WO1998008190A1 - Chip card with an induction coil and method for its manufacture - Google Patents

Chip card with an induction coil and method for its manufacture Download PDF

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Publication number
WO1998008190A1
WO1998008190A1 PCT/DE1997/001709 DE9701709W WO9808190A1 WO 1998008190 A1 WO1998008190 A1 WO 1998008190A1 DE 9701709 W DE9701709 W DE 9701709W WO 9808190 A1 WO9808190 A1 WO 9808190A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
conductor track
card according
passive components
induction coil
Prior art date
Application number
PCT/DE1997/001709
Other languages
German (de)
French (fr)
Inventor
Manfred Fries
Josef Kirschbauer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998008190A1 publication Critical patent/WO1998008190A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • Chip card with an induction coil and process for its manufacture
  • the invention relates to a chip card with a card base body and with at least one semiconductor component, an induction coil for data and energy exchange and at least one further passive component.
  • the invention further relates to a method for producing such a chip card.
  • contactless chip cards In addition to chip cards with a contact field consisting of six to eight electrical contact surfaces, via which a connection for data and energy transmission is established by means of a card reader, so-called contactless chip cards are also known.
  • An induction coil is provided in the chip card, with which the transmission is carried out without contact.
  • the induction coil is part of an oscillating circuit in which a capacitor and an ohmic resistor are located as further passive components.
  • Surface-mounted capacitors are used as capacitors for the exact frequency tuning of the resonant circuit. In many cases they have such a height that these contactless chip cards are designed to be relatively thick. It is therefore not possible to adhere to the external dimensions of the chip card specified in a corresponding ISO standard, which fixes the card height to a maximum of 0.84 mm.
  • the invention is based on the object of creating a chip card of the type mentioned at the outset which is particularly flat and which can be produced using a simple method.
  • the object is achieved in that all passive components of the resonant circuit, ie induction coil and at least one Capacitor and a resistor can be produced together in a single process in the form of two-dimensional interconnect structures directly on the card base.
  • This has the advantage that it is no longer necessary to assemble discrete passive components, which moreover makes storage unnecessary, speeds up the production process and the
  • the passive components are thus all formed as geometric structures next to one another in one plane. They practically do not add up in height, so that the chip card as a whole is hardly thicker than the basic card body.
  • the corresponding ISO standard can therefore be easily complied with.
  • These conductor track structures are preferably produced by printing an electrically conductive material or an insert etching technique on a metal layer.
  • the structures can thus be generated quickly on the one hand and on the other hand with the required precision in a single layer or level.
  • the ohmic resistance is in the form of a conductor track section with a reduced cross-sectional area, preferably a constriction of the width. In this way, the resistance value can be determined in a particularly simple manner by the geometry of the conductor track.
  • the induction coil is formed by a spiral-shaped conductor track.
  • This conductor track can be arranged along the edges of the card with a sufficiently large inner diameter.
  • the beginning and the end of the spiral are provided with contacting areas in order to enable an easy to establish connection to the semiconductor component.
  • the capacitor is formed by two spaced apart and electrically insulated conductor tracks. They can be designed as one or two blmdwmditch the induction coil.
  • the capacitor area can be increased in that the opposite conductor tracks additionally have fingers or teeth which mesh with one another or mesh with one another.
  • the semiconductor device is preferably arranged on a chip carrier, which is also referred to as a module, which has electrical connections for contacting the passive components.
  • These connections are expediently designed as webs which lead b s to the contact surfaces of the passive components.
  • a particularly simple assembly is made possible in that the webs are designed as bridges for the electrically insulated bridging of conductor track sections. This also has the advantage that the geometry and the course of the conductor tracks for the passive components can largely take place without a rear view of the contact points.
  • the bridges prefferably have an electrically insulating layer on the side facing the conductor track sections to be bridged and to be electrically conductive on the opposite side, and for the associated contact areas to be designed as plated-through holes. Common materials and techniques can thus be used for production and assembly.
  • the bridges are designed as glass-epoxy supports with a copper structure on one side.
  • the bridges are designed as webs of a metallic lead frame with lacquer insulation on one side.
  • the connection frame can also have further webs and fingers with which further connections of the chip are connected.
  • the plane of the drawing corresponds to a surface of a basic card body (ticking) which is glued to a further layer to form an operational chip card.
  • the area shown comprises a module 1 which carries a semiconductor chip (not shown).
  • the module can be designed as a metal leadframe carrier (leadframe carrier) or as a glass epoxy carrier.
  • a recess 40 of the chip card is inserted and glued to the surface.
  • Passive components are printed on the surface of the basic card body by two-dimensional geometric structures of a metallically conductive material, for example aluminum, or by an Emlagen-Etz technique.
  • the passive components are two capacitors 2, 2 'and a resistor 3 in the immediate vicinity of the module 1 and an induction coil 4, which is only shown in the neighboring area of the module 1.
  • the coil 4 also runs along the outer circumference of the card body.
  • the induction coil 4 is used for the contactless transmission of data and energy from an external laser (not shown) to the semiconductor chip on the module 1.
  • the capacitors 2, 2 ', resistor 3 and induction coil 4 form an oscillating circuit connected to the semiconductor module 1.
  • One capacitor 2 is formed by two parallel, spaced conductor track sections 20, 21, each of which has a plurality of mutually perpendicular ones have spaced fingers.
  • the fingers 14 form two comb-like structures with the conductor track sections 20, 21, the fingers 14 of one structure engaging in the interstices of the other structure.
  • the capacitance is formed in the manner of a multilayer plate capacitor by the opposing fingers 14.
  • Resistor 3 is formed in that a conductor track section is provided with a cross-sectional extension or constriction 30 over a predetermined length.
  • the resistance 3 is defined by the cross section of the conductor track.
  • the coil 4 consists of a spiral-shaped conductor track section, the two end sections with flat contacting areas 10, 11 lying in the vicinity of the module 1 in the figure. Cutouts 41 of the coil conductor track are also shown in the figure.
  • the other capacitor 2 'of this circuit example is formed by two blind walls 42 of the coil 4.
  • the windings 42 represent extensions of the coil ends at the contacting areas 10, 11. They run parallel and at a predetermined distance from one another over a predetermined length along the conductor track sections of the coil 4.
  • the capacitor 2 and the resistor 3 are connected to an end section of the coil 4 adjacent to the coil contact region 10 by means of T-shaped branches 22 and 31 of the relevant conductor track sections.
  • the other connection of the capacitor 2 is formed by a flat contact area 12.
  • the other connection of the resistor 3 has a flat contact area 13.
  • All contacting areas 10 to 13 of the passive components 1, 2, 3 are in the same way as the conductor track sections as two-dimensional structures directly on the card base body. produced together with the conductor track sections. They are connected to module 1 in an electrically conductive manner via connecting webs 5, 6, 7.
  • the connecting webs 5, 6, 7 are molded in one piece with the carrier material of the module 1. Accordingly, they have an electrically insulating metallic lead frame carrier or a glass epoxy carrier, depending on the carrier material of module 1. Furthermore, they have an electrically conductive layer which runs on the side of the electrically insulating carrier facing away from the conductor track sections.
  • the electrically conductive layers of the connecting webs 5 to 7 are provided with plated-through holes via the contact areas 10 to 13 on the card body side, so that when the module 1 is assembled, an electrically conductive connection can be produced in a simple manner by soldering or with electrically conductive adhesive .
  • the connecting webs 5 and 7 are designed as bridges 8, 9 for electrically insulating bridging of conductor track sections of the capacitor 2 and the coil 4, respectively. Both the contacting area 12 of the capacitor 2 and the contacting area 11 of the coil 4 are connected to the module 1 via the web 5, the connections of the capacitor 2 and the coil 4 being connected to one another by the electrically conductive layer of the web 5 common connection point.
  • a connecting web or a bridge can be provided with a plurality of metal layers which are electrically insulated from one another, so that contact areas on the chip card side which are not to be brought together to form a common connecting point can also be connected to the module 1 with a web or a bridge.
  • the two connecting webs 5 and 6 form a common electrically insulating carrier layer, on which, at a distance from one another, an electrically conductive layer leads on the one hand to the contacting area 10 and on the other hand to the contacting areas 12 and 11.

Abstract

The invention relates to a contactless chip card and a method for its manufacture. The chip card presents a semi-conducting chip, an induction coil(4) consisting of a spiral shaped conductor path segment and at least one other passive component. According to the invention all passive components i.e. induction coil (4), capacitor (2,2'), resistance (3) are manufactured directly on the body base of the card in one operation in the form of two dimensional structures e.g. by printing or inlay-etching technology. The passive components are defined by the arrangement and geometric form of the conductor path segments. A module (1) supporting the semi-conducting chip presents bridging webs (5, 6,..., 9) enabling the production of connections to the components.

Description

Beschreibungdescription
Chipkarte mit einer Induktionsspule und Verfahren zu ihrer HerstellungChip card with an induction coil and process for its manufacture
Die Erfindung betrifft eine Chipkarte mit einem Kartengrundkor- per und mit mindestens einem Halbleiterbauele ent , einer Induktionsspule zum Daten- und Energieaustausch und mindestens einem weiteren passiven Bauelement. Die Erfindung betrifft ferner ein Verfahren zur Herstellung einer derartigen Chipkarte.The invention relates to a chip card with a card base body and with at least one semiconductor component, an induction coil for data and energy exchange and at least one further passive component. The invention further relates to a method for producing such a chip card.
Neben Chipkarten mit einem Kontaktfeld aus sechs bis acht elektrischen Kontaktflachen, über die ein Anschluß zur Daten- und Energieübertragung mittels einem Kartenleser hergestellt wird, sind auch sogenannte kontaktlose Chipkarten bekannt. Dabei ist in der Chipkarte eine Induktionsspule vorgesehen, mit welcher die Übertragung kontaktlos durchgeführt wird. Die Induktionsspule ist Teil eines Schwingkreises, in welchem als weitere passive Bauelemente ein Kondensator und ein ohmscher Widerstand liegen. Als Kondensator werden f r die genaue Frequenzabstim- ung des Schwingkreises oberflachenmontierte Kondensatoren eingesetzt. Sie weisen vielfach eine solche Bauhohe auf, die dazu führt, daß diese kontaktlosen Chipkarten relativ dick ausgebil- det sind. Es ist daher nicht möglich, die in einer entsprechenden ISO-Norm vorgegebenen Außenabmessungen der Chipkarte einzuhalten, welche die Kartenhöhe auf maximal 0,84 mm festlegt.In addition to chip cards with a contact field consisting of six to eight electrical contact surfaces, via which a connection for data and energy transmission is established by means of a card reader, so-called contactless chip cards are also known. An induction coil is provided in the chip card, with which the transmission is carried out without contact. The induction coil is part of an oscillating circuit in which a capacitor and an ohmic resistor are located as further passive components. Surface-mounted capacitors are used as capacitors for the exact frequency tuning of the resonant circuit. In many cases they have such a height that these contactless chip cards are designed to be relatively thick. It is therefore not possible to adhere to the external dimensions of the chip card specified in a corresponding ISO standard, which fixes the card height to a maximum of 0.84 mm.
Der Erfindung liegt die A u f g b e zugrunde, eine Chipkar- te der eingangs genannten Art zu schaffen, die besonders flach ist und die mit einem einfachen Verfahren hergestellt werden kann.The invention is based on the object of creating a chip card of the type mentioned at the outset which is particularly flat and which can be produced using a simple method.
Die Aufgabe wird dadurch gelöst, daß alle passiven Bauelemente des Schwingkreises, d.h. Induktionsspule sowie mindestens ein Kondensator und ein Widerstand, gemeinsam in einem Einzelprozeß in Form zweidimensionaler Leiterbahnstrukturen unmittelbar auf dem Kartengrundkörper hergestellt werden. Das hat den Vorteil, daß keine Montage von diskreten passiven Bauelementen mehr durchgeführt werden muß, was darüber hinaus die Lagerhaltung überflüssig macht, den Fertigungsablauf beschleunigt und dieThe object is achieved in that all passive components of the resonant circuit, ie induction coil and at least one Capacitor and a resistor can be produced together in a single process in the form of two-dimensional interconnect structures directly on the card base. This has the advantage that it is no longer necessary to assemble discrete passive components, which moreover makes storage unnecessary, speeds up the production process and the
Zuverlässigkeit erhöht.Reliability increased.
Die passiven Bauelemente sind somit alle als geometrische Strukturen nebeneinander in einer Ebene ausgebildet. Sie tragen praktisch nicht in der Höhe auf, so daß die Chipkarte insgesamt kaum dicker ist als der Kartengrundkorper . Die entsprechende ISO-Norm kann daher leicht eingehalten werden.The passive components are thus all formed as geometric structures next to one another in one plane. They practically do not add up in height, so that the chip card as a whole is hardly thicker than the basic card body. The corresponding ISO standard can therefore be easily complied with.
Die Herstellung dieser Leiterbahnstrukturen erfolgt bevorzugt durch Aufdrucken eines elektrisch leitenden Materials oder eine Einlagen-Ätz-Technik an einer Metallschicht. Somit können die Strukturen einerseits schnell und andererseits mit der erforderlichen Präzision in einer einzigen Schicht oder Ebene er- zeugt werden.These conductor track structures are preferably produced by printing an electrically conductive material or an insert etching technique on a metal layer. The structures can thus be generated quickly on the one hand and on the other hand with the required precision in a single layer or level.
Eine vorteilhafte Weiterbildung der Erfindung besteht darin, daß der ohmsche Widerstand in Form eines Leiterbahnabschnitts mit reduzierter Querschnittsfläche, bevorzugt einer Ein- schnürung der Breite, vorhanden ist. Auf diese Weise kann der Widerstandswert auf besonders einfache Weise durch die Geometrie der Leiterbahn festgelegt werden.An advantageous development of the invention is that the ohmic resistance is in the form of a conductor track section with a reduced cross-sectional area, preferably a constriction of the width. In this way, the resistance value can be determined in a particularly simple manner by the geometry of the conductor track.
Die Induktionsspule ist nach einer bevorzugten Ausführungsform der Erfindung durch eine spiralförmig verlaufende Leiterbahn gebildet. Diese Leiterbahn kann mit einem ausreichend großen Innendurchmesser entlang den Kartenrandern eingeordnet werden. Der Anfang und das Ende der Spirale sind mit Kontaktierungsflachen versehen, um eine einfach herzustellende Verbindung mit dem Halbleiterbaustein zu ermöglichen. Es st besonders vorteilhaft, daß der Kondensator durch zwei beabstandet und elektrisch isoliert gegenüberliegende Leiterbahnen gebildet ist. Sie können als ein oder zwei Blmdwmdun- gen der Induktionsspule ausgebildet sein. Die Kondensatorflache kann dadurch vergrößert werden, daß die gegenüberliegenden Leiterbahnen zusätzlich Finger oder Zähne aufweisen, die miteinander kämmen bzw. ineinandergreifen.According to a preferred embodiment of the invention, the induction coil is formed by a spiral-shaped conductor track. This conductor track can be arranged along the edges of the card with a sufficiently large inner diameter. The beginning and the end of the spiral are provided with contacting areas in order to enable an easy to establish connection to the semiconductor component. It is particularly advantageous that the capacitor is formed by two spaced apart and electrically insulated conductor tracks. They can be designed as one or two blmdwmdungen the induction coil. The capacitor area can be increased in that the opposite conductor tracks additionally have fingers or teeth which mesh with one another or mesh with one another.
Der Halbleiterbaustem ist bevorzugt auf einem Chipträger, der auch als Modul bezeichnet wird, angeordnet, welcher elektrische Anschlüsse zur Kontaktierung der passiven Bauelemente aufweist. Diese Anschlüsse werden zweckmäßigerweise als Stege ausgebildet, die b s zu den Kontaktierungsflachen der passiven Bauelemente fuhren. Eine besonders einfache Montage wird dadurch er- möglicht, daß die Stege als Brücken zur elektrisch isolierten Uberbrückung von Leiterbahnabschnitten ausgebildet sind. Das hat ferner den Vorteil, daß die Geometrie und der Verlauf der Leiterbahnen für die passiven Bauelemente weitgehend ohne Ruck- Sicht auf die Kontaktierungspunkte erfolgen kann.The semiconductor device is preferably arranged on a chip carrier, which is also referred to as a module, which has electrical connections for contacting the passive components. These connections are expediently designed as webs which lead b s to the contact surfaces of the passive components. A particularly simple assembly is made possible in that the webs are designed as bridges for the electrically insulated bridging of conductor track sections. This also has the advantage that the geometry and the course of the conductor tracks for the passive components can largely take place without a rear view of the contact points.
Es ist zweckmäßig, daß die Brücken auf der Seite, welche den zu überbrückenden Leiterbahnabschnitten zugewandt ist, eine elektrisch isolierende Schicht aufweisen und auf der gegenüberliegenden Seite elektrisch leitend ausgebildet sind, und daß die zugehörigen Kontaktierungsbereiche als Durchkontaktierung ausgebildet sind. Es können somit gangige Materialien und Techniken für die Herstellung und Montage eingesetzt werden.It is expedient for the bridges to have an electrically insulating layer on the side facing the conductor track sections to be bridged and to be electrically conductive on the opposite side, and for the associated contact areas to be designed as plated-through holes. Common materials and techniques can thus be used for production and assembly.
Besonders einfach ist es, daß die Brücken als Glas-Epoxi-Trager mit einseitiger Kupferstruktur ausgebildet sind Nach einer bevorzugten Alternative sind die Br cken als Stege eines metallischen Anschlußrahmens mit einseitiger Lackisolierung ausgebildet. Der Anschlußrahmen kann dabei auch weitere Stege und Finger aufweisen, mit welchen weitere Anschlüsse des Chips verbun- den sind. Nachfolgend wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels weiter erläutert. Die schematische Darstellung in der einzigen Figur zeigtIt is particularly simple that the bridges are designed as glass-epoxy supports with a copper structure on one side. According to a preferred alternative, the bridges are designed as webs of a metallic lead frame with lacquer insulation on one side. The connection frame can also have further webs and fingers with which further connections of the chip are connected. The invention is explained in more detail below on the basis of an exemplary embodiment shown in the drawing. The schematic representation in the single figure shows
eine ausschnittweise Draufsicht auf einen Kartengrundkörper einer Chipkarte im Bereich eines montierten Moduls .a partial plan view of a card body of a chip card in the area of an assembled module.
In der Darstellung der Figur entspricht die Zeichenebene einer Oberfläche eines Kartengrundkörpers (Inlett), welches mit einer weiteren Lage zu einer betriebsbereiten Chipkarte verklebt wird. Der dargestellte Bereich umfaßt ein Modul 1, welches einen Halbleiterchip (nicht dargestellt) trägt. Das Modul kann als metallischer Anschlußrahmen-Träger (Leadframe-Trager) oder als Glas-Epoxi-Träger ausgebildet sein. Es ist m eine Ausnehmung 40 der Chipkarte oberflächenbundig eingesetzt und angeklebt.In the representation of the figure, the plane of the drawing corresponds to a surface of a basic card body (ticking) which is glued to a further layer to form an operational chip card. The area shown comprises a module 1 which carries a semiconductor chip (not shown). The module can be designed as a metal leadframe carrier (leadframe carrier) or as a glass epoxy carrier. A recess 40 of the chip card is inserted and glued to the surface.
Auf der Oberfläche des Kartengrundkörpers sind passive Bauele- mente durch zweidimensionale geometrische Strukturen eines metallisch leitenden Materials, beispielsweise Aluminium, aufgedruckt oder durch eine Emlagen-Atz-Technik aufgebracht. Es handelt sich bei den passiven Bauelementen um zwei Kondensatoren 2, 2' und einen Widerstand 3 in der unmittelbaren Umgebung des Moduls 1 sowie eine Induktionsspule 4, die lediglich im Nachbarbereich des Moduls 1 dargestellt ist. Die Spule 4 verläuft im übrigen entlang des Außenumfangs des Kartengrundkörpers. Die Induktionsspule 4 dient zum kontaktlosen Übertragen von Daten und Energie von einem externen Laser (nicht darge- stellt) zum Halbleiterchip auf dem Modul 1. Die Kondensatoren 2, 2', Widerstand 3 und Induktionsspule 4 bilden einen am Halbleitermodul 1 angeschlossenen Schwingkreis .Passive components are printed on the surface of the basic card body by two-dimensional geometric structures of a metallically conductive material, for example aluminum, or by an Emlagen-Etz technique. The passive components are two capacitors 2, 2 'and a resistor 3 in the immediate vicinity of the module 1 and an induction coil 4, which is only shown in the neighboring area of the module 1. The coil 4 also runs along the outer circumference of the card body. The induction coil 4 is used for the contactless transmission of data and energy from an external laser (not shown) to the semiconductor chip on the module 1. The capacitors 2, 2 ', resistor 3 and induction coil 4 form an oscillating circuit connected to the semiconductor module 1.
Der eine Kondensator 2 wird durch zwei parallel verlaufende, beabstandete Leiterbahnabschnitte 20, 21 gebildet, die jeweils eine Vielzahl von senkrecht hierzu verlaufenden, voneinander beabstandeten Fingern aufweisen. Die Finger 14 bilden mit den Leiterbahnabschnitten 20, 21 zwei kammartige Strukturen, wobei die Finger 14 der einen Struktur in die Zwischenräume der anderen Struktur eingreifen. Die Kapazität wird in der Art eines mehrschichtigen Plattenkondensators durch die sich gegenüberliegenden Finger 14 gebildet.One capacitor 2 is formed by two parallel, spaced conductor track sections 20, 21, each of which has a plurality of mutually perpendicular ones have spaced fingers. The fingers 14 form two comb-like structures with the conductor track sections 20, 21, the fingers 14 of one structure engaging in the interstices of the other structure. The capacitance is formed in the manner of a multilayer plate capacitor by the opposing fingers 14.
Der Widerstand 3 wird dadurch gebildet, daß ein Leiterbahnabschnitt über eine vorgegebene Lange mit einer Querschnittsver- nngerung bzw. einer Einschnürung 30 versehen ist. Der Widerstand 3 wird durch den Leiterbahnquerschnitt definiert.Resistor 3 is formed in that a conductor track section is provided with a cross-sectional extension or constriction 30 over a predetermined length. The resistance 3 is defined by the cross section of the conductor track.
Die Spule 4 besteht aus einem spiralförmig mehrmals umlaufenden Leiterbahnabschnitt, wobei m der Figur die beiden Endabschmt- te mit flächigen Kontaktierungsbereichen 10, 11 in der Nachbarschaft des Moduls 1 liegen. In der Figur sind ferner Ausschnitte 41 der Spulenleiterbahn dargestellt.The coil 4 consists of a spiral-shaped conductor track section, the two end sections with flat contacting areas 10, 11 lying in the vicinity of the module 1 in the figure. Cutouts 41 of the coil conductor track are also shown in the figure.
Der andere Kondensator 2 ' dieses Schaltungsbeispiels wird durch zwei Blindwmdungen 42 der Spule 4 gebildet. Die Blmdwindungen 42 stellen Verlängerungen der Spulenenden an den Kontaktierungsbereichen 10, 11 dar. Sie verlaufen parallel und in vorgegebenem Abstand zu einander über eine vorgegebene Lange entlang den Leiterbahnabschnitten der Spule 4.The other capacitor 2 'of this circuit example is formed by two blind walls 42 of the coil 4. The windings 42 represent extensions of the coil ends at the contacting areas 10, 11. They run parallel and at a predetermined distance from one another over a predetermined length along the conductor track sections of the coil 4.
Der Kondensator 2 und der Widerstand 3 sind mit einem Endabschnitt der Spule 4 benachbart zum Spulenkontaktierungsbereich 10 durch T-formige Verzweigungen 22 bzw. 31 der betreffenden Leiterbahnabschnitte verbunden. Der andere Anschluß des Konden- sators 2 wird durch einen flächigen Kontaktierungsbereich 12 gebildet. In gleicher Weise weist der andere Anschluß des Widerstands 3 einen flächigen Kontaktierungsbereich 13 auf.The capacitor 2 and the resistor 3 are connected to an end section of the coil 4 adjacent to the coil contact region 10 by means of T-shaped branches 22 and 31 of the relevant conductor track sections. The other connection of the capacitor 2 is formed by a flat contact area 12. In the same way, the other connection of the resistor 3 has a flat contact area 13.
Alle Kontaktierungsbereiche 10 bis 13 der passiven Bauelemente 1, 2, 3 sind in gleicher Weise wie die Leiterbahnabschnitte als zweidimensionale Strukturen unmittelbar auf dem Kartengrundkör- per gemeinsam mit den Leiterbahnabschnitten hergestellt. Sie sind mit dem Modul 1 über Anschlußstege 5, 6, 7 elektrisch leitend verbunden. Die Anschlußstege 5, 6, 7 sind einstückig mit dem Trägermaterial des Moduls 1 ausge ormt . Sie haben demnach entsprechend dem Trägermaterial des Moduls 1 einen elektrisch isolierenden metallischen Anschlußrahmen-Träger oder einen Glas-Epoxi-Träger . Ferner weisen sie eine elektrisch leitende Schicht auf, die auf der den Leiterbahnabschnitten abgewandten Seite des elektrisch isolierenden Trägers verläuft. Die elek- trisch leitenden Schichten der Anschlußstege 5 bis 7 sind über die kartengrundkörperseitigen Kontaktierungsbereiche 10 bis 13 mit Durchkontaktierungen versehen, so daß bei der Montage des Moduls 1 auf einfache Weise durch Löten oder mit elektrisch leitendem Kleber eine elektrisch leitende Verbindung herge- stellt werden kann.All contacting areas 10 to 13 of the passive components 1, 2, 3 are in the same way as the conductor track sections as two-dimensional structures directly on the card base body. produced together with the conductor track sections. They are connected to module 1 in an electrically conductive manner via connecting webs 5, 6, 7. The connecting webs 5, 6, 7 are molded in one piece with the carrier material of the module 1. Accordingly, they have an electrically insulating metallic lead frame carrier or a glass epoxy carrier, depending on the carrier material of module 1. Furthermore, they have an electrically conductive layer which runs on the side of the electrically insulating carrier facing away from the conductor track sections. The electrically conductive layers of the connecting webs 5 to 7 are provided with plated-through holes via the contact areas 10 to 13 on the card body side, so that when the module 1 is assembled, an electrically conductive connection can be produced in a simple manner by soldering or with electrically conductive adhesive .
Die Anschlußstege 5 und 7 sind als Brücken 8, 9 zur elektrisch isolierenden Überbrückung von Leiterbahnabschnitten des Kondensators 2 bzw. der Spule 4 ausgebildet. Über den Steg 5 sind so- wohl der Kontaktierungsbereich 12 des Kondensators 2 als auch der Kontaktierungsbereich 11 der Spule 4 mit dem Modul 1 verbunden, wobei- durch die elektrisch leitende Schicht des Steges 5 die betreffenden Anschlüsse des Kondensators 2 und der Spule 4 auf einen gemeinsamen Anschlußpunkt gelegt werden.The connecting webs 5 and 7 are designed as bridges 8, 9 for electrically insulating bridging of conductor track sections of the capacitor 2 and the coil 4, respectively. Both the contacting area 12 of the capacitor 2 and the contacting area 11 of the coil 4 are connected to the module 1 via the web 5, the connections of the capacitor 2 and the coil 4 being connected to one another by the electrically conductive layer of the web 5 common connection point.
Alternativ zu dem dargestellten Auεführungsbeispiel kann ein Anschlußsteg oder eine Brücke mit mehreren elektrisch voneinander isolierten Metallagen versehen sein, so daß mit einem Steg oder einer Brücke auch chipkartenseitige Kontaktierungsbereiche an das Modul 1 angeschlossen werden können, die nicht zu einem gemeinsamen Anschlußpunkt zusammengeführt werden sollen. Beispielsweise bilden hierbei die beiden Anschlußstege 5 und 6 eine gemeinsame elektrisch isolierende Trägerschicht, auf welcher beabstandet voneinander jeweils eine elektrisch leitende Schicht einerseits zum Kontaktierungsbereich 10 und andererseits zu den Kontaktierungsbereichen 12 und 11 führt. As an alternative to the exemplary embodiment shown, a connecting web or a bridge can be provided with a plurality of metal layers which are electrically insulated from one another, so that contact areas on the chip card side which are not to be brought together to form a common connecting point can also be connected to the module 1 with a web or a bridge. For example, the two connecting webs 5 and 6 form a common electrically insulating carrier layer, on which, at a distance from one another, an electrically conductive layer leads on the one hand to the contacting area 10 and on the other hand to the contacting areas 12 and 11.

Claims

Patentansprüche claims
1. Chipkarte mit einem Kartengrundkorper und mit mindestens einem Halbleiter-Bauelement, einer Induktionsspule zum Daten- und Energieaustausch und mindestens einem weiteren passiven Bauelement (2, 2', 3), d a d u r c h g e k e n n z e i c h n e t , daß alle passiven Bauelemente (2, 2', 3, 4) aus zweidimensiona- len Leiterbahnstrukturen unmittelbar auf dem Kartengrundkorper gebildet sind.1. Chip card with a basic card body and with at least one semiconductor component, an induction coil for data and energy exchange and at least one further passive component (2, 2 ', 3), characterized in that all passive components (2, 2', 3, 4) are formed from two-dimensional conductor track structures directly on the basic card body.
2. Chipkarte nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß ein ohmscher Widerstand (3) durch einen Leiterbahnabschnitt mit reduzierter Querschnittsfläche gebildet ist.2. Chip card according to claim 1, d a d u r c h g e k e n n z e i c h n e t that an ohmic resistor (3) is formed by a conductor track section with a reduced cross-sectional area.
3. Chipkarte nach Anspruch 2, d a d u r c h g e k e n n z e i c h n e t , daß die reduzierte Querschnittsflache durch eine Einschnürung (30) der Breite des Leiterbahnabschnittes gebildet ist.3. Chip card according to claim 2, so that the reduced cross-sectional area is formed by a constriction (30) of the width of the conductor track section.
4. Chipkarte nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß die Spule (4) durch eine spiralförmig verlaufende Leiterbahn gebildet ist.4. Chip card according to one of the preceding claims, that the coil (4) is formed by a spiral-shaped conductor track.
5. Chipkarte nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß ein Kondensator (2) durch zwei elektrisch gegeneinander isolierte, sich in vorgegebenem Abstand gegenüberliegende Lei* terbahnabschnitte (20, 21) gebildet ist. 5. Chip card according to one of the preceding claims, characterized in that a capacitor (2) by two electrically insulated from one another, at a predetermined distance opposite Lei * terbahn sections (20, 21) is formed.
6. Chipkarte nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t , daß die sich gegenüberliegenden Leiterbahnabschnitt (20, 21) des Kondensators (2) Finger (14) oder Zähne aufweisen, die mit- einander kämmen .6. Chip card according to claim 5, so that the opposite conductor track sections (20, 21) of the capacitor (2) have fingers (14) or teeth which mesh with one another.
7. Chipkarte nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t , daß die sich gegenüberliegenden Leiterbahnabschnitte des Kon- densators (2') durch Blindwmdungen (42) der Spule (4) gebildet sind.7. Chip card according to claim 5, so that the opposite conductor track sections of the capacitor (2 ') are formed by blind walls (42) of the coil (4).
8. Chipkarte nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß der Halbleiterbaustem auf ein Modul (1) mit Anschlußstegen (5, 6, 7) gesetzt ist, die mit Kontaktierungsbereichen (10, 11, 12, 13) für die passiven Bauelemente (2, 3, 4) versehen sind.8. Chip card according to one of the preceding claims, characterized in that the semiconductor device is placed on a module (1) with connecting webs (5, 6, 7) with contacting areas (10, 11, 12, 13) for the passive components (2nd , 3, 4) are provided.
9. Chipkarte nach Anspruch 8, d a d u r c h g e k e n n z e i c h n e t , daß Anschlußstege (5, 7) als Brücken (8, 9) zur elektrisch isolierten Überbruckung von Leiterbahnabschnitten ausgebildet sind.9. Chip card according to claim 8, d a d u r c h g e k e n n z e i c h n e t that connecting webs (5, 7) are designed as bridges (8, 9) for electrically insulated bridging of conductor track sections.
10. Chipkarte nach Anspruch 9, d a d u r c h g e k e n n z e i c h n e t , daß die Brücken (8, 9) auf der den zu überbrückenden Leiterbahnabschnitten zugewandten Seite eine elektrisch isolierende Schicht aufweisen und auf der gegenüberliegenden Seite elektrisch leitend ausgebildet sind, und daß die zugehörigen Kontaktierungsbereiche (10, 11, 12, 13) als Durchkontaktierung ausgebildet sind. 10. Chip card according to claim 9, characterized in that the bridges (8, 9) on the side facing the conductor track sections to have an electrically insulating layer and are electrically conductive on the opposite side, and that the associated contacting areas (10, 11, 12, 13) are designed as plated-through holes.
11. Chipkarte nach Anspruch 10, d a d u r c h g e k e n n z e i c h n e t , daß die Brücken (8, 9) als Glas-Epoxi-Träger mit einseitiger11. Chip card according to claim 10, d a d u r c h g e k e n n z e i c h n e t that the bridges (8, 9) as a glass epoxy carrier with one-sided
Kupf erstruktur ausgebildet sind.Copper structure are formed.
12. Chipkarte nach Anspruch 10, d a d u r c h g e k e n n z e i c h n e t , daß die Brücken (8, 9) als Stege eines metallischen Anschluß- rahmens mit einseitiger Lackisolierung ausgebildet sind.12. Chip card according to claim 10, so that the bridges (8, 9) are designed as webs of a metallic connecting frame with lacquer insulation on one side.
13. Verfahren zur Herstellung einer kontaktlosen, einen Kartengrundkorper aufweisenden Chipkarte, die einen Halbleiter- Baustein, eine im wesentlichen aus einer spiralförmig verlau- fenden Leiterbahn bestehenden Induktionsspule und mindestens ein weiteres passives Bauelement aufweist, d a d u r c h g e k e n n z e i c h n e t , daß alle passiven Bauelemente gemeinsam in einem Arbeitsgang in13. Method for producing a contactless chip card having a basic card body, which has a semiconductor component, an induction coil consisting essentially of a spiral-shaped conductor track and at least one further passive component, so that all passive components work together in one operation
Form zweidimensionaler Leiterbahnstrukturen unmittelbar auf dem Kartengrundkorper erzeugt werden.Form two-dimensional conductor track structures are generated directly on the basic map body.
14. Verfahren nach Anspruch 13, d a d u r c h g e k e n n z e i c h n e t , daß die zweidimensionalen Strukturen der passiven Bauelemente aufgedruckt werden.14. The method according to claim 13, so that the two-dimensional structures of the passive components are printed on.
15. Verfahren nach Anspruch 13, d a d u r c h g e k e n n z e i c h n e t , daß die zweidimensionalen Strukturen der passiven Bauelemente in Einlagen-Ätz-Technik hergestellt werden. 15. The method according to claim 13, so that the two-dimensional structures of the passive components are produced using a deposit-etching technique.
PCT/DE1997/001709 1996-08-22 1997-08-11 Chip card with an induction coil and method for its manufacture WO1998008190A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19633923.5 1996-08-22
DE1996133923 DE19633923A1 (en) 1996-08-22 1996-08-22 Chip card with an induction coil and process for its manufacture

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WO1998008190A1 true WO1998008190A1 (en) 1998-02-26

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