WO1998007191A1 - Combination chip module and process for production of a combination chip module - Google Patents

Combination chip module and process for production of a combination chip module Download PDF

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Publication number
WO1998007191A1
WO1998007191A1 PCT/DE1997/001496 DE9701496W WO9807191A1 WO 1998007191 A1 WO1998007191 A1 WO 1998007191A1 DE 9701496 W DE9701496 W DE 9701496W WO 9807191 A1 WO9807191 A1 WO 9807191A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
chip module
conductor tracks
contact surfaces
combination chip
Prior art date
Application number
PCT/DE1997/001496
Other languages
German (de)
French (fr)
Inventor
Peter Stampka
Manfred Fries
Michael Huber
Josef Heitzer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998007191A1 publication Critical patent/WO1998007191A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
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    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • H01L2924/19042—Component type being an inductor

Definitions

  • the invention relates to a combination chip module for both contactless and contact-based transmission of electrical signals or data to an external read / write station, with an expandable, electrically insulating carrier, on or in which one or more integrated semiconductor circuits are arranged, via connection connections on the one hand with one or more coupling elements of a separately or in an integrated form in the chip module provided interface circuit, which enables contactless bidirectional data communication between the chip module and the external reader / writer, and on the other hand with on one side provided on the carrier are electrically conductive contact surfaces which enable contact-based bidirectional data communication between the chip module and the external read / write station.
  • the invention further relates to a method for producing such a combination chip module and the use of such combination chip modules in chip cards.
  • chip modules are produced as intermediate products which are completed in terms of production technology and are further processed independently to end products.
  • a chip module is understood to mean an arrangement in which one or more integrated semiconductor circuits in the form of chips or integrated circuits are arranged on or in an electrically insulating carrier, which are connected to a conductor track system provided on one side or on both sides of the carrier via use connections are, the carrier usually being a flexible film on which the actual semiconductor chip is mounted and on which the mostly gold-plated contact surfaces of the chip card are located.
  • a chip card or a combination chip module is understood to be an arrangement which allows both a contactless and a contact-based transmission of electrical signals or data to a reader / writer, and which for this purpose in addition to the contact areas serving for contact-based transmission are equipped with the components required for the contactless transmission of signals, such as transmission coils or capacitor plates.
  • the components required for the contactless transmission of signals such as transmission coils or capacitor plates.
  • the contactless transmission of electrical signals offers the advantage over the contact person that, compared to the former option, the chip card is not necessarily inserted into the reader / writer, but works contactlessly over a distance of up to a few meters.
  • the contactless signal transmission requires complex circuits with coupling elements that enable signal transmission, the capacitive and inductive coupling being the most suitable because of the flat design of the chip card.
  • Most contactless cards are currently being transmitted inductively, which can be used to implement both data and energy transmission.
  • one or more induction coils are integrated in the card body and are suitably contacted with the circuit located on the semiconductor chip.
  • the transmission of electrical signals is based on the principle of the loosely coupled transformer, the carrier frequency being, for example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz.
  • the carrier frequency being, for example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz.
  • induction coils are compared with one
  • base area of the semiconductor chip of around 10 mm 2 of substantially larger coil areas of typically about 30 to 40 cm 2 is required, the induction coil generally having only a few turns and being flat.
  • the combination chip cards or combination chip modules currently available on the market, it is known to provide, on the one hand, etched coils within an inlay film, and on the other hand, wound coils within an inlay film or wound coils within the card body, which by means of suitable connection techniques with the chip module must be electrically connected.
  • the turns of the induction coil are supported directly by the semiconductor chip and connected to it.
  • Common to all currently available combination chip cards or combination chip modules are the high costs due to the relatively complex manufacturing processes, which cannot be borne by all desired application areas.
  • the object of the present invention is to provide a combination chip module, in particular for use in a chip card, for both contactless and contact-based transmission of electrical signals or data to a reader / writer, which is compared to the previous combination chip cards or combination chip card modules can be manufactured much more simply and therefore more cost-effectively.
  • the one or more coupling elements have metallic conductor tracks, which are likewise formed on the side of the carrier assigned to the contact surfaces. According to the principle of the invention, it can be provided here that the conductor tracks of the one or more coupling elements and the metallic contact surfaces Chen arranged in the same plane and are made of the same material or the same materials.
  • the conductor tracks of the coupling element are accordingly shifted to the contact side of the chip card module.
  • a particularly simple and inexpensive arrangement can be obtained if the carrier is provided on one side with a thin, continuous metal coating, from which the conductor tracks of the one or more coupling elements and the contact surfaces are structured by structuring, preferably by means of etching processes using suitable etching masks Work step.
  • the invention also relates to chip module units which consist of a plurality of chip modules arranged one behind the other and / or next to one another at equal intervals and having a common carrier, preferably a strip-shaped carrier; Chip module units of this type are distinguished by particularly simplified handling and advantages in the electrical function test.
  • the invention also extends to corresponding chip cards which contain chip modules or chip module units according to the invention.
  • natural materials for example cardboard, paper or textile materials for the production of the card body, in contrast to the use of plastic materials, the price per chip card can still be significantly reduced.
  • a carrier is used which is used in the form of an endless strip or corresponding strip spacings and from which the chip modules are punched out to the final shape after completion.
  • the carrier can also be used in the form of an arc, in which case the chip modules may also be used in several parallel len rows are provided, from which individual chip modules or chip module units with several chip modules can be cut or punched out in the last manufacturing step.
  • Suitable materials for the carrier are, for example, epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinylchloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or the like highly impact-resistant thermoplastic material.
  • PES polyether sulfone
  • PPA polyparabanic acid
  • PVC polyvinylchloride
  • ABS acrylonitrile-butadiene-styrene copolymer
  • the carrier advantageously has a thickness in the range from approximately 25 ⁇ m to approximately 200 ⁇ m.
  • the carrier is coated on one side with a metal foil, in particular a copper foil, from which the conductor tracks of the coupling element are structured by means of known semiconductor technology processes , as well as the contact surfaces.
  • a metal foil in particular a copper foil
  • This can be done particularly cost-effectively by structured etching of the metal foil using a suitably designed etching mask, advantageously already on the part of the manufacturer of the continuous film carrier tape.
  • the metal coating provided on one side of the carrier can also consist of several different thin metal layers, at least one layer of the coating in particular comprising copper.
  • a preferred layer structure of such a metal coating can, starting from the outer contact side of the chip module to the chip side, for example look like this: a thin, for example 0.1 ⁇ m thick, bondable Au layer, an approximately 3 ⁇ m to 5 ⁇ m thin, as a diffusion barrier against Copper we kende Ni layer, a structure-etched copper tape of the thickness of preferably 15 microns to 70 microns; the actual carrier in the form of a plastic tape with a thickness of, for example, 100 ⁇ m, preferably made of epoxy resin, Kapton and the like; and an approximately 0.1 ⁇ m thin bondable layer in the recesses or bond holes in the plastic carrier layer, for example consisting of Au, AuCo, Ag and the like.
  • At least part of the module contact side can optionally be coated with electrically insulating lacquer by means of suitable manufacturing steps.
  • the conductor tracks of the at least one coupling element are expedient on their
  • Contact areas can be made per se by any known method, in particular by wire bonding (wire bonding), by automated film bonding (TAB, tape automated bonding) or by surface mounting of integrated SMD (surface mounted device) semiconductor circuits.
  • wire bonding wire bonding
  • TAB automated film bonding
  • SMD surface mounted device
  • the one or more coupling elements have an induction coil with a larger coil circumference than the external dimensions of a semiconductor chip carrying the one or more integrated semiconductor circuits, and the conductor tracks of the induction coil in strip form are arranged side by side, free of crossings and adjacent to the contact surfaces. Particularly favorable geometric conditions are present when the ends of the conductor tracks are widened to form contact connections which lie within the base area occupied by the contact areas.
  • FIG. 1 shows a schematic sectional illustration of a combination chip module for use in a combination chip card according to an exemplary embodiment of the invention
  • Figure 2 is an enlarged view of the detail X of Figure 1;
  • Figure 3 is a schematic bottom view of a combination chip module according to the embodiment of the invention.
  • the exemplary embodiment of the invention shown in FIGS. 1 to 3 comprises a combination chip module 1 for both a contactless and a contact-free transmission of electrical signals or data to an external read / write station (not shown in more detail), with an elastic, electrical insulating plastic carrier 2, on which a semiconductor chip 4, preferably made of silicon base material, is attached by means of an adhesive or adhesive layer 3, on the main surface 5 of which at least one integrated semiconductor circuit (not shown in detail) is formed, which is connected via connection terminals 6 in the form of electrically conductive pad surfaces formed on the main surface 5 and bond wires 7 fastened thereon with electrically conductive ones provided on one side of the carrier 2 K ontakt vom 8 are permanently bonded.
  • the dimensions and arrangements of the contact surfaces 8 are designed according to given ISO standard specifications and are used for the contact-based transmission of electrical signals to an external read / write station equipped with contact tips.
  • metallic conductor tracks 9 which represent the turns of an induction coil 10 with a larger coil circumference than the external dimensions of the semiconductor chip 4, the Conductor tracks 9 of the induction coil 10 are arranged in strips next to one another, without intersections and adjacent to the contact surfaces 8, as can be seen in particular from the rear view according to FIG. 3.
  • the ends of the conductor tracks 9 are widened to form contact connections 11 (connection pads of the coils) which lie within the base area claimed by the contact areas 8. Via these contact connections 11, the induction coil 10 is electrically connected to one of the at least one integrated semiconductor circuit formed on the main surface 5 of the semiconductor chip 4, preferably also via bond wires, which, however, are not shown in the figures for the sake of clarity.
  • FIG. 2 shows an enlarged representation of the detail “X” according to FIG. 1 for further details of the layer structure of the carrier 12 and the metal coating consisting of several individual layers Metal layers 12 and 13, a copper foil 14 about 15 ⁇ m to about 70 ⁇ m thick, and about 3 to about 5 ⁇ m thick Ni layers 15 and 16 applied to both sides of the copper foil 14, which act as a diffusion barrier against copper the conductor tracks 9 and, if appropriate, the contact connections 11 of the induction coil on their surface facing away from the carrier 2 with an electrically insulating protective layer 17 coated, for example a plastic layer with favorable tribological properties.
  • a support frame 17 surrounding the semiconductor chip 4 can be provided, which is preferably fastened to the carrier 2 by an adhesive connection, the chip module 1 also being provided with an encapsulation covering the semiconductor chip 4 and the bonding wires 7 can be, which is indicated schematically with the reference numeral 18.

Abstract

This invention concerns a combination chip module for transmission of electrical signals or data with or without contact to an external read-write station with an elongation-resistant, electrically insulated substrate (2), on or in which one or more integrated semiconductor circuits are arranged. The circuits are connected, via connecting terminals (6), a) to one or more couplers of an interface circuit which is either separate orin integrated form and provided in the chip module (1), which interface circuit enables contactless bidirectional data communication between the chip module (1) and the external read-write station, and b) to electrically conducting contact surfaces (8) provided on one side of the substrate (2), which contact surfaces (8) enable bidirectional data communication with contact, between the chip module (1) and the external read-write station. The one or more couplers have metal printed conductors which are also formed on the side of the substrate (2) facing the contact surfaces (8).

Description

Beschreibungdescription
Bezeichnung der Erfindung: Kombinations-Chipmodul und Verfah¬ ren zur Herstellung eines Kombinations-ChipmodulsTitle of invention: Combination chip module and procedural ¬ ren for producing a composite chip module
Die Erfindung bezieht sich auf ein Kombinations-Chipmodul für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine externe Lese-Schreibstation, mit einem dehnfesten, elektrisch isolie- renden Träger, auf oder in dem eine oder mehrere integrierte Halbleiterschaltungen angeordnet sind, die über Verbindungs- anschlüsse zum Einen mit einem oder mehreren Koppelelementen einer separat oder in integrierter Form in dem Chipmodul vorgesehenen Schnittstellenschaltung, welche eine kontaktlose bidirektionale Datenkommunikation zwischen dem Chipmodul und der externen Lese-Schreibstation ermöglicht, und zum Anderen mit auf einer Seite des Trägers vorgesehenen elektrisch leitenden Kontaktflächen, welche eine kontaktbehaftete bidirektionale Datenkommunikation zwischen dem Chipmodul und der ex- ternen Lese-Schreibstation ermöglicht, verbunden sind. Die Erfindung bezieht sich ferner auf ein Verfahren zur Herstellung eines solchen Kombinations-Chipmoduls, sowie die Verwendung derartiger Kombinations-Chipmodule in Chipkarten.The invention relates to a combination chip module for both contactless and contact-based transmission of electrical signals or data to an external read / write station, with an expandable, electrically insulating carrier, on or in which one or more integrated semiconductor circuits are arranged, via connection connections on the one hand with one or more coupling elements of a separately or in an integrated form in the chip module provided interface circuit, which enables contactless bidirectional data communication between the chip module and the external reader / writer, and on the other hand with on one side provided on the carrier are electrically conductive contact surfaces which enable contact-based bidirectional data communication between the chip module and the external read / write station. The invention further relates to a method for producing such a combination chip module and the use of such combination chip modules in chip cards.
Chipmodule werden bei der Herstellung von Chipkarten als fertigungstechnisch abgeschlossene Zwischenerzeugnisse produziert und unabhängig zu Enderzeugnissen weiter verarbeitet. Unter einem Chipmodul wird hierbei eine Anordnung verstanden, bei der auf oder in einem elektrisch isolierenden Träger eine oder mehrere integrierte Halbleiterschaltungen in Form von Chips oder integrierten Schaltkreisen angeordnet sind, die mit einem auf einer Seite oder auf beiden Seiten des Trägers vorgesehenen Leiterbahnsystem über Verwendungsanschlüsse verbunden sind, wobei der Träger in der Regel einen flexiblen Film darstellt, auf dem der eigentliche Halbleiterchip montiert wird, und auf welchem sich die meist vergoldeten Kontaktflächen der Chipkarte befinden. Unter einer Kombinations- Chipkarte bzw. einem Kombinations-Chipmodul wird eine Anordnung verstanden, welche sowohl für eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine Lese-Schreibstation erlaubt, und welche zu diesem Zweck neben den für eine kontaktbehaftete Übertragung dienenden Kontaktflächen darüber hinaus mit den zur kontaktlosen Übertragung von Signalen benötigten Bauelementen wie Übertragungsspulen oder Kondensatorplatten ausgestattet sind. Neben den derzeit typischen Anwendungsfeidern solcher Chip- karten in der Form von Krankenversichertenkarten, Gleitzei- terfassungskarten, Telefonkarten und dergleichen ergeben sich zukünftig insbesondere Anwendungen im öffentlichen Personennahverkehr, Skilift, Freibad, usw., wo in möglichst kurzer Zeit möglichst viel Personen erfasst werden müssen. Bei sol- chen Anwendungen bietet die kontaktlose Übertragung von elektrischen Signalen gegenüber der Kontaktbehafteten den Vorteil, dass gegenüber der ersteren Möglichkeit die Chipkarte nicht unbedingt in die Lese-Schreibstation eingeführt werden uss, sondern berührungslos über eine Entfernung von bis zu einigen Metern funktioniert. Die kontaktlose Signalübertragung erfordert jedoch aufwendige Schaltungen mit Koppelelementen, die eine Signalübertragung ermöglichen, wobei sich wegen der flachen Bauform der Chipkarte am ehesten die kapazitive und die induktive Kopplung eignen. Derzeit erfolgt bei den meisten kontaktlosen Karten die Übertragung auf induktivem Wege, mit dem sich sowohl die Daten wie auch die Energieübertragung realisieren lassen. Hierbei sind im Kartenkörper eine oder mehrere Induktionsspulen integriert ausgebildet, die auf geeignete Weise mit der auf dem Halbleiterchip be- findlichen Schaltung kontaktiert sind. Die Übertragung von elektrischen Signalen erfolgt nach dem Prinzip des lose gekoppelten Transformators, wobei die Trägerfrequenz beispielsweise im Bereich zwischen 100 und 300 kHz oder bei einigen MHz, insbesondere der Industriefrequenz von 13,56 MHz liegt. Hierfür werden Induktionsspulen mit einem gegenüber derIn the manufacture of chip cards, chip modules are produced as intermediate products which are completed in terms of production technology and are further processed independently to end products. A chip module is understood to mean an arrangement in which one or more integrated semiconductor circuits in the form of chips or integrated circuits are arranged on or in an electrically insulating carrier, which are connected to a conductor track system provided on one side or on both sides of the carrier via use connections are, the carrier usually being a flexible film on which the actual semiconductor chip is mounted and on which the mostly gold-plated contact surfaces of the chip card are located. Under a combination A chip card or a combination chip module is understood to be an arrangement which allows both a contactless and a contact-based transmission of electrical signals or data to a reader / writer, and which for this purpose in addition to the contact areas serving for contact-based transmission are equipped with the components required for the contactless transmission of signals, such as transmission coils or capacitor plates. In addition to the currently typical application fields of such chip cards in the form of health insurance cards, flextime cards, telephone cards and the like, there will in future be particular applications in local public transport, ski lift, outdoor pool, etc., where as many people as possible have to be recorded in the shortest possible time. In such applications, the contactless transmission of electrical signals offers the advantage over the contact person that, compared to the former option, the chip card is not necessarily inserted into the reader / writer, but works contactlessly over a distance of up to a few meters. However, the contactless signal transmission requires complex circuits with coupling elements that enable signal transmission, the capacitive and inductive coupling being the most suitable because of the flat design of the chip card. Most contactless cards are currently being transmitted inductively, which can be used to implement both data and energy transmission. In this case, one or more induction coils are integrated in the card body and are suitably contacted with the circuit located on the semiconductor chip. The transmission of electrical signals is based on the principle of the loosely coupled transformer, the carrier frequency being, for example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz. For this purpose, induction coils are compared with one
Grundfläche des Halbleiterchips von in der Größenordnung etwa 10 mm2 wesentlich größeren Spulenflächen von typischerweise etwa 30 bis 40 cm2 benötigt, wobei die Induktionsspule in der Regel nur wenige Windungen aufweist und flach ausgebildet ist. Bei den derzeit auf dem Markt verfügbaren Kombinations- Chipkarten bzw. Kombinations-Chipmodulen ist es bekannt, zum Einem geätzte Spulen innerhalb einer Inlettfolie, und zum Anderen gewickelte Spulen innerhalb einer Inlettfolie oder gewickelte Spulen innerhalb des Kartenkörpers vorzusehen, die durch geeignete Verbindungstechniken mit dem Chipmodul elektrisch verbunden werden müssen. Bei einer weiteren bekannten Möglichkeit zur Herstellung einer Kombinations-Chipkarte werden die Windungen der Induktionsspule unmittelbar vom Halbleiterchip abgestützt und mit diesem verbunden. Allen derzeit verfügbaren Kombinations-Chipkarten bzw. Kombinations-Chipmo- dulen gemeinsam sind die auf Grund der relativ komplexen Her- stellungsverfahren hohen Kosten, die nicht von allen gewünschten Anwendungsbereichen getragen werden können.Base area of the semiconductor chip of around 10 mm 2 of substantially larger coil areas of typically about 30 to 40 cm 2 is required, the induction coil generally having only a few turns and being flat. In the combination chip cards or combination chip modules currently available on the market, it is known to provide, on the one hand, etched coils within an inlay film, and on the other hand, wound coils within an inlay film or wound coils within the card body, which by means of suitable connection techniques with the chip module must be electrically connected. In a further known possibility of producing a combination chip card, the turns of the induction coil are supported directly by the semiconductor chip and connected to it. Common to all currently available combination chip cards or combination chip modules are the high costs due to the relatively complex manufacturing processes, which cannot be borne by all desired application areas.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Kombinations-Chipmodul insbesondere zur Verwendung in einer Chipkarte für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine Lese-Schreibstation zur Verfügung zu stellen, welche gegenüber den bisherigen Kombinations-Chipkarten bzw. Kombinations-Chipkarten-Modulen wesentlich einfacher und damit ko- stengünstiger hergestellt werden kann.The object of the present invention is to provide a combination chip module, in particular for use in a chip card, for both contactless and contact-based transmission of electrical signals or data to a reader / writer, which is compared to the previous combination chip cards or combination chip card modules can be manufactured much more simply and therefore more cost-effectively.
Diese Aufgabe wird durch ein Kombinations-Chipmodul gemäß Anspruch 1 und ein Verfahren zur Herstellung eines Kombinations-Chipmoduls gemäß Anspruch 13 gelöst.This object is achieved by a combination chip module according to claim 1 and a method for producing a combination chip module according to claim 13.
Erfindungsgemäß ist vorgesehen, dass das oder die mehreren Koppelelemente metallische Leiterbahnen aufweisen, die gleichfalls auf der den Kontaktflächen zugewiesenen Seite des Trägers ausgebildet sind. Dem Prinzip der Erfindung folgend kann hierbei vorgesehen sein, dass die Leiterbahnen des oder der mehreren Koppelelemente und die metallischen Kontaktflä- chen in der gleichen Ebene angeordnet und aus demselben Material bzw. denselben Materialien gefertigt sind.According to the invention, it is provided that the one or more coupling elements have metallic conductor tracks, which are likewise formed on the side of the carrier assigned to the contact surfaces. According to the principle of the invention, it can be provided here that the conductor tracks of the one or more coupling elements and the metallic contact surfaces Chen arranged in the same plane and are made of the same material or the same materials.
Durch kostenreduzierendes Gestalten bei Erzielung einer Mul- tifunktionalbauweise werden erfindungsgemäß die Leiterbahnen des Koppelelemen es sonach auf die Kontaktseite des Chipkarten-Moduls verlagert . Eine besonders einfach und kostengünstig herzustellende Anordnung ergibt sich hierbei, wenn der Träger auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen ist, aus welcher die Leiterbahnen des oder der mehreren Koppelelemente und die Kontaktflächen durch Strukturierung vorzugsweise vermittels Ätzprozessen unter Verwendung geeigneter Ätzmasken in einem Arbeitsgang gefertigt werden.By means of cost-reducing design while achieving a multifunctional design, the conductor tracks of the coupling element are accordingly shifted to the contact side of the chip card module. A particularly simple and inexpensive arrangement can be obtained if the carrier is provided on one side with a thin, continuous metal coating, from which the conductor tracks of the one or more coupling elements and the contact surfaces are structured by structuring, preferably by means of etching processes using suitable etching masks Work step.
Die Erfindungskonzeption bringt folgende wesentliche Vorteile gegenüber dem Stand der Technik mit sich:The concept of the invention has the following significant advantages over the prior art:
- durch die Verlagerung der Leiterbahnen des wenigstens einen Koppelelementes auf die Seite der Kontaktflächen des Chipmoduls eröffnet sich die Möglichkeit der gleichzeitigen Fertigung dieser beiden Bestandteile und damit eine erhebliche Einsparung von Herstellkosten;- The shifting of the conductor tracks of the at least one coupling element to the side of the contact surfaces of the chip module opens up the possibility of the simultaneous production of these two components and thus a considerable saving in manufacturing costs;
- es besteht maximale Designfreiheit beim Layout sowohl der metallischen Leiterbahnen, als auch des Kontaktflächenbereiches ;- There is maximum design freedom in the layout of both the metallic conductor tracks and the contact area;
- auch relativ große Halbleiterchips bzw. integrierte Schaltkreise sind einsetzbar;- Even relatively large semiconductor chips or integrated circuits can be used;
- keine wesentlichen Mehrkosten für die Fertigung der Leiter- bahnen für das wenigstens eine Koppelelement , da die zur- No significant additional costs for the production of the conductor tracks for the at least one coupling element, because the
Fertigung der Kontaktflächen benötigte Ätzmaske lediglich hinsichtlich des Layout-Designs geändert werden muss;Production of the contact areas required etching mask only needs to be changed with regard to the layout design;
- mit Ausnahme der beiden Zusatzkontaktierungsschritte für den elektrischen Anschluss der metallischen Leiterbahnen des wenigstens einen Koppelelementes an die wenigstens eine integrierte Halbleiterschaltung sind keine Änderungen beim Ablauf des Fertigungsprozesses erforderlich; - durch die Verlagerung des Koppelelementes an die Außenseite des Chipmoduls kann eine kompakte Anordnung mit minimalster Bauhöhe erzielt werden;- With the exception of the two additional contacting steps for the electrical connection of the metallic conductor tracks of the at least one coupling element to the at least one integrated semiconductor circuit, no changes are necessary in the course of the manufacturing process; - d urch the displacement of the coupling element to the outside of the chip module, a compact arrangement can be achieved with minimal height;
- vor der endgültigen, abschließenden Formgebung ist ein dy- nämischer und statischer Funktionstest möglich, was besonders bei Verwendung von Endlosfilmen als Träger wichtig ist, da zugleich Handling und Aussondern defekter Chipmodule erleichtert wird.- Before the final, final shaping, a dynamic and static function test is possible, which is particularly important when using continuous films as a carrier, since at the same time handling and sorting out defective chip modules is made easier.
Die Erfindung betrifft ferner auch Chipmodul-Einheiten, die aus mehreren hintereinander und/oder nebeneinander in gleichen Abständen angeordneten Chipmodulen mit gemeinsamen Träger, vorzugsweise einem streifenförmigen Träger, bestehen; derartige Chipmodul -Einheiten zeichnen sich durch besonders erleichtertes Handling und Vorteile beim elektrischen Funktionstest aus.The invention also relates to chip module units which consist of a plurality of chip modules arranged one behind the other and / or next to one another at equal intervals and having a common carrier, preferably a strip-shaped carrier; Chip module units of this type are distinguished by particularly simplified handling and advantages in the electrical function test.
Die Erfindung erstreckt sich ferner auch auf entsprechende Chipkarten, die erfindungsgemäße Chipmodule bzw. Chipmodul- Einheiten enthalten. Durch Verwendung von natürlichen Werkstoffen, beispielsweise Pappe, Papier oder Textilmaterialien für die Herstellung des Kartenkörpers kann im Gegensatz zur Verwendung von Kunststoffmaterialien der Preis pro Chipkarte weiterhin deutlich reduziert werden.The invention also extends to corresponding chip cards which contain chip modules or chip module units according to the invention. By using natural materials, for example cardboard, paper or textile materials for the production of the card body, in contrast to the use of plastic materials, the price per chip card can still be significantly reduced.
Für den bevorzugten Anwendungsbereich der erfindungsgemäßen Chipmodule für Chipkarten wird ein Träger verwendet, der in Form eines endlosen Streifens oder entsprechender Streifenab- stände eingesetzt wird und aus dem die Chipmodule nach der Fertigstellung auf die endgültige Form ausgestanzt werden.For the preferred area of application of the chip modules for chip cards according to the invention, a carrier is used which is used in the form of an endless strip or corresponding strip spacings and from which the chip modules are punched out to the final shape after completion.
Besonders günstig ist hierbei die Verwendung endloser Trägerfilmstreifen, die beiderseits eine Randperforation aufweisen und sich besonders vorteilhaft für die Serienproduktion der Chipmodule eignen, da sie die Positionierung in automatisier- ten Produktionsvorrichtungen erleichtern. Alternativ dazu kann der Träger auch in Bogenform verwendet werden, wobei dann die Chipmodule gegebenenfalls auch in mehreren paralle- len Reihen vorgesehen werden, aus denen im letzten Herstellungsschritt einzelne Chipmodule bzw. auch Chipmoduleinheiten mit mehreren Chipmodulen ausgeschnitten oder ausgestanzt werden können.It is particularly favorable here to use endless carrier film strips which have perforations on both sides and are particularly advantageous for the series production of the chip modules, since they facilitate positioning in automated production devices. As an alternative to this, the carrier can also be used in the form of an arc, in which case the chip modules may also be used in several parallel len rows are provided, from which individual chip modules or chip module units with several chip modules can be cut or punched out in the last manufacturing step.
Geeignete Materialien für den Träger sind beispielsweise Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES) , Po- lyparabansäure (PPA) , Polyvinylclorid (PVC) , Polycarbonat , Kapton und/oder Acrylnitril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hochschlagzähes Thermoplastmaterial. DerSuitable materials for the carrier are, for example, epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinylchloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or the like highly impact-resistant thermoplastic material. The
Träger weist, sofern er in Form eines elastischen, flexiblen Trägerfilms eingesetzt wird, günstigerweise eine Dicke im Bereich von etwa 25 μm bis etwa 200 μ auf.If it is used in the form of an elastic, flexible carrier film, the carrier advantageously has a thickness in the range from approximately 25 μm to approximately 200 μm.
Insbesondere bei der Verwendung von Endlosstreifen (Tapes) für den Träger ist es aus produktionstechnischen Gründen besonders günstig, wenn der Träger auf einer Seite mit einer Metallfolie, insbesondere einer Kupferfolie beschichtet ist, aus welcher durch Strukturierung vermittels an sich bekannter Halbleitertechnologieverfahren sowohl die Leiterbahnen des Koppelelementes, als auch die Kontaktflächen gefertigt werden. Besonders kostengünstig kann dies durch strukturiertes Ätzen der Metallfolie unter Einsatz einer geeignet entworfenen Ätzmaske erfolgen, günstigerweise bereits auf Seiten des Herstellers des Endlosfilm-Trägerbandes.In particular when using endless strips (tapes) for the carrier, it is particularly favorable for production-technical reasons if the carrier is coated on one side with a metal foil, in particular a copper foil, from which the conductor tracks of the coupling element are structured by means of known semiconductor technology processes , as well as the contact surfaces. This can be done particularly cost-effectively by structured etching of the metal foil using a suitably designed etching mask, advantageously already on the part of the manufacturer of the continuous film carrier tape.
Aus produktionstechnischen Gründen und im Sinne optimaler elektrischer Eigenschaften sowie möglichst langer Lebensdauer kann die auf der einen Seite des Trägers vorgesehene Metall- beschichtung auch aus mehreren unterschiedlichen dünnen Metalllagen bestehen, wobei wenigstens eine Lage der Beschichtung insbesondere Kupfer aufweist. Ein bevorzugter Schichtaufbau einer solchen Metallbeschichtung kann, ausgehend von der äußeren Kontaktseite des Chipmoduls bis zur Chipseite, beispielsweise folgendermaßen aussehen: eine dünne, beispielsweise 0,1 μm starke, bondfähige Au-Schicht, eine etwa 3 μm bis 5 μm dünne, als Diffusionsbarriere gegen Kupfer wir- kende Ni-Schicht, ein strukturgeätztes Kupfer-Band der Stärke von vorzugsweise 15 μm bis 70 μm; der eigentliche Träger in Form eines Kunststoffbandes der Stärke von beispielsweise 100 μm, vorzugsweise aus Epoxialharz, Kapton und dergleichen; so- wie eine etwa 0,1 μm dünne bondfähige Schicht in den Aussparungen bzw. Bondlöchern der Kunststoff-Trägerschicht , beispielsweise bestehend aus Au, AuCo, Ag und dergleichen.For reasons of production technology and in terms of optimal electrical properties and the longest possible service life, the metal coating provided on one side of the carrier can also consist of several different thin metal layers, at least one layer of the coating in particular comprising copper. A preferred layer structure of such a metal coating can, starting from the outer contact side of the chip module to the chip side, for example look like this: a thin, for example 0.1 μm thick, bondable Au layer, an approximately 3 μm to 5 μm thin, as a diffusion barrier against Copper we kende Ni layer, a structure-etched copper tape of the thickness of preferably 15 microns to 70 microns; the actual carrier in the form of a plastic tape with a thickness of, for example, 100 μm, preferably made of epoxy resin, Kapton and the like; and an approximately 0.1 μm thin bondable layer in the recesses or bond holes in the plastic carrier layer, for example consisting of Au, AuCo, Ag and the like.
Um elektrische Kurzschlüsse beim Auflegen des Chipmoduls auf leitende Oberflächen, beispielsweise Kontaktspitzen der externen Lese-Schreibstation zu vermeiden, kann optional wenigstens ein Teil der Modulkontaktseite mit elektrisch isolierenden Lack durch geeignete Fertigungsschritte überzogen werden. Zweckmäßigerweise sind hierbei insbesondere die Leiter- bahnen des wenigstens einen Koppelelementes auf ihrer demIn order to avoid electrical short circuits when the chip module is placed on conductive surfaces, for example contact tips of the external read / write station, at least part of the module contact side can optionally be coated with electrically insulating lacquer by means of suitable manufacturing steps. In this case, in particular, the conductor tracks of the at least one coupling element are expedient on their
Träger abgewandten Oberfläche mit einer elektrisch isolierenden Schutzschicht überzogen.Surface facing away from the carrier is coated with an electrically insulating protective layer.
Der elektrische Anschluss der integrierten Halbleiterschal- tungen an die Leiterbahnen des Koppelelementes und/oder derThe electrical connection of the integrated semiconductor circuits to the conductor tracks of the coupling element and / or the
Kontaktflächen kann an sich nach beliebigen, bekannten Verfahren erfolgen, insbesondere durch Drahtbonden (Wire-Bon- ding) , durch automatisiertes Filmbonden (TAB, Tape Automated Bonding) oder durch Oberflächenbefestigung von integrierten SMD-(Surface Mounted Device) -Halbleiterschaltungen. Im Sinne einer möglichst kostengünstigen Herstellung wird einer Kon- taktierung vermittels Bonddrähten mit den Verbindungsan- schlüssen der integrierten Halbleiterschaltungen der Vorzug gegeben, wobei in diesem Falle im Träger Bondlöcher ausgebil- det sind, durch welche die Bonddrähte geführt sind.Contact areas can be made per se by any known method, in particular by wire bonding (wire bonding), by automated film bonding (TAB, tape automated bonding) or by surface mounting of integrated SMD (surface mounted device) semiconductor circuits. In order to make production as cost-effective as possible, contact by means of bond wires with the connection terminals of the integrated semiconductor circuits is preferred, in which case bond holes are formed in the carrier through which the bond wires are guided.
Bei einer besonders bevorzugten Ausbildung der Erfindung ist vorgesehen, dass das oder die mehreren Koppelelemente eine Induktionsspule mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halbleiterschaltungen tragenden Halbleiterchips größeren Spulenumfang aufweisen, und die Leiterbahnen der Induktionsspule streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen angeordnet sind. Besonders günstige geometrische Verhältnisse liegen hierbei vor, wenn die Enden der Leiterbahnen zu Kontaktanschlüssen verbreitert sind, welche in- nerhalb der von den Kontaktflächen beanspruchten Grundfläche liegen.In a particularly preferred embodiment of the invention, it is provided that the one or more coupling elements have an induction coil with a larger coil circumference than the external dimensions of a semiconductor chip carrying the one or more integrated semiconductor circuits, and the conductor tracks of the induction coil in strip form are arranged side by side, free of crossings and adjacent to the contact surfaces. Particularly favorable geometric conditions are present when the ends of the conductor tracks are widened to form contact connections which lie within the base area occupied by the contact areas.
Weitere Merkmale, Vorteile und Zweckmäßigkeiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung eines Ausfüh- rungsbeispieles der Erfindung anhand der Zeichnung. Es zeigt:Further features, advantages and expediencies of the invention result from the following description of an exemplary embodiment of the invention with reference to the drawing. It shows:
Figur 1 eine schematische Schnittdarstellung eines Kombinations-Chipmoduls zur Verwendung in einer Kombinations- Chipkarte gemäß einem Ausführungsbeispiel der Erfin- düng;FIG. 1 shows a schematic sectional illustration of a combination chip module for use in a combination chip card according to an exemplary embodiment of the invention;
Figur 2 eine vergrößerte Darstellung der Einzelheit X aus Figur 1 ; undFigure 2 is an enlarged view of the detail X of Figure 1; and
Figur 3 eine schematische Unteransicht eines Kombinations- Chipmoduls nach dem Ausführungsbeispiel der Erfindung .Figure 3 is a schematic bottom view of a combination chip module according to the embodiment of the invention.
Das in den Figuren 1 bis 3 dargestellte Ausführungsbeispiel der Erfindung umfasst ein Kombinations-Chipmodul 1 für sowohl eine kontaktlose als auch eine kontaktbehaf ete Übertragung von elektrischen Signalen bzw. Daten an eine (nicht näher dargestellte) externe Lese-Schreibstation, mit einem dehnfesten, elektrisch isolierenden Kunststoffträger 2, auf dem vermittels einer Klebe- bzw. Haftschicht 3 ein vorzugsweise aus Silizium-Grundmaterial bestehender Halbleiterchip 4 befestigt ist, auf dessen Hauptoberfläche 5 wenigstens eine (nicht näher dargestellte) integrierte Halbleiterschaltung ausgebildet ist, die über Verbindungsanschlüsse 6 in der Form von auf der Hauptoberfläche 5 ausgebildeter elektrisch leitender Padflächen und daran befestigter Bonddrähte 7 mit auf einer Seite des Trägers 2 vorgesehenen elektrisch leitenden Kontaktflächen 8 dauerhaft verbunden sind. Die Kontaktflächen 8 sind in ihren Abmessungen und Anordnungen nach vorgegebenen ISO-Standardvorgaben ausgebildet und dienen zur kontaktbehafteten Übertragung von elektrischen Signalen an eine mit Kon- taktspitzen ausgestattete externe Lese-Schreibstation. Ebenfalls auf der den Kontaktflächen 8 zugewiesenen Seite des Trägers 2 und in der gleichen Ebene angeordnet und aus demselben Material gefertigt sind metallische Leiterbahnen 9, die die Windungen einer Induktionsspule 10 mit einem gegen- über den äußeren Abmessungen des Halbleiterchips 4 größeren Spulenumfang darstellen, wobei die Leiterbahnen 9 der Induktionsspule 10 streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen 8 angeordnet sind, wie dies insbesondere aus der Rückansicht gemäß Figur 3 ersichtlich ist. Die Enden der Leiterbahnen 9 sind zu Kontaktanschlüssen 11 (Anschlußpads der Spulen) verbreitert, welche innerhalb der von den Kontaktflächen 8 beanspruchten Grundfläche liegen. Über diese Kontaktanschlüsse 11 ist die Induktionsspule 10 elektrisch mit einer der wenigstens einen auf der Hauptoberfläche 5 des Halbleiterchips 4 ausgebildeten integrierten Halbleiterschaltung verbunden, vorzugsweise ebenfalls über Bonddrähte, welche in den Figuren der Übersichtlichkeit halber allerdings nicht näher dargestellt sind.The exemplary embodiment of the invention shown in FIGS. 1 to 3 comprises a combination chip module 1 for both a contactless and a contact-free transmission of electrical signals or data to an external read / write station (not shown in more detail), with an elastic, electrical insulating plastic carrier 2, on which a semiconductor chip 4, preferably made of silicon base material, is attached by means of an adhesive or adhesive layer 3, on the main surface 5 of which at least one integrated semiconductor circuit (not shown in detail) is formed, which is connected via connection terminals 6 in the form of electrically conductive pad surfaces formed on the main surface 5 and bond wires 7 fastened thereon with electrically conductive ones provided on one side of the carrier 2 K ontaktflächen 8 are permanently bonded. The dimensions and arrangements of the contact surfaces 8 are designed according to given ISO standard specifications and are used for the contact-based transmission of electrical signals to an external read / write station equipped with contact tips. Also arranged on the side of the carrier 2 assigned to the contact surfaces 8 and in the same plane and made of the same material are metallic conductor tracks 9 which represent the turns of an induction coil 10 with a larger coil circumference than the external dimensions of the semiconductor chip 4, the Conductor tracks 9 of the induction coil 10 are arranged in strips next to one another, without intersections and adjacent to the contact surfaces 8, as can be seen in particular from the rear view according to FIG. 3. The ends of the conductor tracks 9 are widened to form contact connections 11 (connection pads of the coils) which lie within the base area claimed by the contact areas 8. Via these contact connections 11, the induction coil 10 is electrically connected to one of the at least one integrated semiconductor circuit formed on the main surface 5 of the semiconductor chip 4, preferably also via bond wires, which, however, are not shown in the figures for the sake of clarity.
Die Figur 2 zeigt in einer vergrößerten Darstellung die Einzelheit „X" gemäß Figur 1 nähere Einzelheiten des Schichtaufbaues von dem Träger 12 und der aus mehreren Einzellagen bestehenden Metallbeschichtung. Diese umfasst etwa 0,1 μm starke Au-, AuCo-, Ag- oder dergleichen Metalllagen 12 und 13, eine etwa 15 μm bis etwa 70 μm starke Kupferfolie 14, sowie zu beiden Seiten der Kupferfolie 14 aufgebrachte, jeweils etwa 3 bis etwa 5 μm starke Ni-Schichten 15 und 16, welche als Diffusionsbarriere gegen Kupfer wirken. Zusätzlich sind die Leiterbahnen 9 sowie gegebenenfalls die Kontaktanschlüsse 11 der Induktionsspule auf ihrer dem Träger 2 abgewandten Oberfläche mit einer elektrisch isolierenden Schutzschicht 17 überzogen, beispielsweise einer KunststoffSchicht mit günstigen tribologischen Eigenschaften.FIG. 2 shows an enlarged representation of the detail “X” according to FIG. 1 for further details of the layer structure of the carrier 12 and the metal coating consisting of several individual layers Metal layers 12 and 13, a copper foil 14 about 15 μm to about 70 μm thick, and about 3 to about 5 μm thick Ni layers 15 and 16 applied to both sides of the copper foil 14, which act as a diffusion barrier against copper the conductor tracks 9 and, if appropriate, the contact connections 11 of the induction coil on their surface facing away from the carrier 2 with an electrically insulating protective layer 17 coated, for example a plastic layer with favorable tribological properties.
Zum Schutz des mechanisch empfindlichen Halbleiterchips 4 kann ein den Halbleiterchip 4 umgebender Stützrahmen 17 vorgesehen sein,, der vorzugsweise durch Klebeverbindung mit dem Träger 2 befestigt ist, wobei das Chipmodul l des Weiteren mit einer den Halbleiterchip 4 und die Bonddrähte 7 überdek- kende Verkapselung vorgesehen sein kann, welche schematisch mit dem Bezugszeichen 18 angedeutet ist. To protect the mechanically sensitive semiconductor chip 4, a support frame 17 surrounding the semiconductor chip 4 can be provided, which is preferably fastened to the carrier 2 by an adhesive connection, the chip module 1 also being provided with an encapsulation covering the semiconductor chip 4 and the bonding wires 7 can be, which is indicated schematically with the reference numeral 18.

Claims

Patentansprüche claims
1. Kombinations-Chipmodul für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Si- gnalen bzw. Daten an eine externe Lese-Schreibstation, mit einem dehnfesten, elektrisch isolierenden Träger (2) , auf oder in dem eine oder mehrere integrierte Halbleiterschaltungen angeordnet sind, die über Verbindungsanschlüsse (6) zum Einen mit einem oder mehreren Koppelelementen einer separat oder in integrierter Form in dem Chipmodul (1) vorgesehenen Schnittstellenschaltung, welche eine kontaktlose bidirektionale Datenkommunikation zwischen dem Chipmodul (1) und der externen Lese-Schreibstation ermöglicht, und zum Anderen mit auf einer Seite des Trägers (2) vorgesehenen elektrisch lei- tenden Kontaktflächen (8) , welche eine kontaktbehaftete bidirektionale Datenkommunikation zwischen dem Chipmodul (1) und der externen Lese-Schreibstation ermöglicht, verbunden sind, dadurch gekennzeichnet, dass das oder die mehreren Koppelelemente metallische Leiterbahnen aufweisen, die gleichfalls auf der den Kontaktflächen (8) zugewiesenen Seite des Trägers (2) ausgebildet sind.1. Combination chip module for both a contactless and a contact-based transmission of electrical signals or data to an external read / write station, with an expandable, electrically insulating carrier (2), on or in which one or more integrated semiconductor circuits are arranged are the connection connections (6) on the one hand with one or more coupling elements of a separately or in an integrated form in the chip module (1) provided interface circuit, which enables contactless bidirectional data communication between the chip module (1) and the external read / write station, and on the other hand, are connected to electrically conductive contact surfaces (8) provided on one side of the carrier (2), which enable contact-based bidirectional data communication between the chip module (1) and the external read / write station, characterized in that the or several coupling elements metallic conductor tracks a which are also formed on the side of the carrier (2) assigned to the contact surfaces (8).
2. Kombinations-Chipmodul nach Anspruch 1, dadurch gekennzeichnet, dass die Leiterbahnen (9) des oder der mehreren Koppelelemente und die metallischen Kontaktflächen (8) in der gleichen Ebene angeordnet und aus demselben Material bzw. denselben Materialien gefertigt sind.2. Combination chip module according to claim 1, characterized in that the conductor tracks (9) of the one or more coupling elements and the metallic contact surfaces (8) are arranged in the same plane and are made of the same material or the same materials.
3. Kombinations-Chipmodul nach Anspruch 1 oder 2, dadurch ge- kennzeichnet, dass der Träger (2) auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen ist, aus welcher die Leiterbahnen (9) des oder der mehreren Koppelelemente und die Kontaktflächen (8) durch Strukturierung gefertigt sind.3. Combination chip module according to claim 1 or 2, characterized in that the carrier (2) is provided on one side with a thin, continuous metal coating, from which the conductor tracks (9) of the one or more coupling elements and the contact surfaces (8) are made by structuring.
4. Kombinations-Chipmodul nach Anspruch 3, dadurch gekennzeichnet, dass der auf seiner einen Seite mit der Metallbe- Schichtung versehene Träger (2) als Trägerfilm in Form eines endlosen Streifens oder eines entsprechenden Streifenabschnitts ausgebildet ist.4. Combination chip module according to claim 3, characterized in that the on one side with the Metallbe- Layering provided carrier (2) is designed as a carrier film in the form of an endless strip or a corresponding strip section.
5. Kombinations-Chipmodul nach einem der Ansprüche 1 oder 4, dadurch gekennzeichnet, dass der Träger (2) aus Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES) , Polyparabansäure (PPA) , Polyvinylclorid (PVC) , Polycarbonat , Kapton und/oder Acrylnitril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hochschlagzähes Thermoplastmaterial besteht und gegebenenfalls mit einem Verstärkungsmaterial, insbesondere bestehend aus Glasfasern verstärkt ist.5. Combination chip module according to one of claims 1 or 4, characterized in that the carrier (2) made of epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinyl chloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or similar high-impact thermoplastic material and is optionally reinforced with a reinforcing material, in particular consisting of glass fibers.
6. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Träger (2) eine Stärke von etwa 25 μm bis etwa 200 μm besitzt.6. Combination chip module according to one of claims 1 to 5, characterized in that the carrier (2) has a thickness of about 25 microns to about 200 microns.
7. Kombinations-Chipmodul nach einem der Ansprüche 3 bis 6, dadurch gekennzeichnet, dass die auf der einen Seite des Trä- gers (2) angeordnete Metallbeschichtung Kupfer aufweist.7. Combination chip module according to one of claims 3 to 6, characterized in that the metal coating arranged on one side of the carrier (2) has copper.
8. Kombinations-Chipmodul nach einem der Ansprüche 3 bis 7, dadurch gekennzeichnet, dass die auf der einen Seite des Trägers (2) vorgesehene Metallbeschichtung aus mehreren dünnen Metalllagen (12, 13) besteht.8. Combination chip module according to one of claims 3 to 7, characterized in that the metal coating provided on one side of the carrier (2) consists of a plurality of thin metal layers (12, 13).
9. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Leiterbahnen (9) des oder der mehreren Koppelelemente auf ihrer dem Träger (2) abge- wandten Oberfläche mit einer elektrisch isolierenden Schutzschicht (17) überzogen sind.9. Combination chip module according to one of claims 1 to 8, characterized in that the conductor tracks (9) of the one or more coupling elements on their surface facing away from the carrier (2) are coated with an electrically insulating protective layer (17).
10. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die elektrisch leitenden Kon- taktflächen (8) und/oder die Leiterbahnen (9) des oder der mehreren Koppelelemente vermittels Bonddrähten mit den Verbindungsanschlüssen (6) der einen oder mehreren integrierten Halbleiterschaltungen kontaktiert sind, wobei im Träger Bondlöcher ausgebildet sind, durch welche die Bonddrähte geführt sind.10. Combination chip module according to one of claims 1 to 9, characterized in that the electrically conductive contact surfaces (8) and / or the conductor tracks (9) of the one or more coupling elements by means of bonding wires with the connection terminals (6) of the one or several integrated Semiconductor circuits are contacted, bond holes being formed in the carrier, through which the bond wires are guided.
11. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass das oder die mehreren Koppelelemente eine Induktionsspule mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halbleiterschaltungen tragenden Halbleiterchips (4) größeren Spu- lenumfang aufweist, und die Leiterbahnen (9) der Induktionsspule streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen (8) angeordnet sind.11. Combination chip module according to one of claims 1 to 10, characterized in that the one or more coupling elements has an induction coil with a coil size larger than the external dimensions of a semiconductor chip (4) carrying the one or more integrated semiconductor circuits, and the Conductor tracks (9) of the induction coil are arranged in strips next to one another, free of crossings and adjacent to the contact surfaces (8).
12. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, dass die Enden der Leiterbahnen (9) zu Kontaktanschlüssen (11) verbreitert sind, welche innerhalb der von den Kontaktflächen (8) beanspruchten Grundfläche liegen.12. Combination chip module according to one of claims 1 to 11, characterized in that the ends of the conductor tracks (9) are widened to form contact connections (11) which lie within the base area claimed by the contact areas (8).
13. Verfahren zur Herstellung eines Kombinations-Chipmoduls für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine externe Lese-Schreibstation, mit den Schritten:13. A method for producing a combination chip module for both contactless and contact-based transmission of electrical signals or data to an external read / write station, comprising the steps:
- Bestücken eines dehnfesten, elektrisch isolierenden Trägers (2) , auf dem auf einer Seite elektrisch leitende Kontaktflächen (8) vorgesehen sind, mit einer oder mehreren integrierten Halbleiterschaltungen,Equipping an expandable, electrically insulating carrier (2), on one side of which electrically conductive contact surfaces (8) are provided, with one or more integrated semiconductor circuits,
- Ausbilden bzw. Anordnen wenigstens eines Koppelelementes einer separat oder in integrierter Form in dem Chipmodul (1) vorgesehenen Schnittstellenschaltung, welche eine kontaktlose bidirektionale Datenkommunikation zwischen dem Chipmodul (1) und der externen Lese-Schreibstation ermöglicht,- Forming or arranging at least one coupling element of an interface circuit provided separately or in an integrated form in the chip module (1), which enables contactless bidirectional data communication between the chip module (1) and the external read / write station,
- elektrisches Verbinden der wenigstens einen integrierten Halbleiterschaltung an die elektrisch leitenden Kontaktflächen (8) und des wenigstens einen Koppelelementes über Verbindungsanschlüsse (6) , dadurch gekennzeichnet, daß das oder die mehreren Koppelelemente als metallische Leiterbahnen (9) auf der den Kontaktflächen (8) zugewiesenen Seite des Trägers (2) ausgebildet werden.- electrical connection of the at least one integrated semiconductor circuit to the electrically conductive contact surfaces (8) and the at least one coupling element via connection connections (6), characterized in that the one or more coupling elements are designed as metallic conductor tracks (9) on the side of the carrier (2) assigned to the contact surfaces (8).
14. Verfahren nach Anspruch 13, dadurch gekennzeichnet, dass die Leiterbahnen (9) des wenigstens einen Koppelelementes und die metallischen Kontaktflächen (8) in der gleichen Ebene angeordnet und aus demselben Material bzw. denselben Materiali- en gefertigt werden.14. The method according to claim 13, characterized in that the conductor tracks (9) of the at least one coupling element and the metallic contact surfaces (8) are arranged in the same plane and are made of the same material or the same materials.
15. Verfahren nach Anspruch 13 oder 14, dadurch gekennzeichnet, dass der Träger (2) auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen wird, aus welcher die Leiterbahnen (9) des wenigstens einen Koppelelementes und die Kontaktflächen (8) durch Strukturierung gefertigt werden.15. The method according to claim 13 or 14, characterized in that the carrier (2) is provided on one side with a thin, continuous metal coating, from which the conductor tracks (9) of the at least one coupling element and the contact surfaces (8) by structuring are manufactured.
16. Verfahren nach einem der Ansprüche 13 bis 15, dadurch ge- kennzeichnet, dass der auf seiner einen Seite mit der Metallbeschichtung versehene Träger (2) als Trägerfilm in Form eines endlosen Streifens oder eines entsprechenden Streifenabschnitts ausgebildet wird.16. The method according to any one of claims 13 to 15, characterized in that the carrier (2) provided on one side with the metal coating is formed as a carrier film in the form of an endless strip or a corresponding strip section.
17. Verfahren nach einem der Ansprüche 8 bis 11, dadurch gekennzeichnet, dass der Träger (2) aus Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES) , Polyparabansäure (PPA) , Po- lyvinylclorid (PVC) , Polycarbonat , Kapton und/oder Acrylni- tril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hoch- schlagzähes Thermoplastmaterial gefertigt und gegebenenfalls mit einem Verstärkungsmaterial, insbesondere bestehend aus Glasfasern verstärkt wird.17. The method according to any one of claims 8 to 11, characterized in that the carrier (2) made of epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinylchloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or similar high-impact thermoplastic material and optionally reinforced with a reinforcing material, in particular consisting of glass fibers.
18. Verfahren nach einem der Ansprüche 13 bis 17, dadurch ge- kennzeichnet, dass der Träger (2) eine Stärke von etwa 25 μm bis etwa 200 μm besitzt. 18. The method according to any one of claims 13 to 17, characterized in that the carrier (2) has a thickness of about 25 microns to about 200 microns.
19. Verfahren nach einem der Ansprüche 15 bis 18, dadurch gekennzeichnet, dass die auf der einen Seite des Trägers (2) angeordnete Metallbeschichtung Kupfer aufweist. 19th Method according to one of claims 15 to 18, characterized in that the metal coating arranged on one side of the carrier (2) has copper.
20. Verfahren nach einem der Ansprüche 15 bis 19, dadurch gekennzeichnet, dass die auf der einen Seite des Trägers (2) vorgesehene Metallbeschichtung aus mehreren dünnen Metalllagen besteht .20. The method according to any one of claims 15 to 19, characterized in that the metal coating provided on one side of the carrier (2) consists of several thin metal layers.
21. Verfahren nach einem der Ansprüche 13 bis 20, dadurch gekennzeichnet, dass die Leiterbahnen (9) des wenigstens einen Koppelelementes auf der dem Träger (2) abgewandten Oberfläche mit einer elektrisch isolierenden Schutzschicht überzogen werden.21. The method according to any one of claims 13 to 20, characterized in that the conductor tracks (9) of the at least one coupling element on the surface facing away from the carrier (2) are coated with an electrically insulating protective layer.
22. Verfahren nach einem der Ansprüche 13 bis 21, dadurch gekennzeichnet, dass die elektrisch leitenden Kontaktflächen (8) und/oder die Leiterbahnen (9) des wenigstens einen Koppelelementes vermittels Bonddrähten mit den Verbindungsan- Schlüssen (6) der einen oder mehreren integrierten Halbleiterschaltungen kontaktiert werden, wobei im Träger (2) Bondlöcher ausgebildet werden, durch welche die Bonddrähte (7) geführt werden.22. The method according to any one of claims 13 to 21, characterized in that the electrically conductive contact surfaces (8) and / or the conductor tracks (9) of the at least one coupling element by means of bonding wires with the connection terminals (6) of the one or more integrated semiconductor circuits are contacted, whereby bond holes are formed in the carrier (2) through which the bond wires (7) are guided.
23. Verfahren nach einem der Ansprüche 13 bis 22, dadurch gekennzeichnet, dass das wenigstens eine Koppelelement eine Induktionsspule (10) mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halbleiterschaltungen tragenden Halbleiterchipε (4) größeren Spulenum- fang aufweist, und die Leiterbahnen (9) der Induktionsspule (10) streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen (8) angeordnet werden.23. The method according to any one of claims 13 to 22, characterized in that the at least one coupling element has an induction coil (10) with a coil circumference larger than the external dimensions of a semiconductor chip (4) carrying the one or more integrated semiconductor circuits, and the Conductor tracks (9) of the induction coil (10) are arranged in strips next to one another, free of crossings and adjacent to the contact surfaces (8).
24. Verfahren nach einem der Ansprüche 13 bis 23, dadurch ge- kennzeichnet, dass die Enden der Leiterbahnen (9) zu Kontaktanschlüssen (11) verbreitert werden, welche innerhalb der von den Kontaktflächen (8) beanspruchten Grundfläche liegen. 24. The method as claimed in one of claims 13 to 23, characterized in that the ends of the conductor tracks (9) are widened to form contact connections (11) which lie within the base area claimed by the contact areas (8).
25. Kombinations-Chipmodul-Einheit, gekennzeichnet durch mehrere hintereinander angeordnete Kombinations-Chipmodule (1) nach einem der Ansprüche 1 bis 12 mit gemeinsamem, einstücki- gern Träger (2) .25. Combination chip module unit, characterized by a plurality of combination chip modules (1) arranged one behind the other according to one of claims 1 to 12 with a common, one-piece carrier (2).
26. Verwendung der Kombinations-Chipmodule (l) nach einem der Ansprüche 1 bis 12 sowie der Kombinations-Chipmodul-Einheiten nach Anspruch 25 zur Herstellung von Chipkarten oder ähnli- chen Datenträgern.26. Use of the combination chip modules (1) according to one of claims 1 to 12 and the combination chip module units according to claim 25 for the production of chip cards or similar data carriers.
27. Chipkarte, gekennzeichnet durch mindestens ein Kombinations-Chipmodul (1) nach einem der Ansprüche 1 bis 12 oder mindestens eine Kombinations-Chipmodul-Einheit nach Anspruch 25. 27. Chip card, characterized by at least one combination chip module (1) according to one of claims 1 to 12 or at least one combination chip module unit according to claim 25.
PCT/DE1997/001496 1996-08-08 1997-07-15 Combination chip module and process for production of a combination chip module WO1998007191A1 (en)

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DE19632115A DE19632115C1 (en) 1996-08-08 1996-08-08 Combination chip module for smart cards allowing both contacting- and contactless communication with external data station
DE19632115.8 1996-08-08

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