WO1997041713A1 - New method of forming fine circuit lines - Google Patents
New method of forming fine circuit lines Download PDFInfo
- Publication number
- WO1997041713A1 WO1997041713A1 PCT/US1997/007191 US9707191W WO9741713A1 WO 1997041713 A1 WO1997041713 A1 WO 1997041713A1 US 9707191 W US9707191 W US 9707191W WO 9741713 A1 WO9741713 A1 WO 9741713A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- copper
- substrate
- circuit lines
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU29939/97A AU2993997A (en) | 1996-05-01 | 1997-05-01 | New method of forming fine circuit lines |
EP97924540A EP0868837A1 (en) | 1996-05-01 | 1997-05-01 | New method of forming fine circuit lines |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1666596P | 1996-05-01 | 1996-05-01 | |
US60/016,665 | 1996-05-01 | ||
US84638097A | 1997-04-30 | 1997-04-30 | |
US08/846,380 | 1997-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997041713A1 true WO1997041713A1 (en) | 1997-11-06 |
Family
ID=26688922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/007191 WO1997041713A1 (en) | 1996-05-01 | 1997-05-01 | New method of forming fine circuit lines |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0868837A1 (en) |
AU (1) | AU2993997A (en) |
WO (1) | WO1997041713A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0935407A1 (en) * | 1998-01-14 | 1999-08-11 | MITSUI MINING & SMELTING CO., LTD. | Method for producing multi-layer printed wiring boards having blind vias |
EP0948247A1 (en) * | 1998-04-01 | 1999-10-06 | Mitsui Mining & Smelting Co., Ltd. | Method for producing vias in the manufacture of printed wiring boards |
WO2000003568A1 (en) * | 1998-07-09 | 2000-01-20 | Oak-Mitsui, Inc. | Improved method for forming conductive traces and printed circuits made thereby |
LU90376B1 (en) * | 1999-03-23 | 2000-09-25 | Circuit Foil Luxembourg Trading Sarl | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
WO2000057680A1 (en) * | 1999-03-23 | 2000-09-28 | Circuit Foil Luxembourg Trading S.À R.L. | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
EP1121008A1 (en) * | 1998-09-03 | 2001-08-01 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
EP1157821A1 (en) * | 1999-12-08 | 2001-11-28 | Ibiden Co., Ltd. | Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
SG90037A1 (en) * | 1999-01-29 | 2002-07-23 | Mitsui Mining & Smelting Co | Method for producing multi-layer printed wiring boards having blind vias |
US6884944B1 (en) | 1998-01-14 | 2005-04-26 | Mitsui Mining & Smelting Co., Ltd. | Multi-layer printed wiring boards having blind vias |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS648694A (en) * | 1987-06-30 | 1989-01-12 | Hitachi Chemical Co Ltd | Manufacture of insulating substrate with thin nickel layer |
JPH01124286A (en) * | 1987-11-09 | 1989-05-17 | Hitachi Chem Co Ltd | Manufacture of printed-circuit board |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
-
1997
- 1997-05-01 AU AU29939/97A patent/AU2993997A/en not_active Abandoned
- 1997-05-01 EP EP97924540A patent/EP0868837A1/en not_active Withdrawn
- 1997-05-01 WO PCT/US1997/007191 patent/WO1997041713A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS648694A (en) * | 1987-06-30 | 1989-01-12 | Hitachi Chemical Co Ltd | Manufacture of insulating substrate with thin nickel layer |
JPH01124286A (en) * | 1987-11-09 | 1989-05-17 | Hitachi Chem Co Ltd | Manufacture of printed-circuit board |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 13, no. 181 (E - 750) 27 April 1989 (1989-04-27) * |
PATENT ABSTRACTS OF JAPAN vol. 13, no. 371 (E - 807) 17 August 1989 (1989-08-17) * |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
US6884944B1 (en) | 1998-01-14 | 2005-04-26 | Mitsui Mining & Smelting Co., Ltd. | Multi-layer printed wiring boards having blind vias |
US6107003A (en) * | 1998-01-14 | 2000-08-22 | Mitsui Mining & Smelting Co., Ltd. | Method for producing multi-layer printed wiring boards having blind vias |
EP0935407A1 (en) * | 1998-01-14 | 1999-08-11 | MITSUI MINING & SMELTING CO., LTD. | Method for producing multi-layer printed wiring boards having blind vias |
EP0948247A1 (en) * | 1998-04-01 | 1999-10-06 | Mitsui Mining & Smelting Co., Ltd. | Method for producing vias in the manufacture of printed wiring boards |
US6240636B1 (en) | 1998-04-01 | 2001-06-05 | Mitsui Mining & Smelting Co., Ltd. | Method for producing vias in the manufacture of printed circuit boards |
CN1333623C (en) * | 1998-04-01 | 2007-08-22 | 三井金属鉱业株式会社 | Method for producing vias in manufacture of printed wiring boards |
WO2000003568A1 (en) * | 1998-07-09 | 2000-01-20 | Oak-Mitsui, Inc. | Improved method for forming conductive traces and printed circuits made thereby |
JP4959052B2 (en) * | 1998-07-09 | 2012-06-20 | オーク‐ミツイ、インコーポレーテッド | Improved method of forming conductive traces and printed circuit manufactured thereby |
CN100344212C (en) * | 1998-07-09 | 2007-10-17 | 奥克-三井有限公司 | Improved method for forming conductive traces and printed circuits made thereby |
JP2002520195A (en) * | 1998-07-09 | 2002-07-09 | オーク‐ミツイ、インコーポレーテッド | Improved method of forming conductive traces and printed circuits produced thereby |
EP1121008A1 (en) * | 1998-09-03 | 2001-08-01 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
US7832098B2 (en) | 1998-09-03 | 2010-11-16 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
EP1121008A4 (en) * | 1998-09-03 | 2005-02-02 | Ibiden Co Ltd | Multilayer printed wiring board and method for manufacturing the same |
US7415761B2 (en) | 1998-09-03 | 2008-08-26 | Ibiden Co., Ltd. | Method of manufacturing multilayered circuit board |
US8148643B2 (en) | 1998-09-03 | 2012-04-03 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method thereof |
SG90037A1 (en) * | 1999-01-29 | 2002-07-23 | Mitsui Mining & Smelting Co | Method for producing multi-layer printed wiring boards having blind vias |
LU90376B1 (en) * | 1999-03-23 | 2000-09-25 | Circuit Foil Luxembourg Trading Sarl | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
US6779262B1 (en) | 1999-03-23 | 2004-08-24 | Circuit Foil Luxembourg Trading Sarl | Method for manufacturing a multilayer printed circuit board |
WO2000057680A1 (en) * | 1999-03-23 | 2000-09-28 | Circuit Foil Luxembourg Trading S.À R.L. | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
EP1157821A4 (en) * | 1999-12-08 | 2006-02-01 | Ibiden Co Ltd | Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
EP1157821A1 (en) * | 1999-12-08 | 2001-11-28 | Ibiden Co., Ltd. | Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
AU2993997A (en) | 1997-11-19 |
EP0868837A1 (en) | 1998-10-07 |
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