WO1997048074A1 - Carte a memoire et procede de fabrication d'une telle carte - Google Patents
Carte a memoire et procede de fabrication d'une telle carte Download PDFInfo
- Publication number
- WO1997048074A1 WO1997048074A1 PCT/FR1997/000995 FR9700995W WO9748074A1 WO 1997048074 A1 WO1997048074 A1 WO 1997048074A1 FR 9700995 W FR9700995 W FR 9700995W WO 9748074 A1 WO9748074 A1 WO 9748074A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- ring
- sheet
- memory card
- rigid
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 229920001169 thermoplastic Polymers 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229930040373 Paraformaldehyde Natural products 0.000 claims 1
- 229920001519 homopolymer Polymers 0.000 claims 1
- -1 polyoxymethylene Polymers 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000002513 implantation Methods 0.000 description 6
- 230000002787 reinforcement Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000012792 core layer Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000012815 thermoplastic material Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 229920009382 Polyoxymethylene Homopolymer Polymers 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920005372 Plexiglas® Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000368 destabilizing effect Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Definitions
- Memory card and method of manufacturing such a card.
- the invention relates to an integrated circuit memory card, and more particularly to a memory card of the type comprising a card body in one face of which an integrated circuit is embedded, with on this face a conductive pattern constituted by a plurality of conductive pads and associated read / write conductive lines connecting these areas to the integrated circuit.
- This type of integrated circuit memory card embedded in the mass of the card body sometimes lacks reliability, due to the stresses exerted on the edges of the integrated circuit when the card is subjected to bending. If this bending is significant, the curvature of the card body risks destabilizing the implantation of the integrated circuit in the card body, which can go as far as expelling said integrated circuit.
- it is common to provide a covering of the conductive pattern for example by means of an often transparent varnish, leaving the conductive areas of the conductive pattern clear. This protective thickness participates in maintaining the integrated circuit in the card body in the event of flexing of said card body, but this maintenance remains of limited effectiveness.
- Document EP-A-0 189 039 describes a laminated card in which the integrated circuit is housed in a hollow formed in a hard core disposed in the core layer of the card in order to ensure a certain protection of the integrated circuit when the card undergoes deformations.
- Document EP-A-0 311 434 describes a laminated card with an integrated circuit, with a star-shaped reinforcing element placed on each of the two faces of the card body, on either side of the integrated circuit.
- Document EP-A-0331316 finally describes a laminated card in which the integrated circuit is surrounded by a deformable tubular rubber element used to absorb shocks and deformations when the card is manipulated.
- Document EP-A-0 128 822 also describes a method of mounting an integrated circuit module in a card body by hot pressing. It should be noted that no reinforcing element is provided in the area of the integrated circuit.
- the invention aims to solve the aforementioned problem, by designing a memory card of the integrated circuit type embedded in the card body, the structure of which makes it possible to improve the reliability of the implantation of the integrated circuit in the body of menu.
- a memory card of the type comprising a card body in one face of which is embedded an integrated circuit, with on this face a conductive pattern constituted by a plurality of conductive pads and conductive lines associated connecting these areas to the integrated circuit, caractéri ⁇ ed in that a reinforcing element arranged in the form of a closed ring is arranged in the thickness of the card body, facing the area of the integrated circuit, in s 'éten ⁇ dant in a plane substantially parallel to the aforementioned face of the card body.
- the closed reinforcement ring the function of which is to locally stiffen the area of the card which carries the integrated circuit and the electrical connections, thus provides local stiffening of the card body which makes it possible to considerably reduce the stresses in the area concerned. level of the surface of the integrated circuit, thereby increasing the reliability of the electrical connections.
- the closed ring forming the reinforcing element is disposed opposite the conductive areas of the conductive pattern. The rigidified zone thus extends beyond the zone which is opposite the conductive lines, which provides very satisfactory reliability for the electrical connections.
- the closed ring forming the reinforcing element will be disposed substantially at mid-thickness in the card body.
- the closed ring forming the reinforcing element is of revolution around an axis, and the integrated circuit is essentially centered on this axis.
- the ring of revolution may also have a section of rounded or quadrangular shape: such a section facilitates the embedding of the ring in the card body, by promoting the flow of the material around the side walls of said ring.
- the closed ring forming the reinforcing element may be made of any suitable rigid material, and be an injected product of rigid plastic material, for example an injectable polyacrylic or a polyoxymethylene homopolymer, or a metallic product, for example of steel or copper.
- the invention also relates to a method of manufacturing a memory card having at least one of the aforementioned characteristics, said method being remarkable in that it comprises the following successive steps: a) a rigid closed ring is placed on a upper face of a first sheet of thermoplastic plastic; b) this rigid ring is hot pressed into the first sheet; c) a second sheet of thermoplastic plastic material is placed on the first sheet fitted with the rigid ring, and the first and second sheets are assembled under hot pressure so as to constitute an assembly whose thickness corresponds to that of the body of card of the card to be produced, - d) an integrated circuit is hot pressed into the free upper face of the second sheet, up to embedding of said integrated circuit, at a location such that the rigid ring faces the area of the integrated circuit; e) a conductive pattern with conductive areas and associated conductive lines is produced in a manner known per se on this free upper face.
- step b) of hot pressing of the rigid ring is carried out until a partial embedding of said element in the first sheet, and step c) simultaneously achieves a partial embedding of this rigid ring in the second sheet. This ensures a very satisfactory anchoring of the rigid ring in the mass of the card body.
- the first and second sheets used have substantially the same thickness, so that the implantation of the rigid ring is located substantially at mid-thickness in the card body, that is to say in the median plane. (containing the neutral line) of said body.
- step e) is followed by a step f) known per se of covering the conductive pattern with a protective layer, leaving visible the conductive areas of said pattern.
- FIG. 1 is a partial schematic top view of a memory card according to the invention, in the area thereof which includes the integrated circuit, the card body being equipped with a reinforcement ring embedded in the thickness of the card body, •
- FIG. 1 is a partial section on II-II of Figure 1, to better distinguish the reinforcing ring disposed in the thickness of the card body;
- FIG 3 illustrates the successive steps, noted a) to f), of a method of manufacturing the aforementioned memory card, in accordance with another aspect of one invention.
- Figures 1 and 2 illustrate a memory card
- said card being of the type comprising a card body 1 made of insulating material, for example polycarbonate, in one face (denoted F) of which is embedded an integrated circuit 2, with on this face F a conductive pattern 3 consisting of a plurality of conductive pads 4 for reading / writing and associated conductive lines 5 connecting these pads to the integrated circuit 2.
- a conductive pattern 3 is shown consisting of a set of six conductive pads 4, each of which is connected to the integrated circuit 2 by an associated conductive line 5.
- such a representation of the conductive pattern 3 is only an example, the invention should in no case be considered as limited to such a particular conductive pattern.
- a reinforcing element 10 arranged in the form of a closed ring is arranged in the thickness of the card body 1, facing the area of the integrated circuit 2, extending in a plane denoted (PM) substantially parallel to the above-mentioned face F of the card body 1.
- the zone concerned may be the zone which is directly below the integrated circuit 2 (the face F being seen from above), but provision will be made preferably to widen this area to include the area which is below the conductive areas 4 of the conductive pattern 3, so that the local stiffening of the card body concerns all of the conductive lines of the conductive pattern, in order to '' obtain optimum reliability of electrical connections.
- FIG. 1 there is thus distinguished such a reinforcing ring 10 which is in the present case revolution around an axis X, the integrated circuit 2 being essentially centered on this axis X.
- the internal diameter of the ring 10 will be at least equal to the largest dimension of the integrated circuit, that is to say the diagonal in the case of a rectangular circuit as it is the case here.
- the outside diameter of said ring will preferably correspond to the largest dimension of the outline containing the conductive lines of the conductive pattern.
- the closed ring 10 is disposed substantially at mid-thickness in the card body 1, extending in the plane PM.
- This plane PM is therefore the median plane of the card body 1, plane through which the neutral line passes parallel to the longitudinal direction of the card and serving as a reference for the deformations of said card body in the event of bending.
- the ring of revolution 10 has a section of quadrangular shape, here a rhombus with points facing upwards and downwards.
- a rhombus with points facing upwards and downwards.
- Such a particular embodiment makes it possible to facilitate the implantation of the closed ring 10 in the mass of the card body, by promoting the creep of the plastic material against the side walls of the ring, as will be described more in detail with reference to FIG. 3 representing the steps of the method for manufacturing this memory card C. It may alternatively be provided with a section of different shape, in particular a section of rounded shape.
- the closed ring 10 can be made of any rigid material giving the desired reinforcement of the integrated circuit area, and one can for example choose a plastic material such as an injectable polyacrylic (for example a polymetacrylate such as Plexiglas ® ) or a polyoxymethylene homopolymer (for example polyacetal), or a metallic material, such as steel or copper.
- FIG. 1 shows a rectangular outline for this protective layer 6, but this naturally only constitutes a particular example.
- a punch PO exerts sufficient pressure on the upper edge of the rigid ring 10, and operates a hot pressing of this rigid ring in the first sheet 1.1, the downward movement of the punch PO being shown schematically by arrow 100.
- this step b) of hot pressing of the rigid ring 10 is carried out until partial embedding (for example by half) of said ring in the first sheet 1.1.
- thermoplastic plastic there is a second sheet 1.2 of thermoplastic plastic on the first sheet 1.1 fitted with the rigid ring 10, and the first and second sheets 1.1, 1.2 are assembled under hot pressure so as to constitute an assembly the thickness of which corresponds to that of the card body of the card to be produced.
- an assembly under hot pressure has been illustrated produced by compression between two press plates PL, the upper plate being in abutment against the upper face marked F.2 of the second thermoplastic sheet 1.2.
- the tightening of the PL plates is shown diagrammatically by the arrows 101.
- Such bonding under hot pressure can be carried out naturally, by melting the thermoplastic material, without it being necessary to provide an added adhesive.
- this assembly may be carried out under hot pressure by passing the sandwich formed by the two superposed sheets between two rolling rolls, in accordance with a well-known technique already used for making laminated memory cards of the type mentioned above.
- the passage between two rollers makes it possible to carry out an assembly under hot pressure continuously, for thermoplastic sheets of great length in which they then simply cut out individual card bodies.
- the two sheets 1.1, 1.2 will preferably be made of the same thermoplastic material, so that the spontaneous adhesion is intimate and reliable. It will be noted that the adhesion of the two sheets takes place at the level of the median plane of the card body obtained.
- step c) Due to the partial embedding of the rigid ring 10 in the first sheet 1.1 produced during step b), step c) simultaneously performs a partial embedding of this rigid ring 10 in the second sheet 1.2. This ensures extremely reliable anchoring of the rigid ring 10, at a precisely determined location.
- Steps d), e), f) implemented then are well known in the art concerned for a one-piece card body, and will therefore only be briefly recalled below.
- an integrated circuit 2 is hot pressed into the free upper face F.2 of the second sheet 1.2, until said integrated circuit is completely embedded, and this at a location such that the rigid ring 10 is opposite the area of the integrated circuit 2.
- This depression is shown diagrammatically by the arrow 102.
- the center of the integrated circuit 2 is as precisely as possible wedged on the axis X of the rigid ring 10.
- the pads of the integrated circuit 2 have been noted 9, which pads are turned outwards in accordance with the conventional technique of direct embedding of the integrated circuit in the card body.
- the conductive pattern 3 is produced with its conductive pads 4, and its associated conductive lines 5 which ensure the connection of the pads 4 to the pads of the integrated circuit 2. This is preferably carried out by depositing on the upper face F.2 a conductive polymer, in particular by a screen printing technique.
- the conductive pattern 3 is covered with a protective layer 6, for example in transparent varnish, leaving the conductive areas 4 of said pattern visible.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/194,766 US6202931B1 (en) | 1996-06-07 | 1997-06-05 | Memory card and method for producing same |
JP10500961A JP2000511669A (ja) | 1996-06-07 | 1997-06-05 | メモリカード及びその製造方法 |
EP97927240A EP0902927B1 (fr) | 1996-06-07 | 1997-06-05 | Carte a memoire et procede de fabrication d'une telle carte |
DE69701142T DE69701142T2 (de) | 1996-06-07 | 1997-06-05 | Speicherkarte und verfahren zu ihrer herstellung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9607091A FR2749687B1 (fr) | 1996-06-07 | 1996-06-07 | Carte a memoire et procede de fabrication d'une telle carte |
FR96/07091 | 1996-06-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997048074A1 true WO1997048074A1 (fr) | 1997-12-18 |
Family
ID=9492831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1997/000995 WO1997048074A1 (fr) | 1996-06-07 | 1997-06-05 | Carte a memoire et procede de fabrication d'une telle carte |
Country Status (7)
Country | Link |
---|---|
US (1) | US6202931B1 (fr) |
EP (1) | EP0902927B1 (fr) |
JP (1) | JP2000511669A (fr) |
DE (1) | DE69701142T2 (fr) |
ES (1) | ES2143313T3 (fr) |
FR (1) | FR2749687B1 (fr) |
WO (1) | WO1997048074A1 (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040213789A1 (en) * | 1997-09-02 | 2004-10-28 | Oron Yacoby-Zeevi | Heparanase activity neutralizing anti-heparanase monoclonal antibody and other anti-heparanase antibodies |
JP2007011836A (ja) * | 2005-07-01 | 2007-01-18 | Nec Tokin Corp | 接触端子付きicカード |
DE102005038132B4 (de) * | 2005-08-11 | 2008-04-03 | Infineon Technologies Ag | Chipmodul und Chipkarte |
US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
CN102047403A (zh) * | 2008-06-02 | 2011-05-04 | Nxp股份有限公司 | 电子器件及电子器件的制造方法 |
US8695207B2 (en) * | 2008-06-02 | 2014-04-15 | Nxp B.V. | Method for manufacturing an electronic device |
FR2951866B1 (fr) * | 2009-10-27 | 2011-11-25 | Arjowiggins Security | Procede de fabrication d'un support integrant un dispositif electronique |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US10032099B2 (en) | 2012-07-20 | 2018-07-24 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
US8857722B2 (en) | 2012-07-20 | 2014-10-14 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
EP3061032A4 (fr) | 2013-10-25 | 2017-10-11 | CPI Card Group -Colorado, Inc. | Carte multicouche polymétallique |
US10089568B2 (en) | 2016-06-01 | 2018-10-02 | CPI Card Group—Colorado, Inc. | IC chip card with integrated biometric sensor pads |
US11048991B2 (en) | 2017-02-14 | 2021-06-29 | CPI Card Group—Colorado, Inc. | Edge-to-edge metal card and production method |
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EP0128822A1 (fr) * | 1983-06-09 | 1984-12-19 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
JPS6195486A (ja) * | 1984-10-17 | 1986-05-14 | Hitachi Ltd | Icカ−ド |
EP0189039A2 (fr) * | 1985-01-21 | 1986-07-30 | Lupa Finances S.A. | Carte munie d'un microprocesseur et/ou d'au moins une mémoire électronique |
EP0311434A2 (fr) * | 1987-10-09 | 1989-04-12 | The De La Rue Company Plc | Carte de circuit intégré |
EP0331316A1 (fr) * | 1988-02-29 | 1989-09-06 | AT&T Corp. | Carte personnelle de données et méthode de fabrication |
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FR2505091A1 (fr) * | 1981-04-30 | 1982-11-05 | Cii Honeywell Bull | Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
EP0339763A3 (fr) * | 1988-04-28 | 1990-04-25 | Citizen Watch Co. Ltd. | Carte à circuit intégré |
DE9422424U1 (de) * | 1994-02-04 | 2002-02-21 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul |
US5514862A (en) * | 1994-05-20 | 1996-05-07 | At&T Corp. | Portable data carrier |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
-
1996
- 1996-06-07 FR FR9607091A patent/FR2749687B1/fr not_active Expired - Fee Related
-
1997
- 1997-06-05 ES ES97927240T patent/ES2143313T3/es not_active Expired - Lifetime
- 1997-06-05 WO PCT/FR1997/000995 patent/WO1997048074A1/fr active IP Right Grant
- 1997-06-05 JP JP10500961A patent/JP2000511669A/ja active Pending
- 1997-06-05 DE DE69701142T patent/DE69701142T2/de not_active Expired - Fee Related
- 1997-06-05 EP EP97927240A patent/EP0902927B1/fr not_active Expired - Lifetime
- 1997-06-05 US US09/194,766 patent/US6202931B1/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0128822A1 (fr) * | 1983-06-09 | 1984-12-19 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
JPS6195486A (ja) * | 1984-10-17 | 1986-05-14 | Hitachi Ltd | Icカ−ド |
EP0189039A2 (fr) * | 1985-01-21 | 1986-07-30 | Lupa Finances S.A. | Carte munie d'un microprocesseur et/ou d'au moins une mémoire électronique |
EP0311434A2 (fr) * | 1987-10-09 | 1989-04-12 | The De La Rue Company Plc | Carte de circuit intégré |
EP0331316A1 (fr) * | 1988-02-29 | 1989-09-06 | AT&T Corp. | Carte personnelle de données et méthode de fabrication |
Non-Patent Citations (1)
Title |
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PATENT ABSTRACTS OF JAPAN vol. 10, no. 274 (P - 498) 18 September 1986 (1986-09-18) * |
Also Published As
Publication number | Publication date |
---|---|
ES2143313T3 (es) | 2000-05-01 |
DE69701142T2 (de) | 2000-09-21 |
FR2749687B1 (fr) | 1998-07-17 |
DE69701142D1 (de) | 2000-02-17 |
EP0902927A1 (fr) | 1999-03-24 |
EP0902927B1 (fr) | 2000-01-12 |
JP2000511669A (ja) | 2000-09-05 |
FR2749687A1 (fr) | 1997-12-12 |
US6202931B1 (en) | 2001-03-20 |
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