WO1998002756A3 - Method of and device for inspecting a PCB - Google Patents

Method of and device for inspecting a PCB Download PDF

Info

Publication number
WO1998002756A3
WO1998002756A3 PCT/IB1997/000687 IB9700687W WO9802756A3 WO 1998002756 A3 WO1998002756 A3 WO 1998002756A3 IB 9700687 W IB9700687 W IB 9700687W WO 9802756 A3 WO9802756 A3 WO 9802756A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
measurement
level
inspecting
pcb
Prior art date
Application number
PCT/IB1997/000687
Other languages
French (fr)
Other versions
WO1998002756A2 (en
Inventor
Der Ven Robert Fransiscus Van
Original Assignee
Philips Electronics Nv
Philips Norden Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics Nv, Philips Norden Ab filed Critical Philips Electronics Nv
Priority to JP10505786A priority Critical patent/JPH11513119A/en
Priority to EP97923300A priority patent/EP0850420A2/en
Publication of WO1998002756A2 publication Critical patent/WO1998002756A2/en
Publication of WO1998002756A3 publication Critical patent/WO1998002756A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

Abstract

A quantity of material is locally deposited on or removed from a substantially flat substrate of a circuit board. The quantity is inspected by carrying out a first measurement of a level of a surface of the material in a direction transversely of the substrate. At least two further measurements are performed of a further level of the substrate in said direction in at least two further locations where the material has not been deposited or removed. A reference level of the substrate is calculated by interpolation between the further measurements to a location of the first measurement. The quantity of material is inspected on the basis of a difference between the first measurement and the reference level.
PCT/IB1997/000687 1996-07-12 1997-06-12 Method of and device for inspecting a pcb WO1998002756A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10505786A JPH11513119A (en) 1996-07-12 1997-06-12 Method and apparatus for inspecting PCB
EP97923300A EP0850420A2 (en) 1996-07-12 1997-06-12 Method of and device for inspecting a pcb

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP96201974 1996-07-12
EP96201974.1 1996-07-12

Publications (2)

Publication Number Publication Date
WO1998002756A2 WO1998002756A2 (en) 1998-01-22
WO1998002756A3 true WO1998002756A3 (en) 1998-03-12

Family

ID=8224182

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1997/000687 WO1998002756A2 (en) 1996-07-12 1997-06-12 Method of and device for inspecting a pcb

Country Status (3)

Country Link
EP (1) EP0850420A2 (en)
JP (1) JPH11513119A (en)
WO (1) WO1998002756A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6516086B2 (en) * 1998-07-13 2003-02-04 Koninklijke Philips Electronics N.V. Method and apparatus for distinguishing regions where a material is present on a surface
CA2301822A1 (en) 2000-03-24 2001-09-24 9071 9410 Quebec Inc. Simultaneous projection of several patterns with simultaneous acquisition for inspection of objects in three-dimensions
TWI775274B (en) * 2021-01-14 2022-08-21 欣興電子股份有限公司 Device and method for measuring thickness of dielectric layer in circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355377A1 (en) * 1988-08-05 1990-02-28 Siemens Aktiengesellschaft Method for testing optically flat electronic component assemblies
US5011960A (en) * 1988-05-20 1991-04-30 Fujitsu Limited Wiring pattern detection method and apparatus
EP0426165A2 (en) * 1989-11-02 1991-05-08 Matsushita Electric Industrial Co., Ltd. Circuit board inspecting apparatus
EP0563829A2 (en) * 1992-03-30 1993-10-06 Sharp Kabushiki Kaisha Device for inspecting printed cream solder
US5329359A (en) * 1991-05-17 1994-07-12 Canon Kabushiki Kaisha Parts mounting inspection method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011960A (en) * 1988-05-20 1991-04-30 Fujitsu Limited Wiring pattern detection method and apparatus
EP0355377A1 (en) * 1988-08-05 1990-02-28 Siemens Aktiengesellschaft Method for testing optically flat electronic component assemblies
EP0426165A2 (en) * 1989-11-02 1991-05-08 Matsushita Electric Industrial Co., Ltd. Circuit board inspecting apparatus
US5329359A (en) * 1991-05-17 1994-07-12 Canon Kabushiki Kaisha Parts mounting inspection method
EP0563829A2 (en) * 1992-03-30 1993-10-06 Sharp Kabushiki Kaisha Device for inspecting printed cream solder

Also Published As

Publication number Publication date
EP0850420A2 (en) 1998-07-01
WO1998002756A2 (en) 1998-01-22
JPH11513119A (en) 1999-11-09

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