998050757A2/en active IP Right Grant
-
2009
- 2009-04-10 JP JP2009095573A patent/JP4901903B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5176796A (en) * | 1988-12-13 | 1993-01-05 | Jujo Paper Co., Ltd. | Avoiding pitch troubles using acylgerol lipase |
US5140643A (en) * | 1989-12-28 | 1992-08-18 | Matsushita Electric Industries Co., Ltd. | Part mounting apparatus with single viewing camera viewing part from different directions |
US5420691A (en) * | 1991-03-15 | 1995-05-30 | Matsushita Electric Industrial Co., Ltd. | Electric component observation system |
US5452080A (en) * | 1993-06-04 | 1995-09-19 | Sony Corporation | Image inspection apparatus and method |
Non-Patent Citations (1)
Title |
---|
See also references of EP1017962A2 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1025418A1 (en) * | 1997-10-21 | 2000-08-09 | BEATY, Elwin M. | Three-dimensional inspection system |
EP1025418A4 (en) * | 1997-10-21 | 2006-09-20 | Elwin M Beaty | Three-dimensional inspection system |
JP2003504607A (en) * | 1999-07-13 | 2003-02-04 | ビーティ エルウィン エム | Apparatus and method for three-dimensional inspection of electronic components |
Also Published As
Publication number | Publication date |
---|---|
EP1017962A2 (en) | 2000-07-12 |
KR20010012293A (en) | 2001-02-15 |
US6055054A (en) | 2000-04-25 |
WO1998050757A3 (en) | 2002-01-03 |
JP4901903B2 (en) | 2012-03-21 |
DE69819027D1 (en) | 2003-11-20 |
DE69819027T2 (en) | 2004-05-19 |
JP2002515124A (en) | 2002-05-21 |
JP2009156877A (en) | 2009-07-16 |
EP1017962A4 (en) | 2000-07-26 |
EP1017962B1 (en) | 2003-10-15 |
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